KR102445227B1 - Vapor chamber using anodizing or die-casting metal, manufacturing method and application thereof - Google Patents

Abstract

The present invention relates to a vapor chamber using anodizing or die-casting metal, which can bond metal that has undergone an anodizing, plating, or die-casting process, can use the metal to maintain a vacuum state in a vapor chamber, and can prevent internal corrosion or leakage, and a manufacturing method and application thereof.

Description

Vapor chamber using anodized or die-casting metal and manufacturing method and application thereof

The present invention relates to a vapor chamber using anodizing, plating or die-casting treated metal, and a manufacturing method and application thereof.

Recently, electronic products generate a lot of heat as they satisfy conditions such as high performance, high quality, or thin film required by consumers.

Accordingly, as the amount of heat generated by the electronic product increases, the development of a heat dissipation device as a means for effectively dissipating heat from the product has been required.

As a representative example of the heat dissipation device, a heat pipe and a vapor chamber are known.

The following is an invention related to a heat pipe among the heat dissipation elements listed above, US Patent Publication No. 2011/0303392 (hereinafter, document 1) discloses that a working fluid transports heat to the inside and discharges it to the outside, and a copper wire is included inside However, the invention relates to a thin-film heat pipe whose exterior is made of copper.

Since the thin film heat pipe of the invention of Document 1 has a very small area in contact with the product, there is a limit in effectively dissipating heat generated in high-performance electronic products.

The following is an invention related to a vapor chamber for improving the problem occurring in the heat pipe described above. US Patent Publication No. US 2020/0309470 (hereinafter, Document 2) discloses an upper and lower portion made of copper by a brazing process. The invention relates to a vapor chamber to which a plate is joined.

However, in the vapor chamber made of copper, the weight of the final product to which the vapor chamber is applied becomes heavy due to the weight of copper, and there is a problem in that economic efficiency is lowered due to an increase in copper price.

In recent years, in order to solve the problem of the vapor chamber made of copper, the need for development of a vapor chamber with improved weight and thermal conductivity using aluminum is increasing.

However, the aluminum vapor chamber has a problem in that aluminum is melted due to high temperature (600° C. or higher) when the brazing process described in the invention of Document 2 is applied when bonding aluminum to aluminum.

<Background art literature>

(Document 1) US Patent Publication No. US 2011/0303392

(Document 2) US Patent Publication No. US 2020/0309470

An object of the present invention is to solve the problems of the background art, and to enable bonding of metals processed by anodizing, plating or die casting.

In particular, an object of the present invention is that it is possible to maintain a vacuum state of the vapor chamber using the metal, and leakage does not occur.

In addition, the present invention uses an anodized or plated metal, so that an oxide film or a plating film is formed on the metal surface, so that the inside of the vapor chamber is not corroded by the working fluid, and the abrasion resistance of the surface of the vapor chamber is improved.

In addition, an object of the present invention is that by using the die-casting-treated metal, the weight of the vapor chamber can be reduced, and mass production is possible.

Furthermore, an object of the present invention is that thermal deformation does not occur by applying a low-temperature thermal fusion process using a polymer adhesive film between the upper plate and the lower plate.

Furthermore, an object of the present invention is to efficiently dissipate heat generated in the applied product by applying a vapor chamber having excellent heat dissipation efficiency to various fields.

In order to achieve the above object, the vapor chamber of the present invention is manufactured in a vacuum state by overlapping an upper plate and a lower plate made of metal processed by any one or more processes selected from anodizing, plating, or die casting, and a working fluid is accommodated therein. characterized by being

The vapor chamber is characterized in that a wick (wick) is further included inside the upper plate or the lower plate to form a passage for the working fluid accommodated in the vapor chamber.

In addition, the vapor chamber is characterized in that it further includes a nozzle for injecting the working fluid into the vapor chamber.

In addition, the vapor chamber is characterized in that a polymer adhesive film is included between the upper plate and the lower plate.

The present invention is characterized in that the vapor chamber is included in the product to achieve another object.

The product is characterized in that it includes a transport device, an electronic product, a thermoelectric device, a light emitting device, an autonomous transport device or a radar chip.

The manufacturing method of the vapor chamber of the present invention includes the steps of pre-processing the upper plate and the lower plate; bonding the upper plate and the lower plate; a step in which a working fluid is injected; and sealing the nozzle; characterized in that it is included.

The pretreatment of the upper plate and the lower plate is characterized in that at least one process selected from anodizing, plating, and die casting is performed.

The vapor chamber according to the present invention is anodizing, plating or die-casting by applying the metal bonding technology, it is possible to maintain the vacuum state of the vapor chamber, there is an effect that does not cause leakage.

In addition, the present invention has an effect that heat transport efficiency is not lowered because the inside of the vapor chamber is not corroded by the working fluid by using the anodized or plated metal.

And, in the present invention, when an oxide film or a plating film is formed on the metal surface, the abrasion resistance of the surface of the vapor chamber is improved, and durability is improved.

In addition, in the present invention, by using the die-casting-treated metal, the vapor chamber can be reduced in weight and mass-produced, so that productivity is improved, and there are excellent advantages in terms of economy.

In addition, in the present invention, a low-temperature thermal fusion process is applied using a polymer adhesive film between the upper plate and the lower plate, so that thermal deformation does not occur, so that flatness is uniformly formed, and high vibration properties can be maintained.

Furthermore, the present invention has the advantage that the vapor chamber with excellent heat dissipation efficiency can be applied to various fields, and the heat generated from the applied product is efficiently radiated, so that the efficiency of the applied product is not reduced due to heat generation.

1 is a perspective view of a vapor chamber according to an embodiment of the present invention.
FIG. 2 is an exploded perspective view of the vapor chamber shown in FIG. 1 .
3 is a cross-sectional view Aa for explaining the vapor chamber shown in FIG.
4 is a cross-sectional view Bb for explaining the vapor chamber shown in FIG.
5 is a cross-sectional view Bb for explaining a vapor chamber according to another embodiment of the present invention.
6 is a view for explaining heat transfer by attaching a vapor chamber to an applied product according to an embodiment of the present invention.
7 is a view for explaining an example in which the vapor chamber according to the embodiment of the present invention is attached to the applied product and the cooling plate.
<Explanation of code>
1: Vapor Chamber
10: upper plate 15: groove 20: lower plate
30: wick 35: passage
40: nozzle
50: adhesive film
60: oxide film 70: plating film
2: Applied products
3: cold plate

Hereinafter, the present invention will be described in detail through examples.

Objects, features, and advantages of the present invention will be readily understood through the following examples.

The present invention is not limited to the embodiments disclosed herein, and may be embodied in other forms. The embodiments disclosed herein are provided so that the spirit of the present invention can be sufficiently conveyed to those of ordinary skill in the technical field to which the present invention belongs, and all transformations included in the technical spirit and scope of the present invention , should be understood to include equivalents or substitutes.

Therefore, the present invention should not be limited by the following embodiments, and it should be understood that all transformations included in the technical spirit and scope of the present invention are included. That is, a person of ordinary skill in the art to which the present invention pertains can variously modify or modify the present invention by adding, changing, deleting or adding components within the scope that does not depart from the spirit of the present invention described in the claims. It will be possible to change, it will also be said to be included within the scope of the present invention.

Since the present invention is capable of various modifications and various embodiments, specific embodiments are illustrated in the drawings and described in detail. In the drawings, the size of the elements or the relative sizes between the elements may be exaggerated for a clear understanding of the present invention. In addition, the shape of the elements shown in the drawings may be slightly changed due to variations in the manufacturing process or the like.

Therefore, the embodiments disclosed herein should not be limited to the shapes shown in the drawings unless otherwise noted, and should be understood to include some degree of deformation.

On the other hand, various embodiments of the present invention may be combined with any other embodiments unless clearly indicated to the contrary. Any feature indicated as particularly preferred or advantageous may be combined with any other feature and features indicated as preferred or advantageous. That is, the various aspects, features, embodiments or implementations of the present invention may be used alone or in various combinations.

It should be understood that the terminology used herein is for the purpose of describing specific embodiments and is not intended to be limited by the claims, and all technical and scientific terms used in this specification are those of ordinary skill unless otherwise noted. has the same meaning as is commonly understood by a person with The singular expression includes the plural expression unless the context clearly dictates otherwise.

In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

1 and 2, the vapor chamber 1 is manufactured in a vacuum state by overlapping the upper plate 10 and the lower plate 20, and a working fluid may be accommodated therein.

The vapor chamber 1 is for dissipating heat generated by the applied product 2 , and is not particularly limited because the size, thickness, shape, etc. may vary depending on the applied product 2 .

The upper plate 10 and the lower plate 20 may be made of metal, preferably made of metal processed by any one or more processes selected from anodizing, plating, and die casting.

For example, aluminum (Al), stainless steel, titanium (Ti), magnesium (Mg), copper (Cu), etc. may be used as the metal.

For example, when aluminum is used as a metal, it has good corrosion resistance, easy casting, is not harmful to the human body because it is non-toxic, and has advantages of being light compared to other metals.

Accordingly, the vapor chamber 1 made of aluminum can reduce the weight of the final product to which it is applied as weight reduction is possible, thereby improving fuel efficiency or performance of the product depending on the field of application.

For example, when stainless steel is used as a metal, it has excellent corrosion resistance, can be reduced in weight with high strength, and has excellent workability.

Accordingly, as the vapor chamber 1 made of stainless steel can be thinned, the weight of the final product to which it is applied is reduced, thereby improving fuel efficiency or performance of the product depending on the field of application.

For example, when titanium is used as a metal, corrosion resistance and mechanical strength are good, and there is an advantage of being light.

Accordingly, the vapor chamber 1 made of titanium can reduce the weight of the final product to which it is applied as weight reduction is possible, thereby improving fuel efficiency or performance of the product depending on the field of application.

For example, when magnesium is used as a metal, it is light compared to other metals, and has advantages in terms of specific strength and specific rigidity.

Accordingly, the vapor chamber 1 made of magnesium can reduce the weight of the final product to which it is applied as weight reduction is possible, thereby improving fuel efficiency or performance of the product depending on the field of application.

For example, when copper is used as a metal, there are advantages of excellent thermal conductivity, flexibility and easy processability, and high corrosion resistance due to large chemical resistance.

Accordingly, as the vapor chamber 1 made of copper has excellent thermal conductivity, the heat dissipation performance of the final product to which the vapor chamber 1 is applied is excellent, so that the efficiency of the product may be improved depending on the field of application.

Since the anodizing is a known technique for forming a film on the metal surface, a detailed description thereof will be omitted.

For example, when the upper plate 10 and the lower plate 20 are made of metal to which anodizing is applied, an oxide film 60 is formed on the metal surface and the inside of the vapor chamber 1 is not corroded by the working fluid. The transport efficiency is not reduced, and the abrasion resistance and durability of the surface of the vapor chamber 1 are improved.

For example, the oxide film 60 is formed of aluminum oxide (Al ₂ O ₃ ) in the case of aluminum, chromium oxide (Cr ₂ O ₃ ) in the case of stainless steel, and titanium dioxide (TiO ₂ ) in the case of titanium. is formed, and in the case of magnesium, magnesium oxide (MgO) may be formed.

In addition, since the metal to which anodizing is applied can be colored in various colors using dyes after the anodizing process, there is an advantage in that the vapor chamber 1 having a beautiful appearance can be manufactured.

Since the plating is a known technique for coating a thin film with another metal component on the metal surface, a detailed description thereof will be omitted.

For example, when the upper plate 10 and the lower plate 20 are made of metal to which plating is applied, the plating film 70 is formed on the metal surface and the inside of the vapor chamber 1 is not corroded by the working fluid, so that the corrosion resistance is excellent. There is an effect that the heat transport efficiency is not lowered, and the abrasion resistance and durability of the surface of the vapor chamber 1 are improved.

In this case, the plating layer 70 may be formed of any one selected from nickel (Ni), chromium (Cr), copper, zinc (Zn), and the like.

For example, when nickel is formed as the plating film 70 on the metal surface, uniformity is excellent and corrosion resistance is improved.

For example, when chromium is formed as the plating film 70 on the metal surface, there are advantages of excellent wear resistance and high corrosion resistance.

For example, when copper is formed as the plating film 70 on the metal surface, thermal conductivity is improved and corrosion resistance is excellent.

For example, when zinc is formed as the plating film 70 on the metal surface, there are various metals that can be treated, and there is an advantage of excellent corrosion resistance.

Therefore, when the plating film 70 is formed with any one selected from nickel, chromium, copper, and zinc, corrosion resistance is excellent, and thus, it may be suitable for the vapor chamber 1 to which water is applied as a working fluid.

Since the die casting is a known technique in which the metal is melted in a mold and forcibly cast under a high pressure, a detailed description thereof will be omitted.

For example, when the upper plate 10 and the lower plate 20 are manufactured with die-casting metal, the vapor chamber 1 can be reduced in weight and mass-produced, so that productivity is improved, and there is an excellent economical advantage.

The working fluid phase changes from liquid to gas in order to dissipate the heat generated by the applied product 2, or vice versa, a solvent in which a phase change occurs by absorbing or releasing heat while changing the phase may be used.

The solvent may be an inorganic solvent or an organic solvent, preferably water, acetone (CH ₃ COCH ₃ ), pentane (C ₅ H ₁₂ ), methanol (CH ₃ OH), ammonia (NH ₃ ), etc. may be used. have.

For example, when water is used as the working fluid, the amount of heat absorbed by the phase change is large, and there is an advantage of being environmentally friendly.

In addition, since water has superior latent heat than other solvents, a lot of heat can be dissipated through the vapor chamber 1, and it can be applied to products that do not catch fire and should not cause a fire.

On the other hand, when water reacts with aluminum or stainless steel among the metals described above, it is oxidized to cause corrosion, or when magnesium and water vapor react, it is oxidized and an explosion may occur.

Accordingly, in the present invention, as described above, the upper plate 10 and the lower plate 20 are made of metal treated by an anodizing or plating process, and as described above, the metal reacts with water and is oxidized to cause corrosion. Or, the problem that an explosion occurs can be improved.

Therefore, according to the present invention, an oxide film 60 or a plating film 70 is formed on the metal surface by using a metal treated by an anodizing or plating process for the upper plate 10 and the lower plate 20 of the vapor chamber 1 , so that the vapor chamber (1) The inside is not corroded so that the heat transport efficiency is not lowered, and at the same time, there is an effect that the abrasion resistance of the surface of the vapor chamber 1 is improved.

For example, when acetone, pentane, methanol, or ammonia is used as the working fluid, the vaporization point is relatively lower than that of water, and the temperature required for the application product 2 to be applied can be maintained.

In addition, when acetone, pentane, methanol or ammonia is used as the working fluid, in order to prevent reaction with the inner surfaces of the upper plate 10 and the lower plate 20 , the inner surfaces of the upper plate 10 and the lower plate 20 . Of course, it can be coated with an adhesive film 50 on the.

As shown in FIG. 2 , a plurality of wicks 30 may protrude inside the upper plate 10 and the lower plate 20 .

As shown in FIG. 3 , the vapor chamber 1 has a wick 30 included in the upper plate 10 and a wick 30 included in the lower plate 20 in contact with each other. By forming the column therein, the passage 35 of the working fluid may be formed.

At this time, the passage 35 is a plurality of passages as the plurality of wicks 30 included in the upper plate 10 and the lower plate 20 come into contact with each other so that the working fluid flows smoothly inside the vapor chamber 1 . (35) can be formed.

Accordingly, in the vapor chamber 1 , the working fluid in which the phase change is generated inside by the plurality of passages 35 may replace the capillary phenomenon.

As shown in FIG. 1 , the vapor chamber 1 may include a nozzle 40 as a passage 35 for injecting the working fluid into the vapor chamber 1 .

As shown in FIG. 2 , the nozzle 40 may be formed by being drawn into a groove 15 formed at inner ends of the upper plate 10 and the lower plate 20 .

In addition, the nozzle 40 may be a metal nozzle so that the inside of the vapor chamber 1 can be pinched off in order to be maintained in a vacuum state.

Here, as the metal nozzle, a metal such as copper, aluminum, stainless steel, or titanium may be used, and preferably, a copper metal nozzle advantageous for maintaining a vacuum state inside the vapor chamber 1 may be used, but is not particularly limited thereto.

In addition, in the vapor chamber 1, one or more layers of an adhesive film 50 are formed between the upper plate 10 and the lower plate 20, as shown in FIG. 2, so that the upper plate 10 and the lower plate 20 are bonded. It may be applied, and preferably 1 to 3 layers may be applied.

For example, when the adhesive film 50 is not applied between the upper plate 10 and the lower plate 20, a high-temperature (600° C. or higher) brazing process must be performed, so that the inside of the vapor chamber 1 is excessively melted. The passage 35 may not be formed.

Accordingly, when brazing is performed, thermal deformation is generated due to high temperature, so that it may be difficult to perform a function as the vapor chamber 1 .

Therefore, the present invention can improve the problem caused by the brazing process as described above by applying the adhesive film 50 between the upper plate 10 and the lower plate 20 to perform a low-temperature thermal fusion process.

For example, when one layer of the adhesive film 50 is applied, the adhesive film 50 may be applied to the inner surface edge of any one of the upper plate 10 or the lower plate 20 and the exposed surface of the wick 30 . .

For example, when two layers of the adhesive film 50 are applied, the adhesive film 50 may be applied to the inner surface edges of the upper plate 10 and the lower plate 20 and the exposed surface of the wick 30 , respectively.

For example, when the adhesive film 50 is applied in three layers, two layers of the adhesive film 50 are applied to the inner surface edge of any one of the upper plate 10 or the lower plate 20 and the exposed surface of the wick 30, One layer of the adhesive film 50 may be applied to the inner surface edge of the other of the upper plate 10 or the lower plate 20 and the exposed surface of the wick 30 .

The adhesive film 50 is a polymer composite adhesive film, polyethylene, unstretched polypropylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, Any one selected from polyamide and liquid crystal polymer may be used, but is not particularly limited thereto.

Accordingly, in the vapor chamber 1, since the adhesive film 50 is used, bonding of metals processed by anodizing, plating or die-casting is possible, and it is possible to maintain a vacuum state of the vapor chamber 1, and leakage occurs. There are advantages to not being.

In addition, in the vapor chamber 1, since the adhesive film 50 is used, a low-temperature thermal fusion process can be applied, so that thermal deformation of the metal does not occur, so that flatness is uniformly formed, and high vibration can be maintained. there is an effect

Here, the low-temperature thermal fusion process may be performed at a temperature of 200° C. or less and a pressure of 1 psi or less, and preferably at a temperature of 120 to 200° C. and a pressure of 0.3 to 0.6 psi.

For example, when a low-temperature heat-sealing process is performed at a temperature of more than 200°C or a pressure of more than 1 psi, the adhesive film 50 is pushed aside due to an excessively high temperature or pressure, resulting in adhesion strength and airtightness. Performance may be degraded.

In addition, due to a temperature of more than 200 ° C or a pressure condition of more than 1 psi, thermal deformation of the metal used in the vapor chamber 1 is generated, so that the flatness is not constant, so thermal resistance is generated, so that the heat dissipation efficiency of the vapor chamber 1 this may be lowered.

For example, when the low-temperature heat-sealing process is performed at a temperature of less than 120° C. or a pressure of less than 0.3 psi, the adhesive film 50 does not melt or does not adhere uniformly due to excessively low temperature or pressure, resulting in adhesion strength and airtightness. Performance may be degraded.

The following is a description of the manufacturing method of the vapor chamber (1).

The manufacturing method of the vapor chamber 1 includes a step in which the upper plate 10 and the lower plate 20 are pretreated, the upper plate 10 and the lower plate 20 are joined, a working fluid is injected, and the nozzle 40 is The sutured steps may be sequentially performed.

First, in the step of pre-treating the upper plate 10 and the lower plate 20 , any one or more processes in which the upper plate 10 and the lower plate 20 are anodizing, plating, or die-casting described above may be performed.

For example, in the step of pretreating the upper plate 10 and the lower plate 20, when the upper plate 10 and the lower plate 20 are anodized, an oxide film 60 is formed on the metal surface to improve corrosion resistance, abrasion resistance and durability. It works.

For example, in the step in which the upper plate 10 and the lower plate 20 are pretreated, when the upper plate 10 and the lower plate 20 are plated, the plating film 70 is formed on the metal surface to improve corrosion resistance, abrasion resistance and durability. has the effect of being

For example, in the step of pre-processing the upper plate 10 and the lower plate 20, when the upper plate 10 and the lower plate 20 are die-casting, there is an advantage in that the vapor chamber 1 can be reduced in weight and mass-produced.

For example, the step of pre-processing the upper plate 10 and the lower plate 20 is that when anodizing is performed after the upper plate 10 and the lower plate 20 are die-casting, weight reduction and mass production of the vapor chamber 1 are possible. At the same time, the oxide film 60 is formed on the metal surface, thereby improving corrosion resistance, abrasion resistance and durability.

For example, in the step of pre-processing the upper plate 10 and the lower plate 20, when plating is performed after the upper plate 10 and the lower plate 20 are die-casting, the vapor chamber 1 can be reduced in weight and mass-produced. At the same time, the plating film 70 is formed on the metal surface, thereby improving corrosion resistance, abrasion resistance and durability.

Next, the step of bonding the upper plate 10 and the lower plate 20 may be performed.

At this time, the step of bonding the upper plate 10 and the lower plate 20 may be arranged so that the upper plate 10 and the lower plate 20, which have been pre-treated through the pre-treated step, face each other.

Here, the upper plate 10 and the lower plate 20 are disposed so that the surfaces on which the wick 30 is formed face each other, and after applying one or more layers of the adhesive film 50 between the upper plate 10 and the lower plate 20 , The low-temperature heat-sealing process described may be performed.

Of course, a process of cooling the joined upper plate 10 and the lower plate 20 after the low-temperature thermal fusion process is performed may be additionally performed.

Next, the step of injecting the working fluid may be performed.

At this time, in the step of injecting the working fluid, the nozzle 40 is introduced into the groove 15 described above to maintain the inside of the joined upper plate 10 and the lower plate 20 in a primary vacuum state, and then, the nozzle 40 ) through which the working fluid described above can be injected.

Here, the nozzle 40 may be inserted into the groove 15 formed at the inner ends of the upper plate 10 and the lower plate 20 by the adhesive film 50 to be bonded thereto.

Next, a step of sealing the nozzle 40 may be performed.

At this time, in the step of sealing the nozzle 40, the inside of the upper plate 10 and the lower plate 20 into which the working fluid is injected is maintained in a secondary vacuum state, and then the nozzle 40 is sealed (pinch off) to the vapor chamber. (1) can be prepared.

In the vapor chamber 1 according to an embodiment of the present invention, the same points as those described above will be omitted, and different points will be mainly described.

The anodized vapor chamber 1 is manufactured in a vacuum state by overlapping the upper plate 10 and the lower plate 20 made of the anodized metal described above, and a working fluid may be accommodated therein.

As shown in FIG. 4 , in the anodized vapor chamber 1 , an oxide film 60 may be formed on the surface of the upper plate 10 and the surface of the lower plate 20 , respectively.

In addition, as shown in FIG. 4, the anodized vapor chamber 1 has an adhesive film 50 between the upper plate 10 on which the oxide film 60 is formed and the lower plate 20 on which the oxide film 60 is formed. can

At this time, when the low-temperature heat-sealing process described above is performed, as only the adhesive film 50 is melted, bonding between the anodized metals is possible, and a vacuum state inside the vapor chamber 1 can be maintained.

Furthermore, in the anodized vapor chamber 1, an oxide film 60 is formed on the surface of the upper plate 10 and the lower plate 20, respectively, so that the working fluid accommodated in the vapor chamber 1 reacts with the oxide film 60 It has the advantage that corrosion does not occur.

The following is a description of a method of manufacturing the anodized vapor chamber 1 , and may be performed in the same manner as the manufacturing method of the vapor chamber 1 described above.

However, in the step of pretreating the upper plate 10 and the lower plate 20 in the manufacturing method of the vapor chamber 1, the upper plate 10 and the lower plate 20 are anodized to form an oxide film 60 on the metal surface. have.

Accordingly, in the anodized vapor chamber 1, as shown in FIG. 4, an oxide film 60 is formed on the surfaces of the upper plate 10 and the lower plate 20, respectively, so that corrosion resistance, abrasion resistance and durability are improved. have.

Thereafter, the above-described steps of bonding the upper plate 10 and the lower plate 20 , injecting a working fluid, and sealing the nozzle 40 may be sequentially performed.

In the vapor chamber 1 according to another embodiment of the present invention, the same points as those described above will be omitted, and different points will be mainly described.

The plated vapor chamber 1 is manufactured in a vacuum state by overlapping the upper plate 10 and the lower plate 20 made of the plated metal described above, and a working fluid may be accommodated therein.

As shown in FIG. 5 , in the plated vapor chamber 1 , a plating film 70 may be formed on the surface of the upper plate 10 and the surface of the lower plate 20 , respectively.

In addition, as shown in FIG. 5 , in the vapor chamber 1 subjected to plating, an adhesive film 50 is formed between the upper plate 10 on which the plated film 70 is formed and the lower plate 20 on which the plated film 70 is formed. can be formed.

At this time, when the low-temperature heat-sealing process described above is performed, as only the adhesive film 50 is melted, bonding between the plated metals is possible, and a vacuum state inside the vapor chamber 1 can be maintained.

Furthermore, since the plating film 70 is formed on the surface of the upper plate 10 and the lower plate 20 in the vapor chamber 1 subjected to plating, the working fluid accommodated in the vapor chamber 1 is the plating film 70 . There is an advantage that corrosion does not occur because it does not overreact.

The following is a description of a method of manufacturing the vapor chamber 1 having been plated, and may be performed in the same manner as the method of manufacturing the vapor chamber 1 described above.

However, in the step of pre-processing the upper plate 10 and the lower plate 20 in the manufacturing method of the vapor chamber 1, the upper plate 10 and the lower plate 20 are plated to form a plating film 70 on the metal surface. can

Accordingly, as shown in FIG. 5, the plating film 70 is formed on the surface of the upper plate 10 and the lower plate 20, respectively, in the vapor chamber 1 having been plated, so that corrosion resistance, abrasion resistance and durability are improved. there is

Thereafter, the above-described steps of bonding the upper plate 10 and the lower plate 20 , injecting a working fluid, and sealing the nozzle 40 may be sequentially performed.

In the vapor chamber 1 according to another embodiment of the present invention, the same points as those described above will be omitted, and different points will be mainly described.

The die-casting process vapor chamber 1 is manufactured in a vacuum state by overlapping the upper plate 10 and the lower plate 20 on which the die-casting is performed as described above, and a working fluid may be accommodated therein.

In addition, in the die-casting-treated vapor chamber 1 , an adhesive film 50 may be formed between the upper plate 10 and the lower plate 20 on which the die-casting is performed.

At this time, when the low-temperature heat-sealing process described above is performed, as only the adhesive film 50 is melted, bonding between the metals on which the die-casting is performed is possible, and a vacuum state inside the vapor chamber 1 can be maintained.

Moreover, the die-casting processed vapor chamber 1 has the advantage of being lightweight and mass-produced.

The following is a description of a method for manufacturing the die-casting process of the vapor chamber 1 , and may be performed in the same manner as the manufacturing method of the vapor chamber 1 described above.

However, in the step of pre-processing the upper plate 10 and the lower plate 20 in the manufacturing method of the vapor chamber 1 , the upper plate 10 and the lower plate 20 may be die-casting.

Accordingly, the die-casting treatment of the vapor chamber 1 may be possible to reduce the weight and mass production of the vapor chamber (1).

Thereafter, the above-described steps of bonding the upper plate 10 and the lower plate 20 , injecting a working fluid, and sealing the nozzle 40 may be sequentially performed.

In the vapor chamber 1 according to another embodiment of the present invention, the same points as those described above will be omitted, and different points will be mainly described.

The following is a description of a method of manufacturing the vapor chamber 1 that is anodized after die casting is performed, and may be performed in the same manner as the manufacturing method of the vapor chamber 1 described above.

However, in the step of pre-processing the upper plate 10 and the lower plate 20 in the manufacturing method of the vapor chamber 1 , the upper plate 10 and the lower plate 20 described above may be manufactured by die casting.

Thereafter, the upper plate 10 and the lower plate 20 manufactured by die casting are anodized to form an oxide film 60 on the surfaces of the upper plate 10 and the lower plate 20 manufactured by die casting, respectively, and the upper plate 10 and the lower plate An adhesive film 50 may be formed between the 20 .

As the adhesive film 50 is melted by the low-temperature thermal fusion process described above, bonding between the anodized metals is possible after die casting is performed, and a vacuum state inside the vapor chamber 1 can be maintained.

Accordingly, as the vapor chamber 1 can be applied to die casting, weight reduction and mass production are possible, and at the same time, anodizing can be applied, so that the oxide film 60 is formed on the metal surface, so corrosion resistance, abrasion resistance and durability are improved. There is this.

Thereafter, the above-described steps of bonding the upper plate 10 and the lower plate 20 , injecting a working fluid, and sealing the nozzle 40 may be sequentially performed.

In the vapor chamber 1 according to another embodiment of the present invention, the same points as those described above will be omitted, and different points will be mainly described.

The following is a description of a method of manufacturing the vapor chamber 1 , which is plated after die casting is performed, and may be performed in the same manner as the manufacturing method of the vapor chamber 1 described above.

However, in the step of pre-processing the upper plate 10 and the lower plate 20 in the manufacturing method of the vapor chamber 1 , the upper plate 10 and the lower plate 20 described above may be manufactured by die casting.

Thereafter, the upper plate 10 and the lower plate 20 manufactured by die casting are plated to form a plating film 70 on the surfaces of the upper plate 10 and the lower plate 20 manufactured by die casting, respectively, and the upper plate 10 and the lower plate An adhesive film 50 may be formed between the 20 .

As the adhesive film 50 is melted by the low-temperature thermal fusion process described above, bonding between the plated metals is possible after die casting is performed, and a vacuum state inside the vapor chamber 1 can be maintained.

Accordingly, in the vapor chamber 1, as die casting is applicable, weight reduction and mass production are possible, and at the same time, plating is possible, so that the plating film 70 is formed on the metal surface. There is this.

Thereafter, the above-described steps of bonding the upper plate 10 and the lower plate 20 , injecting a working fluid, and sealing the nozzle 40 may be sequentially performed.

As shown in FIG. 6 , the vapor chamber 1 according to the embodiment described above may be disposed in contact with one or more surfaces of the applied product 2 .

The applied product 2 may include a transport device, an electronic product, a thermoelectric device, a light emitting device, an autonomous transport device, or a radar chip, but is not particularly limited thereto.

For example, the transportation device may include a battery, a motor, an electronic control box, a display-type instrument panel, a vehicle semiconductor, etc. included in a vehicle, but is not limited thereto.

For example, the electronic product may include, but is not limited to, a battery, a semiconductor, a display, etc. included in a product using electrons.

For example, the electronic product may be included in a battery included in a smartphone, a notebook computer, a semiconductor, or the like, or included in a panel included in a television (TV).

For example, as the thermoelectric element includes a thermoelectric semiconductor, household (dehumidifier, water purifier, vending machine, refrigerator, air conditioner, vehicle cooler, etc.), industrial (machine tool substrate cooling, distribution panel cooler, calorimeter, semiconductor equipment, etc.), Aviation (black box cooling system, avionics control system cooling equipment, heat control device, etc.), space use (generator, heat generator, cooler, etc.), military use (infrared detector, missile induction circuit cooler, laser observation equipment, etc.), It may be applicable for research (thermostat, thermostat heater, cooling device, etc.), medical device (thermostat, blood storage device, heat generator cooling, etc.), but is not limited thereto.

For example, the light emitting device may include a light emitting diode (LED).

For example, a radar chip is included in a radar printed circuit board of a sensor system that uses electromagnetic waves to determine the direction and distance of an object to process radio signals, and autonomous driving may be possible by incorporating artificial intelligence (AI) technology .

As shown in FIG. 6 , the upper surface of the applied product 2 may be placed in contact with the lower surface of the vapor chamber 1 , and the reverse arrangement is possible, of course.

At this time, the size of the vapor chamber (1) may be formed larger than the applied product (2), or may be formed to be the same.

Here, when the size of the vapor chamber 1 is formed larger than the applied product 2, or is formed to be the same, the vapor chamber 1 that does not come into contact with the applied product 2 is generated from the applied product 2 It can dissipate heat.

The following is a description of the process in which the vapor chamber (1) is attached to the applied product (2) and heat is transferred.

As shown in FIG. 6 , when heat is generated in the applied product 2 , the heat may be transferred to the vapor chamber 1 through the surface attached to the applied product 2 .

At this time, the heat may be generated by evaporating the liquid-state working fluid accommodated in one side of the vapor chamber 1 as shown by arrow a1 in FIG. 6 .

The vapor may diffuse heat to the upper surface of the vapor chamber 1 along the passage 35 as shown by arrow a2 in FIG. 6 and at the same time, heat may be uniformly dissipated.

As the heat is dissipated through the vapor chamber 1 , as indicated by arrow a3 shown in FIG. 6 , vapor is condensed in the other side of the vapor chamber 1 to generate a working fluid in a liquid state.

At this time, the working fluid in the liquid state may be refluxed in the direction of the applied product 2 as shown by arrow a4 in FIG. 6 .

Here, by replacing the capillary phenomenon through the wick 30 included in the vapor chamber 1 , cooling of the applied product 2 through reflux and heat dissipation of the working fluid may be possible.

As shown in FIG. 6 , as the vapor chamber 1 is placed in contact with the applied product 2 , by efficiently dissipating the heat generated from the applied product 2 , the applied product 2 by heat generation There is an advantage that the efficiency does not decrease.

The vapor chamber 1 according to the embodiment described above may be disposed between the application product 2 and the cooling plate 3 , as shown in FIG. 7 .

The cooling plate 3 may be air-cooled or water-cooled to which a known technology is applied, but is not limited thereto.

The lower surface of the applied product 2 may be disposed in contact with the upper surface of the vapor chamber 1 with respect to the vapor chamber 1, and the upper surface of the cooling plate 3 may be disposed in contact with the lower surface of the vapor chamber 1, , of course, the reverse arrangement is possible.

As shown in Figure 7, as the vapor chamber 1 is disposed between the applied product 2 and the cooling plate 3, through the cooling plate 3 disposed in contact with the lower surface of the vapor chamber 1, There is an advantage in that the efficiency of the applied product 2 due to heat generation is not lowered by dissipating the heat generated from the applied product 2 more efficiently.

The present invention is a vapor chamber using anodizing, plating or die-casting treated metal and a manufacturing method and application thereof. Industrial use capable of bonding anodized, plated or die-casting metal possible invention.

Claims (8)

Overlap the upper and lower plates made of metal processed by any one or more processes selected from anodizing or die-casting,
The vapor chamber includes a polymer adhesive film between the upper and lower plates so that the flatness of the metal is uniformly formed by a low-temperature thermal fusion process at a temperature of 120 to 200°C and a pressure of 0.3 to 0.6 psi, manufactured in a vacuum becomes,
A wick is included inside the upper or lower plate to form a passage for the working fluid accommodated in the vapor chamber,
A nozzle for injecting the working fluid into the vapor chamber is included,
A vapor chamber, characterized in that an oxide film is formed on the surface of the metal treated by an anodizing process to have corrosion resistance inside the vapor chamber by the working fluid, and the abrasion resistance and durability of the surface of the vapor chamber are improved. delete delete delete An article comprising the vapor chamber of claim 1 . 6. The method of claim 5,
The product is a product including a vapor chamber, characterized in that it includes a transport device, an electronic product, a thermoelectric device, a light emitting device, an autonomous transport device or a radar chip. pretreatment of the upper plate and the lower plate;
bonding the upper plate and the lower plate;
a step in which a working fluid is injected; and
a step in which the nozzle is sealed; is included,
In the step of pre-treating the upper plate and lower plate, any one or more processes selected from anodizing or die-casting are performed,
In the step of bonding the upper and lower plates, a polymer adhesive film is included between the pre-treated upper and lower plates so that the flatness of the metal is constant by a low-temperature thermal fusion process at a temperature of 120 to 200 °C and a pressure of 0.3 to 0.6 psi. is formed,
An oxide film is formed on the metal surface of the upper and lower plates treated by anodizing process, so that the inside of the vapor chamber has corrosion resistance by the working fluid, and the abrasion resistance and durability of the vapor chamber surface are improved. Way. delete

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