CN114046489A - High-power LED light source system and heat dissipation method thereof - Google Patents

High-power LED light source system and heat dissipation method thereof Download PDF

Info

Publication number
CN114046489A
CN114046489A CN202111374352.XA CN202111374352A CN114046489A CN 114046489 A CN114046489 A CN 114046489A CN 202111374352 A CN202111374352 A CN 202111374352A CN 114046489 A CN114046489 A CN 114046489A
Authority
CN
China
Prior art keywords
light source
led light
heat dissipation
pressure gas
real
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202111374352.XA
Other languages
Chinese (zh)
Other versions
CN114046489B (en
Inventor
陈宇
姚毅
杨艺
邢志广
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luster LightTech Co Ltd
Suzhou Luster Vision Intelligent Device Co Ltd
Suzhou Lingyunguang Industrial Intelligent Technology Co Ltd
Original Assignee
Luster LightTech Co Ltd
Suzhou Luster Vision Intelligent Device Co Ltd
Suzhou Lingyunguang Industrial Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luster LightTech Co Ltd, Suzhou Luster Vision Intelligent Device Co Ltd, Suzhou Lingyunguang Industrial Intelligent Technology Co Ltd filed Critical Luster LightTech Co Ltd
Priority to CN202111374352.XA priority Critical patent/CN114046489B/en
Publication of CN114046489A publication Critical patent/CN114046489A/en
Application granted granted Critical
Publication of CN114046489B publication Critical patent/CN114046489B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/60Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/61Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by control arrangements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

The application provides a high-power LED light source system and a heat dissipation method thereof, wherein an LED light source comprises at least one LED substrate, a shell and a heat dissipation cavity, the heat dissipation cavity is arranged between the shell and the LED substrate, one end of the heat dissipation cavity is provided with an air inlet, and the other end of the heat dissipation cavity is provided with an air outlet; the intelligent controller is electrically connected with the LED light source and the detachable air source device, and the intelligent controller is configured to: acquiring the real-time temperature of the LED light source, wherein the real-time temperature is determined by the system environment temperature and the temperature of the target LED substrate; when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-grade high-pressure gas, and enabling the high-grade high-pressure gas to enter the heat dissipation cavity through the air inlet; when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-grade high-pressure air, and enabling the low-grade high-pressure air to enter the heat dissipation cavity through the air inlet; the intelligent controller is used for meeting the heat dissipation requirements of various high-power LED light sources, and the overall size of the high-power LED light sources is reduced.

Description

High-power LED light source system and heat dissipation method thereof
Technical Field
The application relates to the technical field of LED light sources, in particular to a high-power LED light source system and a heat dissipation method thereof.
Background
With the development of the LED chip, the illuminance of the LED chip is higher and higher, the power consumption is higher and higher, and the heat generated by the LED chip is more and more; the high-power LED light source formed by the LED chips has higher and higher requirements on illumination and light distribution uniformity, the LED chip arrangement density is more and more intensive, the heat accumulation effect is more and more prominent, and the normal use of the high-power LED light source is influenced.
The existing high-power LED light source mainly achieves the purpose of cooling by accelerating the circulation of air inside the light source through arranging the fan inside the light source body and arranging the heat dissipation holes on the light source shell. However, the fan cannot meet the heat dissipation requirement of the high-power LED light source, which results in insufficient heat dissipation of the high-power LED light source and reduces the performance of the high-power LED light source.
Disclosure of Invention
The application provides a high-power LED light source system and a heat dissipation method thereof, which aim to solve the technical problems that the heat dissipation requirement of a high-power LED light source cannot be met through a fan, and the performance of the high-power LED light source is reduced.
In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:
in a first aspect, a high-power LED light source system is provided, which includes an LED light source, an intelligent controller and a detachable air source device;
the LED light source comprises at least one LED substrate, a shell and a heat dissipation cavity, the heat dissipation cavity is arranged between the shell and the LED substrate, one end of the heat dissipation cavity is provided with an air inlet, and the other end of the heat dissipation cavity is provided with an air outlet;
the detachable air source device is movably connected with an air inlet of the LED light source through an air pipe;
the intelligent controller is electrically connected with the LED light source and the detachable air source device, and is configured to:
acquiring real-time temperature of an LED light source, wherein the real-time temperature is determined by system environment temperature and temperature of a target LED substrate, and the target LED substrate is an LED substrate with highest power;
when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-level high-pressure gas, and enabling the high-level high-pressure gas to enter the heat dissipation cavity through the air inlet;
when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-gear high-pressure air, and enabling the low-gear high-pressure air to enter the heat dissipation cavity through the air inlet;
and when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, controlling the detachable air source device to output high-pressure gas with a stable gear, and enabling the high-pressure gas to enter the heat dissipation cavity through the air inlet.
In a possible embodiment, one side of the LED substrate is provided with an LED chip, and the other side is provided with at least one heat sink, wherein the heat sink is in the heat sink cavity.
In one possible embodiment, the heat sink comprises a heat dissipating base portion and a heat dissipating fin portion; the radiating fin is fixedly connected with the LED substrate through the radiating bottom.
In a possible embodiment, the fins of the fin portion are arranged in the same direction as the direction of the high-pressure gas from the gas inlet to the gas outlet.
In a possible embodiment, the intelligent controller is movably connected to the trachea.
In a possible embodiment, a temperature sensor is provided on each of the LED substrate and the housing of the LED light source.
In a second aspect, a heat dissipation method for a high power LED light source system is provided, the method includes the following steps:
acquiring real-time temperature of an LED light source, wherein the real-time temperature is determined by system environment temperature and temperature of a target LED substrate, and the target LED substrate is an LED substrate with highest power;
comparing the real-time temperature to a maximum temperature threshold or a minimum temperature threshold;
when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-grade high-pressure gas to enter the heat dissipation cavity;
when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-grade high-pressure gas to enter the heat dissipation cavity;
when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, the detachable air source device is controlled to output high-pressure gas with a stable gear to enter the heat dissipation cavity.
In one possible embodiment, before acquiring the real-time temperature of the LED light source, the method further includes:
determining a highest temperature threshold and a lowest temperature threshold of an LED chip on an LED substrate, wherein the highest temperature threshold and the lowest temperature threshold are determined by chip information and thermal simulation data of the LED chip;
and determining the high-pressure gas pressure and speed corresponding to the high-pressure gas, the stable-gear high-pressure gas and the low-gear high-pressure gas of the detachable air source device.
In one possible embodiment, before determining the maximum temperature threshold and the minimum temperature threshold of the LED chip on the LED substrate, the method further comprises:
when the high-power LED light source system is started, the detachable air source device is controlled to output stable high-pressure gas for a first preset time.
In a possible embodiment, before determining the maximum temperature threshold and the minimum temperature threshold of the LED chip on the LED substrate, the method further comprises:
and when the high-power LED light source system is started, the detachable air source device is controlled to output high-gear high-pressure gas for a second preset time and then is adjusted to be stable-gear high-pressure gas.
The application provides a high-power LED light source system and a heat dissipation method thereof, wherein the LED light source comprises at least one LED substrate, a shell and a heat dissipation cavity, the heat dissipation cavity is arranged between the shell and the LED substrate, one end of the heat dissipation cavity is provided with an air inlet, and the other end of the heat dissipation cavity is provided with an air outlet; the detachable air source device is movably connected with an air inlet of the LED light source through an air pipe; the intelligent controller is electrically connected with the LED light source and the detachable air source device, and is configured to: acquiring real-time temperature of an LED light source, wherein the real-time temperature is determined by system environment temperature and temperature of a target LED substrate, and the target LED substrate is an LED substrate with highest power; when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-level high-pressure gas, and enabling the high-level high-pressure gas to enter the heat dissipation cavity through the air inlet; when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-gear high-pressure air, and enabling the low-gear high-pressure air to enter the heat dissipation cavity through the air inlet; and when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, controlling the detachable air source device to output high-pressure gas with a stable gear, and enabling the high-pressure gas to enter the heat dissipation cavity through the air inlet. This application realizes the heat dissipation demand of multiple high-power LED light source through intelligent control ware to reduced the whole volume of high-power LED light source, the detachable air source device facilitates for the flexibility that the product used.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a high-power LED light source system according to an embodiment of the present disclosure;
FIG. 2 is a longitudinal cross-sectional view of an LED light source according to an embodiment of the present disclosure;
FIG. 3 is a cross-sectional view of an LED light source according to an embodiment of the present disclosure;
FIG. 4 is a schematic flow chart illustrating a heat dissipation method of a high-power LED light source system according to an embodiment of the present disclosure;
wherein: 1-an LED light source; 11-an LED substrate; 12-a housing; 13-heat dissipation cavity; 14-an air inlet; 15-air outlet; 16-a heat sink; 17-an LED chip; 2-an intelligent controller; 3-a removable air source device; 4-trachea.
Detailed Description
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only partial embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The present application is described in further detail below with reference to the attached drawing figures:
some embodiments of the present application provide a high power LED light source system, as shown in fig. 1, the high power LED light source system includes an LED light source, an intelligent controller, and a detachable air source device. The detachable air source device is movably connected with the LED light source through an air pipe; the intelligent controller is electrically connected with the LED light source and the detachable air source device.
As shown in fig. 2, the LED light source includes an LED substrate, a housing and a heat dissipation cavity, the heat dissipation cavity is a sealed cavity formed between the LED substrate and the housing, one end of the heat dissipation cavity has an air inlet, and the other end of the heat dissipation cavity has an air outlet. The detachable air source device is movably connected with an air inlet of the LED light source through an air pipe.
In some embodiments, the LED substrate may be a whole, or may be a plurality of LED substrates arranged according to the requirement of the product.
As shown in fig. 3, one surface of the LED substrate is provided with an LED chip, and the other surface is provided with a heat sink, wherein the heat sink includes a heat dissipation bottom and a heat dissipation fin portion, and the heat sink is fixedly connected with the LED substrate through the heat dissipation bottom and is in close contact with the LED substrate; the fin setting direction of the radiating fin part is the same as the direction of high-pressure gas from the gas inlet to the gas outlet. Through the reasonable design of the radiating fins and the elimination of the radiating fan, the size of the high-power LED light source is reduced.
When the LED light source works, the heat of the LED substrate is conducted to the radiating fins through heat conduction, when high-pressure gas entering the air inlet flows through the radiating fins, the heat is taken away in a convection heat exchange mode, the high-pressure gas is discharged from the air outlet, the heat is taken away, and the radiating effect is achieved.
In some embodiments, the arrangement of the LED chips may be uniform, irregular, or a specific pattern.
In some embodiments, the arrangement of the fins of the heat dissipation fin portion of the heat dissipation fin may be uniformly distributed, or the distribution of the fins may be set according to the arrangement of the corresponding LED chips, or the distribution may be dense in the middle and sparse on both sides.
In some embodiments, the LED substrate may be provided with a temperature sensor for obtaining a temperature of the LED substrate, or obtaining a junction temperature of the LED chip according to the temperature obtained by the sensor of the LED chip itself, where the junction temperature is a highest temperature of the LED chip, and is generally higher than a temperature of the housing and a temperature of a device surface, that is, higher than the temperature of the LED substrate. The shell of the LED light source can be also provided with a temperature sensor for acquiring the temperature of the system environment, and the temperature sensor can be arranged on the intelligent controller or the environment where the high-power light source system is located for measuring the temperature of the system environment.
The detachable air source device generates high-pressure gas higher than one standard atmospheric pressure, the high-pressure gas enters the heat dissipation cavity of the LED light source through the air pipe, heat from the LED substrate on the heat dissipation sheet is taken away, the heat is discharged from the air outlet, the intelligent controller can control the air inlet pressure and the air inlet speed, and the heat dissipation effect of the LED light source is adjusted by adjusting the air inlet pressure and the air inlet speed.
In an embodiment, the detachable air source device may be an air pump, a vacuum diaphragm pump, or a vacuum generator, but is not limited to the above embodiments, and may also be an air source device in a production workshop where a user is located.
The intelligent controller is configured to:
acquiring real-time temperature of an LED light source, wherein the real-time temperature is determined by system environment temperature and temperature of a target LED substrate, and the target LED substrate is an LED substrate with highest power;
when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-level high-pressure gas, and enabling the high-level high-pressure gas to enter the heat dissipation cavity through the air inlet;
when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-gear high-pressure air, and enabling the low-gear high-pressure air to enter the heat dissipation cavity through the air inlet;
and when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, controlling the detachable air source device to output high-pressure gas with a stable gear, and enabling the high-pressure gas to enter the heat dissipation cavity through the air inlet.
By the scheme, the application provides a high-power LED light source system which comprises an LED light source, a heat dissipation cavity and a control circuit, wherein the LED light source comprises at least one LED substrate, a shell and the heat dissipation cavity, the heat dissipation cavity is arranged between the shell and the LED substrate, one end of the heat dissipation cavity is provided with an air inlet, and the other end of the heat dissipation cavity is provided with an air outlet; the intelligent controller is electrically connected with the LED light source and the detachable air source device, and the intelligent controller is configured to: acquiring the real-time temperature of the LED light source, wherein the real-time temperature is determined by the system environment temperature and the temperature of the target LED substrate; when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-grade high-pressure gas, and enabling the high-grade high-pressure gas to enter the heat dissipation cavity through the air inlet; when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-grade high-pressure air, and enabling the low-grade high-pressure air to enter the heat dissipation cavity through the air inlet; the intelligent controller is used for meeting the heat dissipation requirements of various high-power LED light sources, and the overall size of the high-power LED light sources is reduced.
Some embodiments of the present application provide a heat dissipation method for a high power LED light source system, as shown in fig. 4, the method includes:
s101, acquiring real-time temperature of the LED light source.
The real-time temperature is determined by the system environment temperature and the temperature of a target LED substrate, and the target LED substrate is the LED substrate with the highest power.
In some embodiments, the system ambient temperature may be obtained by a temperature sensor mounted on the LED light source housing, or may be obtained by a temperature sensor in the location of the high-power LED light source system.
In some embodiments, when the LED light source has only one LED substrate, the target LED substrate is the LED substrate.
In some embodiments, the LED light source has a plurality of LED substrates, wherein the target LED substrate can be the one with the highest power, and when the power of each substrate is the same, one of the target LED substrates is selected. The temperature of the target LED substrate may be obtained by mounting a temperature sensor, or may be obtained by the temperature of the LED chip, the case temperature of the chip, or the junction temperature.
In some embodiments, the real-time temperature of the LED light source may be obtained by a difference between the temperature of the target LED substrate and the system environment temperature, or may be obtained by using the temperature of the target LED substrate as a main reference temperature.
And S102, comparing the real-time temperature with a maximum temperature threshold or a minimum temperature threshold.
Determining a highest temperature threshold and a lowest temperature threshold of an LED chip on an LED substrate, wherein the highest temperature threshold and the lowest temperature threshold are determined by chip information and thermal simulation data of the LED chip, and can also be determined by LED particle chip data, thermal simulation data and thermal test data; and determining the high-pressure gas pressure and speed corresponding to the high-pressure gas, the stable-gear high-pressure gas and the low-gear high-pressure gas of the detachable air source device. And controlling the control method of the high-pressure gas through the highest temperature threshold and the lowest temperature threshold, or setting the starting of the system.
In one embodiment, when the high-power LED light source system is started, the detachable air source device is controlled to output stable high-pressure gas for a first preset time.
In one embodiment, when the high-power LED light source system is started, the detachable air source device is controlled to output high-pressure gas at a high gear for a second preset time and then adjusted to high-pressure gas at a stable gear.
The intelligent control ware carries out gear regulation and control to can dismantle air source device and controls high-pressure gas's inlet pressure and speed, and the settlement of gear is set for according to specific product, for example, can dismantle air source device's gear has set up 0 gear, 1 gear, 2 gears, 3 gears, 4 gears, 5 gear six grade control gears, wherein 0 gear and 1 gear output low-grade high-pressure gas, 2 gears and 3 gear output stable gear high-pressure gas, 4 gears and 5 gear output high-grade high-pressure gas.
When starting, the first time of predetermineeing of 2 gears output stable gear high-pressure gas can be controlled to air source device can be dismantled to the intelligent control ware, also can control can dismantle air source device and use 5 gears output high gear high-pressure gas second to predetermine the time back, and the adjustment is 2 gears output stable gear high-pressure gas, perhaps can control can dismantle air source device and use 4 gears output high gear high-pressure gas second to predetermine the time back, and the adjustment is 2 gears output stable gear high-pressure gas.
S103, when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-grade high-pressure gas to enter the heat dissipation cavity.
And S104, when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-gear high-pressure gas to enter the heat dissipation cavity.
And S105, when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, controlling the detachable air source device to output high-pressure gas with a stable gear to enter the heat dissipation cavity.
Further describing the above example, when the real-time temperature is higher than the maximum temperature threshold, the detachable air source device is controlled to output high-pressure air of 5 gears into the heat dissipation cavity; when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output high-pressure air of 1 gear to enter the heat dissipation cavity; and when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, controlling the detachable air source device to output high-pressure gas of 3 gears to enter the heat dissipation cavity.
Or when the real-time temperature is higher than the maximum temperature threshold, controlling the output gear of the detachable air source device to be increased, and allowing high-pressure gas from 4 gears to 5 gears to enter the heat dissipation cavity; when the real-time temperature is lower than the lowest temperature threshold value, controlling the output gear of the detachable air source device to be lowered, and enabling high-pressure gas from 1 gear to 0 gear to enter the heat dissipation cavity; and when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, controlling the detachable air source device to output high-pressure gas of 3 gears to enter the heat dissipation cavity.
According to the scheme, the heat dissipation method of the high-power LED light source system comprises the steps of obtaining the real-time temperature of an LED light source, wherein the real-time temperature is determined by the ambient temperature of the system and the temperature of a target LED substrate; comparing the real-time temperature to a maximum temperature threshold or a minimum temperature threshold; when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-grade high-pressure gas to enter the heat dissipation cavity; when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-grade high-pressure gas to enter the heat dissipation cavity; when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, the detachable air source device is controlled to output high-pressure gas with a stable gear to enter the heat dissipation cavity. The application realizes the heat dissipation requirement of various high-power LED light sources through the intelligent controller.
The above-mentioned contents are only for explaining the technical idea of the present application, and the protection scope of the present application is not limited thereby, and any modification made on the basis of the technical idea presented in the present application falls within the protection scope of the claims of the present application.
Additionally, the order in which elements and sequences of the processes described herein are processed, the use of alphanumeric characters, or the use of other designations, is not intended to limit the order of the processes and methods described herein, unless explicitly claimed. While various presently contemplated embodiments have been discussed in the foregoing disclosure by way of example, it should be understood that such detail is solely for that purpose and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements that are within the spirit and scope of the embodiments herein. For example, although the system components described above may be implemented by hardware devices, they may also be implemented by software-only solutions, such as installing the described system on an existing server or mobile device.
Similarly, it should be noted that in the preceding description of embodiments of the application, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the embodiments. This method of disclosure, however, is not intended to require more features than are expressly recited in the claims. Indeed, the embodiments may be characterized as having less than all of the features of a single embodiment disclosed above.
The entire contents of each patent, patent application publication, and other material cited in this application, such as articles, books, specifications, publications, documents, and the like, are hereby incorporated by reference into this application. Except where the application is filed in a manner inconsistent or contrary to the present disclosure, and except where the claim is filed in its broadest scope (whether present or later appended to the application) as well. It is noted that the descriptions, definitions and/or use of terms in this application shall control if they are inconsistent or contrary to the statements and/or uses of the present application in the material attached to this application.

Claims (10)

1. A high-power LED light source system is characterized by comprising an LED light source, an intelligent controller and a detachable air source device;
the LED light source comprises at least one LED substrate, a shell and a heat dissipation cavity, the heat dissipation cavity is arranged between the shell and the LED substrate, one end of the heat dissipation cavity is provided with an air inlet, and the other end of the heat dissipation cavity is provided with an air outlet;
the detachable air source device is movably connected with an air inlet of the LED light source through an air pipe;
the intelligent controller is electrically connected with the LED light source and the detachable air source device, and is configured to:
acquiring real-time temperature of an LED light source, wherein the real-time temperature is determined by system environment temperature and temperature of a target LED substrate, and the target LED substrate is an LED substrate with highest power;
when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-level high-pressure gas, and enabling the high-level high-pressure gas to enter the heat dissipation cavity through the air inlet;
when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-gear high-pressure air, and enabling the low-gear high-pressure air to enter the heat dissipation cavity through the air inlet;
and when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, controlling the detachable air source device to output high-pressure gas with a stable gear, and enabling the high-pressure gas to enter the heat dissipation cavity through the air inlet.
2. A high power LED light source system as claimed in claim 1, wherein one side of the LED substrate is provided with LED chips, and the other side is provided with at least one heat sink, wherein the heat sink is located in the heat sink cavity.
3. The high power LED light source system as claimed in claim 2, wherein the heat sink comprises a heat sink bottom portion and a heat sink fin portion;
the radiating fin is fixedly connected with the LED substrate through the radiating bottom.
4. The high power LED light source system as claimed in claim 3, wherein the fins of the heat dissipating fin portion are arranged in the same direction as the high pressure gas from the gas inlet to the gas outlet.
5. The high power LED light source system as claimed in claim 1, wherein the intelligent controller is movably connected to the air tube.
6. A high power LED light source system as claimed in claim 1, wherein the LED substrate and the LED light source housing are both provided with temperature sensors.
7. A heat dissipation method for a high-power LED light source system is characterized by comprising the following steps:
acquiring real-time temperature of an LED light source, wherein the real-time temperature is determined by system environment temperature and temperature of a target LED substrate, and the target LED substrate is an LED substrate with highest power;
comparing the real-time temperature to a maximum temperature threshold or a minimum temperature threshold;
when the real-time temperature is higher than the maximum temperature threshold, controlling the detachable air source device to output high-grade high-pressure gas to enter the heat dissipation cavity;
when the real-time temperature is lower than the lowest temperature threshold value, controlling the detachable air source device to output low-grade high-pressure gas to enter the heat dissipation cavity;
when the real-time temperature is between the lowest temperature threshold and the highest temperature threshold, the detachable air source device is controlled to output high-pressure gas with a stable gear to enter the heat dissipation cavity.
8. The method for dissipating heat of a high power LED light source system as claimed in claim 7, wherein before obtaining the real time temperature of the LED light source, the method further comprises:
determining a highest temperature threshold and a lowest temperature threshold of an LED chip on an LED substrate, wherein the highest temperature threshold and the lowest temperature threshold are determined by chip information and thermal simulation data of the LED chip;
and determining the high-pressure gas pressure and speed corresponding to the high-pressure gas, the stable-gear high-pressure gas and the low-gear high-pressure gas of the detachable air source device.
9. The method for dissipating heat of a high power LED light source system as claimed in claim 8, wherein before determining the maximum temperature threshold and the minimum temperature threshold of the LED chips on the LED substrate, the method further comprises:
when the high-power LED light source system is started, the detachable air source device is controlled to output stable high-pressure gas for a first preset time.
10. The method for dissipating heat of a high power LED light source system as claimed in claim 8, wherein before determining the maximum temperature threshold and the minimum temperature threshold of the LED chip on the LED substrate, the method further comprises:
and when the high-power LED light source system is started, the detachable air source device is controlled to output high-gear high-pressure gas for a second preset time and then is adjusted to be stable-gear high-pressure gas.
CN202111374352.XA 2021-11-19 2021-11-19 High-power LED light source system and heat dissipation method thereof Active CN114046489B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111374352.XA CN114046489B (en) 2021-11-19 2021-11-19 High-power LED light source system and heat dissipation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111374352.XA CN114046489B (en) 2021-11-19 2021-11-19 High-power LED light source system and heat dissipation method thereof

Publications (2)

Publication Number Publication Date
CN114046489A true CN114046489A (en) 2022-02-15
CN114046489B CN114046489B (en) 2024-01-30

Family

ID=80210118

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111374352.XA Active CN114046489B (en) 2021-11-19 2021-11-19 High-power LED light source system and heat dissipation method thereof

Country Status (1)

Country Link
CN (1) CN114046489B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101254985B1 (en) * 2011-12-28 2013-04-17 재단법인 포항산업과학연구원 Led lighting apparatus
CN104141892A (en) * 2013-05-08 2014-11-12 海洋王(东莞)照明科技有限公司 Lamp structure
CN104197294A (en) * 2014-09-16 2014-12-10 苏州承源光电科技有限公司 LED (light emitting diode) radiator
CN205014310U (en) * 2015-05-19 2016-02-03 南京永乐照明灯饰有限公司 High -power LED lamp lamps and lanterns of heat dissipation formula
US20180283620A1 (en) * 2017-04-01 2018-10-04 Xiamen Eco Lighting Co. Ltd. Lighting device
CN113203083A (en) * 2021-05-07 2021-08-03 广东省科学院半导体研究所 Thermal management system of high-power light source

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101254985B1 (en) * 2011-12-28 2013-04-17 재단법인 포항산업과학연구원 Led lighting apparatus
CN104141892A (en) * 2013-05-08 2014-11-12 海洋王(东莞)照明科技有限公司 Lamp structure
CN104197294A (en) * 2014-09-16 2014-12-10 苏州承源光电科技有限公司 LED (light emitting diode) radiator
CN205014310U (en) * 2015-05-19 2016-02-03 南京永乐照明灯饰有限公司 High -power LED lamp lamps and lanterns of heat dissipation formula
US20180283620A1 (en) * 2017-04-01 2018-10-04 Xiamen Eco Lighting Co. Ltd. Lighting device
CN113203083A (en) * 2021-05-07 2021-08-03 广东省科学院半导体研究所 Thermal management system of high-power light source

Also Published As

Publication number Publication date
CN114046489B (en) 2024-01-30

Similar Documents

Publication Publication Date Title
CN202403244U (en) Water cooling device of large LED (Light-Emitting Diode) lamp system
CN101463984A (en) Illuminating apparatus
CN103016992B (en) Self power generation active heat removal LED
KR20090084689A (en) Led illuminating device, led light source module, and led support member
CN207783398U (en) A kind of radiator structure and intelligent electronic device
CN103717041A (en) Heat-radiating device, heat-radiating device manufacturing method and electronic device
CN209489078U (en) Electronic equipment
CN114046489A (en) High-power LED light source system and heat dissipation method thereof
CN218868563U (en) Switching power supply heat abstractor
CN202992785U (en) Self-generating and active cooling LED (light-emitting diode) light
CN101493219A (en) High heat radiation LED illuminating apparatus and method for manufacturing same
CN111353231A (en) Genetic algorithm-based LED radiator design method and system
CN210937734U (en) Collect air-cooling and integrative cooling system of water-cooling
CN201014253Y (en) Luminous diode lighting device and radiating module thereof
CN201992605U (en) Heat sink for high-power LED (light-emitting diode) lamps
CN202040784U (en) Replaceable LED (light-emitting diode) heat-radiating device
CN202205150U (en) Heat radiation air duct structure for electronic equipment
CN207200606U (en) A kind of brushless motor controller system beneficial to the radiating of mos pipes
CN2746266Y (en) Headlamp with cooling device
CN206673406U (en) The air-cooled heat dissipation structure of intelligent junction box
CN2483539Y (en) Radiator with double fan
CN213517855U (en) Noise reduction type projector
CN219610140U (en) Heating resistor heat radiation structure
CN217523308U (en) Lighting device
CN201465999U (en) Integrated high-frequency electrodeless lamp

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant