CN114012276A - Laser etching device and processing method for peripheral lead of flexible display screen and flexible display screen - Google Patents
Laser etching device and processing method for peripheral lead of flexible display screen and flexible display screen Download PDFInfo
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- 238000010329 laser etching Methods 0.000 title claims abstract description 36
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- 238000005530 etching Methods 0.000 claims abstract description 13
- 238000012545 processing Methods 0.000 claims description 48
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 16
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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Abstract
The invention discloses a laser etching device applied to a peripheral lead of a large-size (86 inches or more) flexible display screen, a processing method and the flexible display screen. The optical platform provides a horizontal working table, the horizontal working table comprises a small-area precise movement area, and a vacuum adsorption objective table is arranged in the area. The one-dimensional moving mechanism is configured in the precise motion area and acts on the CCD camera component and the laser galvanometer component. The CCD camera assembly and the laser galvanometer assembly are respectively used for identifying the positioning target, determining the offset and the inclination angle of the to-be-etched area of the flexible display screen and adjusting the position of the CCD camera assembly and the laser galvanometer assembly according to the identified offset and inclination angle in the process of etching the to-be-etched area of the flexible display screen. The laser etching device for the peripheral lead of the flexible display screen has the advantages of low cost, high precision, high reliability and high efficiency.
Description
Technical Field
The invention relates to the technical field of printed electronics and flat photoelectric devices, in particular to a laser etching device and a processing method for a peripheral lead of a flexible display screen and the flexible display screen.
Background
Taking a widely used flat panel display as an example, it is generally composed of a plurality of layers of optical or optoelectronic devices bonded together. The base material of these devices is glass or PET and other transparent material, in which the functional area is made in the middle and the lead wire is made on the periphery. The middle functional area may be a liquid crystal display pixel, a backlight array, a capacitive or resistive touch cell array, or the like. The central functional region is coupled to external power supply and subsequent processing circuitry by peripheral leads. Typical specifications for the leads include: good conductivity, thin thickness, narrow line width, and physical performance requirements such as aging resistance and bending resistance.
The screen printing method is an important method for manufacturing the peripheral lead, and the common conductive material for printing is silver paste. The method has the advantages of low cost, high efficiency, simple process, high reliability, environmental friendliness and the like. Sometimes, due to differences in production processes, modular design and the like, the middle functional region and the peripheral lead region are often completed in different processes, and the screen printing method is not easy to damage and pollute the middle functional region, which is also one of the advantages.
The accuracy of the screen printing lead is influenced by factors such as the mesh size of the screen, the diameter of the screen, the granularity of slurry, the viscosity of the slurry and the like, and the accurate manufacturing of high-density narrow lines below 40um is generally difficult to realize. This problem is particularly acute for large-sized flat panel devices. Taking a large-sized display panel as an example, the number of display units and touch units is large, the number of lead wires is greatly increased compared with that of a small-sized display panel, and the width of the lead wires must be narrowed and the density thereof is sharply increased under the trend that the design of the outer frame of the display is narrower and narrower. In the large background of the continuous maturity and consumer upgrade of flat panel display technology, the occupation ratio of large-sized panels in the overall panel product is gradually increasing. The solution of the above problem is of obvious commercial importance.
Therefore, a laser etching process is introduced in the industry as a supplement, the specific scheme is that a thick line is subjected to screen printing, a high-density line and a thin line are generated by laser etching, and the line width and the line distance of the high-density line and the thin line can be smaller than 20 um. The current mainstream means of optical field control of laser etching is a galvanometer. At present, the silk-screen and laser etching method is widely applied to various fields such as flat panel display, solar cell and the like, but for the lead manufacturing of large-size products, the method still faces the problems of high cost and limited efficiency, and detailed analysis is as follows:
the processing of large-size panels usually requires a large-size moving platform, taking a panel of a 86-inch television as an example, the X and Y direction moving ranges of the lead processing are about 2300mm and 1250mm, and in order to save floor space and facilitate fixing in the product processing process, a moving gantry double-side driving structure is usually adopted, as shown in fig. 1.
The galvanometer machining head 1 is arranged on a beam shaft 2 and is responsible for movement in a first direction, namely an X axis; the beam shaft 2 is driven synchronously by the motors 3 on two sides in the first direction and is responsible for the movement in the second direction, which is the Y axis. The product is fixed on the table top and does not move. The typical value of the processing view field of the galvanometer processing head 1 is about 80 x 80mm, and the size of a focus focused by laser is about 3-30 um. Typically, the moving platform drives the galvanometer processing head 1 to move in a stepping mode, and each processing view field of the galvanometer processing head 1 is spliced to finally cover the whole processing pattern on a product.
The above lead manufacturing apparatus has several problems.
Firstly, the moving platform adopts a conventional layout, and the breadth of the moving platform must cover the external dimension of the product, so that the manufacturing cost of the high-precision large platform is high, the assembly and the transportation are difficult, and the vacuum adsorption object stage with large area and high flatness is also an important factor of high cost.
Secondly, the motion control of gantry bilateral drive is relatively complex, and related applications require high positioning accuracy (micron level or even submicron level) and high motion speed, and at the moment, the motion control and drive system must adopt high-end configuration, so that the cost is relatively high.
And finally, the span of the gantry beam needs to be more than 1 meter, so that the manufacturing difficulty is high and the cost is high. The gantry beam is usually made of granite or cast aluminum alloy and the like, and the mass of the gantry beam is usually in the order of hundreds of kilograms, which seriously affects the positioning speed and precision of the moving platform. However, in order to ensure structural stability and shape accuracy, a cross beam with a larger cross section is often required, which leads to further increase in mass. It should be noted that, in the whole process, the motion platform makes step motion, which is in a state of frequent rapid acceleration and deceleration, and it is very difficult to obtain high-speed and high-precision step motion in the Y-axis direction (the direction of driving the gantry). If the gantry is made of special materials such as carbon fibers, magnesium-aluminum alloy and the like and is manufactured by a weight-reducing processing technology, although the mass of the gantry can be reduced, the cost is inevitably increased greatly.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a laser etching device, a processing method and a flexible display screen applied to a large-size (86 inches or more) flexible display screen peripheral lead, wherein the laser etching device can realize the processing of the large-size (86 inches or more) flexible display screen peripheral lead only through a one-dimensional moving mechanism and a small-area vacuum adsorption object stage, and has the advantages of low cost, high precision, high reliability and high efficiency.
In order to achieve the above object, an embodiment of the present invention provides a laser etching apparatus for a peripheral lead of a flexible display screen, including an optical platform, a one-dimensional moving mechanism, a CCD camera assembly and a laser galvanometer assembly.
The optical platform is provided with a horizontal working table surface, the horizontal working table surface is divided into a precise movement area and a common bearing area, and a vacuum adsorption objective table is arranged on the horizontal working table surface in the precise movement area and is used for tightly adsorbing an area to be etched of the flexible display screen on the upper surface of the flexible display screen through vacuumizing.
The one-dimensional moving mechanism is configured in the precise motion area of the horizontal working table surface, acts on the CCD camera component and the laser galvanometer component, and provides a movable platform for the CCD camera component and the laser galvanometer component.
The CCD camera assembly is configured on the one-dimensional moving mechanism and located above the vacuum adsorption object stage, and is used for reading a positioning target of the flexible display screen in the region to which the CCD camera assembly belongs and identifying the offset and the inclination angle of the region to be etched of the flexible display screen according to the positioning target.
The laser galvanometer component is arranged on the one-dimensional moving mechanism and located above the vacuum adsorption object stage, adjusts the position of the laser galvanometer component according to the offset and the inclination angle identified by the CCD camera component, and moves along the one-dimensional moving mechanism to act on an area to be etched of the flexible display screen to perform laser etching on peripheral leads.
In one or more embodiments of the invention, the device further comprises a dust suction mechanism, wherein the dust suction mechanism is located above the vacuum adsorption objective table and below the laser galvanometer assembly and is used for sucking away dust generated by silver paste gasification during etching.
In one or more embodiments of the invention, the surface of the vacuum adsorption stage is arranged flush with the horizontal work surface of the general bearing area.
In one or more embodiments of the invention, the maximum length of the vacuum adsorption stage is greater than the maximum length of the flexible display screen.
In one or more embodiments of the present invention, the laser galvanometer assembly includes a laser, an optical galvanometer and a focusing lens, laser emitted by the laser coaxially and parallelly enters the optical galvanometer, the optical galvanometer reflects incident parallel light onto the focusing lens, and the focusing lens focuses the incident parallel light to realize laser etching.
In one or more embodiments of the invention, the field of view of the optical galvanometer is greater than 50 x 50mm, sufficient to cover the width of the wire area.
In one or more embodiments of the present invention, the CCD camera assembly includes two CCD cameras, both of the two CCD cameras are disposed on the one-dimensional moving mechanism and are movable along the one-dimensional moving mechanism, and the two CCD cameras are respectively disposed at both ends of the laser galvanometer assembly.
The embodiment of the invention also provides a method for processing the peripheral lead of the flexible display screen, which comprises the following steps: adopting screen printing silver paste to form the overall area outline of the peripheral lead of the flexible display screen; positioning and fixing a region to be etched on the first side of the flexible display screen in a vacuum adsorption manner, and etching a lead in the region to be etched on the first side of the flexible display screen; performing 90-degree rotation and secondary positioning on the flexible display screen, then performing vacuum adsorption and fixation, performing lead etching on a second side to-be-etched area of the flexible display screen after the flexible display screen rotates by 90 degrees, and communicating the etched leads with the etched leads of the previous time in a one-to-one correspondence manner; and repeating the previous step until the etching of the lead is finished.
In one or more embodiments of the present invention, the positioning the area to be etched on the first side of the flexible display screen includes: reading a positioning target on the first side of the flexible display screen by adopting a CCD (charge coupled device) camera, and identifying the offset and the inclination angle of an area to be etched on the first side of the flexible display screen according to the positioning target; and the laser galvanometer component is adopted to control the laser galvanometer component to adjust the position of the laser galvanometer component according to the offset and the inclination angle recognized by the CCD camera, and the laser galvanometer component acts on the first side to-be-etched area of the flexible display screen to perform laser etching on the lead wire of the to-be-etched area.
In one or more embodiments of the present invention, the rotating and secondarily positioning the flexible display screen by 90 degrees includes: reading a positioning target of a region to be etched on the second side of the flexible display screen, which needs to be etched after the flexible display screen rotates by 90 degrees, by using a CCD (charge coupled device) camera, and identifying the inclination angle of the region to be etched on the second side of the flexible display screen after the flexible display screen rotates by 90 degrees according to the positioning target; and reading the graph etched at the previous time by adopting a CCD camera, and calculating and controlling the offset of the laser galvanometer component according to the read graph etched at the previous time so as to correspondingly communicate the lead etched at this time with the lead etched at the previous time one by one.
In one or more embodiments of the present invention, the reading the pattern etched last time includes: and reading the complete lead pattern etched at the previous time and/or reading the part to be spliced at the tail end of the lead pattern etched at the previous time.
The embodiment of the present invention further provides a flexible display screen, which includes a functional area and lead areas, wherein the lead areas are disposed on the periphery of the functional area and are arranged corresponding to the functional area one by one, and the lead areas are processed by the method for processing the peripheral leads of the flexible display screen according to any one of claims 5 to 8.
In one or more embodiments of the present invention, the width of the lead region is 5 to 30mm, the width of the lead in the region is 30 to 500um, and the distance between adjacent leads in the region is 5 to 50 um.
Compared with the prior art, the laser etching device for the peripheral lead of the flexible display screen simplifies a two-dimensional moving platform into a one-dimensional moving platform, is matched with a small-area vacuum adsorption object stage, does not need to drive a heavy gantry to drive the optical galvanometer to move, greatly improves the moving performance and the moving precision of the optical galvanometer, greatly increases the processing efficiency, and has the advantages of low cost, high precision, high reliability and high efficiency.
According to the laser etching device for the peripheral lead of the flexible display screen, provided by the embodiment of the invention, the two movable CCD cameras are arranged, so that 2 positioning targets are respectively movably identified or the graph etched in the previous time is read, the movement time is reduced, and the detection positioning speed is increased.
The processing method of the flexible display screen peripheral lead wire is a processing technology designed for the laser etching device of the flexible display screen peripheral lead wire, and the processing precision of the peripheral lead wire can be improved and the processing cost can be saved by processing the flexible display screen on one side and splicing and processing the peripheral lead wire side by side for multiple times.
According to the processing method of the peripheral lead of the flexible display screen, disclosed by the embodiment of the invention, in order to realize accurate splicing on a next processing graph to process a next graph, before next processing, on the basis that the CCD camera identifies two positioning targets, the CCD camera is required to identify the graph processed at the previous time, and double identification and positioning are carried out, so that the splicing precision can be greatly improved, and the error accumulation is effectively avoided.
According to the processing method of the peripheral lead of the flexible display screen, provided by the embodiment of the invention, the width of the whole lead area is covered by setting the processing optical galvanometer with the visual field larger than 50 x 50 mm; in addition, the processing method does not need to use the whole square area of the full galvanometer view field, and mainly uses the partial area in the middle part, so that the distortion correction difficulty of the galvanometer is greatly reduced, and the precision is greatly improved.
According to the flexible display screen provided by the embodiment of the invention, the space between the lead wires is small, so that the narrow frame design of the display is facilitated; and secondly, the width of the lead is large, so that the resistance is reduced, and the conductivity is improved.
Drawings
FIG. 1 is a schematic diagram of a movable gantry double-side driving structure for processing a large-size flexible display screen in the prior art;
FIG. 2 is a schematic structural diagram of a laser etching apparatus for a peripheral lead of a flexible display screen according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a flexible display according to an embodiment of the present invention;
FIG. 4 is an enlarged detail view at C of FIG. 3;
FIG. 5 is an enlarged detail view at D of FIG. 3;
fig. 6 is a flowchart of a method for processing a peripheral lead of a flexible display panel according to an embodiment of the present invention.
Fig. 7 is a schematic view of distortion of the field of view of the galvanometer in the laser etching apparatus for the peripheral lead of the flexible display screen according to the embodiment of the present invention (the middle area is the field of view actually used by the processing apparatus and the processing method).
Detailed Description
The following detailed description of the present invention is provided in conjunction with the accompanying drawings, but it should be understood that the scope of the present invention is not limited to the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the word "comprise", or variations such as "comprises" or "comprising", will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
As shown in fig. 2, an embodiment of the present invention provides a laser etching apparatus for a peripheral lead of a flexible display screen, which includes an optical platform 10, a one-dimensional moving mechanism 20, a CCD camera assembly and a laser galvanometer assembly 40. The one-dimensional moving mechanism 20 is erected on the optical platform 10, and the CCD camera assembly and the laser galvanometer assembly 40 are both arranged on the one-dimensional moving mechanism 20 and can move relative to the optical platform 10 under the action of the one-dimensional moving mechanism 20.
The optical platform 10 has a horizontal table surface divided in its width direction into a precision motion region 11A and a general bearing region 11B. Wherein the area of the general bearing area 11B is larger than that of the precision motion area 11A.
In one embodiment, the precision motion zone 11A has a width 1/2 or 1/3 that is the width of the normal bearing zone 11B.
A vacuum adsorption object stage 12 is arranged in the precise motion area 11A on the horizontal working table. The vacuum adsorption stage 12 extends along the length direction of the precise movement area 11A, and the upper surface of the vacuum adsorption stage 12 is flush with the upper surface of the general bearing area 11B. The vacuum adsorption stage 12 is used for tightly adsorbing the area to be etched of the flexible display screen on the upper surface of the flexible display screen through vacuum pumping, and other parts of the flexible display screen can be placed in the common bearing area 11B of the horizontal workbench surface.
In one embodiment, the maximum length of the vacuum chuck stage 12 is greater than the maximum length of the flexible display screen to be etched.
In an embodiment, a rotating table may be disposed on the common carrying area 11B, a suction hole is disposed on a surface of the rotating table, and the rotating table may be controlled by a rotating motor and configured to rotate the flexible display screen thereon to etch the peripheral leads on different sides. In the rotation process, the vacuum adsorption object stage 12 releases the vacuum adsorption to the flexible display screen, the flexible display screen is adsorbed by the rotating table and rotates, and the vacuum adsorption object stage 12 adsorbs and fixes again after rotating to the position. Wherein the upper surface of the rotary table is flush with the upper surface of the vacuum adsorption stage 12.
In other embodiments, the flexible display screen can be rotated manually.
The one-dimensional moving mechanism 20 is disposed in the precise movement region 11A of the horizontal table surface, and acts on the CCD camera assembly and the laser galvanometer assembly 40 to provide a movable platform for the two. The one-dimensional moving mechanism 20 may include a linear guide 21 provided along the length direction of the precision motion region 11A, a plurality of slide tables 22 provided on the linear guide 21, and a plurality of drive motors 23 that drive the slide tables 22 to move along the linear guide 21.
The CCD camera assembly comprises two CCD cameras, the two CCD cameras are respectively arranged on the sliding tables 22 at the two ends of the linear guide rail 21 of the one-dimensional moving mechanism 20 and are positioned above the vacuum adsorption object stage 12, and the CCD camera assembly is used for reading the positioning target 53 of the flexible display screen in the region to which the CCD camera assembly belongs and identifying the offset and the inclination angle of the region to be etched of the flexible display screen according to the positioning target 53.
The laser galvanometer component 40 is configured on the sliding table 22 of the one-dimensional moving mechanism 20 in the middle of the linear guide rail 21 (two CCD cameras are arranged on two sides of the laser galvanometer component 40) and is also positioned above the vacuum adsorption object stage 12, the laser galvanometer component 40 adjusts the position thereof according to the offset and the inclination angle recognized by the CCD camera component and moves the area to be etched acting on the flexible display screen along the one-dimensional moving mechanism 20 to perform laser etching of the peripheral lead. The laser galvanometer component 40 comprises a laser, an optical galvanometer and a focusing lens, wherein laser emitted by the laser coaxially and parallelly enters the optical galvanometer, the optical galvanometer reflects incident parallel light to the focusing lens, and the focusing lens focuses the incident parallel light to realize laser etching. Wherein, the visual field of the optical galvanometer is larger than 50 x 50mm and is enough to cover the width of the lead wire area.
In a specific embodiment, the laser etching apparatus for the peripheral lead of the flexible display screen may further include a dust suction mechanism (not shown), and the dust suction mechanism may be disposed above the vacuum adsorption stage and below the laser galvanometer assembly 40, and is configured to suck away dust generated by gasification of the silver paste during etching.
The matching among the structures and the measurement and calculation of the offset and the inclination angle can be controlled by a control mechanism (with control software or connected with an external control program). And will not be described in great detail herein.
Referring to fig. 3 to 5, the present invention provides a flexible display panel, which includes a functional region 51 and lead regions 52, wherein the lead regions 52 are disposed on the periphery of the functional region 51 and are arranged corresponding to the functional region 51 one by one. Wherein, the regional width of lead wire district 52 is 5 ~ 30mm, and the width of regional interior lead wire is 30 ~ 500um, and the interval between the adjacent lead wire in the region is 5 ~ 50 um. The central functional region 51 may be a liquid crystal display pixel, a backlight array, a capacitive or resistive touch cell array, etc., and the central functional region 51 may be coupled to an external power supply and subsequent processing circuitry through peripheral leads.
Referring to fig. 6, an embodiment of the present invention further provides a method for processing a peripheral lead of a flexible display screen, including: adopting screen printing silver paste to form an overall area outline s1 of the peripheral lead of the flexible display screen; positioning and fixing a region to be etched on the first side of the flexible display screen in a vacuum adsorption mode, and performing lead etching on the region to be etched on the first side of the flexible display screen s 2; performing 90-degree rotation and secondary positioning on the flexible display screen, then performing vacuum adsorption and fixation, performing lead etching s3 on a second side to-be-etched area of the flexible display screen after rotating by 90 degrees, wherein the lead etched at this time is in one-to-one correspondence communication with the lead etched at the previous time; the above steps are repeated until the wire etching is completed s 4.
In one or more embodiments of the present invention, the positioning the area to be etched on the first side of the flexible display screen includes: reading a positioning target 53 on the first side of the flexible display screen by using a CCD camera, and identifying the offset and the inclination angle of an area to be etched on the first side of the flexible display screen according to the positioning target 53; and the laser galvanometer component is adopted to control the laser galvanometer component to adjust the position of the laser galvanometer component according to the offset and the inclination angle recognized by the CCD camera, and the laser galvanometer component acts on the first side to-be-etched area of the flexible display screen to perform laser etching on the lead wire of the to-be-etched area.
After the flexible display screen is manually placed or automatically rotated by the rotating mechanism, the flexible display screen has certain displacement deviation and needs to be subjected to deflection correction. The positioning targets 53 on the flexible display screen are read by the camera (at least 2 positioning targets 53 are identified at a time), and then the offset and the inclination angle of the flexible display screen are identified by computer calculation. When the galvanometer is processed, the original processing graph is correspondingly moved and rotated, so that the galvanometer processing is adaptive to the inclination of the flexible display screen.
In one or more embodiments of the present invention, the rotating and secondarily positioning the flexible display screen by 90 degrees includes: reading a positioning target 53 of an area to be etched on the second side of the flexible display screen, which needs to be etched after the flexible display screen rotates by 90 degrees, by using a CCD (charge coupled device) camera, and identifying the inclination angle of the area to be etched on the second side of the flexible display screen after the flexible display screen rotates by 90 degrees according to the positioning target 53; and reading the graph etched at the previous time by adopting a CCD camera, and calculating and controlling the offset of the laser galvanometer component according to the read graph etched at the previous time so as to correspondingly communicate the lead etched at this time with the lead etched at the previous time one by one.
In order to realize accurate splicing on the next processing graph to process the next graph, before the next processing, on the basis that the CCD camera identifies the two positioning targets 53, the CCD camera is required to identify the graph processed at the previous time, and double identification and positioning are realized, so that the splicing precision can be greatly improved, and the error accumulation is effectively avoided. The principle is as follows: the positioning target 53 is usually manufactured by screen printing, the pattern precision is low, the peripheral lead pattern precision of laser processing is high, in addition, the former processing cannot be completely consistent with the positioning target 53 on the flexible display screen, and the camera needs to recognize the pattern of the former processing, so that the error accumulation can be effectively avoided.
In one or more embodiments of the present invention, the reading the pattern etched last time includes: and reading the complete lead pattern etched at the previous time and/or reading the part to be spliced at the tail end of the lead pattern etched at the previous time.
Compared with the prior art, the laser etching device for the peripheral lead of the flexible display screen simplifies a two-dimensional moving platform into a one-dimensional moving platform, is matched with a small-area vacuum adsorption object stage, does not need to drive a heavy gantry to drive the optical galvanometer to move, greatly improves the moving performance and the moving precision of the optical galvanometer, greatly increases the processing efficiency, and has the advantages of low cost, high precision, high reliability and high efficiency.
According to the laser etching device for the peripheral lead of the flexible display screen, provided by the embodiment of the invention, the two movable CCD cameras are arranged, so that 2 positioning targets are respectively movably identified or the graph etched in the previous time is read, the movement time is reduced, and the detection positioning speed is increased.
The processing method of the flexible display screen peripheral lead wire is a processing technology designed for the laser etching device of the flexible display screen peripheral lead wire, and the processing precision of the peripheral lead wire can be improved and the processing cost can be saved by processing the flexible display screen on one side and splicing and processing the peripheral lead wire side by side for multiple times.
According to the processing method of the peripheral lead of the flexible display screen, disclosed by the embodiment of the invention, in order to realize accurate splicing on a next processing graph to process a next graph, before next processing, on the basis that the CCD camera identifies two positioning targets, the CCD camera is required to identify the graph processed at the previous time, and double identification and positioning are carried out, so that the splicing precision can be greatly improved, and the error accumulation is effectively avoided.
According to the processing method of the peripheral lead of the flexible display screen, provided by the embodiment of the invention, the width of the whole lead area is covered by setting the processing optical galvanometer with the visual field larger than 50 x 50 mm; in addition, the processing method does not need to use the whole square area of the full galvanometer view field, and mainly uses the partial area in the middle part, as shown in figure 7, the distortion correction difficulty of the galvanometer can be greatly reduced, and the precision is greatly improved.
According to the flexible display screen provided by the embodiment of the invention, the space between the lead wires is small, so that the narrow frame design of the display is facilitated; and secondly, the width of the lead is large, so that the resistance is reduced, and the conductivity is improved.
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.
Claims (10)
1. A laser etching device for a peripheral lead of a flexible display screen is characterized by comprising an optical platform, a one-dimensional moving mechanism, a CCD camera component and a laser galvanometer component;
the optical platform is provided with a horizontal working table surface, the horizontal working table surface is divided into a precise movement area and a common bearing area, and a vacuum adsorption object stage is arranged in the precise movement area on the horizontal working table surface and is used for tightly adsorbing an area to be etched of the flexible display screen on the upper surface of the flexible display screen through vacuumizing;
the one-dimensional moving mechanism is configured in a precise motion area of the horizontal working table surface, acts on the CCD camera component and the laser galvanometer component, and provides a platform and power for the movement of the CCD camera component and the laser galvanometer component;
the CCD camera assembly is configured on the one-dimensional moving mechanism and located above the vacuum adsorption object stage, and is used for reading a positioning target of the flexible display screen in the region to which the CCD camera assembly belongs and identifying the offset and the inclination angle of the region to be etched of the flexible display screen according to the positioning target;
the laser galvanometer component is arranged on the one-dimensional moving mechanism and located above the vacuum adsorption object stage, adjusts the position of the laser galvanometer component according to the offset and the inclination angle identified by the CCD camera component, and moves along the one-dimensional moving mechanism to act on an area to be etched of the flexible display screen to perform laser etching on peripheral leads.
2. The laser etching device for the peripheral lead of the flexible display screen according to claim 1, further comprising a dust suction mechanism, wherein the dust suction mechanism is located above the vacuum adsorption stage and below the laser galvanometer assembly and is used for sucking away dust generated by silver paste gasification during etching.
3. The laser etching device for the peripheral lead of the flexible display screen according to claim 1, wherein the surface of the vacuum adsorption object stage is flush with the horizontal worktable surface of the common bearing area; and/or the presence of a gas in the gas,
the maximum length of the vacuum adsorption object stage is larger than that of the flexible display screen.
4. The laser etching device for the peripheral lead of the flexible display screen as claimed in claim 1, wherein the laser galvanometer component comprises a laser, an optical galvanometer and a focusing lens, laser emitted by the laser coaxially and parallelly enters the optical galvanometer, the optical galvanometer reflects incident parallel light onto the focusing lens, and the focusing lens focuses the laser etching device to realize laser etching.
5. A processing method of a peripheral lead of a flexible display screen is characterized by comprising the following steps:
adopting screen printing silver paste to form the overall area outline of the peripheral lead of the flexible display screen;
positioning and fixing a region to be etched on the first side of the flexible display screen in a vacuum adsorption manner, and etching a lead in the region to be etched on the first side of the flexible display screen;
performing 90-degree rotation and secondary positioning on the flexible display screen, then performing vacuum adsorption and fixation, performing lead etching on a second side to-be-etched area of the flexible display screen after the flexible display screen rotates by 90 degrees, and communicating the etched leads with the etched leads of the previous time in a one-to-one correspondence manner;
and repeating the previous step until the etching of the lead is finished.
6. The method for processing the peripheral lead of the flexible display screen as claimed in claim 5, wherein the step of positioning the area to be etched on the first side of the flexible display screen comprises the following steps:
reading a positioning target on the first side of the flexible display screen by adopting a CCD (charge coupled device) camera, and identifying the offset and the inclination angle of an area to be etched on the first side of the flexible display screen according to the positioning target;
and the laser galvanometer component is adopted to control the laser galvanometer component to adjust the position of the laser galvanometer component according to the offset and the inclination angle recognized by the CCD camera, and the laser galvanometer component acts on the first side to-be-etched area of the flexible display screen to perform laser etching on the lead wire of the to-be-etched area.
7. The method for processing the peripheral lead of the flexible display screen according to claim 5, wherein the rotating the flexible display screen by 90 degrees and the positioning the flexible display screen for the second time comprise:
reading a positioning target of a region to be etched on the second side of the flexible display screen, which needs to be etched after the flexible display screen rotates by 90 degrees, by using a CCD (charge coupled device) camera, and identifying the inclination angle of the region to be etched on the second side of the flexible display screen after the flexible display screen rotates by 90 degrees according to the positioning target;
and reading the graph etched at the previous time by adopting a CCD camera, and calculating and controlling the offset of the laser galvanometer component according to the read graph etched at the previous time so as to correspondingly communicate the lead etched at this time with the lead etched at the previous time one by one.
8. The method for processing the peripheral lead of the flexible display screen as claimed in claim 7, wherein the reading of the previously etched pattern comprises:
and reading the complete lead pattern etched at the previous time and/or reading the part to be spliced at the tail end of the lead pattern etched at the previous time.
9. A flexible display screen, comprising a functional region and lead regions, wherein the lead regions are disposed at the periphery of the functional region and are in one-to-one correspondence with the functional region, and the lead regions are processed by the method for processing the peripheral leads of the flexible display screen according to any one of claims 5 to 8.
10. The flexible display screen of claim 9, wherein the width of the lead area is 5-30 mm, the width of the lead in the area is 30-500 um, and the distance between adjacent leads in the area is 5-50 um.
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