CN114005785A - Rotary platform and wafer splitting equipment - Google Patents
Rotary platform and wafer splitting equipment Download PDFInfo
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- CN114005785A CN114005785A CN202111389231.2A CN202111389231A CN114005785A CN 114005785 A CN114005785 A CN 114005785A CN 202111389231 A CN202111389231 A CN 202111389231A CN 114005785 A CN114005785 A CN 114005785A
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- 230000000670 limiting effect Effects 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims description 16
- 230000000712 assembly Effects 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 230000033001 locomotion Effects 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 5
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of wafer processing, in particular to a rotary platform and wafer splitting equipment, wherein the rotary platform comprises a first driving component, and the first driving component is arranged along a first direction; the hollow torque motor is annular, a hollow cavity is formed in the middle of the hollow torque motor, the hollow torque motor is arranged on the first driving assembly, and the first driving assembly can drive the hollow torque motor to move back and forth along the first direction; a wafer can be placed on the hollow torque motor, and the hollow torque motor can drive the wafer to rotate; the supporting component is arranged in a hollow cavity of the hollow torque motor and used for supporting the wafer; and the limiting assembly is arranged on the hollow torque motor and used for limiting the wafer. The invention can improve the repeated positioning precision and the flatness, thereby ensuring the splitting processing effect of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to a rotary platform and wafer splitting equipment.
Background
The wafer need be placed on rotary platform at the lobe of a leaf course of working, and the microscope carrier that is used for placing the wafer on current rotary platform adopts gear drive to drive the microscope carrier rotation, because during gear engagement transmission, there is the clearance between the teeth of a cogwheel, thereby leads to the repeated positioning accuracy lower, and in addition, at the in-process of gear assembly, because the error of assembly leads to the plane degree of microscope carrier relatively poor.
Therefore, a rotary platform and a wafer breaking apparatus are needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a rotary platform and wafer splitting equipment, which can improve repeated positioning precision and flatness so as to ensure the splitting processing effect of a wafer.
In order to achieve the purpose, the invention adopts the following technical scheme:
a rotary platform, comprising:
a first drive assembly disposed along a first direction;
the hollow torque motor is annular, a hollow cavity is formed in the middle of the hollow torque motor, the hollow torque motor is arranged on the first driving assembly, and the first driving assembly can drive the hollow torque motor to move back and forth along the first direction; a wafer can be placed on the hollow torque motor, and the hollow torque motor can drive the wafer to rotate;
the supporting component is arranged in a hollow cavity of the hollow torque motor and used for supporting the wafer;
and the limiting assembly is arranged on the hollow torque motor and used for limiting the wafer.
Further, first drive assembly includes first driving piece and transmission assembly, transmission assembly includes first lead screw and first screw, first lead screw with first driving piece transmission is connected, first screw with first lead screw spiro union, cavity torque motor sets up on the first screw.
Further, the hollow torque motor is arranged on a mounting plate, and the mounting plate is fixedly arranged on the first driving assembly.
Further, still include first slip subassembly, first slip subassembly includes first slide rail and first slider, first slide rail is followed the first direction sets up, first slider slides and sets up on the first slide rail, the mounting panel sets up on the slider.
Further, still include locating component, locating component compresses tightly cylinder and spacer including the location, the location compresses tightly the cylinder and fixes and is set up on the mounting panel, be provided with the spacer on the piston rod that the location compressed tightly the cylinder, the spacer can with the wafer butt is in order to fix the wafer.
Further, a plurality of positioning assemblies are arranged at intervals along the circumferential direction of the wafer.
Furthermore, the limiting assembly comprises a plurality of limiting pins, and the limiting pins are arranged on the hollow torque motor at intervals along the circumferential direction of the wafer.
Further, the support assembly comprises a first support assembly and a second support assembly, the first support assembly and the second support assembly are arranged along the first direction, the first support assembly and the second support assembly are arranged oppositely, and the first support assembly and the second support assembly can move towards or away from each other to support different positions of the wafer.
Further, the sliding device further comprises a second sliding assembly, the second sliding assembly comprises a second sliding rail, a second sliding block and a third sliding block, the second sliding rail is arranged along the first direction, the second sliding block and the third sliding block are arranged on the second sliding rail in a sliding mode, the first supporting assembly is arranged on the second sliding block, and the second supporting assembly is arranged on the third sliding block.
A wafer cracking device comprises the rotating platform.
The invention has the beneficial effects that:
according to the rotating platform provided by the invention, the first driving assembly is provided with the hollow torque motor which is annular and provided with the hollow cavity, the hollow torque motor is used for driving the wafer to rotate, the hollow torque motor is provided with the limiting assembly for limiting the position of the wafer, and the hollow cavity of the hollow torque motor is internally provided with the supporting assembly for supporting the wafer. When the wafer is processed, the first driving assembly and the hollow torque motor can adjust the position of the wafer, and the limiting assembly can ensure that the position of the wafer on the hollow torque motor cannot change in the processing process. Through adopting the hollow torque motor to replace original gear drive structure to avoid the clearance that exists between the teeth of a cogwheel, promoted the repeated positioning accuracy, the wafer sets up on hollow torque motor moreover, because hollow torque motor's plane degree is higher, can guarantee the plane degree of wafer, thereby guarantees the lobe of a leaf processing effect of wafer.
The wafer splitting equipment provided by the invention comprises the rotary platform, and can improve the repeated positioning precision and the flatness, so that the splitting processing effect of the wafer is ensured.
Drawings
FIG. 1 is a general schematic view of a rotary platform of the present invention;
FIG. 2 is a schematic illustration of a hollow torque motor and positioning assembly in a rotary platform according to the present invention;
FIG. 3 is a schematic view of a first drive assembly and support assembly in a rotary platform of the present invention.
In the figure:
1. a work table; 2. a first drive assembly; 21. a first driving member; 22. a first lead screw; 23. a first screw nut; 3. a first slide assembly; 31. a first slide rail; 32. a first slider; 4. a first support assembly; 41. a second driving member; 42. a second lead screw; 43. a second screw; 44. a first support member; 5. a second support assembly; 51. a third driving member; 52. a third lead screw; 53. a third screw; 54. a second support member; 6. a second slide assembly; 61. a second slide rail; 62. a second slider; 7. a hollow torque motor; 71. mounting a plate; 72. a spacing pin; 8. a positioning assembly; 81. positioning a compaction cylinder; 82. and (6) a positioning sheet.
Detailed Description
The technical scheme of the invention is further explained by combining the attached drawings and the embodiment. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the process of splitting a wafer, in order to improve the repeated positioning precision of the wafer and ensure the processing effect, as shown in fig. 1 to 3, the invention provides a rotary platform. This rotary platform includes: workstation 1, first drive assembly 2, hollow torque motor 7, supporting component and spacing subassembly.
The first driving assembly 2 is arranged on the workbench 1 along a first direction, the workbench 1 is made of marble, and the workbench 1 is arranged on wafer splitting equipment; the hollow torque motor 7 is annular, a hollow cavity is formed in the middle of the hollow torque motor 7, the hollow torque motor 7 is arranged on the first driving assembly 2, and the first driving assembly 2 can drive the hollow torque motor 7 to move back and forth along a first direction; the wafer can be placed on the hollow torque motor 7, and the hollow torque motor 7 can drive the wafer to rotate; the supporting component is arranged in the hollow cavity of the hollow torque motor 7 and used for supporting the wafer; the limiting component is fixedly arranged on the hollow torque motor 7 and used for limiting the wafer.
When a wafer is processed, the first driving assembly 2 and the hollow torque motor 7 can adjust the position of the wafer, and the limiting assembly can ensure that the position of the wafer on the hollow torque motor 7 cannot be changed in the processing process. Through adopting hollow torque motor 7 to replace original gear drive structure to avoid the error that the clearance that exists between the teeth of a cogwheel caused, promoted the repeated positioning accuracy, the wafer sets up on hollow torque motor 7 moreover, because hollow torque motor 7's plane degree is higher, can guarantee the plane degree of wafer, thereby guarantee the lobe of a leaf processing effect of wafer.
Further, the first driving assembly 2 comprises a first driving member 21 and a transmission assembly, the transmission assembly comprises a first lead screw 22 and a first nut 23, the first lead screw 22 is in transmission connection with the first driving member 21, the first nut 23 is in threaded connection with the first lead screw 22, and the hollow torque motor 7 is arranged on the first nut 23. Specifically, first driving piece 21 is the motor, and the output shaft of motor passes through the shaft coupling and is connected with first lead screw 22 transmission, thereby the motor rotates through the drive first lead screw 22 and drives first screw 23 motion, thereby first screw 23 can drive hollow torque motor 7 and drive the wafer motion. By adopting the screw rod and nut structure, the precise transmission ratio can be ensured, thereby ensuring the moving precision of the wafer. In other embodiments, a ball screw structure, a synchronous belt transmission structure, or a rack and pinion structure may be used, but not limited thereto.
Further, the hollow torque motor 7 is provided on a mounting plate 71, and the mounting plate 71 is fixedly provided on the nut of the first drive assembly 2. The mounting plate 71 is arranged to facilitate the mounting and fixing of the hollow torque motor 7, thereby facilitating the mounting of the rotary platform.
Further, the rotating platform further comprises a first sliding assembly 3, the first sliding assembly 3 comprises a first sliding rail 31 and a first sliding block 32, the first sliding rail 31 is arranged along the first direction, the first sliding block 32 is arranged on the first sliding rail 31 in a sliding manner, and the mounting plate 71 is arranged on the sliding block. Through setting up first slip subassembly 3, can lead the motion of mounting panel 71, guarantee the smoothness nature and the stationarity that first drive assembly 2 drove the motion of mounting panel 71 moreover. In this embodiment, the first sliding assemblies 3 are provided in two sets, and the two sets of first sliding assemblies 3 are arranged in parallel at intervals.
Further, in order to limit the movement distance of the first slider 32 on the first slide rail 31, so as to prevent the wafer from being abnormal in the processing process, in this embodiment, limit switches are fixedly disposed at both ends of the first slide rail 31, and when the first slider 32 touches the limit switches, the limit switches can send signals to control the first transmission member to stop rotating, so as to protect the wafer. In order to further improve the limiting effect, limiting protrusions can be arranged at the two ends of the first sliding rail 31, and the limiting protrusions play a role in mechanical hard limiting.
In the prior art, a sucking disc is adopted to fix the position of a wafer, but in the process of splitting the wafer, the wafer is moved at a high speed and impacted by a riving knife under high frequency, and the sucking disc adsorbs the wafer, so that the hidden danger of flying and offset exists. In order to solve the problem, the rotating device further comprises a positioning assembly 8, the positioning assembly 8 comprises a positioning pressing cylinder 81 and a positioning piece 82, the positioning pressing cylinder 81 is fixedly arranged on the mounting plate 71, the positioning piece 82 is fixedly arranged on a piston rod of the positioning pressing cylinder 81, and the positioning piece 82 can abut against the wafer to fix the wafer. When the positioning and compressing device is used, the positioning plate 82 is driven by the positioning and compressing cylinder 81 to fix the wafer, so that the relative position of the wafer on the hollow torque motor 7 is not changed, and the phenomena of wafer flying and deviation are effectively avoided.
In order to further improve the positioning effect of the wafer and further eliminate the phenomena of flying and deviation of the wafer, thereby ensuring the processing quality, a plurality of positioning assemblies 8 are further arranged at intervals along the circumferential direction of the wafer. In this embodiment, the wafer includes body and wafer frame, and the body setting has circular arc limit and plain edge in the wafer frame, and the spacer 82 and the butt of circular arc limit drive wafer pivoted in-process at hollow torque motor 7, and the spacer 82 can not produce with the wafer and interfere.
Further, the limiting component comprises a plurality of limiting pins 72, and the plurality of limiting pins 72 are arranged on the hollow torque motor 7 at intervals along the circumferential direction of the wafer. Specifically, the positioning pins are used to limit the flat edges of the wafer frame, and the limit pins 72 also rotate along with the wafer in the process that the hollow torque motor 7 drives the wafer to rotate. The situation of displacement in the process of processing the wafer can be avoided by arranging the limiting pin 72, so that the positioning stability of the wafer is further improved.
Further, the support assembly comprises a first support assembly 4 and a second support assembly 5, the first support assembly 4 and the second support assembly 5 are arranged on the workbench 1 along a first direction, the first support assembly 4 and the second support assembly 5 are arranged oppositely, and the first support assembly 4 and the second support assembly 5 can move towards or away from each other to support different positions of the wafer. The flexibility of supporting the wafer can be improved by arranging the first supporting component 4 and the second supporting component 5, so that the effect of processing the wafer is ensured.
Specifically, the first support member 4 includes: the second driving part 41 is arranged on the workbench 1 and is in transmission connection with the second lead screw 42, the second lead screw 42 is arranged along a first direction, the second lead screw 43 is in threaded connection with the second lead screw 42, the first supporting part 44 is connected with the second lead screw 43, the second lead screw 42 is driven by the second driving part 41, and the second lead screw 42 drives the second lead screw 43 to move, so that the first supporting part 44 is driven to realize the position adjustment of the first supporting part 44. In this embodiment, the second driving member 41 is a motor.
The second support member 5 includes: the third driving part 51 is arranged on the workbench 1 and is in transmission connection with the third lead screw 52, the third lead screw 52 is arranged along a first direction, the third lead screw 53 is in threaded connection with the third lead screw 52, the second supporting part 54 is connected with the third lead screw 53, the third lead screw 52 is driven by the third driving part 51, and the third lead screw 52 drives the third lead screw 53 to move, so that the second supporting part 54 is driven to realize the position adjustment of the second supporting part 54. In this embodiment, the third driving member 51 is a motor.
Further, the rotating platform further includes a second sliding assembly 6, the second sliding assembly 6 includes a second sliding rail 61, a second sliding block 62 and a third sliding block, the second sliding rail 61 is disposed along the first direction, the second sliding block 62 and the third sliding block are both slidably disposed on the second sliding rail 61, the first supporting member 44 is fixedly disposed on the second sliding block 62, and the second supporting member 54 is fixedly disposed on the third sliding block. By providing the second sliding assembly 6, the fluency of the movement of the first support 44 and the second support 54 can be further improved.
The embodiment also provides wafer lobe of a leaf equipment, including above rotary platform, can promote repeated positioning accuracy and plane degree to guarantee the lobe of a leaf processing effect of wafer.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A rotary platform, comprising:
a first drive assembly (2), the first drive assembly (2) being arranged in a first direction;
the hollow torque motor (7) is annular, a hollow cavity is formed in the middle of the hollow torque motor (7), the hollow torque motor (7) is arranged on the first driving assembly (2), and the first driving assembly (2) can drive the hollow torque motor (7) to move back and forth along the first direction; the wafer can be placed on the hollow torque motor (7), and the hollow torque motor (7) can drive the wafer to rotate;
the supporting component is arranged in a hollow cavity of the hollow torque motor (7) and used for supporting the wafer;
and the limiting assembly is arranged on the hollow torque motor (7) and is used for limiting the wafer.
2. A rotary platform according to claim 1, characterized in that the first drive assembly (2) comprises a first drive member (21) and a transmission assembly, the transmission assembly comprises a first lead screw (22) and a first nut (23), the first lead screw (22) is in transmission connection with the first drive member (21), the first nut (23) is in threaded connection with the first lead screw (22), and the hollow torque motor (7) is arranged on the first nut (23).
3. A rotary platform according to claim 1, characterized in that the hollow torque motor (7) is arranged on a mounting plate (71), the mounting plate (71) being fixedly arranged on the first drive assembly (2).
4. A rotary platform according to claim 3, further comprising a first slide assembly (3), said first slide assembly (3) comprising a first slide rail (31) and a first slider (32), said first slide rail (31) being disposed along said first direction, said first slider (32) being slidably disposed on said first slide rail (31), said mounting plate (71) being disposed on said slider.
5. The rotary platform according to claim 3, further comprising a positioning assembly (8), wherein the positioning assembly (8) comprises a positioning pressing cylinder (81) and a positioning plate (82), the positioning pressing cylinder (81) is fixedly arranged on the mounting plate (71), a piston rod of the positioning pressing cylinder (81) is provided with the positioning plate (82), and the positioning plate (82) can abut against the wafer to fix the wafer.
6. A rotary platform according to claim 5, wherein a plurality of the positioning assemblies (8) are arranged at intervals along the circumference of the wafer.
7. A rotary platform according to claim 1, wherein the spacing assembly comprises a plurality of spacing pins (72), the plurality of spacing pins (72) being disposed on the hollow torque motor (7) at intervals along the circumference of the wafer.
8. A rotary platform according to claim 1, wherein the support assembly comprises a first support assembly (4) and a second support assembly (5), the first support assembly (4) and the second support assembly (5) are arranged along the first direction, and the first support assembly (4) and the second support assembly (5) are arranged opposite to each other, the first support assembly (4) and the second support assembly (5) being movable towards and away from each other to support different positions of the wafer.
9. A rotary platform according to claim 8, further comprising a second sliding assembly (6), wherein the second sliding assembly (6) comprises a second sliding rail (61), a second sliding block (62) and a third sliding block, the second sliding rail (61) is arranged along the first direction, the second sliding block (62) and the third sliding block are both arranged on the second sliding rail (61) in a sliding manner, the first supporting assembly (4) is arranged on the second sliding block (62), and the second supporting assembly (5) is arranged on the third sliding block.
10. A wafer cleaving apparatus comprising the rotary platform of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111389231.2A CN114005785A (en) | 2021-11-22 | 2021-11-22 | Rotary platform and wafer splitting equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111389231.2A CN114005785A (en) | 2021-11-22 | 2021-11-22 | Rotary platform and wafer splitting equipment |
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| CN114005785A true CN114005785A (en) | 2022-02-01 |
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| CN202111389231.2A Pending CN114005785A (en) | 2021-11-22 | 2021-11-22 | Rotary platform and wafer splitting equipment |
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