CN113204083B - Non-airtight packaging type optical module, light emitting device and manufacturing method of connecting piece - Google Patents

Abstract

The invention relates to a non-airtight packaging type optical module, a light emitting device and a manufacturing method of a connecting piece. The high-frequency transmission element of the optical module and the heat dissipation surface of the transmission optical device are located on the same side of the optical module, the same heat dissipation surface is adopted, the high-frequency wiring of the transmission optical device adopts double-layer connecting block wiring, the high-frequency wiring of the laser assembly is turned, and the advantages of low loss, high heat dissipation and the like are achieved.

Description

Non-airtight packaging type optical module, light emitting device and manufacturing method of connecting piece

Technical Field

The invention belongs to the technical field of optical communication, and particularly relates to a non-airtight packaging type optical module, a light emitting device and a manufacturing method of a connecting piece.

Background

For non-airtight optical devices and optical modules, especially for optical modules with a rate of 100Gpbs or more, such as 100GLR1/FR1, 400GFR4/DR4/LR4, and DR8 of 800G, in order to obtain good high-frequency characteristics, a laser module of an optical emitting device is directly electrically interconnected with PCBA, electric signal transmission is realized through very short gold wire bonding, high-frequency loss caused by long-distance use of a soft tape is avoided, such as patents cn201710590788.x, CN201710590796.4, CN201911251516.2, CN202020015405.3, and the like, and in order to reduce high-frequency loss, a via hole must be avoided from being punched on a high-frequency signal wire, so in an excellent high-frequency design of the optical module, the laser module, the high-frequency signal wire and a high-frequency emission source are arranged in the same plane, that is simultaneously positioned on the top plane of the PBCA. The high frequency signal source is usually an LDD (laser diode driver) or a DSP (digital signal processing) or the like. The two chips are high-power-consumption electronic elements and must dissipate heat, so in the optical module, the heat dissipation surface of LDD \ DSP is directly communicated with the heat dissipation area of the optical module tube shell; at this time, since the laser component and the LDD/DSP are disposed on the same plane, but the heat dissipation of the laser component is downward heat dissipation, and the heat dissipation direction is opposite to the heat dissipation direction of the LDD/DSP, for example, patent nos. cn201710590788.x, CN201710590796.4, CN201911251516.2, CN202020015405.3, etc., so the heat dissipation surface of the laser component is the upper cover of the optical module, rather than the heat dissipation area, and the upper cover is usually thin, and the heat is further transferred through the sealing rubber ring, and the transfer distance is long, and the contact area is small, so the heat dissipation effect is poor, which may cause the heat dissipation effect of the laser component to be poor when the laser component is used at high temperature, and even if there is a TEC (thermoelectric cooler) for controlling temperature, the power consumption of the TEC may be increased, even reach the upper limit of the TEC cooling, and further cause the high frequency performance of the light emitting component to be degraded.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provides a manufacturing method of a non-airtight packaging type optical module, a light emitting device and a connecting piece, which have the advantages of low loss, high heat dissipation and the like.

The technical scheme of the invention is realized as follows: the invention discloses a light emitting device, which comprises a device tube shell, wherein the device tube shell is provided with a main body groove, one end of the device tube shell is provided with a light port assembly, the other end of the device tube shell is provided with a circuit board embedded groove for installing a circuit board, the circuit board embedded groove is communicated with the main body groove, the main body groove of the device tube shell is internally provided with at least one laser chip, and the laser chip is attached to a connecting piece and is electrically connected with the circuit board inserted into the device tube shell through the connecting piece.

Furthermore, the connecting piece is provided with a high-frequency signal wire, a high-frequency GND wire and a power supply bonding pad, and the high-frequency signal wire, the high-frequency GND wire and the power supply bonding pad are electrically connected with the laser chip.

Furthermore, the connecting piece comprises a lower connecting block and an upper connecting block, a first high-frequency wiring assembly is arranged on the upper surface of the lower connecting block, a second high-frequency wiring assembly is arranged on the upper surface of the upper connecting block, the upper connecting block is fixed on the upper surface of the lower connecting block in an inverted manner, so that one part of the upper surface of the upper connecting block is fixedly attached to one part of the upper surface of the lower connecting block, the second high-frequency wiring assembly on the upper surface of the upper connecting block is correspondingly attached to the first high-frequency wiring assembly on the upper surface of the lower connecting block respectively to form electric connection, the other part of the upper surface of the upper connecting block is suspended, and the second high-frequency wiring assembly on the suspended part of the upper surface of the upper connecting block is electrically connected with a circuit board inserted into the device tube; the laser chip is disposed on an upper surface of the lower connection block.

Further, a solder area, a first high-frequency signal wiring line, a first high-frequency GND wiring line and a first power supply pad are arranged on the upper surface of the lower connecting block, the laser chip is mounted on the solder area on the upper surface of the lower connecting block, gaps are arranged among the first high-frequency signal wiring line, the first high-frequency GND wiring line and the first power supply pad, a second high-frequency signal wiring line, a second high-frequency GND wiring line and a second power supply pad are arranged on the upper surface of the upper connecting block, gaps are arranged among the second high-frequency signal wiring line, the second high-frequency GND wiring line and the second power supply pad, and the upper surface of one part of the upper connecting block is fixedly attached to the upper surface of one part of the lower connecting block, so that the second high-frequency signal wiring line, the second high-frequency GND wiring line and the second power supply pad of the upper connecting block are respectively attached to the first high-frequency signal wiring line, the first high-frequency GND wiring line and the first power supply pad of the lower connecting block, The first power supply bonding pads are correspondingly attached one by one to form electric connection.

Furthermore, a first high-frequency GND wiring area of the lower connecting block is provided with a first GND through hole penetrating through the lower connecting block, and the first GND through hole is filled with a conductive material and used for electrically connecting the first high-frequency GND wiring on the upper surface of the lower connecting block with the GND at the bottom of the lower connecting block;

a second high-frequency GND wiring area of the upper connecting block is provided with a second GND through hole penetrating through the upper connecting block, and the second GND through hole is filled with a conductive material and used for electrically connecting the second high-frequency GND wiring on the upper surface of the upper connecting block with the GND at the bottom of the upper connecting block;

the solder area is arranged in the first high-frequency GND wiring area;

the first high-frequency signal wire is surrounded by the first high-frequency GND wire in a U shape; the power supply bonding pad is located on the periphery of the first high-frequency GND wire.

And mounting the required electric elements on the first high-frequency GND wiring area.

Furthermore, the lower connecting block and the upper connecting block are ceramic blocks; the lower connecting block and the upper connecting block are fixed together through high-temperature sintering to form the ceramic connecting piece.

Furthermore, the upper surface of the lower connecting block faces the notch of the main body groove, the upper surface of the upper connecting block faces the bottom of the main body groove, and the wall of the device tube shell, which is positioned at the bottom of the main body groove, is provided with a gold wire bonding window corresponding to the suspended part of the upper surface of the upper connecting block; the gold wire bonding window is provided with a first sealing cover plate.

The gold wire bonding window is used for the in and out of the cleaver during gold wire bonding.

Furthermore, the laser chip is positioned at one end, close to the circuit board embedded groove, in the main body groove of the device tube shell, an optical window is arranged at one end, far away from the circuit board embedded groove, of the device tube shell and used for installing an optical port assembly, a wavelength division multiplexing element and a collimating lens are further arranged in the main body groove of the device tube shell, and the collimating lens and the wavelength division multiplexing element are sequentially arranged on an optical path between the laser chip and the optical port assembly; an isolator is arranged in the optical window and is positioned on an optical path between the wavelength division multiplexing element and the optical port assembly; the connecting piece and the collimating lens are fixed on the TEC or the cushion block, and the TEC or the cushion block is fixed at the bottom of the main groove of the device tube shell.

Further, a second sealing cover plate is fixed on the notch of the main body groove and used for sealing the main body groove of the light emitting device.

The invention also discloses a non-airtight packaging type optical module which comprises a module tube shell, a circuit board and a receiving optical device, wherein the circuit board and the receiving optical device are both positioned in the module tube shell, the emitting optical device is also arranged in the module tube shell, one part of the circuit board is embedded into the device tube shell of the emitting optical device and is fixedly connected with the device tube shell of the emitting optical device, and the circuit board is electrically connected with a connecting piece of the emitting optical device through gold wire bonding.

Furthermore, a high-frequency emitting element is arranged on the circuit board, a first radiating fin is arranged between the high-frequency emitting element and the module tube shell, and a second radiating fin is arranged between the device tube shell and the module tube shell of the light emitting device; the outer wall of the module tube shell is provided with a radiator, the first radiating fin and the second radiating fin are located on the same side, and the radiator is arranged on the side.

Furthermore, the first radiating fin is fixed between the high-frequency emission element and the inner wall of the base of the module tube shell, and the second radiating fin is fixed between the device tube shell of the emission light device and the inner wall of the base of the module tube shell; the radiator is fixed on the outer wall of the base of the module tube shell, the second radiating fin is positioned between the bottom wall of the device tube shell of the light-emitting device and the base of the module tube shell, and the notch of the main body groove of the device tube shell faces the upper cover of the module tube shell.

Furthermore, the circuit board is provided with a high-frequency emitting element, a high-frequency signal circuit and a gold wire bonding pad, the high-frequency emitting element is electrically connected with the gold wire bonding pad through the high-frequency signal circuit, and the gold wire bonding pad on the circuit board is correspondingly electrically connected with the connecting piece through gold wire bonding.

The invention also discloses a manufacturing method of the connecting piece, which comprises the following steps:

manufacturing an upper connecting block and a lower connecting block;

holes are punched in the upper connecting block and the lower connecting block respectively;

conducting material filling is carried out on the through holes of the upper connecting block and the lower connecting block;

presetting metal routing layers on the surfaces of the upper connecting block and the lower connecting block;

the upper connecting block is reversely buckled on the lower connecting block, the first part of the upper surface of the upper connecting block covers the first part of the upper surface of the lower connecting block, the metal wiring layer of the upper surface of the upper connecting block is correspondingly attached to the metal wiring layer of the upper surface of the lower connecting block, the upper connecting block and the lower connecting block are fixedly connected to form a connecting piece, and at the moment, the second part of the upper connecting block and the second part of the lower connecting block are not mutually covered.

Further, will go up the connecting block back-off under on the connecting block, and go up the first part of connecting block upper surface and cover the first part of connecting block upper surface down, make the metal routing layer of connecting block upper surface and the metal routing layer of connecting block upper surface correspond the laminating down to fixed connection forms the connecting piece, specifically includes: the lower connecting block and the upper connecting block are ceramic blocks, the upper connecting block is reversely buckled on the lower connecting block, and the first part of the upper surface of the upper connecting block covers the first part of the upper surface of the lower connecting block, so that the metal wiring layer on the upper surface of the upper connecting block is correspondingly attached to the metal wiring layer on the upper surface of the lower connecting block and is fixed through a tool clamp; and (4) sending the connecting block into a high-temperature sintering furnace, and sintering the upper connecting block and the lower connecting block together.

Before the steel plate is sent into a high-temperature sintering furnace, covering isolation materials on the second parts of the upper connecting block and the lower connecting block;

and after the upper connecting block and the lower connecting block are sintered together, removing the isolating materials on the upper connecting block and the lower connecting block. The isolation material is a non-metal isolation material.

The invention has at least the following beneficial effects: the core electronic element of the optical module, namely the high-frequency emitting element and the radiating surface of the emitting optical device are positioned on the same side of the optical module, the same radiating surface is adopted, the high-frequency wiring of the emitting optical device adopts double-layer connecting block wiring, the high-frequency wiring of the laser assembly is turned, and the advantages of low loss, high radiating and the like are achieved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a cross-sectional view of an emissive light device provided by an embodiment of the present invention;

FIG. 2 is a side view of a light emitting device provided by an embodiment of the present invention;

FIG. 3 is an assembled view of a connector according to an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a lower connecting block according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of an upper connecting block according to an embodiment of the present invention;

FIG. 6 is a schematic view of a connector covered with a non-metallic insulating material according to an embodiment of the present invention;

fig. 7 is an assembled cross-sectional view of an optical module according to an embodiment of the present invention;

FIG. 8 is a schematic diagram of a connection between a light emitting device and a circuit board according to an embodiment of the present invention;

FIG. 9 is an enlarged view of portion P of FIG. 8;

FIG. 10 is a bottom view of FIG. 8;

fig. 11 is a side view of fig. 8.

In the drawings, 101 is a circuit board, 102 is a light emitting device, 103-1 is a base, 103-2 is an upper cover, 104 is a heat sink, 105-1 is a first heat sink, 105-2 is a second heat sink, 106 is a device package, 107 is a high frequency emitting element, 201 is a high frequency signal line, 202 is a gold wire bonding pad, 203 is a high frequency trace assembly, 204 is a gold wire, 301 is a filter capacitor, 401 is an isolation material, 501 is a first sealing cover plate, 502 is a second sealing cover plate, 601 is a laser chip, 602 is a connector, 602-1 is a lower connector block, 602-2 is an upper connector block, 603 is a collimating lens, 604 is a wavelength division multiplexing element, 605 is an isolator, 606 is an optical port assembly, 607 is a TEC, 608 is a body groove, 701 is a gold wire bonding window, 702 is a body groove window, 703 is a circuit board embedded groove, 801 is a eutectic solder region, 802 is a first high frequency signal trace, 803 is a first high-frequency GND trace, 804 is a first laser chip power supply pad, 805 is a first GND via, 901 is a second high-frequency signal trace, 902 is a second high-frequency GND trace, 903 is a second laser chip power supply pad, and 904 is a second GND via.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

The terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of the present invention, the meaning of "plurality" or "a plurality" is two or more unless otherwise specified.

The light emitting device and the optical module described in this patent are non-hermetic packages, and can be applied to the case where CWDM and LWDM or other specifically required multi-channel wavelengths work simultaneously, and also can be used for the case of single-wavelength working, for convenience of presentation, a 4-channel light emitting device for CWDM is taken as an example for description, wherein the working wavelength adopts, but is not limited to, the commonly used 4 wavelengths or combinations of CWDM, such as 1271nm, 1291nm, 1311nm, 1331nm, and the like.

Example one

Referring to fig. 1to 5, an embodiment of the invention provides a light emitting device, including a device package 106, the device package 106 is provided with a main body groove 608, one end of the device package 106 is provided with an optical port assembly 606, the other end of the device package 106 is provided with a circuit board embedded groove 703 for mounting a circuit board, the circuit board embedded groove 703 is communicated with the main body groove 608, at least one laser chip 601 is arranged in the main body groove 608 of the device package 106, and the laser chip 601 is attached to a connecting member 602 and electrically connected with a circuit board 101 inserted into the device package through the connecting member 602.

Further, the connecting piece 602 is provided with a high-frequency signal wire, a high-frequency GND wire and a power supply pad, and the high-frequency signal wire, the high-frequency GND wire and the power supply pad are electrically connected with the laser chip.

Further, the connecting member 602 includes a lower connecting block 602-1 and an upper connecting block 602-2, a first high-frequency wiring assembly is disposed on an upper surface of the lower connecting block, a second high-frequency wiring assembly is disposed on an upper surface of the upper connecting block, the upper connecting block is fixed on an upper surface of the lower connecting block in an inverted manner, so that a portion of an upper surface of the upper connecting block is fixedly attached to a portion of an upper surface of the lower connecting block, the second high-frequency wiring assembly on the upper surface of the upper connecting block is correspondingly attached to the first high-frequency wiring assembly on the upper surface of the lower connecting block, thereby forming an electrical connection, another portion of the upper connecting block is suspended, and the second high-frequency wiring assembly on the suspended portion of the upper surface of the upper connecting block is electrically connected to a top surface of a circuit board inserted. The laser chip is disposed on an upper surface of the lower connection block. The upper surface of the suspended part of the upper connecting block and the top surface of the circuit board are positioned on the same side.

Further, a eutectic solder area 801, a first high-frequency signal wire 802, a first high-frequency GND wire 803 and a first power supply pad are arranged on the upper surface of the lower connecting block 602-1, the laser chip is mounted on the eutectic solder area on the upper surface of the lower connecting block and is electrically connected with the first high-frequency signal wire, the first high-frequency GND wire and the first power supply pad respectively, gaps are formed among the first high-frequency signal wire 802, the first high-frequency GND wire and the first power supply pad, a second high-frequency signal wire 901, a second high-frequency GND wire 902 and a second power supply pad are arranged on the upper surface of the upper connecting block 602-2, gaps are formed among the second high-frequency signal wire, the second high-frequency GND wire and the second power supply pad, and one part of the upper surface of the upper connecting block is fixedly attached to one part of the upper surface of the lower connecting block, so that the second high-frequency signal wire, the first high-frequency signal wire, the second high-frequency GND wire and the second power supply pad are fixedly attached to the upper surface of the lower connecting block, The second high-frequency GND wire and the second power supply bonding pad are correspondingly attached to the first high-frequency signal wire, the first high-frequency GND wire and the first power supply bonding pad of the lower connecting block one to form electric connection. The laser chip is attached to the first high-frequency GND wiring region.

Further, the first high-frequency GND wiring area of the lower connection block is provided with at least one first GND via hole 805 penetrating through the lower connection block, and the first GND via hole 805 is filled with a conductive material for electrically connecting the first high-frequency GND wiring on the upper surface of the lower connection block with the bottom GND of the lower connection block. The first high-frequency GND line of the lower connecting block of this embodiment is provided with a plurality of first GND via holes that run through the lower connecting block.

The second high-frequency GND wiring area of the upper connecting block is provided with at least one second GND through hole 904 penetrating through the upper connecting block, and the second GND through hole 904 is filled with a conductive material and used for enabling the second high-frequency GND wiring on the upper surface of the upper connecting block to be electrically connected with the bottom GND of the upper connecting block. The second high-frequency GND wiring of the upper connecting block is provided with a plurality of second GND through holes penetrating through the upper connecting block.

The high-frequency GND wiring and the GND via hole meet the necessary condition of high-frequency signal transmission, and the upper and lower layers of connecting blocks are provided with the GND via holes, so that the loss during the transmission of the high-frequency signal is reduced.

The eutectic solder area is arranged in the first high-frequency GND wiring area;

the first high-frequency signal wire is surrounded by the first high-frequency GND wire in a U shape; the power supply bonding pad is positioned on the periphery of the first high-frequency GND wire;

and mounting required electric elements such as a filter capacitor on the first high-frequency GND wiring area.

Preferably, the lower connecting block and the upper connecting block are ceramic blocks; the lower connecting block and the upper connecting block are fixed together through high-temperature sintering to form the ceramic connecting piece.

Of course, the lower connecting block and the upper connecting block of the invention are not limited to the ceramic block, and other suitable materials with high frequency and low loss factor, such as high-resistance silicon materials, can be selected according to the requirements.

Furthermore, the upper surface of the lower connecting block faces the notch of the main body groove, the upper surface of the upper connecting block faces the bottom of the main body groove, and the wall of the device tube shell, which is positioned at the bottom of the main body groove, is provided with a gold wire bonding window 701 corresponding to the suspended part of the upper surface of the upper connecting block; the gold wire bonding window is provided with a first sealing cover plate 501 for sealing the gold wire bonding window. The gold wire bonding window is used for the in and out of the cleaver during gold wire bonding.

Further, the laser chip is located at one end of the device tube shell close to the circuit board embedded groove in the main body groove, an optical window is arranged at one end of the device tube shell far away from the circuit board embedded groove and used for installing an optical port component 606, a wavelength division multiplexing component 604 and a collimating lens 603 are further arranged in the main body groove of the device tube shell, and the collimating lens 603 and the wavelength division multiplexing component 604 are sequentially arranged on a light path between the laser chip and the optical port component 606; an isolator 605 is arranged in the optical window, and the isolator 605 is positioned on the optical path between the wavelength division multiplexing element 604 and the optical port component 606; the connector 602 and collimating lens 603 are fixed to a TEC607 or block that is fixed to the bottom of the body slot 608 of the device package.

Further, a second sealing cover plate 502 is fixed on the notch of the main body groove 608 for sealing the main body groove 608 of the light emitting device. The circuit board of this embodiment is a PCBA.

As shown in fig. 10, the body slot opening of the light emitting device is on the same side as the bottom side of the PCBA, the bottom plane commonly referred to in the art. As shown in fig. 11, a first sealing cover 501 and a second sealing cover 502 are located at the upper and lower ends of the light emitting device, respectively. The first sealing cover plate 501 is bonded in the gold wire bonding window of the device package 106 and sealed with a structural adhesive. The first sealing cover 501 is a glass cover or a metal cover.

The second sealing cap 502 is bonded within the body slot window 702 of the device package 106 and sealed with structural adhesive. The second sealing cover plate 502 is a glass cover plate or a metal cover plate.

As shown in fig. 1, the light emitting device 102 of the present embodiment includes a laser chip set, a COC connection set, a collimating lens set, a wavelength division multiplexing element 604, an isolator 605, an optical port set 606, and a TEC 607. In this embodiment, one laser chip corresponds to one connecting member, and one laser chip corresponds to one collimating lens. The device package 106 of the light emitting device 102 includes a package wall, a body recess 608, an optical window, a gold wire bonding window 701, a body recess window 702, and a circuit board insertion recess 703. The set of COC connectors is located on the right side of the device package 106 and on the left side of the circuit board insertion slot 703. The eutectic solder area 801 is arranged on the surface above the COC connecting piece group, the laser chip group 601 is attached to the position right above the eutectic solder area 801 of the COC connecting piece group in a eutectic mode, and the laser chips of the laser chip group 601 are arranged at equal intervals and can adopt different working wavelengths or the same working wavelength. The COC connector group comprises a plurality of connectors. The connecting piece comprises a lower connecting block 602-1 and an upper connecting block 602-2, the lower connecting block 602-1 and the upper connecting block 602-2 are fixed together to form a connecting piece, the thickness of the connecting piece can be freely adjusted, when the thickness of the connecting piece is thinner, in order to match the height of the collimating lens group 603, an AlN ceramic cushion block can be arranged below the connecting piece 602, and the AlN ceramic cushion block or the connecting piece 602 is attached above the TEC607 and fixed through heat conducting silver glue. When refrigeration is not needed, the TEC607 can be replaced by an AlN ceramic plate according to needs. The TEC607 or AlN ceramic plate is attached to the inner bottom surface of the main body groove 608 of the device package 106 and fixed by a heat conductive silver paste. The device case 106 is preferably made of tungsten copper, purple copper or molybdenum copper, has good heat conduction property, and can also be made of kovar material and tungsten copper material by brazing. And a collimating lens group is arranged above the TEC607 or AlN ceramic plate and on the left side of the COC connecting group, and the laser chip group is positioned on the back focal plane of the collimating lens group to form a quasi-parallel optical path. The area of the TEC607 or AlN ceramic wafer completely covers the lower connection block 602-1 and the collimating lens group to ensure sufficient heat dissipation or temperature control. The wavelength division multiplexing element 604 is provided on the left side of the collimating lens group, and the wavelength division multiplexing element 604 may be of a thin film filter type, a polarization multiplexing type, an AWG type, or the like, but is not limited to the type, and a thin film filter type is preferable. On the left side of the wavelength division multiplexing element 604 is the optical window of the package in which an isolator 605 is arranged. To the left of isolator 605 is an optical port assembly 606, which optical port assembly 606 is preferably pigtailed to avoid hard attachment of the optical device to the PCBA. The circuit board embedded groove 703 is used for installing the PCBA101, and the PCBA101 and the circuit board embedded groove 703 are fixed together through structural adhesive and sealed by the structural adhesive.

The centers of the optical ports of the laser chip set 601, the collimating lens set 603, the wavelength division multiplexing element 604, the isolator 605 and the optical port assembly 606 are located in the same plane, which is parallel to the bottom surface of the body groove of the device package 106.

As can be seen from fig. 6 and fig. 1, the heat dissipation sequence of the laser chip is as follows: connecting pieces, AlN ceramic cushion blocks, TEC (or AlN ceramic plates), the bottom surface of a device tube shell, radiating fins 105-2, a base 103-1 of a module tube shell and a radiator 104.

As shown in fig. 4, the upper surface of the lower connection block 602-1 of this embodiment is provided with a eutectic solder region 801, a first high-frequency signal trace 802, a first high-frequency GND trace 803, a first laser chip power supply pad 804, a first GND via 805, a sheet resistor, a bottom GND, and other functional pads, wherein the first GND via 805 is used for communicating the first high-frequency GND trace 803 with the bottom GND, the via penetrates through the lower connection block, and the inside of the via is filled with a conductive material, such as Cu, Ag, W, or the like. The eutectic solder area 801 is arranged above the first high-frequency GND wire 803 and on the left side of the lower connecting block 602-1, the first high-frequency signal wire 802 is arranged in the middle area of the high-frequency GND wire 803-1 and the high-frequency GND wire 803-2 and is surrounded by the high-frequency GND wire 803-1 and the high-frequency GND wire 803-2 in a U shape, a gap is arranged between the first high-frequency signal wire 802 and the high-frequency GND wire 803-1 and the high-frequency GND wire 803-2, and the size of the gap meets the high-frequency characteristic impedance of the laser assembly, such as 50 ohms. Functional pads such as a laser chip power supply pad and an MPD power supply pad are provided on the periphery of the first high-frequency GND line 803. Electrical elements such as a filter capacitor 301 are attached above the first high-frequency GND line 803. The lower surface, i.e., the bottom surface, of the lower connection block 602-1 is provided with a bottom GND.

As shown in fig. 5, the upper surface of the upper connection block 602-2 of the present embodiment is provided with a second high-frequency signal trace 901, a second high-frequency GND trace 902, a second laser chip power supply pad 903, a second GND via 904, and other functional pads, where the second GND via 904 is used for communicating the second high-frequency GND trace 902 with the bottom GND, and the via penetrates through the upper connection block, and the inside of the via is filled with a conductive material, such as Cu, Ag, or W. The second high-frequency signal trace 901 is located in the middle area of the high-frequency GND trace 902-1 and the high-frequency GND trace 902-2, a gap is arranged between the second high-frequency signal trace 901 and the high-frequency GND trace 902-1 and the high-frequency GND trace 902-2, and the size of the gap meets the high-frequency characteristic impedance of the laser assembly, such as 50 ohms. Functional pads such as a laser chip power supply pad and an MPD power supply pad are provided on the periphery of the second high-frequency GND line 902. The lower surface, i.e., the bottom surface, of the upper connection block 602-2 is provided with a bottom GND.

In the right area of the upper connector block 602-2, the dashed line 905 is used as a boundary, and the right area is labeled as i, and in the left area of the lower connector block 602-1, the dashed line 806 is used as a boundary, and the left area is labeled as ii. Go up regional I of connecting block 602-2 and the regional II of connecting block 602-1 down, two regional areas are the same, length and width are the same, and two regions meet and paste together to go up connecting block 602-2 left-hand thread and connect the top of connecting block 602-1 down, walk line, pad one-to-one, the corresponding relation is: 804 corresponds to 903, 803-1 corresponds to 902-1, 802 corresponds to 901, 803-2 corresponds to 902-2. Because the bonding pads are connected and attached, in order to increase the mounting tolerance, the width of each wire in the area I and the area II is correspondingly widened, the width is preferably more than 0.15mm, but the adjusted signal line still meets the characteristic impedance of high frequency. After bonding, 804 and 903 are conducted, 802 and 901 are conducted, 803-1 and 902-1 are conducted, and 803-2 and 902-2 are conducted. Therefore, by the attaching mode, the signal line can be transmitted from the bottom surface to the top surface, the transmission is still kept on the metal surface, and the high-frequency signal is prevented from passing through the hole. The first GND via 805 of the lower connection block 602-1 may be correspondingly attached to the second GND via 904 of the upper connection block 602-2.

The COC connecting piece after being attached and assembled is solidified together, the upper connecting block and the lower connecting block can be sintered together in a mode of manufacturing raw porcelain and high-temperature sintering, and the COC connecting piece has good bonding force and signal transmission and conduction characteristics.

Example two

Referring to fig. 3 to 6, an embodiment of the present invention further discloses a method for manufacturing a connector, including the following steps:

1. manufacturing a raw ceramic part of the upper ceramic plate and a raw ceramic part of the lower ceramic plate;

2. respectively drilling holes in the green ceramic piece of the upper ceramic piece and the green ceramic piece of the lower ceramic piece;

3. filling metal materials into the through holes of the green ceramic parts of the upper ceramic piece and the lower ceramic piece;

4. carrying out surface treatment such as grinding and polishing on the green ceramic piece of the upper ceramic piece and the green ceramic piece of the lower ceramic piece;

5. presetting metal routing layers and the like on the surfaces of the green ceramic piece of the upper ceramic piece and the green ceramic piece of the lower ceramic piece;

6. the raw porcelain spare of going up the potsherd and the raw porcelain spare of potsherd are pasted according to corresponding relation and are fixed with the frock clamp, specifically include: the lower connecting block and the upper connecting block are ceramic blocks, the upper connecting block is reversely buckled on the lower connecting block, the first part of the upper surface of the upper connecting block covers the first part of the upper surface of the lower connecting block, so that the metal wiring layer on the upper surface of the upper connecting block is correspondingly attached to the metal wiring layer on the upper surface of the lower connecting block and is fixed by a clamping fixture, and at the moment, the second part of the upper connecting block and the second part of the lower connecting block are not mutually covered;

7. an isolation material 401 is preset on the second part, namely the non-working surface, of the green ceramic piece of the upper ceramic piece and the green ceramic piece of the lower ceramic piece, as shown in fig. 6, the isolation material is a non-metal isolation material, specifically an easily-stripped and non-metal material, and is used for avoiding the molecule exchange with the metal of the connecting piece and facilitating the later-stage removal and cutting;

8. sintering and forming in a high-temperature sintering furnace;

9. removing the preset non-metal isolation material and cleaning;

10. adjusting elements such as resistors and the like and sizes;

11. cutting into individual finished products after the manufacture is finished.

EXAMPLE III

Referring to fig. 3 to 5, an embodiment of the present invention further discloses a method for manufacturing a connector, including the following steps:

manufacturing an upper connecting block and a lower connecting block; the lower connecting block and the upper connecting block are made of silicon materials, such as high-resistance silicon materials;

holes are punched in the upper connecting block and the lower connecting block respectively;

conducting material filling is carried out on the through holes of the upper connecting block and the lower connecting block;

presetting metal routing layers on the surfaces of the upper connecting block and the lower connecting block;

pre-arranging eutectic solder on the upper surface of the first part of the lower connecting block, wherein the eutectic solder covers all metal routing layers on the upper surface of the first part of the lower connecting block;

the upper connecting block is reversely buckled on the lower connecting block, the first part of the upper surface of the upper connecting block covers the first part of the upper surface of the lower connecting block, the metal wiring layer of the upper surface of the upper connecting block is correspondingly attached to the metal wiring layer of the upper surface of the lower connecting block, the upper connecting block and the lower connecting block are fixedly connected through eutectic welding, a connecting piece is formed, and at the moment, the second part of the upper connecting block and the second part of the lower connecting block are not mutually covered.

Example four

Referring to fig. 1to 11, an embodiment of the present invention further discloses an optical module, which is packaged in a non-hermetic manner and includes a module case, a circuit board, i.e., a PCBA, and a receiving optical device, where the circuit board and the receiving optical device are both located in the module case, the module case is further provided with the emitting optical device, a part of the circuit board is embedded in the device case of the emitting optical device and is fixedly connected to the device case of the emitting optical device, and the circuit board is electrically connected to a connector of the emitting optical device through gold wire bonding. The module case includes a base 103-1 and a cover 103-2. A space for mounting a light emitting device, a circuit board, etc. is formed between the upper cover 103-2 of the module case and the base 103-1 of the module case.

The PCBA101 of the embodiment is positioned by the limiting columns of the module tube shell, the international standard protocol of the optical module is met, the light emitting device 102 is located on the left side of the PCBA101, meanwhile, a part of the left side of the PCBA101 is embedded into the device tube shell 106 of the light emitting device 102, and the parts are bonded together through curing of hard structural glue, so that the PCBA101 and the light emitting device 102 are bonded together inside the module, and the position of the light emitting device 102 is limited by the PCBA 101.

Further, a high-frequency emitting element LDD/DSP107 is provided on the top surface of the circuit board, a first heat sink 105-1 is provided between the high-frequency emitting element LDD/DSP107 and the base 103-1 of the module case, a second heat sink 105-2 is provided between the device case 106 of the light emitting device 102 and the base 103-1 of the module case, and a heat sink 104 is provided on the outer wall of the base 103-1 of the module case. The top surface of the suspended part of the upper connecting block and the top surface of the circuit board of the embodiment face the base of the module tube shell.

Preferably, a first cooling fin is arranged between the high-frequency emission element and the inner wall of the base of the module tube shell, and a second cooling fin is arranged between the device tube shell of the emission optical device and the inner wall of the base of the module tube shell; the outer wall of the base of the module tube shell is provided with a radiator, so that the first radiating fin and the second radiating fin are positioned at the same side, namely the side provided with the first radiating fin and the second radiating fin is provided with the radiator; the second radiating fin is located between the bottom wall of the device tube shell of the light-emitting device and the base of the module tube shell, and the notch of the main body groove of the device tube shell faces the upper cover of the module tube shell.

The first and second heat radiation fins 105-1 and 105-2 are made of a heat radiation material having a high thermal conductivity. As can be seen from fig. 7, the high frequency emitting device LDD/DSP107 is on the same side as the heat dissipating surface of the light emitting device 102, and the side is connected to a heat sink, which has a good heat dissipating effect.

Furthermore, a high-frequency emission element, a high-frequency signal circuit and a gold wire bonding pad are arranged on the top surface of the circuit board, namely the PCBA, the high-frequency emission element is electrically connected with the gold wire bonding pad through the high-frequency signal circuit, and the gold wire bonding pad on the circuit board is correspondingly and electrically connected with the connecting piece through gold wire bonding. And corresponding circuits on the circuit board are correspondingly and electrically connected with the connecting piece through gold wire bonding pads.

As shown in fig. 8 to 9, the connection between the PCBA101 and the light-emitting device 102 is formed by providing a high-frequency emitting device LDD/DSP107 on the top surface of the circuit board (PCBA) 101, providing a high-frequency signal line 201 on the left side of the high-frequency emitting device LDD/DSP107 and on the surface layer of the top surface of the PCBA101, the high-frequency signal line extending to the left end of the PCBA101, and providing a gold wire bonding pad 202 on the left end of the PCBA101, and correspondingly, providing a coc (chip) connector on the laser chip end of the light-emitting device 102, the connector preferably being made of AlN ceramic with high heat dissipation coefficient, providing a high-frequency trace combination 203 on the surface thereof, and electrically interconnecting the gold wire bonding pad 202 and the high-frequency trace combination 203 by bonding with a gold wire 204. The gold wire bond pad 202 and the high frequency trace combination 203 are level in height in the vertical direction and all face the top surface of the PCBA.

The LDD/DSP chip and the emitting optical device on the core of the PCBA of the optical module radiate heat on the same radiating surface of the optical module tube shell, have the advantages of excellent performance, low cost, simple structure, high reliability and the like, can be applied to CWDM and LWDM wavelengths, and can be packaged in optical modules such as QSFP28, QSFP-DD, OSFP, SFP-DD and the like.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (9)

1. A light emitting device, characterized by: the device comprises a device tube shell, wherein the device tube shell is provided with a main body groove, one end of the device tube shell is provided with an optical port assembly, the other end of the device tube shell is provided with a circuit board embedded groove used for installing a circuit board, the circuit board embedded groove is communicated with the main body groove, at least one laser chip is arranged in the main body groove of the device tube shell, and the laser chip is attached to a connecting piece and is electrically connected with the circuit board inserted into the device tube shell through the connecting piece;

the connecting piece comprises a lower connecting block and an upper connecting block, wherein a first high-frequency wiring assembly is arranged on the upper surface of the lower connecting block, a second high-frequency wiring assembly is arranged on the upper surface of the upper connecting block, the upper connecting block is reversely fixed on the upper surface of the lower connecting block, so that part of the upper surface of the upper connecting block is attached and fixed with part of the upper surface of the lower connecting block, the second high-frequency wiring assembly on the upper surface of the upper connecting block is correspondingly attached to the first high-frequency wiring assembly on the upper surface of the lower connecting block respectively to form electric connection, the other part of the upper surface of the upper connecting block is suspended, and the second high-frequency wiring assembly on the suspended part of the upper surface of the upper connecting block is electrically connected with a circuit board inserted into a device tube; the laser chip is disposed on an upper surface of the lower connection block.

2. A light emitting device as claimed in claim 1, characterized in that: the upper surface of the lower connecting block is provided with a welding material area, a first high-frequency signal wire, a first high-frequency GND wire and a first power supply bonding pad, the laser chip is pasted on the welding material area on the upper surface of the lower connecting block, gaps are arranged among the first high-frequency signal wire, the first high-frequency GND wire and the first power supply bonding pad, a second high-frequency signal wire, a second high-frequency GND wire and a second power supply bonding pad are arranged on the upper surface of the upper connecting block, gaps are arranged among the second high-frequency signal wire, the second high-frequency GND wire and the second power supply bonding pad, and the upper surface of one part of the upper connecting block is fixedly attached to the upper surface of one part of the lower connecting block, so that the second high-frequency signal wire, the second high-frequency GND wire and the second power supply bonding pad of the upper connecting block are correspondingly attached to the first high-frequency signal wire, the first high-frequency GND wire and the first power supply bonding pad of the lower connecting block one by one, forming an electrical connection;

a first high-frequency GND wiring area of the lower connecting block is provided with a first GND through hole penetrating through the lower connecting block, and the first GND through hole is filled with a conductive material and used for electrically connecting the first high-frequency GND wiring on the upper surface of the lower connecting block with the GND at the bottom of the lower connecting block;

a second high-frequency GND wiring area of the upper connecting block is provided with a second GND through hole penetrating through the upper connecting block, and the second GND through hole is filled with a conductive material and used for electrically connecting the second high-frequency GND wiring on the upper surface of the upper connecting block with the GND at the bottom of the upper connecting block;

the solder area is arranged in the first high-frequency GND wiring area;

the first high-frequency signal wire is surrounded by the first high-frequency GND wire in a U shape; the power supply bonding pad is located on the periphery of the first high-frequency GND wire.

3. A light emitting device as claimed in claim 1, characterized in that: the lower connecting block and the upper connecting block are ceramic blocks; the lower connecting block and the upper connecting block are fixed together through high-temperature sintering to form the ceramic connecting piece.

4. A light emitting device as claimed in claim 1, characterized in that: the upper surface of the lower connecting block faces the notch of the main body groove, the upper surface of the upper connecting block faces the bottom of the main body groove, and the wall of the device tube shell, which is positioned at the bottom of the main body groove, is provided with a gold wire bonding window corresponding to the suspended part of the upper surface of the upper connecting block; the gold wire bonding window is provided with a first sealing cover plate.

5. A light emitting device as claimed in claim 1, characterized in that: the laser chip is positioned at one end, close to the circuit board embedded groove, in the main body groove of the device tube shell, an optical window is arranged at one end, far away from the circuit board embedded groove, of the device tube shell and used for installing an optical port assembly, a wavelength division multiplexing element and a collimating lens are further arranged in the main body groove of the device tube shell, and the collimating lens and the wavelength division multiplexing element are sequentially arranged on an optical path between the laser chip and the optical port assembly; an isolator is arranged in the optical window and is positioned on an optical path between the wavelength division multiplexing element and the optical port assembly; the connecting piece and the collimating lens are fixed on the TEC or the cushion block, and the TEC or the cushion block is fixed at the bottom of the main groove of the device tube shell; and a second sealing cover plate is fixed on the notch of the main body groove and used for sealing the main body groove of the light emitting device.

6. The utility model provides a non-airtight encapsulation type optical module, includes module tube, circuit board, receives optical device, circuit board, receive optical device all are located the module tube, its characterized in that: the module package is further provided with a light emitting device as claimed in any one of claims 1to 5, a part of the circuit board is embedded in the device package of the light emitting device and fixedly connected with the device package of the light emitting device, and the circuit board is electrically connected with the connecting member of the light emitting device through gold wire bonding.

7. A non-hermetically packaged optical module in accordance with claim 6, wherein: a high-frequency emission element is arranged on the circuit board, a first radiating fin is arranged between the high-frequency emission element and the module tube shell, and a second radiating fin is arranged between the device tube shell and the module tube shell of the light-emitting device; the outer wall of the module tube shell is provided with a radiator, the first radiating fin and the second radiating fin are positioned on the same side, and the radiator is arranged on the side; the first radiating fin is fixed between the high-frequency emitting element and the inner wall of the base of the module tube shell, and the second radiating fin is fixed between the device tube shell of the emitting optical device and the inner wall of the base of the module tube shell; the radiator is fixed on the outer wall of the base of the module tube shell, the second radiating fin is positioned between the bottom wall of the device tube shell of the light-emitting device and the base of the module tube shell, and the notch of the main body groove of the device tube shell faces the upper cover of the module tube shell;

the circuit board is provided with a high-frequency emitting element, a high-frequency signal circuit and a gold wire bonding pad, the high-frequency emitting element is electrically connected with the gold wire bonding pad through the high-frequency signal circuit, and the gold wire bonding pad on the circuit board is correspondingly electrically connected with the connecting piece through gold wire bonding.

8. A method of manufacturing said connection in a light emitting device according to any of claims 1to 5, comprising the steps of:

manufacturing an upper connecting block and a lower connecting block;

holes are punched in the upper connecting block and the lower connecting block respectively;

conducting material filling is carried out on the through holes of the upper connecting block and the lower connecting block;

presetting metal routing layers on the surfaces of the upper connecting block and the lower connecting block;

the upper connecting block is reversely buckled on the lower connecting block, the first part of the upper surface of the upper connecting block covers the first part of the upper surface of the lower connecting block, the metal wiring layer of the upper surface of the upper connecting block is correspondingly attached to the metal wiring layer of the upper surface of the lower connecting block, the upper connecting block and the lower connecting block are fixedly connected to form a connecting piece, and at the moment, the second part of the upper connecting block and the second part of the lower connecting block are not mutually covered.

9. The method of making a connector of claim 8, wherein: to go up connecting block back-off under on the connecting block, and go up the first part of connecting block upper surface and cover the first part of connecting block upper surface down, the metal routing layer of connecting block upper surface corresponds the laminating with the metal routing layer of connecting block upper surface down on the messenger to fixed connection forms the connecting piece, specifically includes: the lower connecting block and the upper connecting block are ceramic blocks, the upper connecting block is reversely buckled on the lower connecting block, and the first part of the upper surface of the upper connecting block covers the first part of the upper surface of the lower connecting block, so that the metal wiring layer on the upper surface of the upper connecting block is correspondingly attached to the metal wiring layer on the upper surface of the lower connecting block and is fixed through a tool clamp; sending the mixture into a high-temperature sintering furnace, and sintering the upper connecting block and the lower connecting block together;

before the steel plate is sent into a high-temperature sintering furnace, covering isolation materials on the second parts of the upper connecting block and the lower connecting block;

and after the upper connecting block and the lower connecting block are sintered together, removing the isolating materials on the upper connecting block and the lower connecting block.

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