CN114035282A - Optical module - Google Patents
Optical module Download PDFInfo
- Publication number
- CN114035282A CN114035282A CN202111284350.1A CN202111284350A CN114035282A CN 114035282 A CN114035282 A CN 114035282A CN 202111284350 A CN202111284350 A CN 202111284350A CN 114035282 A CN114035282 A CN 114035282A
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- Prior art keywords
- circuit board
- heat
- heat conducting
- chip
- photoelectric chip
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Light Receiving Elements (AREA)
Abstract
The application relates to the technical field of optical communication, and discloses an optical module which comprises a shell, a radiating block arranged in the shell, a circuit board and a first photoelectric chip; wherein, the shell is provided with a heat dissipation surface; the first surface of the circuit board is provided with a heat conducting part embedded in the circuit board, and the heat conducting part is provided with an upper surface close to the first surface of the circuit board; the first photoelectric chip is attached to the upper surface of the heat conducting part and is electrically connected with the circuit board; the radiating block is simultaneously in heat conduction connection with the radiating surface of the shell and the upper surface of the heat conducting portion, heat generated by the first photoelectric chip is conducted to the heat conducting portion, and then conducted to the radiating surface of the shell through the heat conducting portion and the radiating block. The optical module of this application has also improved the wiring space and the circuit design degree of freedom of its circuit board when improving high-speed optical module's heat dispersion, has reduced the signal crosstalk between light transmitting terminal and the light receiving terminal.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
In response to the market demand for high bandwidth and high rate data transmission, module designs are increasingly being developed in the direction of miniaturization and high density. Although highly integrated circuits strive for miniaturization and low power consumption, the high thermal power consumption of modules becomes a problem that must be faced with the development of high-speed, high-bandwidth module technology.
In order to solve the above problems, the prior art designs a circuit board 10' with a copper-filled heat dissipation structure as shown in fig. 1 to be applied to an optical module. Such a circuit board has two problems. On one hand, the heat dissipation path of the heat generating chip 20 ' on the circuit board 10 ' dissipates heat from the secondary heat dissipation surface of the housing through the heat dissipation pad 30 ', and the heat dissipation performance thereof needs to be improved; on the other hand, the copper filling 11 ' penetrates below the circuit board 10 ', so that the wiring space on the lower surface of the circuit board 10 ' is reduced, and the dense wiring of a high-speed circuit is not facilitated.
Disclosure of Invention
The purpose of this application lies in improving high-speed optical module's heat dispersion, improves the wiring space and the line design degree of freedom of its circuit board simultaneously, reduces the signal crosstalk between light transmitting terminal and the light receiving terminal.
In order to achieve one of the above objects, the present application provides an optical module, including a housing, a heat dissipation block disposed in the housing, a circuit board, and a first optoelectronic chip; the shell is provided with a heat dissipation surface;
the circuit board comprises a first surface and a second surface which are opposite; the first surface is provided with a heat conducting part embedded in the circuit board, and the thickness of the heat conducting part is smaller than that between the first surface and the second surface of the circuit board; the heat conducting portion has an upper surface adjacent to the first surface;
the first photoelectric chip is attached to the upper surface of the heat conducting part and is electrically connected with the circuit board; the radiating block is simultaneously in heat conduction connection with the radiating surface of the shell and the upper surface of the heat conducting portion, and heat generated by the first photoelectric chip is conducted to the heat conducting portion and is conducted to the radiating surface of the shell through the heat conducting portion and the radiating block.
As a further improvement of the embodiment, the heat conducting portion includes a heat conducting block, the first surface is provided with a groove, and the heat conducting block is embedded in the groove.
As a further improvement of the embodiment, the heat conduction portion includes a plurality of dense heat conduction holes, and the heat conduction holes are filled with a heat conduction metal; the circuit board comprises a conductor layer which is in heat conduction communication with the dense heat conduction holes.
As a further improvement of the embodiment, the dense heat conduction holes are via holes or laser stacked holes which do not penetrate through the circuit board.
As a further improvement of the embodiment, the circuit board further includes an electrical chip, the electrical chip is attached to the upper surface of the heat conducting portion, and the electrical chip is electrically connected to the first optoelectronic chip and the circuit board respectively.
As a further improvement of the embodiment, the optical module has an optical interface and an electrical interface; the heat conducting part is positioned at one end of the circuit board close to the optical interface.
As a further improvement of the embodiment, the heat dissipation block further includes an optical carrier located between the circuit board and the optical interface for carrying an optical element of an optical module.
As a further improvement of the embodiment, the optical module further includes a second optoelectronic chip, the second optoelectronic chip is located on the optical bearing portion of the heat dissipation block and close to the circuit board, and the second optoelectronic chip is electrically connected to the circuit board.
As a further improvement of the embodiment, the first optoelectronic chip is a light receiving end chip, and the second optoelectronic chip is a light emitting end chip; the second photoelectric chip and the first photoelectric chip are positioned on different sides of the heat dissipation block.
As a further improvement of the embodiment, an electrically isolating and thermally conducting pad is arranged between the thermal conducting portion and the heat dissipation block and/or between the second optoelectronic chip and the heat dissipation block.
The beneficial effect of this application: the heat conducting part of the high-speed circuit board is connected with the heat dissipation block, (1) both the photoelectric chip and the electric chip on the circuit board can finally dissipate heat from the main heat dissipation surface of the shell through the heat conducting part and the heat dissipation block, and the heat dissipation performance of the optical module is effectively improved; (2) the heat conducting part does not penetrate through the circuit board, more wiring space is provided on the second surface of the circuit board, and the freedom degree of circuit design is improved; (3) the light receiving end chip and the light emitting end chip are arranged on different sides of the radiating block, and corresponding circuits are also distributed on different sides of the circuit board, so that signal crosstalk between the light emitting end and the light receiving end is effectively reduced.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation structure of a heat-generating chip on an internal circuit board of an optical module in the prior art;
fig. 2 is a schematic view of a partial structure of an optical module in embodiment 1 of the present application;
fig. 3 is a schematic view of an internal heat dissipation structure of an optical module in embodiment 1 of the present application;
fig. 4 is a partial sectional view of a heat dissipation structure in embodiment 1 of the present application;
FIG. 5 is a schematic view showing a plurality of heat conduction holes densely formed in a heat conduction portion in example 1 of the present application;
fig. 6 is a partial sectional view of a heat dissipation structure according to embodiment 2 of the present application;
fig. 7 is a partial sectional view of a heat dissipation structure according to embodiment 3 of the present application;
fig. 8 is a partial sectional view of a heat dissipation structure according to embodiment 4 of the present application;
fig. 9 is a schematic diagram of a back side structure of the circuit board according to embodiment 4.
Reference numerals: 10', a circuit board; 11', pouring copper; 20', a heat-generating chip; 30', a heat dissipation pad;
10. a housing; 11. a heat dissipating surface; 20. an optical interface; 30. an electrical interface; 40. a circuit board; 41. a heat conducting portion; 411. an upper surface; 412. laser hole stacking; 413. a thermally conductive metal; 414. a heat conducting block; 42. a conductor layer; 43. a first surface; 44. a second surface; 50. a heat dissipating block; 60. a first photoelectric chip; 70. an electrical chip; 80. an electrically isolated thermally conductive pad; 90. a second photoelectric chip; A. a heat dissipation path.
Detailed Description
The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.
In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are provided to illustrate only the basic structure of the subject matter of the present application.
Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. When an element or layer is referred to as being "on," or "connected" to another element or layer, it can be directly on, connected to, or intervening elements or layers may be present.
Example 1
Referring to fig. 2 to 5, the optical module of this embodiment includes a housing 10, a heat dissipation block 50 disposed in the housing 10, a circuit board 40, and a first optoelectronic chip 60, where the housing 10 has a heat dissipation surface 11.
The circuit board 40 includes a first surface 43 and a second surface 44 opposite to each other, wherein the first surface 43 is provided with a heat conduction portion 41 embedded in the circuit board 40, and the thickness of the heat conduction portion 41 is smaller than the thickness between the first surface 43 and the second surface 44 of the circuit board 40. The heat conducting portion 41 has an upper surface 411 adjacent to the first surface 43 of the circuit board 40, and the first optoelectronic chip 60 is mounted on the upper surface 411 of the heat conducting portion 41 and electrically connected to the circuit board 40. In this embodiment, the upper surface 411 of the thermal conductor 41 is flush with the first surface 43 of the circuit board 40, or is slightly lower than the first surface 43 of the circuit board 40, so as to leave enough glue space for a chip (e.g., the first optoelectronic chip 60) attached to the upper surface 411 of the thermal conductor 41. The heat dissipating block 50 is thermally connected to the heat dissipating surface 11 of the housing 10 and the upper surface 413 of the heat conducting portion 41, and the heat generated by the first optoelectronic chip 60 is conducted to the heat conducting portion 41, and then conducted to the heat dissipating surface 11 of the housing 10 through the heat conducting portion 41 and the heat dissipating block 50, so as to form a U-shaped or L-shaped heat dissipating path, such as the heat dissipating path a shown in fig. 3.
As shown in fig. 4, in this embodiment, the heat conducting portion 41 of the circuit board 40 includes a plurality of dense heat conducting holes filled with a heat conducting metal; the circuit board 40 further includes a conductive layer in conductive thermal communication with the plurality of closely spaced thermal vias. The dense thermal vias in this embodiment are laser stacks 412 that do not extend through the circuit board 40, i.e., portions of the interlayer laser stacks, as shown in fig. 5. The laser stack hole 412 only penetrates through a portion of the substrate layer of the multilayer circuit board 40 from the first surface 43 to the bottom, and the laser stack hole 412 is filled with a heat conductive metal 413 and is in heat conductive communication with the conductor layer 42 of the multilayer circuit board 40. The heat dissipation of the first optoelectronic chip 60 (heat generating chip) on the heat conducting portion 41 is conducted downward through the laser stack hole 412 and the conductor layer 42 is laterally conducted to the lower portion of the heat dissipating block 50, and then conducted upward through the laser stack hole 412 to the heat dissipating block 50, and conducted from the heat dissipating block 50 to the heat dissipating surface 11 (in this embodiment, the heat dissipating surface is a main heat dissipating surface) of the housing 10, so as to form a U-shaped heat dissipating path. Therefore, the heating chip in the optical module can finally dissipate heat through the main heat dissipation surface of the shell, and the heat dissipation performance of the optical module can be effectively improved. And the heat conducting part does not penetrate through the circuit board, so that more wiring spaces are provided on the second surface of the circuit board, and the circuit integration level and the design freedom degree are improved.
The laser stack holes in the above embodiments may also be via holes processed on the circuit board by other methods. The heat-conducting metal can be copper or other metal with good heat-conducting property; the conductor layer can be a copper layer or other metal with good heat conduction and electric conduction performance. The first optoelectronic chip may be a light receiving end chip or a light emitting end chip.
Example 2
As shown in embodiment 2 of fig. 6, different from embodiment 1, in this embodiment, the circuit board 40 further includes an electrical chip 70, the electrical chip 70 is one of the main heat generating chips and is also attached to the upper surface 411 of the heat conducting portion 41 of the circuit board 40, the electrical chip 70 is electrically connected to the first optoelectronic chip 60 and the circuit board 40 respectively, that is, the first optoelectronic chip 60 is electrically connected to the electrical chip 70, and the electrical chip 70 is further electrically connected to the circuit board 40. In this embodiment, the dense heat conduction holes forming the heat conduction portion 41 extend to the edge of the circuit board 40, and have a larger heat conduction connection area with the heat dissipation block 50, so that the heat dissipation conduction speed is increased, and the heat dissipation performance of the optical module is further improved.
In this embodiment, the first optoelectronic chip 60 is an optical receiving end chip, and the electronic chip 70 is a transimpedance amplifier (TIA).
Example 3
In embodiment 3 shown in fig. 7, unlike embodiment 1, the heat conducting portion 41 of the circuit board 40 includes a heat conducting block 414, and a groove is formed on the first surface 43 of the circuit board 40, and the heat conducting block 414 is embedded in the groove. The first photoelectric chip 60 is attached to the upper surface 411 of the heat conductive block 414. The heat slug 50 may be directly thermally coupled to the thermal slug 414 via a thermally conductive adhesive, or may be thermally coupled to the thermal slug 414 via an electrically isolated thermal pad 80.
The heat-conducting block 414 may be a copper block or other metal block with good heat-conducting property.
Example 4
As shown in fig. 8 and 9, an optical module of this embodiment has the same optical interface 20 and electrical interface 30 as the optical module of embodiment 1, and reference is made to fig. 1 and 2. The heat conducting portion 41 of the circuit board 40 of the optical module of this embodiment is located at one end of the circuit board 40 near the optical interface 20. The heat slug 50 further comprises an optical carrier 51, the optical carrier 51 being located between the circuit board 40 and the optical interface 20 for carrying the optical elements of the optical module.
In this embodiment, the optical module further includes a second optoelectronic chip 90, the second optoelectronic chip 90 is located on the optical carrier 51 of the heat slug 50 and close to the circuit board 40, and the second optoelectronic chip 90 is electrically connected to the circuit board 40. Specifically, the first photoelectric chip 60 is a light receiving end chip, the second photoelectric chip 90 is a light emitting end chip, and the second photoelectric cell 90 and the first photoelectric chip 60 are located on different sides of the heat sink 50.
The light receiving end chip and the light emitting end chip are arranged on different sides of the radiating block, and corresponding circuits are also distributed on different sides of the circuit board, so that signal crosstalk between the light emitting end and the light receiving end is effectively reduced. And the light receiving end chip and the light emitting end chip on different sides are finally radiated through the main radiating surface of the shell, so that the signal crosstalk is reduced, and the radiating performance of the optical module is not influenced.
The heat conducting portion and the heat dissipating block and/or the second optoelectronic chip and the heat dissipating block in the above embodiments may be connected through an electrically isolated heat conducting pad, or may be connected through direct heat conduction by using a heat conducting adhesive. The electrically isolated thermal pad may be an insulating material with good thermal conductivity, such as aluminum nitride, and the thermal conductive adhesive may be silver adhesive or other thermal conductive insulating adhesive.
The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.
Claims (21)
1. An optical module comprises a shell, a heat dissipation block, a circuit board and a first photoelectric chip, wherein the heat dissipation block, the circuit board and the first photoelectric chip are arranged in the shell; the method is characterized in that:
the shell is provided with a heat dissipation surface;
the circuit board is provided with a heat conducting part, the heat conducting part is provided with an upper surface facing the heat radiating surface, and the upper surface of the heat conducting part is exposed out of the circuit board;
the first photoelectric chip is arranged on the upper surface of the heat conducting part and is electrically connected with the circuit board;
the radiating block is connected with the radiating surface of the shell and the heat conducting portion in a heat conduction mode, and heat generated by the first photoelectric chip is conducted to the heat conducting portion and conducted to the radiating surface of the shell through the heat conducting portion and the radiating block.
2. The optical module of claim 1, wherein: the circuit board comprises a first surface and a second surface which are opposite, the first surface faces the heat dissipation surface, and the upper surface of the heat conduction part is exposed out of the first surface.
3. The light module of claim 2, wherein: the heat conducting part is embedded in the circuit board.
4. The light module of claim 3, wherein: the heat conduction part does not penetrate through the second surface.
5. The light module of claim 3, wherein: the upper surface of the thermal conduction portion is adjacent to a first surface of the circuit board.
6. The optical module of claim 1, wherein: the heat dissipation block is connected with the upper surface of the heat conduction part in a heat conduction mode.
7. The optical module of claim 1, wherein: the heat conducting part comprises a heat conducting block; or, the heat conducting part comprises a plurality of intensive heat conducting holes, heat conducting metal is filled in the heat conducting holes, the circuit board comprises a conductor layer, and the conductor layer is communicated with the intensive heat conducting holes in a heat conducting mode.
8. The optical module of claim 1, wherein: the circuit board further comprises an electric chip, the electric chip is arranged on the upper surface of the heat conducting portion, and the electric chip is electrically connected with the first photoelectric chip and the circuit board respectively.
9. The light module according to any one of claims 2-8, characterized in that:
the optical module further comprises a second photoelectric chip;
the second photoelectric chip is positioned on the surface of the optical bearing part, which is back to the heat dissipation surface of the shell, and is electrically connected with the circuit board;
the heat generated by the second photoelectric chip is conducted to the heat dissipation surface of the shell through the heat dissipation block.
10. The light module of claim 9, wherein: the first photoelectric chip is electrically connected with the first surface of the circuit board, and the second photoelectric chip is electrically connected with the second surface of the circuit board.
11. The light module according to any one of claims 1-8, characterized in that:
the optical module has an optical interface and an electrical interface;
the position of the heat dissipation block, which is in heat conduction connection with the heat conduction portion, is located between the first photoelectric chip and the optical interface, and the heat dissipation block is provided with an avoidance space for avoiding a light path between the first photoelectric chip and the optical interface.
12. An optical module comprises a shell, a heat dissipation block, a circuit board and a first photoelectric chip, wherein the heat dissipation block, the circuit board and the first photoelectric chip are arranged in the shell; the method is characterized in that:
the shell is provided with a heat dissipation surface, and the circuit board comprises a first surface and a second surface which are opposite, wherein the first surface faces the heat dissipation surface;
the optical module further comprises a heat conducting portion; the heat conducting part is arranged on the circuit board, and at least part of the heat conducting part is exposed on the first surface of the circuit board; the first photoelectric chip is arranged at the position where the heat conducting part is exposed out of the first surface, and the first photoelectric chip is electrically connected with the circuit board;
the radiating block is connected with the radiating surface of the shell and the heat conducting portion in a heat conduction mode, and heat generated by the first photoelectric chip is conducted to the heat conducting portion and conducted to the radiating surface of the shell through the heat conducting portion and the radiating block.
13. The light module of claim 12, wherein: the heat conduction part does not penetrate through the second surface.
14. The light module of claim 12, wherein: the circuit board further comprises an electric chip, the electric chip is arranged on the position, exposed out of the first surface, of the heat conducting portion, and the electric chip is electrically connected with the first photoelectric chip and the circuit board respectively.
15. The light module of claim 12, wherein:
the optical module further comprises a second photoelectric chip;
the second photoelectric chip is positioned on the surface of the optical bearing part, which is back to the heat dissipation surface of the shell, and is electrically connected with the circuit board;
the heat generated by the second photoelectric chip is conducted to the heat dissipation surface of the shell through the heat dissipation block.
16. The light module of claim 15, wherein: the first photoelectric chip is electrically connected with the first surface of the circuit board, and the second photoelectric chip is electrically connected with the second surface of the circuit board.
17. The light module of claim 12, wherein:
the optical module has an optical interface and an electrical interface;
the position of the heat dissipation block, which is in heat conduction connection with the heat conduction portion, is located between the first photoelectric chip and the optical interface, and the heat dissipation block is provided with an avoidance space for avoiding a light path between the first photoelectric chip and the optical interface.
18. The light module according to any one of claims 12-17, characterized in that: the heat conducting part comprises a heat conducting block; or, the heat conducting part comprises a plurality of intensive heat conducting holes, heat conducting metal is filled in the heat conducting holes, the circuit board comprises a conductor layer, and the conductor layer is communicated with the intensive heat conducting holes in a heat conducting mode.
19. The optical module of any of claims 12-17, the thermal conductor having an upper surface facing the heat dissipation surface of the housing, the upper surface facing the first surface proximate the circuit board, the first optoelectronic chip being disposed on the upper surface.
20. The light module of claim 19, wherein: the heat dissipation block is connected with the upper surface of the heat conduction part in a heat conduction mode.
21. The light module according to any one of claims 12-17, characterized in that: the radiating block is abutted against the side edge of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111284350.1A CN114035282B (en) | 2018-08-27 | 2018-08-27 | Optical module |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810982693.7A CN110865441B (en) | 2018-08-27 | 2018-08-27 | Optical module |
| CN202111284350.1A CN114035282B (en) | 2018-08-27 | 2018-08-27 | Optical module |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810982693.7A Division CN110865441B (en) | 2018-08-27 | 2018-08-27 | Optical module |
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| CN114035282A true CN114035282A (en) | 2022-02-11 |
| CN114035282B CN114035282B (en) | 2023-03-28 |
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| CN201810982693.7A Active CN110865441B (en) | 2018-08-27 | 2018-08-27 | Optical module |
| CN202111284350.1A Active CN114035282B (en) | 2018-08-27 | 2018-08-27 | Optical module |
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| CN201810982693.7A Active CN110865441B (en) | 2018-08-27 | 2018-08-27 | Optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114488423A (en) * | 2020-10-27 | 2022-05-13 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114488419B (en) * | 2020-10-23 | 2023-06-20 | 苏州旭创科技有限公司 | Optical module packaging structure |
| CN113534363A (en) * | 2021-06-24 | 2021-10-22 | 武汉英飞光创科技有限公司 | COB optical module and manufacturing method thereof |
| CN113204083B (en) * | 2021-07-07 | 2021-09-07 | 武汉联特科技股份有限公司 | Non-airtight packaging type optical module, light emitting device and manufacturing method of connecting piece |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110865441A (en) | 2020-03-06 |
| CN110865441B (en) | 2021-11-19 |
| CN114035282B (en) | 2023-03-28 |
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