CN114055707A - Insulating glue pouring device for semiconductor silicon wafer processing - Google Patents
Insulating glue pouring device for semiconductor silicon wafer processing Download PDFInfo
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- CN114055707A CN114055707A CN202111281777.6A CN202111281777A CN114055707A CN 114055707 A CN114055707 A CN 114055707A CN 202111281777 A CN202111281777 A CN 202111281777A CN 114055707 A CN114055707 A CN 114055707A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention relates to the technical field of semiconductor processing equipment, in particular to an insulating glue pouring device for processing a semiconductor silicon wafer, which comprises a base frame, wherein the top end of the base frame is provided with a working circular table, and the insulating glue pouring device further comprises: the driving mechanism is arranged between the base frame and the working circular table and can drive the working circular table to a workpiece machining position; the glue spraying mechanism is arranged on one side of the working circular table and can spray insulating glue on a workpiece on the working circular table; the adjusting mechanism is arranged at the top end of the working circular table and can be used for spraying glue on workpieces with different circular diameters by driving the glue spraying mechanism; the second motor drives the driving gear to rotate, the clamping plate can push the workpiece to move, the injector also moves towards the workpiece, and the positions of the injector and the clamping plate are adapted to the diameter of the current workpiece, so that the pouring of the insulating glue is completed, the centering can be automatically completed, and the injector is suitable for semiconductor silicon wafers with different diameters.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to an insulating glue pouring device for processing a semiconductor silicon wafer.
Background
A diode semi-finished product in the prior art is composed of two gaskets and a silicon wafer, and can be seen from figure 1 in the specification, wherein the upper gasket and the lower gasket are gaskets, the silicon wafer is arranged in the middle, nickel layers are coated on the upper surface and the lower surface of the silicon wafer, the nickel layers on the silicon wafer are melted and connected onto the silicon wafer, the edge of the silicon wafer is cut into an inclined shape, zinc liquid is coated on the upper gasket, the outer side of the silicon wafer is exposed in the air, if water exists on the outer side of the silicon wafer, the two gaskets can be directly conducted to cause diode failure, meanwhile, the silicon wafer is also considered to be insulated from the outside, and therefore, glue is required to be applied to the edge of the silicon wafer.
Referring to fig. 2 in the attached drawings of the specification, the glue injection schematic diagram of the diode semi-finished product refers to that an injector is used for injecting insulating glue on the outer side of a silicon wafer, and the injector is arranged towards the outer side of the silicon wafer and injects glue around the silicon wafer in a circle. In fig. 3, the silicon wafer 312 is located between the upper nickel wafer 311 and the lower nickel wafer 313, and during glue injection, the injector 314 rotates around the silicon wafer 312 for one circle and simultaneously injects the glue out.
In the prior art, the insulating glue is poured on the outer side of the semiconductor silicon wafer through a manually operated injector, so that the defects of low efficiency, low yield and the like exist, the similar glue injection equipment cannot be suitable for products with different specifications, and the diameters of the semiconductor silicon wafers in actual production are different, so that glue injection equipment capable of processing the semiconductor silicon wafers with different diameters is needed, and therefore, the insulating glue pouring device for processing the semiconductor silicon wafers is provided.
Disclosure of Invention
The invention aims to solve the defect that an insulating glue pouring device for processing a semiconductor silicon wafer cannot process semiconductor silicon wafers with different diameters in the prior art, and provides the insulating glue pouring device for processing the semiconductor silicon wafer.
In order to achieve the purpose, the invention adopts the following technical scheme:
the design is an insulating cement pouring device for processing semiconductor silicon chips, including the base frame, the base frame top is provided with the work round platform, still includes:
the driving mechanism is arranged between the base frame and the working circular table and can drive the working circular table to a workpiece machining position;
the glue spraying mechanism is arranged on one side of the working circular table and can spray insulating glue on a workpiece on the working circular table;
the adjusting mechanism is arranged at the top end of the working circular table, and the adjusting mechanism can drive the glue spraying mechanism to spray glue on workpieces with different diameters.
Preferably, actuating mechanism includes first motor, first motor fixed mounting is in the base frame, the output shaft of first motor runs through the base frame, the output shaft fixed mounting of first motor has first hydro-cylinder, the output of first hydro-cylinder links firmly in the department of the centre of a circle of work round platform bottom.
Preferably, it includes swash plate and syringe to spout gluey mechanism, the swash plate is located work round platform top one side, the syringe is located swash plate one side just the injection port of syringe sets up towards the work round platform, the outer fixed mounting of empty section of thick bamboo of syringe has the rectangle frame, fixed mounting has two symmetric distribution's L shape connecting rod on the swash plate, two the lower extreme of L shape connecting rod is respectively through the both sides of screw connection at the rectangle frame, fixed mounting has the second hydro-cylinder on the swash plate, the output fixed mounting of second hydro-cylinder has the disk, the disk passes through the screw detachable connection with the piston handle end of syringe.
Preferably, adjustment mechanism includes the plectane, the plectane is located the work round platform top, fixed mounting has the support on the base frame, the support upper end links firmly on the plectane.
The adjusting mechanism further comprises a plurality of concentric assemblies, the concentric assemblies are positioned between the working round platform and the circular plate, the concentric assemblies are distributed in a circumferential array manner by the working round platform, each concentric assembly comprises a slide, the slide is fixedly connected to the bottom of the circular plate, clamping grooves are formed in two sides in the slide, movable blocks are arranged in the slide in a sliding manner, clamping blocks are fixedly arranged on two sides of each movable block, the clamping blocks are respectively arranged in the clamping grooves in a sliding manner, first lead screws are arranged in the slide, the first lead screws penetrate through the movable blocks and are in threaded connection with the movable blocks, two ends of each first lead screw are respectively and rotatably arranged at two ends in the slide, a first connecting shaft is rotatably arranged at one end outside the slide, the first connecting shaft penetrates through the slide and is fixedly connected with the first lead screws, a first bevel gear is fixedly arranged at the end part of the first connecting shaft, and the lower ends of the movable blocks extend out of the slide, the movable block lower extreme fixed mounting has the riser, riser one side lower extreme is provided with movable subassembly.
Preferably, adjustment mechanism still includes the support frame, the support frame links firmly at the plectane top, be provided with the fly leaf in the support frame, the equal fixed mounting in fly leaf bottom both ends has the third hydro-cylinder, the output of third hydro-cylinder all links firmly at the swash plate top, be provided with two interval distribution's first guide arm in the support frame, first guide arm runs through fly leaf and tip and links firmly at the support frame inboard respectively, be provided with the second lead screw in the support frame, the second lead screw run through the fly leaf and with fly leaf threaded connection, the second lead screw tip is rotatable the installation inboard at the support frame respectively, the outer rotatable second connecting axle of installing of support frame, the second connecting axle runs through the support frame and links firmly with the second lead screw, second connecting axle tip fixed mounting has second bevel gear.
The adjusting mechanism further comprises a center shaft, the center shaft is rotatably installed at the circle center of the top of the circular plate, the lower end of the center shaft penetrates through the circular plate, the center shaft, the first oil cylinder and the output shaft of the first motor are overlapped in axis center, a third bevel gear is fixedly installed at the bottom end of the center shaft and meshed with a plurality of first bevel gears on the outer side, a fourth bevel gear is fixedly installed at the top end of the center shaft and meshed with a second bevel gear, a driven gear is fixedly installed on the center shaft, a second motor is fixedly installed at the top of the circular plate, a driving gear is fixedly installed at the output shaft of the second motor, and the driving gear is meshed with the driven gear.
Preferably, the movable assembly comprises a clamping plate, one side of the clamping plate is an arc surface, the two ends of the other side of the clamping plate are fixedly provided with second guide rods, the second guide rod penetrates through the vertical plate, a first spring is sleeved on the second guide rod, two ends of the first spring are fixedly connected to the vertical plate and the clamping plate respectively, a guide sleeve is fixedly arranged on one side of the vertical plate, a round rod is arranged in the guide sleeve in a sliding manner, one end of the round rod extends out of the guide sleeve, a travel switch is fixedly arranged at the end part of the round rod, a second spring is sleeved on the round rod, the two ends of the second spring are respectively and fixedly connected on the guide sleeve and the travel switch, a magnet block is fixedly arranged on one side of the clamping plate and can touch the travel switch to trigger the travel switch, the travel switch can control the on-off of the second motor, an electromagnet is fixedly mounted on one side of the vertical plate, and the electromagnet can attract the magnet block when being electrified.
Preferably, fixed mounting has the controller on the base frame, the equal electric connection of first motor, first hydro-cylinder, second motor, second hydro-cylinder, third hydro-cylinder and electro-magnet to controller, the work of the steerable first motor of controller, first hydro-cylinder, second motor, second hydro-cylinder, third hydro-cylinder and electro-magnet.
The invention provides an insulating glue pouring device for processing a semiconductor silicon wafer, which has the beneficial effects that: the second motor drives the driving gear and rotates, a plurality of risers are gradually close to the work piece and move, splint can promote the work piece and move, meanwhile, the fourth bevel gear of center pin upper end rotates, syringe synchronous motion, and the syringe also moves towards the work piece, all accomplish the heart with the work piece contact back when a plurality of splint, and the diameter of the current work piece of position adaptation of syringe and splint this moment, the back is accomplished in the injecting glue, first hydro-cylinder drives the work round platform and moves down and keeps away from the riser, outside industrial robot takes out the work piece on the work round platform, thereby accomplish the pouring of insulating cement and can accomplish the heart automatically and be applicable to the semiconductor silicon chip of different diameters.
Drawings
Fig. 1 is a schematic structural diagram of a diode semi-finished product.
Fig. 2 is a schematic diagram of glue injection of a diode semi-finished product.
Fig. 3 is a schematic structural diagram of an insulating glue pouring device for processing a semiconductor silicon wafer according to the present invention.
Fig. 4 is a front view of an insulating glue pouring device for processing a semiconductor silicon wafer according to the present invention.
Fig. 5 is an enlarged schematic view of an adjusting mechanism of the insulating glue pouring device for processing the semiconductor silicon wafer according to the invention.
Fig. 6 is an enlarged schematic view of a glue spraying mechanism of the insulating glue pouring device for processing the semiconductor silicon wafer according to the first embodiment of the invention.
Fig. 7 is a second enlarged schematic view of a glue spraying mechanism of the insulating glue pouring device for processing the semiconductor silicon wafer according to the invention.
FIG. 8 is an enlarged schematic view of a concentric assembly of an insulation paste casting apparatus for processing a semiconductor silicon wafer according to the present invention.
Fig. 9 is an enlarged cross-sectional view of a slide of an insulating glue pouring device for processing a semiconductor silicon wafer according to the present invention.
Fig. 10 is an enlarged schematic structural diagram of a movable assembly of the insulating glue pouring device for processing the semiconductor silicon wafer according to the invention.
Fig. 11 is a control system diagram of an insulating glue pouring device for processing a semiconductor silicon wafer according to the present invention.
In the figure: an upper gasket 311, a silicon chip 312, a lower gasket 313, an injector 314, a base frame 1, a work round table 2, a first motor 3, a first oil cylinder 4, an inclined plate 5, an injector 6, a rectangular frame 7, an L-shaped connecting rod 8, a second oil cylinder 9, a round sheet 10, a round sheet 11, a bracket 12, a slideway 13, a clamping groove 14, a movable block 15, a clamping block 16, a first screw rod 17, a first connecting shaft 18, a vertical plate 19 and a first bevel gear 20, the device comprises a support frame 21, a movable plate 22, a third oil cylinder 23, a first guide rod 24, a second screw rod 25, a second connecting shaft 26, a second bevel gear 27, a central shaft 28, a third bevel gear 29, a fourth bevel gear 30, a driven gear 31, a second motor 32, a driving gear 33, a clamping plate 34, a second guide rod 35, a first spring 36, a guide sleeve 37, a round rod 38, a travel switch 39, a second spring 40, a magnet block 41, an electromagnet 42, a controller 43 and a workpiece 111.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example 1:
referring to fig. 3-11, an insulating glue pouring device for semiconductor silicon wafer processing includes a base frame 1, and a working circular table 2 is arranged on the top end of the base frame 1, and further includes: the driving mechanism is arranged between the base frame 1 and the working circular truncated cone 2, and the driving mechanism can drive the working circular truncated cone 2 to a workpiece machining position; the glue spraying mechanism is arranged on one side of the working circular table 2 and can spray insulating glue on a workpiece on the working circular table 2; the adjusting mechanism is arranged at the top end of the working circular table 2, and the adjusting mechanism can drive the glue spraying mechanism to spray glue on workpieces with different diameters.
The driving mechanism comprises a first motor 3, the first motor 3 is fixedly installed in the base frame 1, an output shaft of the first motor 3 penetrates through the base frame 1, a first oil cylinder 4 is fixedly installed at the output shaft end of the first motor 3, and the output end of the first oil cylinder 4 is fixedly connected to the circle center of the bottom of the working circular truncated cone 2. First motor 3 can drive first hydro-cylinder 4, work round platform 2 synchronous rotation, because first hydro-cylinder 4 is connected with external line, the syntropy that lasts rotates can take place the winding condition of circuit, consequently first motor 3 drive first hydro-cylinder 4 rotate the round at every turn can, and rotate next time and need the switching-over to rotate, first hydro-cylinder 4 can drive work round platform 2 and reciprocate, places work piece 111 on the work round platform 2.
Spout gluey mechanism and include swash plate 5 and syringe 6, swash plate 5 is located 2 top one sides of work round platform, syringe 6 is located 5 one side of swash plate and syringe 6's injection port and sets up towards work round platform 2, the outer fixed mounting of empty section of thick bamboo of syringe 6 has rectangle frame 7, fixed mounting has two symmetric distribution's L shape connecting rod 8 on the swash plate 5, the lower extreme of two L shape connecting rods 8 is respectively through the both sides of screw connection at rectangle frame 7, fixed mounting has second hydro-cylinder 9 on the swash plate 5, the output fixed mounting of second hydro-cylinder 9 has disk 10, disk 10 can dismantle the connection through the screw with syringe 6's piston handle end. The rectangular frame 7 and the L-shaped connecting rod 8 are detachable, the wafer 10 and the piston handle of the injector 6 are detachable, so that the injector 6 can be detached, the injector 6 is taken out, the injector 6 is filled with glue, then the injector 6 is installed, after the workpiece 111 is placed on the working circular table 2 and is in axial line coincidence with the working circular table 2, the injector 6 can be moved up and down and back and forth, an injection port of the injector faces a glue injection position on the outer side of the workpiece 111, and the second oil cylinder 9 can push the piston handle of the injector 6 and uniformly discharge the glue when working.
After silicon wafers with different diameters are placed on the working circular table 2, the silicon wafers are required to be moved to a position where the silicon wafers are overlapped with the working circular table 2 in an axis line mode, then the injector 6 is moved to a position where the diameter of the corresponding silicon wafer is appropriate according to the diameter of the silicon wafer, glue injection is carried out, the injector 6 rotates for a circle relative to the silicon wafer, and therefore insulating glue can be injected on the outer sides of the silicon wafers for a circle.
The adjusting mechanism comprises a circular plate 11, the circular plate 11 is positioned at the top end of the working circular table 2, a support 12 is fixedly installed on the base frame 1, and the upper end of the support 12 is fixedly connected to the circular plate 11. The adjusting mechanism further comprises a plurality of concentric assemblies, the concentric assemblies are positioned between the working circular table 2 and the circular plate 11, the concentric assemblies are distributed in a circumferential array manner on the working circular table 2, each concentric assembly comprises a slide 13, the slide 13 is fixedly connected to the bottom of the circular plate 11, clamping grooves 14 are respectively formed in two sides in the slide 13, movable blocks 15 are arranged in the slide 13 in a sliding manner, clamping blocks 16 are respectively and fixedly arranged on two sides of each movable block 15, the clamping blocks 16 are respectively and slidably arranged in the clamping grooves 14, a first screw rod 17 is arranged in the slide 13, the first screw rod 17 penetrates through the movable blocks 15 and is in threaded connection with the movable blocks 15, two ends of the first screw rod 17 are respectively and rotatably arranged at two ends in the slide 13, a first connecting shaft 18 is rotatably arranged at one outer end of the slide 13, the first connecting shaft 18 penetrates through the slide 13 and is fixedly connected with the first screw rod 17, a first bevel gear 20 is fixedly arranged at the end of the first connecting shaft 18, and the lower end of the movable block 15 extends out of the slide 13, the lower end of the movable block 15 is fixedly provided with a vertical plate 19, and the lower end of one side of the vertical plate 19 is provided with a movable assembly.
The adjusting mechanism further comprises a support frame 21, the support frame 21 is fixedly connected to the top of the circular plate 11, a movable plate 22 is arranged in the support frame 21, third oil cylinders 23 are fixedly mounted at two ends of the bottom of the movable plate 22, output ends of the third oil cylinders 23 are fixedly connected to the top of the inclined plate 5, two first guide rods 24 distributed at intervals are arranged in the support frame 21, the first guide rods 24 penetrate through the movable plate 22, end portions of the first guide rods are fixedly connected to the inner side of the support frame 21, second lead screws 25 are arranged in the support frame 21, the second lead screws 25 penetrate through the movable plate 22 and are in threaded connection with the movable plate 22, end portions of the second lead screws 25 are rotatably mounted on the inner side of the support frame 21 respectively, a second connecting shaft 26 is rotatably mounted outside the support frame 21, the second connecting shaft 26 penetrates through the support frame 21 and is fixedly connected with the second lead screws 25, and end portions of the second connecting shaft 26 are fixedly mounted with second bevel gears 27.
The adjusting mechanism further comprises a central shaft 28, the central shaft 28 is rotatably mounted at the center of the circle at the top of the circular plate 11, the lower end of the central shaft 28 penetrates through the circular plate 11, the central shaft 28, the first oil cylinder 4 and the output shaft of the first motor 3 are overlapped in axis, a third bevel gear 29 is fixedly mounted at the bottom end of the central shaft 28, the third bevel gear 29 is meshed with a plurality of first bevel gears 20 on the outer side, a fourth bevel gear 30 is fixedly mounted at the top end of the central shaft 28, the fourth bevel gear 30 is meshed with the second bevel gear 27, a driven gear 31 is fixedly mounted on the central shaft 28, a second motor 32 is fixedly mounted at the top of the circular plate 11, a driving gear 33 is fixedly mounted at the output shaft of the second motor 32, and the driving gear 33 is meshed with the driven gear 31.
The workpiece 111 is placed on the working circular table 2, whether the workpiece 111 is concentric or not is not determined, when the adjusting mechanism works, the second motor 32 works to drive the driving gear 33 to rotate, the driving gear 33 drives the driven gear 31 to rotate, the central shaft 28 rotates, the third bevel gear 29 at the lower end of the central shaft 28 rotates and drives the plurality of first bevel gears 20 to rotate, the plurality of first bevel gears 20 synchronously rotate and turn the same, the connecting shaft 18 rotates and drives the first screw rod 17 to rotate, the first screw rod 17 rotates to drive the movable block 15 to move along the direction of the slide way 13, the movable block 15 is fixedly connected with the vertical plate 19, the vertical plate 19 and a movable assembly on one side of the vertical plate 19 synchronously move, the plurality of vertical plates 19 gradually approach the workpiece 111 to move, and the movable assembly can push the workpiece 111 to move; meanwhile, the fourth bevel gear 30 at the upper end of the central shaft 28 rotates, the fourth bevel gear 30 drives the second bevel gear 27 to rotate, the second bevel gear 27, the second connecting shaft 26 and the second lead screw 25 are connected into a whole, so that the second lead screw 25 rotates and drives the movable plate 22 to horizontally move along the first guide rod 24, the movable plate 22 is connected with the inclined plate 5 into a whole through the third oil cylinder 23, it can be known that the injector 6 synchronously moves, and the injector 6 also moves towards the workpiece 111, after the centering and the adjustment are synchronously performed and are all completed, the third oil cylinder 23 drives the inclined plate 5 to move downwards, so that the injector 6 moves to a working position, it needs to be explained that, because in an initial state, the positions of the injector 6 and the movable component correspond to each other and match the diameter of the workpiece 111 in a fixed state when the diameter of the workpiece 111 is changed, the injector 6 and the movable component are driven by the second motor 32 to synchronously move and correspond to the displacement amount, therefore, when the second motor 32 stops at a certain time, the positions of the injector 6 and the movable assemblies still adapt to the diameter of the current workpiece 111, and as the plurality of groups of movable assemblies are distributed in a circumferential array with the working circular truncated cone 2, the movable assemblies are arranged into three groups, and the plurality of groups of movable assemblies are matched and push the workpiece 111 to move, the workpiece 111 is pushed to the coaxial line, and the centering can be automatically completed while the adjustment is carried out.
Example 2:
referring to fig. 1-11, as another preferred embodiment of the present invention, the difference from embodiment 1 is that the movable assembly includes a clamping plate 34, one side of the clamping plate 34 is a cambered surface, two ends of the other side of the clamping plate 34 are both fixedly installed with a second guide rod 35, the second guide rod 35 penetrates through a vertical plate 19, the second guide rod 35 is sleeved with a first spring 36, two ends of the first spring 36 are respectively fixedly connected to the vertical plate 19 and the clamping plate 34, one side of the vertical plate 19 is fixedly installed with a guide sleeve 37, a round rod 38 is slidably installed in the guide sleeve 37, one end of the round rod 38 extends out of the guide sleeve 37, an end of the round rod 38 is fixedly installed with a travel switch 39, the round rod 38 is sleeved with a second spring 40, two ends of the second spring 40 are respectively fixedly connected to the guide sleeve 37 and the travel switch 39, one side of the clamping plate 34 is fixedly installed with a magnet block 41, the magnet block 41 can touch and trigger the travel switch 39, the travel switch 39 can control the on and off of the second motor 32, an electromagnet 42 is fixedly arranged on one side of the vertical plate 19, and the electromagnet 42 can attract the magnet block 41 when being electrified.
When the movable assembly works specifically, when the movable assembly is in contact with the workpiece 111, namely the clamping plates 34 are in contact with the workpiece 111, because the workpiece 111 is light, the deformation of the first spring 36 is negligible, when the clamping plates 34 are in contact with the workpiece 111 and then centering is completed, then the second motor 32 continues to rotate, and at this time, because the workpiece 111 blocks the clamping plates 34 to continue moving, the first spring 36 is stressed to contract, the magnet block 41 on the clamping plate 34 contacts the stroke switch 39, in this short process, the stroke switch 39 works and controls the second motor 32 to stop working, at this time, the position of the clamping plate 34 is located at a position adapted to the diameter of the workpiece 111 and the injector 6 is also, then the third cylinder 23 drives the injector 6 to move downwards to the glue injection station, then glue is sprayed and the workpiece 111 rotates, but at this time, the clamping plates 34 are attached to the side of the workpiece 111 and the workpiece 111 cannot rotate smoothly, at this time, the electromagnet 42 is electrified again, the electromagnet 42 attracts the magnet block 41 and moves the clamp plate 34 in the direction away from the workpiece 111, and the first spring 36 and the second spring 40 contract synchronously, so that the clamp plate 34 is separated from the workpiece 111, and then the first motor 3 drives the workpiece 111 on the working circular table 2 to rotate and the injector 6 injects glue uniformly and synchronously.
The base frame 1 is fixedly provided with a controller 43, the first motor 3, the first oil cylinder 4, the second motor 32, the second oil cylinder 9, the third oil cylinder 23 and the electromagnet 42 are electrically connected to the controller 43, and the controller 43 can control the first motor 3, the first oil cylinder 4, the second motor 32, the second oil cylinder 9, the third oil cylinder 23 and the electromagnet 42 to work.
The total working flow is as follows:
during charging, an external industrial robot can charge and take materials, a controller 43 before charging controls a first oil cylinder 4 to start, the first oil cylinder 4 drives a working circular table 2 to move downwards and away from a vertical plate 19, the external industrial robot places a workpiece 111 on the working circular table 2 and then performs centering and adjusting work, the first oil cylinder 4 drives the working circular table 2 to move upwards and return to the original position, the controller 43 controls a second motor 32 to start, the second motor 32 drives a driving gear 33 to rotate, the driving gear 33 drives a driven gear 31 to rotate, a central shaft 28 rotates, a third bevel gear 29 at the lower end of the central shaft 28 rotates and drives a plurality of first bevel gears 20 to rotate, the plurality of first bevel gears 20 synchronously rotate and have the same steering, a connecting shaft 18 rotates and drives a first screw rod 17 to rotate, the first screw rod 17 rotates and can drive a movable block 15 to move along the direction of a slide way 13, and the movable block 15 is fixedly connected with the vertical plate 19, the vertical plates 19 and movable assemblies on one side of the vertical plates 19 move synchronously, the vertical plates 19 gradually move towards the workpiece 111, and the clamping plates 34 can push the workpiece 111 to move; meanwhile, the fourth bevel gear 30 at the upper end of the central shaft 28 rotates, the fourth bevel gear 30 drives the second bevel gear 27 to rotate, the second bevel gear 27, the second connecting shaft 26 and the second lead screw 25 are connected into a whole, so that the second lead screw 25 rotates and drives the movable plate 22 to horizontally move along the first guide rod 24, the movable plate 22 is connected with the inclined plate 5 into a whole through the third oil cylinder 23, the injector 6 synchronously moves, the injector 6 also moves towards the workpiece 111, after a plurality of clamping plates 34 are contacted with the workpiece 111, the centering is completed, then the second motor 32 continues to rotate, the magnet block 41 on the clamping plate 34 is contacted with the stroke switch 39, the stroke switch 39 works and controls the second motor 32 to stop, at the moment, the position of the clamping plate 34 is located at a position adaptive to the diameter of the workpiece 111, the injector 6 also works, then the controller 43 controls the third oil cylinder 23 to work, the third oil cylinder 23 drives the injector 6 to downwards move to the glue injection station, the controller 43 detects a signal of stopping the second motor 32 and then controls the electromagnet 42 to be electrified, the electromagnet 42 attracts the magnet block 41 and enables the clamping plate 34 to move towards the direction far away from the workpiece 111, the first spring 36 and the second spring 40 synchronously contract, so that the clamping plate 34 is separated from the workpiece 111, the controller 43 controls the first motor 3 to work, the first motor 3 drives the workpiece 111 on the working circular table 2 to rotate, the controller 43 controls the second oil cylinder 9 to work, the second oil cylinder 9 pushes the injector 6 and glue is injected synchronously and uniformly, after glue injection is completed, the first oil cylinder 4 drives the working circular table 2 to move downwards and far away from the vertical plate 19, the workpiece 111 is taken out of the working circular table 2 by an external industrial robot, and accordingly pouring of insulation glue is completed, and centering and semiconductor silicon wafers suitable for different diameters can be automatically completed.
And then the controller 43 controls the electromagnet 42 to be powered off, the clamping plate 34 is not restrained by external force any more, the first spring 36 and the second spring 40 are restored to the original shapes, the travel switch 39 is separated from the magnet block 41, the controller 43 controls the first motor 3 to work and rotate reversely, the first motor 3 drives the clamping plate 34 to return to the original position, the third oil cylinder 23 drives the injector 6 to return to the original position, and the next workpiece 111 is processed in a similar and reciprocating way.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. The utility model provides a semiconductor silicon chip processing is with insulating cement pouring device, includes base frame (1), base frame (1) top is provided with work round platform (2), its characterized in that still includes:
the driving mechanism is arranged between the base frame (1) and the working circular table (2), and the driving mechanism can drive the working circular table (2) to a workpiece machining position;
the glue spraying mechanism is arranged on one side of the working circular table (2) and can spray insulating glue on a workpiece on the working circular table (2);
the adjusting mechanism is arranged at the top end of the working circular table (2), and the adjusting mechanism can drive the glue spraying mechanism to spray glue on workpieces with different circular diameters.
2. The insulating glue pouring device for processing the semiconductor silicon wafer is characterized in that the driving mechanism comprises a first motor (3), the first motor (3) is fixedly installed in the base frame (1), an output shaft of the first motor (3) penetrates through the base frame (1), a first oil cylinder (4) is fixedly installed at an output shaft end of the first motor (3), and an output end of the first oil cylinder (4) is fixedly connected to the circle center of the bottom of the working circular table (2).
3. The apparatus of claim 1, wherein the casting device comprises a casting device for casting the insulating paste, the glue spraying mechanism comprises an inclined plate (5) and an injector (6), the inclined plate (5) is positioned on one side of the top end of the working circular table (2), the injector (6) is positioned at one side of the inclined plate (5), an injection port of the injector (6) is arranged towards the working circular table (2), a rectangular frame (7) is fixedly arranged outside the empty cylinder of the injector (6), two L-shaped connecting rods (8) which are symmetrically distributed are fixedly arranged on the inclined plate (5), the lower ends of the two L-shaped connecting rods (8) are respectively connected with the two sides of the rectangular frame (7) through screws, a second oil cylinder (9) is fixedly arranged on the inclined plate (5), a wafer (10) is fixedly arranged at the output end of the second oil cylinder (9), the disc (10) is detachably connected with the piston handle end of the injector (6) through a screw.
4. The insulation paste pouring device for processing the semiconductor silicon wafer according to claim 1, wherein the adjusting mechanism comprises a circular plate (11), the circular plate (11) is positioned at the top end of the working circular table (2), a support frame (12) is fixedly arranged on the base frame (1), and the upper end of the support frame (12) is fixedly connected to the circular plate (11);
the adjusting mechanism further comprises a plurality of concentric assemblies, the concentric assemblies are located between the working circular truncated cone (2) and the circular plate (11), the concentric assemblies are distributed in a circumferential array mode through the working circular truncated cone (2), the concentric assemblies comprise a slide (13), the slide (13) is fixedly connected to the bottom of the circular plate (11), clamping grooves (14) are formed in two sides of the slide (13), movable blocks (15) are arranged in the slide (13) in a sliding mode, clamping blocks (16) are fixedly arranged on two sides of each movable block (15), the clamping blocks (16) are arranged in the clamping grooves (14) in a sliding mode respectively, first lead screws (17) are arranged in the slide (13), the first lead screws (17) penetrate through the movable blocks (15) and are in threaded connection with the movable blocks (15), two ends of the first lead screws (17) are rotatably arranged at two ends of the slide (13) respectively, first connecting axle (18) is rotatably installed to the outer one end of slide (13), first connecting axle (18) run through slide (13) and link firmly with first lead screw (17), first connecting axle (18) tip fixed mounting has first bevel gear (20), movable block (15) lower extreme extends to outside slide (13), movable block (15) lower extreme fixed mounting has riser (19), riser (19) one side lower extreme is provided with movable subassembly.
5. The insulating glue pouring device for processing the semiconductor silicon wafer according to claim 1, wherein the adjusting mechanism further comprises a support frame (21), the support frame (21) is fixedly connected to the top of the circular plate (11), a movable plate (22) is arranged in the support frame (21), third oil cylinders (23) are fixedly arranged at two ends of the bottom of the movable plate (22), output ends of the third oil cylinders (23) are fixedly connected to the top of the inclined plate (5), two first guide rods (24) are arranged in the support frame (21) at intervals, the first guide rods (24) penetrate through the movable plate (22) and are respectively fixedly connected to the inner side of the support frame (21), second lead screws (25) are arranged in the support frame (21), the second lead screws (25) penetrate through the movable plate (22) and are in threaded connection with the movable plate (22), and ends of the second lead screws (25) are respectively rotatably arranged on the inner side of the support frame (21), a second connecting shaft (26) is rotatably arranged outside the supporting frame (21), the second connecting shaft (26) penetrates through the supporting frame (21) and is fixedly connected with a second screw rod (25), and a second bevel gear (27) is fixedly arranged at the end part of the second connecting shaft (26);
the adjusting mechanism further comprises a central shaft (28), the central shaft (28) is rotatably installed at the center of a circle at the top of the circular plate (11), the lower end of the central shaft (28) penetrates through the circular plate (11), the central shaft (28), the first oil cylinder (4) and the output shaft of the first motor (3) are overlapped in axis, a third bevel gear (29) is fixedly installed at the bottom end of the central shaft (28), the third bevel gear (29) is meshed with a plurality of first bevel gears (20) on the outer side, a fourth bevel gear (30) is fixedly installed at the top end of the central shaft (28), the fourth bevel gear (30) is meshed with a second bevel gear (27), a driven gear (31) is fixedly installed on the central shaft (28), a second motor (32) is fixedly installed at the top of the circular plate (11), and a driving gear (33) is fixedly installed at the output shaft of the second motor (32), the driving gear (33) is meshed with the driven gear (31).
6. The insulating glue pouring device for processing the semiconductor silicon wafer as claimed in claim 1, wherein the movable assembly comprises a clamping plate (34), one side of the clamping plate (34) is an arc surface, two ends of the other side of the clamping plate (34) are fixedly provided with second guide rods (35), the second guide rods (35) penetrate through a vertical plate (19), the second guide rods (35) are sleeved with first springs (36), two ends of the first springs (36) are fixedly connected to the vertical plate (19) and the clamping plate (34) respectively, one side of the vertical plate (19) is fixedly provided with a guide sleeve (37), round rods (38) are slidably arranged in the guide sleeve (37), one ends of the round rods (38) extend out of the guide sleeve (37), the end parts of the round rods (38) are fixedly provided with travel switches (39), the round rods (38) are sleeved with second springs (40), second spring (40) both ends link firmly respectively on uide bushing (37) and travel switch (39), splint (34) one side fixed mounting has magnet piece (41), magnet piece (41) can touch and make it trigger on travel switch (39), the break-make of travel switch (39) steerable second motor (32), riser (19) one side fixed mounting has electro-magnet (42), but electro-magnet (42) circular telegram attraction magnet piece (41).
7. The insulating glue pouring device for processing the semiconductor silicon wafer as claimed in claim 1, wherein a controller (43) is fixedly mounted on the base frame (1), the first motor (3), the first oil cylinder (4), the second motor (32), the second oil cylinder (9), the third oil cylinder (23) and the electromagnet (42) are all electrically connected to the controller (43), and the controller (43) can control the operation of the first motor (3), the first oil cylinder (4), the second motor (32), the second oil cylinder (9), the third oil cylinder (23) and the electromagnet (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111281777.6A CN114055707A (en) | 2021-11-01 | 2021-11-01 | Insulating glue pouring device for semiconductor silicon wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111281777.6A CN114055707A (en) | 2021-11-01 | 2021-11-01 | Insulating glue pouring device for semiconductor silicon wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114055707A true CN114055707A (en) | 2022-02-18 |
Family
ID=80236221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111281777.6A Withdrawn CN114055707A (en) | 2021-11-01 | 2021-11-01 | Insulating glue pouring device for semiconductor silicon wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114055707A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116424780A (en) * | 2023-06-13 | 2023-07-14 | 山西多尔晋泽煤机股份有限公司 | Movable reversed loader bottom plate convex groove |
-
2021
- 2021-11-01 CN CN202111281777.6A patent/CN114055707A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116424780A (en) * | 2023-06-13 | 2023-07-14 | 山西多尔晋泽煤机股份有限公司 | Movable reversed loader bottom plate convex groove |
| CN116424780B (en) * | 2023-06-13 | 2023-08-25 | 山西多尔晋泽煤机股份有限公司 | Movable reversed loader bottom plate convex groove |
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Application publication date: 20220218 |