CN114058286A - Plug-in heat-conducting elastomer and preparation method thereof - Google Patents
Plug-in heat-conducting elastomer and preparation method thereof Download PDFInfo
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- CN114058286A CN114058286A CN202011224164.4A CN202011224164A CN114058286A CN 114058286 A CN114058286 A CN 114058286A CN 202011224164 A CN202011224164 A CN 202011224164A CN 114058286 A CN114058286 A CN 114058286A
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- 229920001971 elastomer Polymers 0.000 title claims abstract description 50
- 239000000806 elastomer Substances 0.000 title claims abstract description 50
- 238000002360 preparation method Methods 0.000 title description 11
- 239000012790 adhesive layer Substances 0.000 claims abstract description 90
- 239000010410 layer Substances 0.000 claims abstract description 61
- 238000007493 shaping process Methods 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- -1 polyethylene terephthalate Polymers 0.000 claims description 19
- 230000017525 heat dissipation Effects 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 239000004698 Polyethylene Substances 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 11
- 239000004743 Polypropylene Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 11
- 229920000573 polyethylene Polymers 0.000 claims description 11
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 11
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 11
- 229920001721 polyimide Polymers 0.000 claims description 11
- 229920001155 polypropylene Polymers 0.000 claims description 11
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 229920002312 polyamide-imide Polymers 0.000 claims description 5
- 229920000515 polycarbonate Polymers 0.000 claims description 5
- 239000004417 polycarbonate Substances 0.000 claims description 5
- 239000004814 polyurethane Substances 0.000 claims description 5
- 239000004800 polyvinyl chloride Substances 0.000 claims description 5
- 239000005033 polyvinylidene chloride Substances 0.000 claims description 5
- 239000004831 Hot glue Substances 0.000 claims description 4
- 238000012546 transfer Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract description 7
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- 229910002804 graphite Inorganic materials 0.000 description 8
- 239000010439 graphite Substances 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 239000000499 gel Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 238000004513 sizing Methods 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000004826 seaming Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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Abstract
The invention provides a plug-in heat-conducting elastomer, which is positioned between a heating body and a heat radiating piece and comprises a heat-conducting adhesive layer and a shaping layer. The heat conductive adhesive layer can transfer heat in the XYZ direction, so that heat can be transferred through the shortest path. The shaping layer surrounds the outer surface of the heat-conducting adhesive layer and is provided with a plurality of chamfers or fillets, so that the obstruction of the heat-conducting elastic body in plugging and unplugging can be reduced. The pluggable heat-conducting elastomer of the invention is a heat-conducting elastomer which can be obliquely plugged and unplugged and has good heat transfer effect.
Description
Technical Field
The present invention relates to a heat conductive elastomer, and more particularly, to a pluggable heat conductive elastomer.
Background
Light and thin electronic devices (such as notebook computers, mobile phones, flat panel televisions, and the like) generate a large amount of heat during use. Heat generated by the electronic device needs to be dissipated immediately or components inside the product may fail or be inoperative, possibly shortening the life of the electronic device or causing a fire. In order to achieve a good heat dissipation effect of the electronic device, a heat conduction element is usually added between the electronic component (i.e., the heating element) and the heat dissipation element, and the heat conduction element directly contacts the surfaces of the electronic component and the heat dissipation element, so as to increase the heat conduction efficiency from the electronic component to the heat dissipation element. However, in the very limited internal space of the slim electronic device, the space between the heating element and the heat sink is narrow, so it is not easy to add the heat conducting element with a fixed shape.
In order to solve the problem of heat dissipation in a narrow space of an electronic device, the compounds of the thermally conductive silicone gel sold in the market are scattered and spread due to heat and pressure. The heat-conducting silica gel with the micromolecule structure can fill up more tiny gaps and gaps. They further increase the heat transfer area between the processor and the heat sink. Generally, the conventional heat conductive silica gel exists in the form of liquid or viscous liquid. It is not always easy to open the enclosure and remove the heat sink from the processor for a long period of time. Therefore, it is necessary to provide the heat conductive silicone rubber with long-term stability and reliability. The heat conduction and heat exchange between the processor and the radiator can be continuously carried out in a relatively long period. However, in order to achieve good thermal conductivity and fluid properties, water or other liquids are typically found in thermally conductive silicone gels. When these liquids are volatilized and evaporated over time, the thermally conductive silicone gel is solidified, and voids are formed between the molecules of the thermally conductive silicone gel. Therefore, the heat conductive silica gel is damaged and is not reusable.
The thermally conductive elastomer of the prior art US 2014/0332193 a1 is chamfered, however, it is structured such that a graphite layer surrounds the elastomer. The elastomer is not thermally conductive, since it serves only as a support. It can be seen from this that the conventional technique US 2014/0332193 a1 can transfer heat only in the XY plane of the graphite layer, and the heat transfer effect is extremely poor in the vertical direction of the graphite layer, so that the heat transfer paths are distributed only along the surface of the heat transfer elastic body, thereby reducing the heat transfer effect of the heat transfer elastic body. Furthermore, the graphite layers have the major disadvantage of relatively low mechanical strength and of being easily broken. The graphite layer can conduct electricity as well as heat, so that the use of the graphite layer as a heat conducting material requires the use of other insulating materials to overcome the problem of electricity conduction.
Disclosure of Invention
Technical problem to be solved
Accordingly, the productivity and competitiveness of the electronic industry can be greatly enhanced for developing a heat-conducting elastomer with good heat conduction and easy insertion and extraction in a narrow space.
(II) technical scheme
In view of the above problems and reasons to be solved, the present invention provides a plug-in thermal conductive elastomer, which includes a thermal conductive adhesive layer and a shaping layer. Above-mentioned design layer centers on above-mentioned heat-conducting adhesive layer's surface, and above-mentioned design layer has a plurality of chamfers or fillet, and has certain pliability, and surperficial static friction coefficient is low, can stand certain plug power, and at heat-conducting elastomer plug in-process, design layer itself can not take place fold, impale, protects the heat-conducting adhesive layer not influenced by plug power simultaneously. The shaping layer has certain flexibility, so that the heat-conducting elastomer can be easily filled in a gap between the two components during plugging.
According to another embodiment of the present invention, the thermal conductive adhesive layer includes an adhesive layer and thermal conductive ceramic powder. The heat-conducting ceramic powder is dispersed in the adhesive layer.
According to another embodiment of the present invention, the adhesive layer is a thermal conductive silicone or a non-silicone type thermal conductive adhesive.
According to another embodiment of the present invention, the material of the heat conductive ceramic powder may be, for example, aluminum oxide, zinc oxide, magnesium oxide, aluminum hydroxide, aluminum nitride, silicon nitride, graphite, boron nitride, carbon fiber, metal powder material (such as aluminum powder, iron powder, copper powder, etc.), or any combination thereof.
According to another embodiment of the present invention, the thickness of the thermal conductive adhesive layer is greater than 0.3 mm.
According to another embodiment of the present invention, the material of the shaping layer is polyethylene terephthalate (PET), Polyethylene (PE), polypropylene (PP), Ethylene Vinyl Acetate (EVA), polyvinyl chloride (PVC), Polyimide (PI), polyvinylidene chloride (PVDC), Polyurethane (PU), Polycarbonate (PC), polyamide-imide (PAI) resin, acrylic resin, or any combination thereof.
According to another embodiment of the present invention, the thickness of the patterned layer is 8 μm to 100 μm.
According to another embodiment of the present invention, the pluggable thermal conductive elastomer further includes an adhesive layer for adhering the stacked thermal conductive adhesive layers.
According to another embodiment of the present invention, the adhesive layer is a hot melt adhesive or a liquefied resin adhesive.
The invention provides a preparation method of a plug-in heat-conducting elastomer, which comprises the steps of firstly placing a heat-conducting adhesive layer on a shaping layer, and then folding the shaping layer and the heat-conducting adhesive layer into a shape, wherein the shape is provided with a plurality of chamfers or fillets.
According to another embodiment of the present invention, the method further includes coating an adhesive layer on the thermal conductive adhesive layer.
According to another embodiment of the present invention, the shape is a folded or double-folded shape.
According to another embodiment of the present invention, the thermal conductive adhesive layer used in the method includes an adhesive layer and a thermal conductive ceramic powder, wherein the thermal conductive ceramic powder is dispersed in the adhesive layer.
According to another embodiment of the present invention, the material of the shaping layer used in the above method is polyethylene terephthalate (PET), Polyethylene (PE), polypropylene (PP), Ethylene Vinyl Acetate (EVA), polyvinyl chloride (PVC), Polyimide (PI), polyvinylidene chloride (PVDC), Polyurethane (PU), Polycarbonate (PC), polyamide-imide (PAI) resin, acrylic resin, or any combination thereof.
(III) advantageous effects
As described above, the heat conductive adhesive layer of the plug-in heat conductive elastomer can transmit heat in the XYZ direction, so that heat can be transmitted through the shortest path. The shaping layer is provided with a plurality of chamfers or fillets, so that the obstruction of the heat-conducting elastic body in plugging and unplugging can be reduced. Therefore, the pluggable heat-conducting elastomer can be obliquely (easily) plugged and unplugged, and has a good heat transfer effect. In addition, the preparation method of the pluggable heat-conducting elastomer is a simple and fast preparation method, and does not need to use a large amount of materials and equipment.
Drawings
In order to make the aforementioned and other objects, features, advantages and embodiments of the invention more comprehensible, the following description is given:
fig. 1A-2B are schematic perspective views respectively illustrating a pluggable thermal elastomer according to some embodiments of the present invention;
FIGS. 3A and 3B are schematic flow charts illustrating a method for preparing a pluggable thermal elastomer according to some embodiments of the present invention;
fig. 4A and 4B are top views illustrating the application of an adhesive layer on a thermal conductive adhesive layer according to some embodiments of the invention.
Description of the reference numerals
100a, 100b, 105a, 105 b: a plug-in heat-conducting elastomer;
110: a heat-conducting adhesive layer;
111: a glue layer;
112: a thermally conductive ceramic powder;
120: a shaping layer;
125a, 125 b: seaming;
130: an adhesive layer;
201-203: and (5) carrying out the following steps.
Detailed Description
For the purpose of understanding the features, contents and advantages of the present invention, the present invention will be described in detail with reference to the following embodiments, wherein the drawings are used for illustrative purposes and for supporting the specification, and are not necessarily to scale and precise arrangements after the practice of the present invention, and the appended drawings are not to be construed as limiting the scope of the present invention in any way.
Reference is made to the accompanying drawings for a description of a desired embodiment in accordance with the present invention. The same components are denoted by the same reference numerals, and repeated description of the same components is omitted.
Please refer to FIG. 3A, and also refer to FIGS. 1A-1B. Fig. 3A is a flow chart illustrating a method for preparing a plug-in thermal conductive elastomer according to some embodiments of the invention. Fig. 1A-1B are schematic perspective views illustrating a pluggable thermal elastomer according to some embodiments of the invention.
In step 201 of fig. 3A, a thermal conductive adhesive layer 110 with an appropriate size is disposed on a sizing layer 120 with an appropriate size. The length of the sizing layer 120 is, for example, at least twice the length of the thermal conductive adhesive layer 110.
In step 203 of fig. 3A, the molding layer 120 is folded over the thermal conductive adhesive layer 110 to cover the thermal conductive adhesive layer 110, so as to form the pluggable thermal conductive elastomers 100a and 100B having a plurality of chamfers (C-corners) or rounded corners (R-corners) as shown in fig. 1A-1B. Fig. 1A and 1B are different in the folding manner of the plug-in thermal conductive elastomer 100a and the plug-in thermal conductive elastomer 100B during the preparation process. In fig. 1A, the fixing layer 120 is folded in such a manner that the left and right sides are partially folded, and a seam 125a is formed above the thermal conductive adhesive layer 110. In fig. 1B, the shaping layer 120 is folded in a direct manner.
In use, the pluggable thermal conductive elastic bodies 100a and 100b are located between the heat generating body (not shown) and the heat dissipating member (not shown), and directly contact the heat generating body and the heat dissipating member at the same time. Since the insertion-removal type heat conductive elastic bodies 100a and 100b have a plurality of chamfers or fillets, the insertion-removal operation between the heat generating body and the heat sink can be easily performed.
In addition, the setting layer 120 has a certain wear resistance index, flexibility, and a surface having a low static friction coefficient. Due to the characteristics, the obstruction of the heat-conducting elastic bodies 100a and 100b in the inserting and pulling process can be reduced, so that even if the heat-conducting elastic bodies are inserted and pulled for multiple times, the shaping layer 120 itself cannot be wrinkled or pierced, and meanwhile, the heat-conducting adhesive layer 110 can be protected from the influence of inserting and pulling force. The shaping layer 120 has a certain flexibility, so that the pluggable heat-conducting elastomers 100a and 100b can be filled in a narrow space between the heating element and the heat dissipation element and fully and directly contact the heating element and the heat dissipation element, so that heat generated by the heating element can be transmitted to the heat dissipation element in real time and dissipated.
In the above manufacturing method, according to an embodiment of the present invention, the material of the fixing layer 120 may be, for example, polyethylene terephthalate (PET), Polyethylene (PE), polypropylene (PP), Ethylene Vinyl Acetate (EVA), polyvinyl chloride (PVC), Polyimide (PI), polyvinylidene chloride (PVDC), Polyurethane (PU), Polycarbonate (PC), polyamide-imide (PAI) resin, acrylic resin, or any combination thereof. According to another embodiment of the present invention, the thickness of the patterned layer 120 is 8 μm to 100 μm, such as 8 μm, 9 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm or 100 μm. If the thickness of the setting layer 120 is less than 8 μm, it will not be enough to protect the thermal conductive adhesive layer 110. If the thickness of the patterned layer 120 is greater than 100 μm, the thermal conductive adhesive layer 110 may not have a sufficient thickness in a limited space, and the thermal conductive efficiency may be reduced.
According to another embodiment of the present invention, the thermal conductive adhesive layer 110 includes an adhesive layer 111 and a thermal conductive ceramic powder 112. The heat conductive ceramic powder 112 is dispersed in the adhesive layer 111.
According to another embodiment of the present invention, the thermal conductivity K of the adhesive layer 111 may be 0.1W/mK to 30.0W/mK, and the heat resistant temperature thereof may be 120 ℃ or higher. According to an embodiment, the heat resistant temperature of the adhesive layer 111 may be above 150 ℃. According to another embodiment of the present invention, the material of the adhesive layer 111 may be, for example, a thermally conductive silicone (silicon) or a non-silicon type thermally conductive adhesive.
According to another embodiment of the present invention, the material of the thermally conductive ceramic powder 112 is aluminum oxide, zinc oxide, magnesium oxide, aluminum hydroxide, aluminum nitride, boron nitride, silicon nitride, graphite, boron nitride, carbon fiber, metal powder material (such as aluminum powder, iron powder, copper powder, etc.), or any combination thereof.
According to another embodiment of the present invention, the main purpose of the heat conductive adhesive layer 110 is to increase the heat conduction efficiency from the surface of the heating element to the heat dissipation member. The thickness of the thermal conductive adhesive layer 110 is greater than 0.3mm, such as 0.3mm to 50.0mm, such as 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 5.0mm, 10.0mm, 15.0mm, 20.0mm, 25.0 mm, 30.0mm, 35.0mm, 40.0mm, 45.0mm, 50.0mm, and the like.
The present invention provides another preparation method, please refer to fig. 3B. FIG. 3B is a flow chart illustrating a method for preparing a pluggable thermal elastomer according to an embodiment of the invention. Fig. 3B differs from fig. 3A by the addition of a step 202, the remaining steps and materials being the same, as described in detail below.
In step 201 of fig. 3B, the thermal conductive adhesive layer 110 is disposed on the shaping layer 120.
In step 202 of fig. 3B, an adhesive layer 130 may be optionally coated on the thermal conductive adhesive layer 110, and the adhesive layer is uniformly coated and does not have air bubbles.
According to another embodiment of the present invention, the adhesive layer 130 is applied in an area as shown in fig. 4A, and fig. 4A is a top view illustrating the application of the adhesive layer on the thermal conductive adhesive layer according to an embodiment of the present invention. In fig. 4A, the adhesive layer 130 covers only an area of the middle portion of the thermal conductive adhesive layer 110. According to another embodiment of the present invention, if the material of the adhesive layer 111 itself has adhesiveness (self-adhesiveness), the adhesive layer 130 is not needed, i.e. the thermal adhesive layer 110 can be adhered by itself. Finally, step 203 is performed to fold the pluggable thermal conductive elastomer into a schematic three-dimensional structure as shown in fig. 1A-1B. In fig. 1A, the fixing layer 120 and the thermal conductive adhesive layer 110 are folded in such a way that the left and right sides are partially folded, and a seam 125a is formed above the thermal conductive adhesive layer 110. In fig. 1B, the fixing layer 120 and the thermal conductive adhesive layer 110 are folded directly in half, and a seam 125B is formed on the side of the thermal conductive adhesive layer 110. Because the adhesive layer 130 is covered by the thermal conductive adhesive layer 110 or the adhesive layer 130 is not used, the pluggable thermal conductive elastomers 100a and 100b are two-layer structures in appearance, the outer surface is the shaping layer 120 and the inner surface is the thermal conductive adhesive layer 110.
According to another embodiment of the present invention, the adhesive layer 130 is applied in an area as shown in fig. 4B, and fig. 4B is a top view illustrating the application of the adhesive layer on the thermal conductive adhesive layer according to an embodiment of the present invention. The adhesive layer 130 covers the entire area of the thermal conductive adhesive layer 110. Finally, step 203 is performed to fold the pluggable thermal conductive elastomer into a schematic three-dimensional structure as shown in fig. 2A-2B. From the appearance, the pluggable thermal conductive elastic bodies 105a and 105b have a three-layer structure, the outer layer is the shaping layer 120, the middle layer is the thermal conductive adhesive layer 110, and the innermost layer is the adhesive layer 130.
In step 203 of fig. 3B, the patterned layer 120 and the thermal conductive adhesive layer 110 are folded to form the pluggable thermal conductive elastomers 100a, 100B, 105a, 105B with a plurality of chamfers (C-corners) or rounded corners (R-corners) as shown in fig. 1A-2B. The differences between FIG. 1A and FIG. 1B are already described in paragraph [26] of the present specification, and thus are not described again. Fig. 2A and fig. 2B are different in the folding manner of the pluggable thermal conductive elastomers 105a and 105B during the preparation process. In fig. 2A, the fixing layer 120 and the thermal conductive adhesive layer 110 are folded in such a way that the left and right sides are partially folded, and a seam 125a is formed above the thermal conductive adhesive layer 110. In fig. 2B, the fixing layer 120 and the thermal conductive adhesive layer 110 are folded directly in half, and a seam 125B is formed on the side of the thermal conductive adhesive layer 110. In use, the pluggable heat conductive elastic bodies 105a and 105b are also located between the heat generating body (not shown in the figure) and the heat dissipating member (not shown in the figure) and directly contact the heat generating body and the heat dissipating member at the same time. Since the insertion-removal heat conductive elastic bodies 105a and 105b have a plurality of chamfers or fillets, the insertion-removal operation between the heat generating body and the heat sink can be easily performed.
The adhesive layer 130 is a hot melt adhesive or a liquefied resin adhesive. According to another embodiment of the present invention, the above hot melt adhesive is formed of any one of ethylene vinyl acetate, polyisobutylene, polyamide, polyethylene terephthalate, polypropylene, polyester, polyimide, and polyethylene. The liquefied resin adhesive may be, for example, silicone, epoxy, acryl, or the like. According to another embodiment of the present invention, the thickness of the adhesive layer 130 ranges from 0.01mm to 0.9mm, such as 0.01mm, 0.02mm, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and other different thicknesses.
According to another embodiment of the present invention, the overall thermal conductivity K of the pluggable thermal conductive elastomers 100a, 100b, 105a, 105b is 0.1W/mK to 30W/mK.
According to another embodiment of the present invention, the preparation method may use a bonding device, and the sizing layer 120, the thermal conductive adhesive layer 110 and the adhesive layer 130 are sequentially placed in the bonding device and folded into a shape by the bonding device. The bonding apparatus may be operated at, for example, 25 ℃ and a pressure of 1-100 psi. One of the outermost layers of the shaping layer 120 is pasted with double-sided adhesive tape and fixed on the bonding device, so that the pluggable thermal conductive elastomers 100a, 100b, 105a, 105b will not be displaced.
In summary, the present invention provides a plug-in heat conductive elastomer capable of transferring heat in XYZ directions, so that the shortest path can be used for heat transfer. The shaping layer is provided with a plurality of chamfers or fillets, so that the friction force during plugging can be reduced. The plug-in heat-conducting elastomer of the present invention is a heat-conducting elastomer which can be easily plugged in and out and has a good heat-conducting effect. The preparation method of the plug-in heat-conducting elastomer provided by the invention is a simple and rapid preparation method, and does not need a large amount of materials and equipment.
While the foregoing is directed to embodiments of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Claims (13)
1. A pluggable thermally conductive elastomer comprising:
a heat-conducting adhesive layer; and
the shaping layer surrounds the outer surface of the heat-conducting glue layer and is provided with a plurality of chamfers or fillets, wherein the plug-in heat-conducting elastic body is positioned between the heating body and the heat dissipation piece and directly contacts the heating body and the heat dissipation piece at the same time.
2. The pluggable thermal elastomer of claim 1, further comprising an adhesive layer for adhering the stacked thermal adhesive layers.
3. The pluggable thermally conductive elastomer according to claim 2, wherein the adhesive layer is a hot melt adhesive or a liquefied resin adhesive.
4. The pluggable thermally conductive elastomer of claim 1, wherein the thermally conductive adhesive layer comprises:
a glue layer; and
the heat conducting ceramic powder is dispersed in the glue layer.
5. The pluggable thermal elastomer of claim 4, wherein the adhesive layer is made of a thermally conductive silicone or a non-silicone type thermally conductive adhesive.
6. The pluggable thermal elastomer of claim 1, wherein the thickness of the thermal adhesive layer is greater than 0.3 mm.
7. The pluggable thermal elastomer of claim 1, wherein the setting layer is made of polyethylene terephthalate (PET), Polyethylene (PE), polypropylene (PP), Ethylene Vinyl Acetate (EVA), polyvinyl chloride (PVC), Polyimide (PI), polyvinylidene chloride (PVDC), Polyurethane (PU), Polycarbonate (PC), polyamide-imide (PAI) resin, acrylic resin, or any combination thereof.
8. The pluggable thermal elastomer of claim 1, wherein the thickness of the patterned layer is 8 μm to 100 μm.
9. A method for preparing a plug-in heat-conducting elastomer comprises the following steps:
placing the heat-conducting glue layer on the shaping layer; and
the shaping layer and the heat-conducting adhesive layer are folded into a shape, wherein the shape is provided with a plurality of chamfers or fillets, and the plug-in heat-conducting elastomer is positioned between the heating body and a heat dissipation piece and is directly contacted with the heating body and the heat dissipation piece at the same time.
10. The method as claimed in claim 9, further comprising applying an adhesive layer on the thermal conductive layer.
11. The method of claim 9, wherein the shape is a folded or double folded shape.
12. The method as claimed in claim 9, wherein the thermal conductive adhesive layer comprises an adhesive layer and thermal conductive ceramic powder dispersed in the adhesive layer.
13. The method of claim 9, wherein the fixing layer is made of polyethylene terephthalate (PET), Polyethylene (PE), polypropylene (PP), Ethylene Vinyl Acetate (EVA), polyvinyl chloride (PVC), Polyimide (PI), polyvinylidene chloride (PVDC), Polyurethane (PU), Polycarbonate (PC), polyamide-imide (PAI) resin, acrylic resin, or any combination thereof.
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US20030128519A1 (en) * | 2002-01-08 | 2003-07-10 | International Business Machine Corporartion | Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using same |
CN103797903A (en) * | 2012-07-31 | 2014-05-14 | Lg电子株式会社 | Heat conductive elastic body |
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CN108471702A (en) * | 2018-05-15 | 2018-08-31 | 苏州盛达胶粘制品有限公司 | A kind of thermal conductivity foam tape and preparation method thereof |
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- 2020-11-05 CN CN202011224164.4A patent/CN114058286A/en active Pending
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US20030128519A1 (en) * | 2002-01-08 | 2003-07-10 | International Business Machine Corporartion | Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using same |
CN103797903A (en) * | 2012-07-31 | 2014-05-14 | Lg电子株式会社 | Heat conductive elastic body |
CN106189913A (en) * | 2016-08-24 | 2016-12-07 | 湖南省普瑞达内装材料有限公司 | Heat conduction adhesive tape and heat-conducting double-sided adhesive tape |
CN108471702A (en) * | 2018-05-15 | 2018-08-31 | 苏州盛达胶粘制品有限公司 | A kind of thermal conductivity foam tape and preparation method thereof |
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