CN114019735A - Display panel and display mother board - Google Patents
Display panel and display mother board Download PDFInfo
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- CN114019735A CN114019735A CN202111271184.1A CN202111271184A CN114019735A CN 114019735 A CN114019735 A CN 114019735A CN 202111271184 A CN202111271184 A CN 202111271184A CN 114019735 A CN114019735 A CN 114019735A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136254—Checking; Testing
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Abstract
The application discloses display panel and display mother board, display panel includes: the testing device comprises a substrate base plate and a testing wire arranged on the substrate base plate, wherein one end of the testing wire is exposed from the side edge of the substrate base plate, and the other end of the testing wire extends towards the inside of the substrate base plate and is connected with an internal circuit; a unidirectional conductive structure is arranged on the test wiring; the unidirectional conductive structure enables the test wire to be in unidirectional conduction along the direction that one end of the test wire close to the exposed position faces one end of the internal circuit, and is in unidirectional disconnection along the direction that one end of the test wire close to the internal circuit faces one end of the exposed position. This application is through above-mentioned scheme to solve the problem of naked test line and conductive adhesive tape short circuit.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel and a display mother board.
Background
At present, display technologies are continuously developed, display panels of various sizes are widely used in life of people, and liquid crystal display panels are currently the mainstream display panels, so that the cost is low, the display effect is excellent, and the low radiation is popular among consumers. Taking a liquid crystal display (TFT-LCD) panel as an example, the LCD includes a liquid crystal display panel, a backlight module, an optical film, a frame, and a conductive adhesive tape disposed on a side of the display panel.
Generally, a liquid crystal display panel includes a display area and a non-display area around the display area, the non-display area is provided with a plurality of test traces, and in order to test the circuit conduction condition of each liquid crystal display panel on a large display mother board, test pads of all the liquid crystal display panels on the large display mother board are generally connected together through the test traces for testing. However, after the large display mother board is cut, the end of the test trace is exposed from the side of the liquid crystal display panel, which causes short circuit due to contact with the attached conductive adhesive tape in the subsequent process, resulting in poor display.
Disclosure of Invention
The application aims to provide a display panel and a display mother board so as to solve the problem that an exposed test wire and a conductive adhesive tape are short-circuited.
The application discloses display panel includes: the testing device comprises a substrate base plate and a testing wire arranged on the substrate base plate, wherein one end of the testing wire is exposed from the side edge of the substrate base plate, and the other end of the testing wire extends towards the inside of the substrate base plate and is connected with an internal circuit; a unidirectional conductive structure is arranged on the test wiring; the unidirectional conductive structure enables the test wire to be in unidirectional conduction along the direction that one end of the test wire close to the exposed position faces one end of the internal circuit, and is in unidirectional disconnection along the direction that one end of the test wire close to the internal circuit faces one end of the exposed position.
Optionally, the unidirectional conducting structure comprises a unidirectional conducting diode.
Optionally, the unidirectional conductive structure includes a field effect transistor, the field effect transistor includes a control end, an input end and an output end, and a control electrode of the field effect transistor and the input end of the field effect transistor are connected to one end of the test trace close to the exposed position; the output end of the field effect transistor is connected to one end of the test wire close to the internal circuit.
Optionally, the unidirectional conductive structure includes a thin film transistor, the thin film transistor includes a control end, an input end and an output end, and the control end of the thin film transistor and the input end of the thin film transistor are connected to one end of the test trace close to the exposed position; the output end of the thin film transistor is connected to one end of the test wire close to the internal circuit.
Optionally, the display panel further includes a test terminal disposed on the test trace, the test trace is divided into a first trace segment and a second trace segment according to a position of the test terminal, the first trace segment is exposed from a side surface of the display panel after extending to a side edge of the display panel, and the second trace segment extends to an inside of the display panel and is connected to the internal circuit; the unidirectional conductive structure is arranged on the first route segment or the second route segment.
Optionally, at least two unidirectional conductive structures are arranged, and the at least two unidirectional conductive structures are respectively arranged corresponding to the first routing segment and the second routing segment.
Optionally, the unidirectional conductive structure includes a unidirectional conducting diode and an active switch, the unidirectional conducting diode is disposed on the first route segment, the active switch is disposed on the second route segment, and a control end of the active switch is connected to an input end; the active switch comprises a thin film transistor or a field effect transistor.
Optionally, the display panel further includes a test transition line, one end of the test transition line is connected to the test trace line, the test trace line is divided into a third trace line segment and a fourth trace line segment by a connection point of the test transition line and the test trace line, wherein one end of the test transition line is connected to one end of the third trace line segment and one end of the fourth trace line segment respectively, the other end of the third trace line is exposed from a side edge of the display panel, and the other end of the fourth trace line segment is connected to the internal circuit; the other end of the test transition line is exposed from the side edge of the display panel, and the one-way conductive structure is arranged on the fourth route segment.
Optionally, the display panel includes a terminal side and a non-terminal side, the terminal side is used for binding a circuit board, the non-terminal side is opposite to the terminal side, the display panel is provided with a first transition line and a second transition line corresponding to the non-terminal side, an exposed position of the first transition line corresponding to the third running line segment is exposed at a side edge of the non-terminal side, and an exposed position of the second transition line corresponding to the test transition line is exposed at a side edge of the non-terminal side.
The application also discloses a display mother board which comprises a plurality of uncut display panels, wherein a plurality of cutting lines are arranged on the display mother board along the edges of the uncut display panels, the display mother board is provided with a test end, the test wire of each uncut display panel is respectively connected to the test end, and the position of the uncut display panel intersected with the corresponding cutting line is exposed after cutting; and the display mother board is cut along the cutting line to form the display panel.
This application sets up the scheme that the frame kept apart the electrically conductive sticky tape for the exposed position that will test the line correspondence, and this application will correspond the exposed position of test line and directly paste with electrically conductive sticky tape under the circumstances that does not guarantee to have test line and electrically conductive sticky tape short circuit for narrow frame or frameless's display panel is suitable for more easily, can not increase the width of frame. And the unidirectional conductive structure is used, so that the test wire and the conductive adhesive tape are in direct contact, but the test wire and the internal circuit are not influenced by the conductive adhesive tape.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic top view of a display motherboard according to a first embodiment of the present application;
fig. 2 is a schematic diagram of a display panel according to a first embodiment of the present application;
FIG. 3 is a schematic diagram of a field effect transistor of a first embodiment of the present application;
FIG. 4 is a schematic diagram of a thin film transistor according to a first embodiment of the present application;
FIG. 5 is a schematic diagram of a unidirectional conducting diode of the first embodiment of the present application;
fig. 6 is a schematic view of a second display panel of the first embodiment of the present application;
FIG. 7 is a schematic view of a display motherboard according to a second embodiment of the present application;
fig. 8 is a schematic diagram of a display panel according to a second embodiment of the present application.
Wherein, 1, a display mother board; 2. cutting a line; 3. testing a common line; 10. a display panel; 11. a terminal side; 12. a non-terminal side; 100. a substrate base plate; 110. testing the wiring; 111. a first route segment; 112. a second route segment; 113. a third route segment; 114. a fourth route segment; 120. testing a transition line; 121. a first transition line; 122. a second transition line; 130. a unidirectional conductive structure; 131. a unidirectional conducting diode; 141. a field effect transistor; 145. a thin film transistor; 150. a conductive adhesive tape; 170. a test terminal; 190. an internal circuit.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; . The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
The first embodiment is as follows:
as shown in fig. 1, as a first embodiment of the present application, a schematic plan view of a display mother board is disclosed, where the display mother board 1 includes a plurality of uncut display panels 10, the display mother board 1 is provided with a plurality of cutting lines 2 along edges of the uncut display panels 10, the display mother board 1 is provided with test ends, each test trace 110 of the uncut display panels 10 is connected to the test end, and is exposed at a position corresponding to an intersection of the cutting lines 2 after cutting, specifically, the display mother board 1 is further provided with a plurality of test common lines 3, each display panel 10 is provided with a plurality of test traces 110, and the corresponding test traces 110 are connected to the test common lines 3 in a one-to-one correspondence manner and are connected to the test ends through the test common lines 3. The large display mother board 1 is further provided with a plurality of cutting lines 2, the display panel 10 can be cut from the large display mother board 1 by cutting along the plurality of cutting lines 2, and the test traces 110 are exposed on the side edges of the display panel 10 at the positions of the corresponding cutting lines 2.
As shown in fig. 2, which shows a schematic diagram of a display panel of a first embodiment of the present application, a display panel 10 is disclosed, the display panel 10 comprising: the testing device comprises a substrate base plate 100 and a testing wire 110 arranged on the substrate base plate 100, wherein one end of the testing wire 110 is exposed from the side edge of the substrate base plate 100, and the other end of the testing wire extends towards the inside of the substrate base plate 100 and is connected with an internal circuit 190; a unidirectional conductive structure 130 is disposed on the test trace 110; the unidirectional conductive structure 130 makes the test trace 110 unidirectionally conducted along a direction from one end of the test trace 110 close to the exposed position to one end of the internal circuit, and unidirectionally disconnected along a direction from one end of the test trace close to the internal circuit to one end of the exposed position.
It should be noted that the display panel 10 further includes a conductive adhesive 150, and the conductive adhesive 150 is disposed on the side of the substrate base plate 100, and covers the test trace 110 at the exposed position of the side of the gasket base plate corresponding to the test trace 110.
This application sets up the scheme that the frame kept apart the electrically conductive sticky tape for the exposed position that will test line 110 corresponds, and this application will correspond the exposed position of test line 110 and directly paste with the electrically conductive sticky tape under the circumstances that does not guarantee to have test line 110 and electrically conductive sticky tape short circuit for narrow frame or frameless's display panel 10 is suitable for more easily, can not increase the width of frame. Moreover, the unidirectional conductive structure 130 is used, so that the test trace 110 and the conductive tape are in direct contact, but the test trace 110 and the internal circuit 190 are not affected by the conductive tape. The unidirectional conductive structure 130 can be directly formed on the substrate 100, which is easy to be implemented in the manufacturing process without adding additional processes.
In this embodiment, the unidirectional conductive structure 130 includes active switches, and the active switches respectively include a control terminal, an input terminal, and an output terminal. The active switch may be a field effect transistor 141, as shown in fig. 3, the field effect transistor 141 includes a corresponding control terminal being a gate, a corresponding input terminal being a source or a drain, and a corresponding output terminal being a drain or a source, where the input terminal is a source and the output terminal is a drain, for example, the gate and the source are connected to one end of the test trace 110 near the exposed position; the drain is connected to an end of the test trace 110 near the internal circuit 190. A field effect transistor is simply a switch. And applying a voltage on the grid to control the on or off of the source and the drain. Different ions are doped into the polysilicon in the process to obtain an N-type device or a P-type device, so that a plurality of simple logic circuits can be conveniently realized.
The field effect transistor 141 is a voltage control element, and the field effect transistor 141 can be turned on by the signal source even if the current is small when the signal source satisfies the voltage. And the field effect transistor 141 can operate under a very low current and a very low voltage. In this embodiment, the source and the gate of the field effect transistor 141 are simultaneously connected to one end of the test trace 110 near the exposed position, and the drain of the field effect transistor 141 is connected to one end of the test trace 110 near the internal circuit 190. It can be realized that, during testing, the testing signal can be transmitted to the internal circuit 190 after the field effect transistor 141 is opened by the gate, after the testing is completed, the testing trace 110 is cut and exposed from the side of the display panel 10 and directly contacts with the conductive tape 150, the conductive tape 150 generally has a static protection structure or a grounding structure, and the field effect transistor 141 can only be conducted in one direction, i.e. the signal can be transmitted to the internal circuit 190 from the exposed position, and the signal cannot be transmitted to the exposed position from the internal circuit 190, so that even if the conductive tape 150 directly contacts with the testing trace 110, the short circuit and other situations will not occur.
In this embodiment, the active switch may also be a thin film transistor 145, and the thin film transistor 145, as shown in fig. 4, includes a source, a gate, and a drain, where the gate and the source are connected to one end of the test trace 110 near the exposed position; the drain is connected to an end of the test trace 110 near the internal circuit 190. In this embodiment, the source and the gate of the thin film transistor 145 are connected together, so that the thin film transistor 145 is turned on in one direction. The thin film transistor 145 may be formed in the same process as the pixel thin film transistor 145 in the display panel 10, and no additional process is required.
In this embodiment, the unidirectional conductive structure 130 may also be a unidirectional conducting diode 131, as shown in fig. 5, the thin film transistor inside the processing display panel of the unidirectional conducting diode is similar, after the semiconductor layer is etched, the semiconductor layer needs to be doped, and the doping process is performed after the position where the diode needs to be formed is etched on the film layer through the mask design: p-type material-growing silicon dioxide-coating photoresist-exposing-developing, etching-doping, and then forming the unidirectional conducting diode.
The unidirectional conducting diode 131 further has an ESD (Electro-Static discharge) prevention function, and the conductive tape 150 is attached to the surface of the display panel 10, so as to transfer the electrostatic charges on the surface of the display panel 10 to the ground structure of the display panel 10 through the conductive tape 150, thereby preventing ESD. However, the conductive tape 150 may directly contact the test trace 110 at the exposed position of the test trace 110, which may cause an electrostatic breakdown diode; the diode is manufactured by forming an N-type semiconductor on one side and a P-type semiconductor on the other side by different doping processes. When the reverse voltage generated when the display panel 10 encounters ESD increases to a certain extent, the reverse current will suddenly increase. If the external circuit can not limit the current, the current can be so large that the PN junction is burnt out, so that the PN junction is broken down, and the internal circuit is protected from being damaged.
As shown in fig. 6, the display panel 10 further includes a test terminal 170, the test terminal 170 is disposed on the test trace 110, the test trace 110 is divided into a first trace segment 111 and a second trace segment 112 by the test terminal 170, the first trace segment 111 is exposed after extending to a side of the display panel 10, and the second trace segment 112 extends to the inside of the display panel 10 and is connected to the internal circuit 190; the unidirectional conductive structure 130 may be disposed on the first wire segment 111 or the second wire segment 112.
The test terminal 170 is used to perform a lighting test on the display panel 10 before the display panel 10 is not bound to a circuit board. It is required to connect a signal with the exposed test terminal 170 through a probe, and transmit the signal to the inside of the display panel 10 through the test terminal 170. At this time, the conductive adhesive tape 150 is not yet attached to the side of the display panel 10. Therefore, the unidirectional conductive structure 130 can be disposed on both the first wire segment 111 and the second wire segment 112.
For the one-way conducting diode 131, the diode can be disposed on the first wire segment 111 or the second wire segment 112, the one-way conducting diode 131 further has an ESD protection function, and the conductive tape 150 is attached to the surface of the display panel 10, so as to transfer the electrostatic charges on the surface of the display panel 10 to the ground structure of the display panel 10 through the conductive tape 150, thereby preventing ESD. However, the conductive tape 150 may directly contact the test trace 110 at the exposed position of the test trace 110, which may cause an electrostatic breakdown diode; different doping processes are used to form an N-type semiconductor on one side and a P-type semiconductor on the other side, so that the diode is manufactured. When the reverse voltage generated when the display panel 10 encounters ESD increases to a certain extent, the reverse current will suddenly increase. If the external circuit can not limit the current, the current can be so large that the PN junction is burnt out, so that the PN junction is broken down, and the internal circuit is protected from being damaged.
In the case of the field effect transistor 141, the field effect transistor 141 may be disposed on the first wire segment 111 or the second wire segment 112; for the first wire segment 111, unidirectional conduction of the first wire segment 111 can be realized. For the second routing segment 112, since the test terminal 170 is exposed and easily corroded, and the corrosion of the metal layer in the test terminal 170 after corrosion has a spreading property, the field effect transistor 141 or the thin film transistor 145 can be disposed on the second routing segment 112 to prevent the corrosion of the test terminal 170 to the internal circuit 190 along the test routing 110 after corrosion, and since the source and drain of the field effect transistor 141 or the thin film transistor 145 are not in direct contact, the metal spreading corrosion can be cut off by the field effect transistor 141 or the thin film transistor 145.
In another modified embodiment, the unidirectional pass diode 131 and the field effect transistor 141 may be used in combination, for example, the unidirectional pass diode 131 is disposed on the first wire segment 111, and the field effect transistor 141 is disposed on the second wire segment 112. The unidirectional conducting diode 131 further has an ESD protection function, and can be disposed on the first wire segment 111 to prevent the static electricity of the conductive tape 150 from activating the gate of the thin film transistor 145 or the field effect transistor 141, which may cause the occurrence of poor display such as a screen flash due to the instant grounding of the test wire 110. Even if the conductive tape 150 has static electricity, the unidirectional conducting diode 131 still cannot ground the test trace 110 in the reverse direction, so that the test trace 110 can be better protected. Because of the test terminal 170, the test terminal 170 can be used to test the display panel 10 before the display panel 10 is unbound, and if the test terminal 170 is corroded or is in other electrostatic contact at the later stage, the thin film transistor 145 or the field effect transistor 141 is further disposed on the second wire segment 112, so that the metal layer in the test terminal 170 is corroded due to corrosion at the later stage of the test unit, and can be cut off by the thin film transistor 145 or the field effect transistor 141 in the process of spreading the corrosion of the metal layer. But also can prevent static charges on the test terminals 170 from entering the test traces 110 and burning out the internal circuits 190 after the display panel 10 is tested by the test terminals 170.
Example two:
as shown in fig. 7, a schematic top view of a display mother board according to a second embodiment is disclosed, and the design of the display mother board 1 is different from that of the first embodiment, wherein the display mother board 1 does not include the test common line 3, that is, there is no location on the large display mother board 1 where the test common line 3 is disposed, and all the test traces 110 need to be disposed on each display panel 10. In this type of display mother substrate 1, only one cutting line 2 is provided between two adjacent display panels 10. A display panel 10 according to the second embodiment is shown in fig. 8, and the display panel 10 is provided with more test transition lines 120, so as to transmit the test signal to the next display panel 10 through the test transition lines 120, and the test transition lines 120 may not be connected to the circuit inside the current display panel 10, but only connected to the test traces 110.
The test transition line 120 is connected to the test trace 110, and divides the test trace 110 into a third trace segment 113 and a fourth trace segment 114, wherein one end of the test transition line 120 is connected to one end of the third trace segment 113, the other end of the third trace is exposed from the side of the display panel 10, the other end of the test transition line 120 is exposed from the side of the display panel 10, and the unidirectional conductive structure 130 is disposed on the fourth trace segment 114.
The display panel 10 includes a terminal side 11 and a non-terminal side 12, the terminal side 11 is used for binding the circuit board of the display panel 10, and the non-terminal side 12 is disposed opposite to the terminal side 11. The display panel 10 is provided with a first transition line 121 and a second transition line 122 corresponding to the non-terminal side 12, the exposed position of the first transition line 121 corresponding to the third running line segment 113 is exposed at the side edge of the non-terminal side 12, and the exposed position of the second transition line 122 corresponding to the test transition line 120 is exposed at the side edge of the non-terminal side 12
As shown in fig. 7: the test signal needs to pass through the first transition line 121 disposed on the non-terminal side 12 of the display panel 10R (right) and then be transmitted to the third running line segment 113 of the display panel 10L (left), and after the display panel 10L (left) passes through the test transition line 120, the test signal is transmitted to the next display panel 10 through the second transition line 122 after returning to the second transition line 122 on the non-terminal side 12 of the display panel 10R (right). The design can reduce the area waste on the display motherboard 1, and the first transition line 121 and the second transition line 122 are not connected with other lines after being cut, thereby forming a suspended state, having capacitance shielding and preventing the problem of electrostatic explosion damage. But this design may result in the test traces 110 being exposed at two locations on the terminal side 11 of the display panel 10, respectively. The test signal can be distinguished according to the signal input and output, which are an input exposed end and an output exposed end respectively, the input exposed end is a test wiring 110 at an exposed position where a wire is close to the signal input end, the test wiring 110 at the input exposed end is an input end of a third wiring segment 113, and a test transition wire 120 at the output exposed end outputs the test signal to the next display panel 10.
For the display panel 10 of the present embodiment, the test terminal 170 is disposed on the fourth line segment 114, and the fourth line segment 114 is connected to the third line segment 113 through a via, that is, the fourth line segment 114 is not located in the same layer as the third line segment 113, and the third line segment 113 and the test transition line 120 may be formed in the same layer. The test routing structure comprises the first routing section, the second routing section, the third routing section, the fourth routing section, the test transition line, the first transition line and the second transition line which can be collectively called as the test routing.
The difference is that in this embodiment, the unidirectional conductive structure 130 may be disposed on the fourth wire segment 114, specifically, the unidirectional conducting diode 131 is disposed on the fourth wire segment 114, and more specifically, the unidirectional conducting diode 131 is disposed on one side of the test terminal 170 on the fourth wire segment 114, which is close to the third wire segment 113, because the unidirectional conducting diode 131 has a voltage drop, and the arrangement of the display panel 10 necessarily has a far end and a near end, the voltage drop at the far end may be more serious, the voltage of the display panel 10 at the far end is insufficient, and the problem of misjudgment is caused. Therefore, the one-way conduction diode 131 is not disposed on the test transition line 120, and the one-way conduction diode 131 is disposed on the side of the first wire segment 111 close to the test terminal 170, so that the signal loop from the first wire segment 111 to the test transition line 120 is not provided with the one-way conduction diode 131, i.e., there is no voltage drop. And a one-way conduction diode 131 is arranged on a signal loop from the first wire segment 111 to the test terminal 170, so as to prevent the exposed position of the first wire segment 111 or the test transition line 120 from being short-circuited with the conductive tape 150.
It should be noted that the inventive concept of the present application can form many embodiments, but the present application has a limited space and cannot be listed one by one, so that, on the premise of no conflict, any combination between the above-described embodiments or technical features can form a new embodiment, and after the embodiments or technical features are combined, the original technical effect will be enhanced
The technical solution of the present application can be widely applied to various display panels, such as TN (Twisted Nematic) display panel, IPS (In-Plane Switching) display panel, VA (Vertical Alignment) display panel, MVA (Multi-Domain Vertical Alignment) display panel, and of course, other types of display panels, such as OLED (Organic Light-Emitting Diode) display panel, and the above solution can be applied thereto.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (10)
1. A display panel, comprising: the testing device comprises a substrate base plate and a testing wire arranged on the substrate base plate, wherein one end of the testing wire is exposed at the side surface of the substrate base plate, and the other end of the testing wire extends towards the inside of the substrate base plate to be connected with an internal circuit; the test wiring is characterized in that a one-way conductive structure is arranged on the test wiring;
the unidirectional conductive structure enables the test wire to be in unidirectional conduction along the direction that one end of the test wire close to the exposed position faces one end of the internal circuit, and is in unidirectional disconnection along the direction that one end of the test wire close to the internal circuit faces one end of the exposed position.
2. The display panel of claim 1, wherein the unidirectional conductive structure comprises a unidirectional conducting diode.
3. The display panel of claim 1, wherein the unidirectional conductive structure comprises a field effect transistor, the field effect transistor comprises a control terminal, an input terminal and an output terminal, the control terminal of the field effect transistor and the input terminal of the field effect transistor are connected to one end of the test trace near the exposed position; the output end of the field effect transistor is connected to one end of the test wire close to the internal circuit.
4. The display panel according to claim 1, wherein the unidirectional conductive structure comprises a thin film transistor, the thin film transistor comprises a control terminal, an input terminal and an output terminal, the control terminal of the thin film transistor and the input terminal of the thin film transistor are connected to one end of the test trace near the exposed position; the output end of the thin film transistor is connected to one end of the test wire close to the internal circuit.
5. The display panel according to claim 1, wherein the display panel further comprises a test terminal disposed on the test trace, the test trace is divided into a first trace segment and a second trace segment at a position of the test terminal, the first trace segment is exposed from a side surface of the display panel after extending to a side edge of the display panel, and the second trace segment extends to an inside of the display panel and is connected to the internal circuit;
the unidirectional conductive structure is arranged on the first route segment or the second route segment.
6. The display panel according to claim 5, wherein the unidirectional conductive structures are provided with at least two corresponding to the first routing segments and the second routing segments, respectively.
7. The display panel according to claim 6, wherein the unidirectional conductive structure comprises a unidirectional conducting diode and an active switch, the unidirectional conducting diode is arranged on the first route segment, the active switch is arranged on the second route segment, and a control end and an input end of the active switch are connected; the active switch comprises a thin film transistor or a field effect transistor.
8. The display panel according to claim 1, wherein the display panel further comprises a test transition line, one end of the test transition line is connected to the test trace line, the test trace line is divided into a third trace line segment and a fourth trace line segment by a connection point of the test transition line and the test trace line, wherein one end of the test transition line is respectively connected to one end of the third trace line segment and one end of the fourth trace line segment, the other end of the third trace line is exposed from a side edge of the display panel, and the other end of the fourth trace line segment is connected to the internal circuit; the other end of the test transition line is exposed from the side edge of the display panel, and the one-way conductive structure is arranged on the fourth route segment.
9. The display panel according to claim 8, wherein the display panel comprises a terminal side and a non-terminal side, the terminal side is used for binding a circuit board for the display panel, the non-terminal side is arranged opposite to the terminal side, the display panel is provided with a first transition line and a second transition line corresponding to the non-terminal side, the exposed position of the first transition line corresponding to the third running line section is exposed at the side edge of the non-terminal side, and the exposed position of the second transition line corresponding to the test transition line is exposed at the side edge of the non-terminal side.
10. A display mother board, comprising a plurality of uncut display panels, wherein the display mother board is provided with a plurality of cutting lines along the edges of the uncut display panels, the display mother board is provided with a testing end, the testing trace of each uncut display panel is connected to the testing end, and the crossing position of the testing trace and the corresponding cutting line is exposed after cutting, wherein the display panel according to any one of claims 1 to 9 is formed after the display mother board is cut along the cutting lines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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