CN114054723B - Device and method for manufacturing liquid metal coil - Google Patents
Device and method for manufacturing liquid metal coil Download PDFInfo
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- CN114054723B CN114054723B CN202111147900.5A CN202111147900A CN114054723B CN 114054723 B CN114054723 B CN 114054723B CN 202111147900 A CN202111147900 A CN 202111147900A CN 114054723 B CN114054723 B CN 114054723B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D46/00—Controlling, supervising, not restricted to casting covered by a single main group, e.g. for safety reasons
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Abstract
The invention discloses a manufacturing device and a manufacturing method of a liquid metal coil, relates to the technical field of liquid metal coil manufacturing, and solves the technical problem that the temperature change in a temperature field of the liquid metal coil manufacturing device is small.
Description
Technical Field
The present disclosure relates to a liquid metal coil, and more particularly, to a device and a method for manufacturing a liquid metal coil.
Background
The liquid metal represented by gallium has the characteristics of low melting point and high boiling point, is in a liquid state within the temperature range of 29.8-2403 ℃, and has stable molecular structure characteristics, so that macroscopic electrical characteristics are more stable, and the liquid metal is more suitable for manufacturing high-temperature sensors.
High-precision and multifunctional sensors often require liquid metal coils to have precise and tiny dimensional structures and complex internal and external appearance characteristics. The existing liquid metal coil depends on the solidification of liquid metal, the temperature field provided by the existing liquid metal coil is simpler, and the temperature change in the temperature field is smaller. And the small-scale and high-precision liquid metal coil is easy to have the conditions of channel damage and the like caused by sinking, cracking, breaking and expansion when solidified under the temperature field due to the narrow and complex channel, so that a defective coil is formed, and the waste of resources and time is caused.
Disclosure of Invention
The application provides a manufacturing device and a manufacturing method of a liquid metal coil, which technically aim to realize the temperature difference of different areas in a space temperature field in the manufacturing device, ensure the solidification speed of each part of a liquid metal runner to be consistent and realize the control of the integral solidification speed of the liquid metal runner.
The liquid metal coil temperature control system is newly designed on the temperature control module array, the electrical impedance monitoring module array and the auxiliary control system, and is expected to realize accurate temperature control to a space temperature field where the liquid metal coil is located to manufacture a high-quality liquid metal coil. The application establishes a temperature control module array, can provide the high resolution, the accurate temperature control platform that can regulate and control, it has special demand and the complex construction that designs to aim at solving current liquid metal coil, it has the difference to make the liquid metal solidification speed of its inside different positions, and current liquid metal coil solidification system accuse temperature condition is single, can not realize the temperature difference of different regions in the space temperature field, can't ensure that liquid metal runner each part solidification speed keeps unanimous, the problem of the control to the whole solidification speed of liquid metal runner, this application aims at providing a manufacturing installation of stable feasible high-quality liquid metal coil.
The technical purpose of the application is realized by the following technical scheme:
the manufacturing device of the liquid metal coil comprises a heat insulation layer, wherein a temperature control module array is arranged inside the heat insulation layer and connected with an auxiliary control system;
the temperature control module array comprises a heat conduction layer, a temperature measurement layer, a temperature control layer and a heat dissipation layer which are arranged from top to bottom, wherein the temperature measurement layer, the temperature control layer and the heat conduction layer are all formed by a two-dimensional array of M rows and N columns, each unit in the temperature measurement layer array comprises a temperature measurement element, and each unit in the temperature control layer array comprises a temperature control unit;
the heat conduction layer is provided with a coil mould, two ends of the coil mould are connected with the heat conduction layer through a micro-channel clamp, the coil mould is provided with an inlet channel and an outlet channel, and a pump is arranged at the inlet channel and the outlet channel;
a coil runner is arranged in the coil mould, electrode pairs are arranged at each node of the coil runner, and the electrode pairs form an electrical impedance monitoring module array;
the auxiliary control system comprises a power supply, a controller, a first multiplexer, a second multiplexer, a third multiplexer, a first wire, a second wire and a third wire, wherein the power supply is connected with the controller, and the controller is connected with the first multiplexer, the second multiplexer and the third multiplexer; the first multiplexer is connected with the temperature measuring layer through the first conducting wire, the second multiplexer is connected with the temperature control layer through the second conducting wire, and the third multiplexer is connected with the electrode pairs of the electrical impedance monitoring module array through the third conducting wire.
The beneficial effect of this application lies in: this application is through control by temperature change module array and electrical impedance monitoring module array, can control the temperature field in liquid metal coil place space, and then satisfy the liquid metal coil that has the precision, small size structure and complicated inside and outside appearance characteristics and solidify required harsh temperature condition, in order to ensure that each part of liquid metal coil solidification curve keeps in suitable and level that approaches, the problem of the condition such as runner destruction is easily appeared sunkenly when solidifying in present liquid metal coil solidification system, crackle, fracture and inflation has been solved, to making more little yardstick, the liquid metal coil of higher precision provides effective help.
Drawings
FIG. 1 is a schematic view of the overall structure of a manufacturing apparatus according to the present application;
FIG. 2 is a top sectional view of the temperature measuring layer;
FIG. 3 is a top sectional view of a temperature control layer;
FIG. 4 is a schematic diagram of the auxiliary control system logic;
FIG. 5 is a schematic view of a liquid metal flow channel;
FIG. 6 is a flow chart of a method of manufacturing a liquid metal coil according to the present application;
in the figure: 1-a heat insulating layer; 2-a pump; 3-micro channel fixture; 4-a coil mold; 5-temperature measuring layer; 6-heat conducting layer; 7-temperature control layer; 8-a heat dissipation layer; 9-a fan; 10-a heat pipe; 11-a fin; 12-a first wire; 13-a first thermally conductive material; 14-a temperature measuring element; 15-a first insulating material; 16-a second conductive line; 17-a second thermally conductive material; 18-a semiconductor refrigerator; 19-a second insulating material; 20-a power supply; 21-a controller; 22-a first multiplexer; 23-a second multiplexer; 24-a third multiplexer; 25-a third wire; 26-positioning holes; 27-a pad; 28-coil flow path.
Detailed Description
The technical solution of the present application will be described in detail below with reference to the accompanying drawings.
Fig. 1 is a schematic view of the overall structure of the manufacturing apparatus of the present application, and as shown in fig. 1, the manufacturing apparatus includes a heat insulating layer, a temperature control module array is disposed inside the heat insulating layer, and the temperature control module array is connected to an auxiliary control system.
The temperature control module array comprises a heat conduction layer, a temperature measurement layer, a temperature control layer and a heat dissipation layer which are arranged from top to bottom, wherein the temperature measurement layer, the temperature control layer and the heat conduction layer are all formed by a two-dimensional array with M rows and N columns, each unit in the temperature measurement layer array comprises a temperature measurement element, and each unit in the temperature control layer array comprises a temperature control unit.
The coil mold is arranged on the heat conduction layer, two ends of the coil mold are connected with the heat conduction layer through the micro-channel fixture, an inlet and outlet channel is arranged on the coil mold, and a pump is arranged at the inlet and outlet channel.
As a specific embodiment, the heat dissipation layer includes heat pipes, fins, and fans, the fins are distributed around the heat pipes, and the fans are disposed on two sides of the heat pipes.
Specifically, the thermal insulation layer is used to reduce the influence of the external ambient temperature; a pump for controlling the flow of liquid metal, a microchannel fixture (e.g., a set screw) for holding the coil mold; the coil mould is used for shaping the liquid metal; the temperature measuring layer is used for measuring a space temperature field; the heat conduction layer is used for controlling the temperature in each unit to be uniform; the temperature control layer is used for changing a space temperature field; the heat dissipation layer is used for transferring heat of the temperature control layer; the fan is used for increasing the convection heat dissipation strength; the heat pipe is used for uniformly distributing heat; the fins are used for increasing the strength of convective heat dissipation.
Specifically, a coil runner is arranged in the coil mould, electrode pairs are arranged at each node of the coil runner, and the electrode pairs form an electrical impedance monitoring module array.
As shown in FIG. 2, each unit in the thermometric layer array further comprises a first wire, a first thermally conductive material, and a first thermally insulating material, the first thermally conductive material being connected to the thermometric element, and the first thermally insulating material being connected to the first thermally conductive material.
Specifically, a first wire is used for transmitting temperature measuring signals, a first heat conducting material is used for ensuring uniform temperature in each unit, a temperature measuring element is used for measuring the temperature of each unit, and a first heat insulating material is used for reducing the temperature influence of other units.
As shown in fig. 3, the temperature control unit includes a second wire, a semiconductor cooler, a second heat conductive material connected to the semiconductor cooler, and a second heat insulating material connected to the second heat conductive material.
Specifically, the second lead is used for receiving a temperature control signal, the second heat conduction material is used for ensuring the temperature in the temperature control unit to be uniform, the semiconductor refrigerator is used for controlling the temperature, and the second heat insulation material is used for reducing the temperature influence of other units.
Each unit in the heat conduction layer array comprises a heat conduction material and a heat insulation material connected with the edge of each unit, and the heat conduction material is mainly used for ensuring the uniform temperature in each unit.
Fig. 5 is a schematic view of a liquid metal flow channel, and as shown in fig. 5, the liquid metal flow channel is arranged in a coil mold, the coil mold is fixed by a positioning hole and a positioning bolt, an electrode pair is fixed at each node of the coil flow channel in the coil mold by a bonding pad, and the electrode pair is connected with a third lead and then connected with a third multiplexer by the third lead.
As shown in fig. 4, the auxiliary control system includes a power supply, a controller, a first multiplexer, a second multiplexer, a third multiplexer, a first wire, a second wire, and a third wire, the power supply is connected to the controller, and the controller is connected to all of the first multiplexer, the second multiplexer, and the third multiplexer. The first multiplexer is connected with the first wire, the second multiplexer is connected with the second wire, and the third multiplexer is connected with the third wire.
The power supply is used for supplying power to the whole auxiliary control system; the controller is used for receiving and processing the electrical impedance and the temperature measurement signal and transmitting the temperature control signal; the three multiplexers are used for realizing the conversion between the single-path signal and the multi-path signal.
Specifically, the first multiplexer is connected with a temperature measuring element of the temperature measuring layer through a first lead, the second multiplexer is connected with a semiconductor refrigerator of the temperature measuring layer through a second lead, and the third multiplexer is connected with an electrode pair of the electrical impedance monitoring module array through a third lead.
In summary, a two-dimensional temperature control module array with M rows and N columns is adopted, each unit in the array is composed of an independent temperature measuring element and a temperature control unit, and small-range temperature monitoring and control can be carried out on a space temperature field where the liquid metal coil is located. The adjacent temperature control modules are isolated by adopting a heat insulating material, the adjacent temperature control modules are prevented from being influenced mutually, so that the respective and accurate temperature control of small-scale local areas is realized, a heat insulating shell structure is also arranged outside the system, the factors of heat conduction, convection, radiation and the like of the external environment to a refrigerating system are ensured to be reduced, the complex structures such as front and back different cross sectional areas, angular runners and the like can be designed according to some special requirements of the liquid metal coil, and the requirement of controlling a temperature field so as to keep the solidification speed consistent can be met.
The impedance monitoring module array adopts an ultraviolet photoetching technology. The system divides the coil mould into an upper part and a lower part for manufacturing when the coil mould is manufactured, wherein the lower part adopts an ultraviolet lithography technology to add electrodes at the key position influencing the coil forming besides the conventional manufacturing when the lower part is manufactured, so that the flow of liquid metal in the mould is not influenced when the lower part can be connected with an external circuit. The detection circuit is externally connected with each positive and negative electroplating electrode plate to obtain the electrical impedance and the electrical impedance change rate of the liquid metal coil part corresponding to the corresponding electrode plate, so that the solidification degree and the solidification curve of the corresponding liquid metal coil part are deduced, and the solidification of the liquid metal coil is monitored.
The auxiliary control system receives signals from temperature measuring layers in the electrical impedance monitoring module array and the temperature control module array, acquires a liquid metal solidification curve and a current temperature field of each area of the current coil mold, so that the areas with higher and lower solidification speeds can be obtained.
The assembly details of the manufacturing apparatus include: firstly, assembling a heat insulating layer outside the temperature control module array, connecting the temperature control module array and the heat insulating layer in order, connecting the temperature control module array and the auxiliary control system through a connector of the heat insulating layer, then placing and fixing the liquid metal coil mould and the pump, and connecting the liquid metal coil and the auxiliary control system through an electrode pair.
A method for manufacturing a liquid metal coil by the apparatus for manufacturing a liquid metal coil according to the present application, as shown in fig. 6, includes:
s1: liquid metal is pumped into the inlet and outlet flow passages through a pump and enters the coil mold.
S2: and acquiring a current space temperature field through a temperature measuring layer of the temperature control module array, and acquiring a solidification curve of each node in a current coil flow channel through the electrical impedance monitoring module array.
S3: and analyzing the current space temperature field and the solidification curve through an auxiliary control system to obtain an unreasonable area of the solidification curve, and transmitting information to the temperature control layer to correspondingly adjust the temperature field.
S4: and repeating the steps S2 to S3 until the solidification curves of all the nodes in the coil flow channel tend to be stable.
S5: and loosening the micro-channel clamp, taking down the coil mold, and separating the coil mold from the liquid metal coil to obtain the liquid metal coil in a solidification state.
Specifically, before temperature control, the relation between the electrical impedance, the inductance and the solidification degree is established through testing.
When the temperature is controlled, the liquid metal is pumped into the coil flow channel to fill the whole coil flow channel, and then the current ambient temperature and the solidification curve of each monitored part of the liquid metal are obtained through the auxiliary control system. Firstly, the whole temperature field is adjusted to the temperature range required by solidification, the solidification speed is reduced by properly increasing the temperature of the corresponding temperature field when the solidification degree or speed is too high, the solidification speed is increased by properly reducing the temperature of the corresponding temperature field when the solidification degree or speed is too low, and the whole solidification speed and the solidification curve of the liquid metal are kept consistent by the mode.
After the process is repeatedly carried out for a period of time, the electrical impedance and the inductance of each part of the coil finally tend to a stable and relatively close value, at the moment, redundant liquid metal is pumped by a pump, then the fixing of the flow channel is cancelled, the flow channel of the coil is taken down, the upper part and the lower part of the flow channel of the coil are separated, and the liquid metal coil in a solidification state is obtained.
The foregoing is an exemplary embodiment of the present application, and the scope of the present application is defined by the claims and their equivalents.
Claims (5)
1. The manufacturing device of the liquid metal coil comprises a heat insulating layer and is characterized in that a temperature control module array is arranged in the heat insulating layer and connected with an auxiliary control system;
the temperature control module array comprises a heat conduction layer, a temperature measurement layer, a temperature control layer and a heat dissipation layer which are arranged from top to bottom, wherein the temperature measurement layer, the temperature control layer and the heat conduction layer are all formed by a two-dimensional array of M rows and N columns, each unit in the temperature measurement layer array comprises a temperature measurement element, and each unit in the temperature control layer array comprises a temperature control unit; each unit in the temperature control module array with M rows and N columns consists of an independent temperature measuring element and a temperature control unit, and adjacent temperature control modules are isolated by adopting a heat insulating material;
the heat conduction layer is provided with a coil mould, two ends of the coil mould are connected with the heat conduction layer through a micro-channel clamp, the coil mould is provided with an inlet channel and an outlet channel, and a pump is arranged at the inlet channel and the outlet channel;
a coil runner is arranged in the coil mould, electrode pairs are arranged at each node of the coil runner, and the electrode pairs form an electrical impedance monitoring module array;
the auxiliary control system comprises a power supply, a controller, a first multiplexer, a second multiplexer, a third multiplexer, a first wire, a second wire and a third wire, wherein the power supply is connected with the controller, and the controller is connected with the first multiplexer, the second multiplexer and the third multiplexer; the first multiplexer is connected with the temperature measuring layer through the first conducting wire, the second multiplexer is connected with the temperature control layer through the second conducting wire, and the third multiplexer is connected with the electrode pairs of the electrical impedance monitoring module array through the third conducting wire.
2. The apparatus of claim 1, wherein the heat dissipation layer comprises heat pipes, fins distributed around the heat pipes, and fans disposed on both sides of the heat pipes.
3. The apparatus of claim 2, wherein each cell in the array of temperature sensing layers further comprises the first wire, a first thermally conductive material, and a first insulating material, the first thermally conductive material being coupled to the temperature sensing element, the first insulating material being coupled to the first thermally conductive material;
the first multiplexer is connected with the temperature measuring element through the first conducting wire.
4. The apparatus of claim 3, wherein the temperature control unit comprises the second wire, a semiconductor cooler, a second thermally conductive material, and a second thermally insulating material, the second thermally conductive material being coupled to the semiconductor cooler, the second thermally insulating material being coupled to the second thermally conductive material;
the second multiplexer is connected with the semiconductor cooler through the second wire.
5. A method of manufacturing a liquid metal coil using the apparatus for manufacturing a liquid metal coil according to any one of claims 1 to 4, comprising:
s1: liquid metal is pumped into an inlet and outlet flow passage through a pump and enters a coil mold;
s2: acquiring a current space temperature field through a temperature measuring layer of a temperature control module array, and acquiring a solidification curve of each node in a current coil flow channel through an electrical impedance monitoring module array;
s3: analyzing the current space temperature field and the solidification curve through an auxiliary control system to obtain an unreasonable solidification curve area, and transmitting information to a temperature control layer to correspondingly adjust the temperature field;
s4: repeating the steps S2-S3 until the solidification curves of all the nodes in the coil flow channel tend to be stable;
s5: and loosening the micro-channel clamp, taking down the coil mold, and separating the coil mold from the liquid metal coil to obtain the liquid metal coil in a solidification state.
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| CN202111147900.5A CN114054723B (en) | 2021-09-29 | 2021-09-29 | Device and method for manufacturing liquid metal coil |
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| CN202111147900.5A CN114054723B (en) | 2021-09-29 | 2021-09-29 | Device and method for manufacturing liquid metal coil |
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| CN114054723B true CN114054723B (en) | 2023-02-17 |
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