CN114061345A - Heat conduction member and method for manufacturing heat conduction member - Google Patents
Heat conduction member and method for manufacturing heat conduction member Download PDFInfo
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- CN114061345A CN114061345A CN202110869241.XA CN202110869241A CN114061345A CN 114061345 A CN114061345 A CN 114061345A CN 202110869241 A CN202110869241 A CN 202110869241A CN 114061345 A CN114061345 A CN 114061345A
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- plate portion
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- rod
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000005530 etching Methods 0.000 claims description 11
- 238000003825 pressing Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 35
- 239000000463 material Substances 0.000 description 32
- 238000005304 joining Methods 0.000 description 15
- 230000017525 heat dissipation Effects 0.000 description 14
- 238000005219 brazing Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 9
- 238000012986 modification Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910000881 Cu alloy Inorganic materials 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- -1 freon substitutes Chemical class 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat conduction member and a method of manufacturing the heat conduction member. The heat conduction member has a case in which a working medium is sealed, and the case includes: a1 st plate portion; a2 nd plate part overlapped on the 1 st plate part; and a plurality of pillar portions extending downward from the 2 nd plate portion. Each pillar portion has: a base portion which is connected to the 2 nd plate portion and is tapered downward; and a rod-shaped portion extending downward from an end portion below the pedestal portion. At least a cross-sectional shape of a cross-section perpendicular to the vertical direction of the rod-shaped portion is a flat circular shape.
Description
Technical Field
The present invention relates to a heat conduction member and a method of manufacturing the heat conduction member.
Background
Conventionally, as a method of cooling a heating element, a method using a steam chamber is known. The steam chamber has a container in which a cavity is formed by one plate-like body and another plate-like body opposed to the one plate-like body. The working fluid and the core structure are contained in the container. In the steam chamber, the inner surface of the other plate-like body has a pillar portion having a function of maintaining the internal space of the decompressed cavity portion (see, for example, japanese unexamined patent publication No. 2019-82264).
In the conventional steam chamber, the column part has a purpose of maintaining the internal space of the cavity. Therefore, a certain range of the internal space of the cavity portion is required, and a space for flowing the working fluid changed into a gas phase by heating is narrowed, which may obstruct the flow. Further, the column portion may become a resistance to the flow of the working fluid in the gas phase due to its shape.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a heat conduction member capable of improving the heat conduction efficiency of a working medium by smoothly flowing the vaporized working medium.
An exemplary heat conduction member of the present invention includes a case in which a working medium is sealed. The housing has a1 st plate portion; a2 nd plate portion superposed on an upper portion of the 1 st plate portion; and a plurality of pillar portions extending downward from the 2 nd plate portion. Each of the column portions has: a pedestal portion which is connected to the 2 nd plate portion and is tapered downward; and a rod-shaped portion extending downward from an end portion below the pedestal portion, wherein at least a cross-sectional shape of a cross-section of the rod-shaped portion perpendicular to the vertical direction is a flat circular shape.
An exemplary method of manufacturing a heat conduction member according to the present invention includes the steps of: an etching step of forming a recess recessed upward from a lower surface of the 2 nd plate portion and a plurality of protrusions arranged inside the recess and extending in a vertical direction by etching; and a pressing step of pressing a jig against an end portion of the plurality of protruding portions located below the protruding portions in the vertical direction and compressing the protruding portions with the jig to form a column portion.
According to the exemplary heat conduction member of the present invention, the heat conduction efficiency of the working medium can be improved by smoothly flowing the vaporized working medium.
The above and other features, elements, steps, features and advantages of the present invention will be more clearly understood from the following detailed description of preferred embodiments of the present invention with reference to the accompanying drawings.
Drawings
Fig. 1 is a perspective view of a heat conductive member of the present invention.
Fig. 2 is a bottom view of the heat conduction member shown in fig. 1.
Fig. 3 is a sectional view of the heat conductive member shown in fig. 1.
Fig. 4 is a bottom view of the post portion.
Fig. 5 is a cross-sectional view of the pillar portion shown in fig. 4 taken along the line V-V.
Fig. 6 is a cross-sectional view of the pillar portion shown in fig. 4 taken along the line VI-VI.
Fig. 7 is an enlarged bottom view of the 2 nd plate portion.
Fig. 8 is a cross-sectional view of a plate portion forming plate material in which a concave portion and a protruding portion are formed by etching treatment.
Fig. 9 is a cross-sectional view of the 2 nd plate portion formed by press working.
Fig. 10 is a sectional view showing a joining process of overlapping the 2 nd plate portion on the 1 st plate portion.
Fig. 11 is a bottom view of the pillar portion of modification 1.
Fig. 12 is a bottom view of the 2 nd plate portion of the 2 nd modification example.
Fig. 13 is a bottom view of the 2 nd plate portion of the 3 rd modification.
Detailed Description
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In this specification, the heat conduction member 100 has a rectangular shape in a plan view, and the 1 st plate portion 1 and the 2 nd plate portion 2 overlap in the gravity direction. Therefore, the direction in which the 1 st plate portion 1 and the 2 nd plate portion 2 overlap, i.e., the vertical direction, is the Z direction. When the heat conductive member 100 is viewed from the Z direction, the short-side direction of the heat conductive member 100 is defined as the X direction, and the longitudinal direction is defined as the Y direction. The size, shape, and size relationship between the constituent elements in the drawings are merely examples, and are not necessarily the same as the actual size, shape, and size relationship between the constituent elements.
Fig. 1 is a perspective view of a heat conduction member 100 of the present invention. Fig. 2 is a bottom view of the heat conducting member 100. Fig. 3 is a cross-sectional view taken along a plane parallel to the ZY-plane of the heat conductive member 100 shown in fig. 2.
As shown in fig. 1 to 3, the heat conductive member 100 has a case 101. As shown in fig. 2 and 3, the housing 101 has a space 102 inside. The column portion 3 and the core structure 4 are disposed in the space 102. The space 102 is sealed, and the working medium Md is sealed inside the space 102. That is, the heat conduction member 100 includes a case 101 in which the working medium Md is sealed.
The heat conduction member 100 is a so-called vapor chamber that transfers heat by utilizing a change in state of the enclosed working medium Md, that is, evaporation due to heating and condensation due to cooling.
The heat conduction member 100 is in contact with the heating element Ht, and transfers heat from the heating element Ht to the heat conduction member 100. As shown in fig. 3, in heat conduction member 100, one side of casing 101 in the Y direction is heated region 103, and the other side is heat dissipation region 104. The heating element Ht contacts the lower surface of the heated region 103. The heat of the heating element Ht is transferred to the heated region 103 of the heat conductive member 100.
The liquid working medium Md sealed in the space 102 is heated by the heat from the heating element Ht and evaporated, and changes its state to a vapor Vp of the working medium (hereinafter, simply referred to as a vapor Vp). The vapor Vp flows toward the heat dissipation area 104. In the heat dissipation area 104, the heat of the vapor Vp is transferred to the housing 101. Thereby, the vapor Vp is condensed and returned to the liquid working medium Md. The liquid working medium Md flows along the core structure 4 toward the heated region 103. The liquid working medium Md is heated again and evaporated in the heated region 103, and the state changes to vapor Vp. The above operations are repeated, and the heat conducting member 100 transports heat from the heating element Ht, thereby lowering the temperature of the heating element Ht. That is, the heat conductive member 100 is used as a heat radiating member of the heating element Ht.
In the heat conduction member 100 of the present embodiment, water is used as the working medium Md, but the present invention is not limited thereto. Examples thereof include alcohol compounds, freon substitutes, hydrocarbon compounds, fluorinated hydrocarbon compounds, diol compounds, and the like. As the working medium Md, a substance that evaporates (vaporizes) in the heated region 103 due to heat from the heating element Ht and condenses (liquefies) in the heat radiation region 104 by transferring heat to the casing 101 can be widely used.
The heat conduction member 100 will be described in more detail. As shown in fig. 1 to 3, the case 101 of the heat conduction member 100 includes the 1 st plate portion 1, the 2 nd plate portion 2, and the column portion 3. In the heat conduction member 100, the 1 st plate portion 1 and the 2 nd plate portion 2 are overlapped in the Z direction, and outer edge portions in the X direction and the Y direction are joined. The housing 101 is formed by joining the 1 st plate portion 1 with the 2 nd plate portion 2. That is, the housing 101 has the 1 st plate portion 1 and the 2 nd plate portion 2 superposed on the upper portion of the 1 st plate portion 1.
In the present embodiment, the 1 st plate portion 1 is formed of a material containing a copper alloy, for example. The material constituting the 1 st plate portion 1 is not limited to copper alloy, and a material such as metal having a strength (elastic modulus) of a predetermined or higher and a thermal conductivity of a predetermined or higher can be used.
For example, the metal film may be formed by performing a treatment of forming a metal film such as copper plating on the surface of a metal material such as stainless steel, titanium, or a titanium alloy. Even if the materials are difficult to be joined by the brazing material, the materials can be joined by the brazing material for joining copper or copper alloy by forming copper plating. Therefore, the brazing material can be easily selected.
As described above, the 1 st plate portion 1 is a plate material, and has a rectangular shape in which the Y direction is the longitudinal direction when viewed from the Z direction. The outer edge portion is an engaged portion 11 to be engaged with an engaging portion 22 described later when viewed from the Z direction.
In the present embodiment, the step of forming the concave portion can be omitted by using the 1 st plate portion 1 having the flush upper surface, but the present invention is not limited to this. For example, the 1 st plate portion 1 may have a recess portion constituting the space 102. This can increase the space 102.
In the present embodiment, the 2 nd plate portion 2 is formed of a material containing a copper alloy, for example. The material constituting the 2 nd plate portion 2 is not limited to copper alloy, and a material such as metal having a strength (elastic modulus) of a predetermined or higher and a thermal conductivity of a predetermined or higher can be used.
For example, the metal film may be formed by performing a treatment of forming a metal film such as copper plating on the surface of a metal material such as stainless steel, titanium, or a titanium alloy. Even if the materials are difficult to be joined by the brazing material, the materials can be joined by the brazing material for joining copper or copper alloy by forming copper plating. Therefore, the brazing material can be easily selected.
As shown in fig. 2, the 2 nd plate portion 2 has a flat plate portion 21 and a joint portion 22. The flat plate portion 21 has a rectangular shape when viewed from the Z direction. The joint portion 22 extends downward in the Z direction from the outer edge of the lower surface of the flat plate portion 21. The joint portion 22 is formed in a closed ring shape when viewed from the Z direction. The 2 nd plate portion 2 has a recess 20 formed by a flat plate portion 21 and a joint portion 22. The recess 20 is recessed upward in the Z direction from the lower surface of the 2 nd plate portion 2. That is, the 2 nd plate portion 2 has a recess 20 recessed from a surface facing the 1 st plate portion 1. The recess 20 forms a space 102 when the 1 st plate portion 1 is joined to the 2 nd plate portion 2.
As shown in fig. 1 and 2, the 1 st plate portion 1 and the 2 nd plate portion 2 are rectangular in shape having the same size when viewed in the Z direction. At this time, the outer edge of the 1 st plate portion 1 and the outer edge of the 2 nd plate portion 2 overlap in the Z direction. The 1 st plate portion 1 may be larger than the 2 nd plate portion 2. In this case, the outer edge of the 2 nd plate portion 2 is disposed inside the outer edge of the 1 st plate portion 1 as viewed in the Z direction. The 1 st plate portion 1 and the 2 nd plate portion 2 are not limited to rectangular shapes when viewed from the Z direction. The shape may be a square shape in plan view, a polygonal shape such as a triangle or a hexagon, or a circle. Further, a combination of these shapes may be used.
The details of the pillar portion 3 will be described with reference to the drawings. Fig. 4 is a bottom view of the post portion. Fig. 5 is a cross-sectional view of the pillar portion shown in fig. 4 taken along the line V-V. Fig. 6 is a cross-sectional view of the pillar portion shown in fig. 4 taken along the line VI-VI. In fig. 5 and 6, the boundary between the pedestal portion 31 and the rod portion 32 of the pillar portion 3 is shown, but the boundary may not be clearly determined in the actual pillar portion 3.
As shown in fig. 3, the pillar portion 3 includes a pedestal portion 31 and a rod portion 32. The pillar 3 extends downward from a portion of the flat plate portion 21 of the 2 nd plate portion 2 where the recess 20 is formed. That is, the plurality of pillar portions 3 extend downward from the 2 nd plate portion. The pedestal portion 31 extends downward in the Z direction from the lower surface of the 2 nd plate portion 2. The cross-sectional shape of the cross-section of the pedestal portion 31 perpendicular to the Z direction is circular. The pedestal portion 31 is tapered downward in the Z direction. That is, the pedestal portion 31 is connected to the 2 nd plate portion 2 and becomes thinner downward.
As shown in fig. 5 and 6, the cross-sectional shape of the pedestal portion 31 in the Z direction is a trapezoidal shape, and the portion in contact with the oblique side is a curved shape. However, the present invention is not limited to this, and may be linear, or may be a shape in which a plurality of straight lines are connected.
The rod 32 extends downward from the lower end of the base 31. That is, the rod 32 extends downward from the lower end of the base 31. The rod-like portion 32 is a columnar body having a cross-sectional shape that is uniform or substantially uniform in the Z direction. As shown in fig. 4 to 6, etc., the cross-sectional shape of the cross-section perpendicular to the Z direction of the rod-like portion 32 of the pillar portion is a flat circle having a major axis a1 extending in the Y direction and a minor axis a2 extending in the X direction and shorter than the major axis a 1. That is, at least the cross-sectional shape of the rod-like portion 32 in a cross section perpendicular to the vertical direction is a flat circular shape. Here, the flat circular shape widely indicates a shape in which the outer diameters in the intersecting direction are different and at least a part of the outer periphery is formed by a curved line.
For example, the outer peripheral shape of a mathematically defined ellipse or a shape in which 2 circles are arranged in series with a common tangent line is also a flat circle. A line segment connecting 2 points having the longest distance in the flat circular outer shape is defined as a major axis, and a line segment having the longest distance in a direction perpendicular to the major axis is defined as a minor axis. The flat circular shape may have no symmetry such as point symmetry or line symmetry as long as it has a major axis and a minor axis.
As shown in fig. 3 to 6, etc., in the pillar portion 3, the pedestal portion 31 and the rod portion 32 are formed of one member. As shown in fig. 3, the pillar portion 3 is disposed inside the recess 20 of the 2 nd plate portion 2 and is formed of the same member as the flat plate portion 21. The column portion 3 extends downward in the Z direction from the lower surface of the flat plate portion 21. As shown in fig. 3, the length L1 in the Z direction of the plurality of pillar portions 3 is shorter than the depth D1 in the Z direction of the recessed portion 20.
That is, the length L1 in the vertical direction of the pillar portion 3 is shorter than the depth D1 in the vertical direction of the recess 20, and a plurality of pillar portions 3 are arranged inside the recess 20. With this configuration, a gap is formed between the 1 st plate portion 1 and the pillar portion 3. The core structure 4 can be disposed in the gap. This eliminates the need to form a recess in the 1 st plate 1, thereby simplifying the manufacturing process of the housing 101.
Next, the arrangement of the pillar portions 3 in the recess 20 of the 2 nd plate portion 2 will be described with reference to the drawings. Fig. 7 is an enlarged bottom view of the 2 nd plate 2. As shown in fig. 2, 7, and the like, in the recess 20 of the 2 nd plate portion 2, a plurality of column portions 3 are arranged at equal intervals in the X direction and the Y direction, respectively. That is, the plurality of column parts 3 are arranged at equal intervals in the X direction. The plurality of pillar portions 3 are also arranged at equal intervals in the Y direction.
In the 2 nd plate part 2, the arrangement interval in the X direction of the plurality of pillar parts 3 is the same length as the arrangement interval in the Y direction. Therefore, both the arrangement interval in the X direction and the arrangement interval in the Y direction of the plurality of pillar portions 3 are set to the arrangement pitch P1. The X-direction interval is the same as the Y-direction interval, but the present invention is not limited to this. Or may be a different spacing. In addition, the substrates may be arranged obliquely with respect to the X direction and the Y direction.
As shown in fig. 2 and 7, the long axis a1 of the cross section of the rod-like portion 32 of each pillar portion 3 perpendicular to the Z direction is along the Y direction when viewed from the Z direction. That is, the long axes a1 of the rod-like portions 32 of the plurality of columnar portions 3 in the cross section perpendicular to the vertical direction are parallel to each other. That is, the plurality of columnar parts 3 are two-dimensionally arranged in a state where the rod-like parts 32 face in the same direction when viewed from the Z direction.
As shown in fig. 7, the outer peripheral surfaces of the rod-like portions 32 of the column parts 3 arranged in the X direction face each other in the X direction with a gap W1 therebetween. The gap W1 is along the minor axis a2 of the rod 32, and is longer than the minor axis a 2. That is, the gap W1 between the outer peripheral surfaces of the rod-like portions 32 of the pillar portions 3 adjacent in the direction along the short axis a2 of the cross section of the rod-like portions 32 perpendicular to the vertical direction is longer than the length of the short axis a 2.
The housing 101 further includes a core structure 4 disposed between the 1 st plate portion 1 and the 2 nd plate portion 2. The core structure 4 is in contact with the lower end 30 of the rod-shaped portion 32 of the pillar portion 3. Examples of the core structure 4 include a porous body such as a wire, a net, a nonwoven fabric, and a sintered body. As a material of the core structure 4, the same copper alloy as that of the 1 st plate portion 1 and the 2 nd plate portion 2 can be used, but the material is not limited thereto. Examples of the metal material include copper, aluminum, nickel, iron, titanium, alloys thereof, carbon fibers, and ceramics.
Further, the core structure 4 is disposed on the upper surface of the 1 st plate portion 1. The core structure 4 and the 1 st plate portion 1 may be formed of one member. In the case of using the 1 st plate portion 1 having a recess on the upper surface, the core structure 4 may be disposed in the recess. This facilitates positioning of the core structure 4 in the production of the heat conductive member 100.
As shown in fig. 3, in the housing 101, the engaging portion 22 of the 2 nd plate portion 2 engages with the engaged portion 11 of the 1 st plate portion 1, and the 2 nd plate portion 2 overlaps with the 1 st plate portion 1 in the Z direction.
The joining of the joined portion 11 and the joining portion 22 is performed by, for example, heating and pressing. Specifically, the temperature of the engaged part 11 and the engaging part 22 is raised to a predetermined temperature. Then, the upper surface of the to-be-joined part 11 is brought into contact with the lower surface of the joining part 22, and a joining process is performed in which the pressure of the contact surface is equal to or higher than a predetermined pressure. By performing the bonding process, a part of the particles is arranged across both the bonded part 11 and the bonding part 22 on the contact surface between the bonded part 11 and the bonding part 22. Thereby, the engaged portion 11 and the engaging portion 22 are engaged. The details of the bonding step will be described later.
In the case 101, the joining of the joined part 11 and the joining part 22 has a sealing property capable of suppressing permeation of the liquid working medium Md and the vapor Vp at the joined portion.
The method of joining the joined part 11 and the joining part 22 is not limited to this. For example, a brazing material may be disposed between the joined portion 11 and the joining portion 22, and joined by the brazing material by heating and pressing, that is, so-called brazing. In the case of brazing, the brazing material may be disposed by forming a groove in at least one of the upper surface of the joined part 11 and the lower surface of the joining part 22.
In the case 101 of the heat conduction member 100 of the present embodiment, the upper surface 10 of the 1 st plate portion 1 is planar. Therefore, when the 2 nd plate portion 2 is overlapped and joined on the upper portion of the 1 st plate portion 1, the recess 20 of the 2 nd plate portion 2 is closed by the upper surface of the 1 st plate portion 1, and a space 102 is formed. In the case 101, the height of the space 102 in the Z direction is substantially the same as the depth D1 of the recess 20. Therefore, the height of the space 102 is also denoted by D1 (see fig. 3).
When joining the 1 st plate portion 1 and the 2 nd plate portion 2, the core structure 4 is disposed in a portion surrounded by the joined portion 11 on the upper surface 10 of the 1 st plate portion 1. Thereby, the core structure 4 is disposed inside the space 102. As shown in fig. 3, the length L1 of the pillar portion 3 in the Z direction is shorter than the height D1 of the space 102 in the Z direction. Therefore, a gap is formed between the lower end 30 of the pillar 3 and the upper surface 10 of the 1 st plate 1. In the heat conduction member 100, the core structure 4 is disposed in the gap between the pillar portion 3 and the 1 st plate portion 1. Further, in the heat conduction member 100, the lower end 30 of the pillar portion 3 is in contact with the core structure 4. The heat conduction member 100 has the structure shown above.
The operation of the heat conduction member 100 will be described in detail. As shown in fig. 3, when the heat from the heating element Ht is transferred to the heated region 103 of the casing 101, the liquid working medium Md is heated and evaporated (vaporized). The vapor Vp generated by the evaporation of the working medium Md moves within the space 102 toward the heat dissipation area 104. I.e. to transport heat. Then, in the heat dissipation area 104, the latent heat of the vapor Vp is transferred to the casing 101. Thereby, the vapor Vp is cooled and condensed (liquefied), and returns to the liquid working medium Md. Further, the heat transferred from the vapor Vp to the casing 101 is radiated to the outside at a lower temperature than the casing 101.
The working medium Md is adsorbed to the core structure 4. The working medium Md adsorbed on the core structure 4 flows back to the heated region 103 in the space 102 by the capillary phenomenon. Then, the working medium Md is evaporated again in the heated region 103. By repeating the above operations, the heat conductive member 100 transfers heat from the heated region 103 to the heat dissipation region 104. In the heat conduction member 100, the heat dissipation region 104 of the casing 101 is made larger than the heated region 103, so that more heat can be transferred. This enables heat from the heating element Ht to be efficiently removed.
By providing the heat conduction member 100 with the core structure, the working medium Md condensed in the heat dissipation region 104 can flow rapidly to the heated region 103 by capillary action. This can improve the heat conduction efficiency of the heat conduction member 100. The core structure 4 may be omitted as long as the configuration is such that the working medium of the liquid can be made to flow by forming a gradient or the like from the heat radiation region 104 toward the heated region 103 on the upper surface 10 of the 1 st plate portion 1. In this case, the pillar portion 3 is in contact with the upper surface 10 of the 1 st plate portion 1.
As described above, the heat conduction member 100 transmits heat generated by the heating element Ht, and dissipates the heat of the heating element Ht. Examples of the heat generating element Ht include, but are not limited to, integrated circuits such as a CPU, MPU, and memory, devices having a rotating body such as a hard disk and an optical disk, devices used in electronic devices such as a battery and a liquid crystal panel, and smart phones, tablet PCs, and personal computers. The heat conduction member 100 can be widely used for heat dissipation of devices that generate heat in accordance with operations.
Inside the space 102, the working medium Md is evaporated by the heat of the heating element Ht. In order to facilitate evaporation of the working medium Md, the pressure inside the space 102 is often lower than the pressure outside. Therefore, a force generated by a pressure difference between the inside and the outside is applied to the housing 101. For example, the flat plate portion 21 is easily depressed by a pressure difference between the inside and the outside of the case 101.
The flat plate portion 21 is supported by the plurality of column portions 3, and deformation due to a pressure difference between the inside and the outside of the space 102 of the case 101 is suppressed. Further, the portion of the pillar 3 connected to the 2 nd plate portion 2 is formed in a shape that extends from the boundary portion with the rod portion 32 toward the 2 nd plate portion 2, whereby the strength of the pillar 3 at the connecting portion can be increased. For example, even when an external force in the falling direction acts on the pillar portion 3, the deformation of the pillar portion 3 in the falling direction can be suppressed. Therefore, deformation of the pillar 3 is suppressed, and deformation of the space 102 can be suppressed. Further, by suppressing the deformation of the space 102, the movement of the vapor Vp in the space 102 is less likely to be inhibited.
The 1 st plate portion 1 may also be deformed by a pressure difference between the inside and the outside. If the 1 st plate part 1 is recessed, the heating element Ht may be separated from the 1 st plate part 1. In addition, the working medium Md may be difficult to move due to the depression of the 1 st plate portion 1. The plurality of columnar portions 3 and the core structure 4 can also suppress deformation of the 1 st plate portion 1. This allows the heating element Ht to contact the 1 st plate part 1, and heat can be stably transferred from the heating element Ht to the 1 st plate part 1. Further, by suppressing the deformation of the 1 st plate portion 1, the movement of the working medium Md in the space 102 is not easily hindered. Thus, in the heat conduction member 100 of the present embodiment, a decrease in heat radiation efficiency from the heating element Ht can be suppressed.
In heat conduction member 100, column portion 3 has a shape in which pedestal portion 31 connected to flat plate portion 21 of plate portion 2 expands upward. Therefore, the strength of the portion of the pillar portion 3 connected to the flat plate portion 21 can be increased. Therefore, the ratio of the column portion 3 in the space 102 can be reduced, and the region in which the vapor Vp flows can be enlarged. This allows the vapor of the working medium to flow smoothly, thereby improving the heat transfer efficiency of the working medium.
In the heat conductive member 100, the heated region 103 and the heat dissipation region 104 are arranged in the Y direction. The vapor Vp heated and evaporated in the heated region 103 moves in the Y direction. The vapor Vp moves in the Y direction in the gap between the column parts 3 adjacent in the X direction. The plurality of columnar parts 3 are two-dimensionally arranged in the X direction and the Y direction with the rod-like parts 32 facing in the same direction when viewed from the Z direction. This makes the flow direction of the vapor Vp uniform in the Y direction. In the heat conduction member 100, the gap W1 between the column parts 3 adjacent in the X direction is wider than the short axis a2, which is the width in the X direction of the rod-like part 32 of the column part 3 (see fig. 7). Therefore, the vapor Vp flows easily.
As shown in fig. 2, 7, and the like, the long axis a1 of the cross section perpendicular to the vertical direction of the rod-shaped portions 32 of the plurality of columnar parts 3 extends in a direction along the moving direction of the vaporized vapor Vp. Therefore, the resistance of the vapor Vp flowing around the rod 32 is smaller than that in the case where the rod 32 has a circular cross-sectional shape. As described above, by arranging the plurality of column sections 3 such that the long axes a1 of the rod-shaped sections 32 are aligned in the Y direction, the steam Vp can smoothly flow from the heated region 103 to the heat dissipation region 104. As described above, the heat conduction efficiency of the heat conduction member 100 can be improved by making the flow of the vapor Vp uniform and making the vapor Vp flow smoothly.
The manufacturing process of the case 101 will be described with reference to the drawings. Fig. 8 is a cross-sectional view of the plate portion forming plate material 2P in which the concave portion 20P and the protruding portion 3P are formed by etching. Fig. 9 is a cross-sectional view of the 2 nd plate portion 2 formed by press working. Fig. 10 is a cross-sectional view showing a joining process of overlapping the 2 nd plate portion 2 on the 1 st plate portion 1.
The 2 nd plate portion 2 of the case 101 is formed by etching the bottom surface of the plate portion forming plate material 2P. The plate portion forming plate material 2P is a plate material having the same thickness as the 2 nd plate portion 2 and having the same shape as the 2 nd plate portion 2 as viewed from the Z direction.
As shown in fig. 8, the bottom surface of the plate portion forming plate material 2P is etched, thereby forming a recess 20P and a protrusion 3P which is disposed inside the recess 20P and protrudes downward in the Z direction on the lower surface of the plate portion forming plate material 2P. At this time, the depth of the recess 20P is D1, and the length of the projection 3P is also D1.
As shown in fig. 8, the projection 3P has: a1 st portion 31P which is tapered downward; and a2 nd portion 32P projecting downward from a lower end of the 1 st portion 31P, and having a cross section perpendicular to the Z direction with a uniform or substantially uniform shape in the axial direction. At the end of the etching process, the cross-sectional shapes of the 1 st portion 31P and the 2 nd portion 32P in the cross-sectional plane perpendicular to the Z direction are circular.
As shown in fig. 9, the jig Jg is abutted against the lower end 30P of all the protruding portions 3P from the lower side of the plate portion forming plate material 2P in which the recessed portions 20P and the protruding portions 3P are formed. Then, the jig Jg is pressed upward to perform the pressing process for compressing the protruding portion 3P. Thereby, the length of the protruding portion 3P is compressed to L1, and the pillar portion 3 is formed. In addition, the 2 nd portion 32P having a small cross-sectional area, that is, the rod-like portion 32 is more easily deformed than the 1 st portion 31P, that is, the pedestal portion 31, at the time of compression.
The cross-sectional shape of the cut surface of the rod-like portion 32 of the column portion 3 is extended in the rolling direction of the plate portion forming plate material 2P by compression, and is deformed from a circular shape to a flat circular shape. For example, by setting the rolling direction of the plate section forming plate material 2P to the direction in which the steam Vp flows, the column section 3 can be formed in which the flow direction of the steam Vp is the major axis a 1.
Then, as shown in fig. 10, the core structure 4 is disposed in the region surrounded by the joined portion 11 on the upper surface 10 of the 1 st plate portion 1 which is separately manufactured, and the 2 nd plate portion 2 is overlapped with the 1 st plate portion 1 from above. At this time, the engaging portion 22 of the 2 nd plate portion 2 is brought into contact with the engaged portion 11 of the 1 st plate portion 1. Then, the 1 st plate portion 1 and the 2 nd plate portion 2 are heated to be raised to a predetermined temperature, and thereafter, a joining process of pressing the 2 nd plate portion 2 against the 1 st plate portion 1 is performed.
At this time, the pressure of the contact surface between the engaged portion 11 and the engaging portion 22 is equal to or higher than a predetermined pressure. Thereby, the engaged portion 11 and the engaging portion 22 are engaged. In the heating in the joining process, the entire 1 st plate portion 1 and the 2 nd plate portion 2 may be heated, or the joined portion 11 and the joining portion 22 may be locally heated.
After the case 101 is formed, the interior of the space 102 is depressurized, and the working medium is stored to seal the space 102. By the above manufacturing method, the heat conductive member 100 is formed. The above-described manufacturing method is an example, and is not limited to this manufacturing method. For example, when the bottom surface of the plate portion forming plate 2P is etched, the pillar portion 3 having a flat circular cross section may be formed by the etching.
The method for manufacturing the 2 nd plate portion 2 is not limited to etching, and the following method can be widely adopted: the plate is chemically or physically cut or melted to form a recess in the lower surface of the 2 nd plate portion 2, so that the pillar portion 3 and the 2 nd plate portion 2 can be formed as one member. In the case where the 1 st plate portion 1 has a recessed portion structure, the recessed portion may be formed by etching or may be formed by a chemical or physical method.
In the case 101 shown above, the 2 nd plate portion 2 and the pillar portion 3 are formed of one member, but the present invention is not limited thereto. For example, the pillar 3, which is a member different from the 2 nd plate portion 2, may be fixed to the portion of the flat plate portion 21 of the 2 nd plate portion 2 where the recess 20 is formed.
The column part 3a of modification 1 will be described with reference to the drawings. Fig. 11 is a bottom view of the pillar portion 3a of modification 1. The shape of the base portion 31a of the pillar portion 3a shown in fig. 11 is different from the base portion 31 of the pillar portion 3. The other points are the same as those of the pillar portion 3, namely, the pillar portion 3 a. Therefore, in the pillar portion 3a, the same reference numerals are given to portions substantially the same as those of the pillar portion 3 shown in fig. 4 and the like, and detailed description of the same portions is omitted.
A cross-sectional shape of a cross-section perpendicular to the Z direction of the pedestal portion 31a of the pillar portion 3a shown in fig. 11 is a flat circular shape. That is, the cross-sectional shape of the cross-section of the pedestal portion 31a perpendicular to the vertical direction is a flat circular shape. The pedestal portion 31a has a shape tapered downward, similarly to the pedestal portion 31. The pedestal portion 31a is connected to the flat plate portion 21 of the 2 nd plate portion 2. The portion of the base portion 31a connected to the flat plate portion 21 is a flat circular shape having a major axis b1 and a minor axis b 2. The flattening ratio of the cross-sectional shape of the cross-sectional surface perpendicular to the Z direction of the seat 31a is smaller than the flattening ratio of the cross-sectional shape of the cross-sectional surface perpendicular to the Z direction of the rod 32.
Further, when the pillar portion 3a is formed by the pressing process, the cross-sectional shape of the cross-section of the rod portion 32 perpendicular to the Z direction may slightly change in the Z direction. Therefore, in practice, the maximum value of the flattening ratio of the cross-sectional shape of the cross-sectional surface perpendicular to the Z direction of the pedestal portion 31a is smaller than the minimum value of the flattening ratio of the cross-sectional shape of the cross-sectional surface perpendicular to the vertical direction of the rod-like portion 32.
By adopting such a configuration, the base portion 31a can be reduced in volume as compared with the base portion 31 having a circular cross section. This can reduce the proportion of the pedestal portion 31a in the space 102, and can enlarge the region in which the vapor Vp flows. Therefore, the flow of the vapor Vp can be smoothed, and the heat transfer efficiency of the working medium can be further improved. As shown in fig. 11, by aligning the long axis b1 with the flow direction of the vapor Vp, the resistance of the vapor Vp flowing around the base portion 31a can be further reduced.
In the present embodiment, the long axis b1 of the pedestal portion 31a is in the same direction as the long axis a1 of the cross section of the rod-shaped portion 32, but the present invention is not limited thereto and may be inclined.
The 2 nd plate part 2b of the 2 nd modification will be described with reference to the drawings. Fig. 12 is a bottom view of the 2 nd plate portion 2b of the 2 nd modification. The 2 nd plate portion 2b shown in fig. 12 is different from the 2 nd plate portion 2 in the direction of the long axis a1 of the rod-like portion 32 of the pillar portion 3. The other points are the same as those of the 2 nd plate part 2, and the structure of the 2 nd plate part 2b is the same as that of the 2 nd plate part 2. Therefore, in the 2 nd plate portion 2b, the same reference numerals are given to substantially the same portions as those of the 2 nd plate portion 2 shown in fig. 2 and the like, and detailed description of the same portions is omitted.
As shown in fig. 12, the rod-like portions 32 of the plurality of columnar portions 3 of the 2 nd plate portion 2b have a non-uniform direction in which the long axis a1 of the cross section perpendicular to the vertical direction extends. With this configuration, even when the direction of the force acting on the pillar portion 3 is not uniform, there is a pillar portion 3 having the rod-like portion 32 whose major axis a1 is in the same direction or substantially the same direction as the direction of the force. By using the 2 nd plate portion 2b, deformation of the space 102 can be suppressed regardless of the direction of the force acting on the housing 101, and the heat conduction efficiency of the working medium can be improved by smoothing the flow of the working medium.
The 2 nd plate part 2c of the 3 rd modification will be described with reference to the drawings. Fig. 13 is a bottom view of the 2 nd plate portion 2c of the 3 rd modification. The 2 nd plate portion 2c shown in fig. 13 has a square shape when viewed from the Z direction, and the direction of the long axis a1 of the rod-like portion 32 of the pillar portion 3 is different from that of the 2 nd plate portion 2. The other points are the same as those of the 2 nd plate part 2, and the structure of the 2 nd plate part 2c is the same as that of the 2 nd plate part 2. Therefore, in the 2 nd plate portion 2c, parts substantially identical to those of the 2 nd plate portion 2 shown in fig. 2 and the like are denoted by the same reference numerals, and detailed description of the same parts is omitted.
The 2 nd plate portion 2c has a square flat plate portion 21c when viewed in the Z direction, and a joint portion 22c extending downward from an outer edge portion of the flat plate portion 21 c. The 2 nd plate portion 2c has a recess 20c surrounded by the joint portion 22c, and the long axes a1 of the rod-like portions 32 of the plurality of pillar portions 3 extend in a direction radially extending from a center point Sp of the recess 20c as viewed from the Z direction. That is, the long axes of the cross sections perpendicular to the vertical direction of the rod-shaped portions 32 of the plurality of columnar portions 3 extend in a direction radially spreading from the predetermined position Sp.
As described above, in the heat conductive member 100, the heat transferred from the heating element Ht is transferred to the portion away from the heating element Ht, and the heating element Ht is cooled. In the shape of the portion where the heating element Ht is disposed, heat may be radially transferred. In this case, the heating element Ht is disposed at the center of the heat conductive member 100 when viewed from the Z direction, and the column part 3 is disposed at a position where the long axis a1 of the rod-like part 32 extends in a direction in which the heating element Ht radially spreads from the center point Sp. This facilitates the radial movement of the vapor Vp vaporized by the heat from the heating element Ht, and thus the flow of the working medium can be smoothed to improve the heat transfer efficiency of the working medium.
Further, the structure in which the heating element Ht is disposed at the center when viewed in the Z direction has been described as an example, but the present invention is not limited thereto. For example, even when the center is shifted, the column part 3 may be disposed at a position where the long axis a1 extends in a direction radially extending from the center point Sp, with the center of the portion where the heating element Ht contacts being the center point Sp. In the device having the heating element Ht, the arrangement of the long axis a1 may be adjusted according to the position of the heating element Ht and other devices. In this case, the arrangement shape is not limited to the radial shape, and may be parallel, or may include both configurations.
The embodiments of the present invention have been described above, but the present invention is not limited to the above. In addition, various changes may be made to the embodiments of the present invention as long as they do not depart from the gist of the invention.
The heat conductive member of the present invention can be used for heat dissipation from devices that generate heat when operated and are used in thin electronic devices such as smartphones, tablet PCs, and notebook PCs, for example. In addition, the heat dissipation device can be used for heat dissipation of a device that generates heat.
Claims (10)
1. A heat conduction member having a case in which a working medium is sealed,
the housing has:
a1 st plate portion;
a2 nd plate portion superposed on an upper portion of the 1 st plate portion; and
a plurality of pillar portions extending downward from the 2 nd plate portion,
it is characterized in that the preparation method is characterized in that,
each of the column portions has:
a pedestal portion which is connected to the 2 nd plate portion and is tapered downward; and
a rod-shaped portion extending downward from an end portion below the pedestal portion,
at least a cross-sectional shape of a cross-section of the rod-shaped portion perpendicular to the vertical direction is a flat circular shape.
2. The heat-conducting member according to claim 1,
the cross section of the base part perpendicular to the vertical direction is flat and circular,
in each of the column portions, a maximum value of a flattening ratio of a cross-sectional shape of a cross-sectional surface of the pedestal portion perpendicular to the vertical direction is smaller than a minimum value of a flattening ratio of a cross-sectional shape of a cross-sectional surface of the rod-shaped portion perpendicular to the vertical direction.
3. The heat-conducting member according to claim 1,
the long axes of the cut surfaces of the plurality of rod-shaped portions are parallel to each other.
4. The heat-conducting member according to claim 3,
the distance between the outer peripheral surfaces of the columnar portions adjacent to each other in a direction along a short axis of a cross section of the rod-shaped portion perpendicular to the vertical direction is longer than the length of the short axis.
5. The heat-conducting member according to claim 2,
the long axes of the cross sections of the plurality of rod-shaped portions perpendicular to the vertical direction extend radially from predetermined positions.
6. The heat-conducting member according to claim 1,
the long axes of the cross sections of the plurality of rod-shaped portions perpendicular to the vertical direction extend in a direction along the moving direction of the vaporized working medium.
7. The heat-conducting member according to claim 1,
the plurality of rod-shaped portions have a non-uniform direction in which a long axis of a cross section perpendicular to the vertical direction extends.
8. The heat-conducting member according to any one of claims 1 to 7,
the 2 nd plate portion has a recess recessed from a surface opposed to the 1 st plate portion,
the length of the pillar portion in the vertical direction is shorter than the depth of the recess in the vertical direction, and the plurality of pillar portions are arranged inside the recess.
9. The heat-conducting member according to claim 8,
the case further includes a core structure disposed between the 1 st plate portion and the 2 nd plate portion, the core structure being in contact with the lower end of the rod-shaped portion of the pillar portion.
10. A method for manufacturing a heat conductive member in which a working medium is sealed in a case formed by overlapping a1 st plate portion and a2 nd plate portion on an upper portion of the 1 st plate portion,
the method for manufacturing the heat conduction member comprises the following steps:
an etching step of forming a recess recessed upward from a lower surface of the 2 nd plate portion and a plurality of protrusions arranged inside the recess and extending in a vertical direction by etching; and
and a pressing step of pressing a jig against an end portion of the plurality of protruding portions located below the protruding portions in the vertical direction and compressing the protruding portions with the jig to form a column portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-131228 | 2020-07-31 | ||
| JP2020131228A JP2022027308A (en) | 2020-07-31 | 2020-07-31 | Heat transfer member and manufacturing method of heat transfer member |
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| Publication Number | Publication Date |
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| CN114061345A true CN114061345A (en) | 2022-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110869241.XA Pending CN114061345A (en) | 2020-07-31 | 2021-07-30 | Heat conduction member and method for manufacturing heat conduction member |
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| JP (1) | JP2022027308A (en) |
| CN (1) | CN114061345A (en) |
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| KR102445227B1 (en) * | 2022-05-18 | 2022-09-20 | 주식회사 어플라이드서멀 | Vapor chamber using anodizing or die-casting metal, manufacturing method and application thereof |
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| JP2017204503A (en) * | 2016-05-09 | 2017-11-16 | 昭和電工株式会社 | Heat transfer structure, insulating laminate, insulated circuit board, and base for power module |
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2020
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| JP2001183079A (en) * | 1999-12-27 | 2001-07-06 | Fujikura Ltd | Flat type heat pipe and its manufacturing method |
| CN2786532Y (en) * | 2005-04-08 | 2006-06-07 | 珍通科技股份有限公司 | Board-shaped heat pipe |
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| JP2022027308A (en) | 2022-02-10 |
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