CN114005785A - Rotary platform and wafer splitting equipment - Google Patents

Rotary platform and wafer splitting equipment Download PDF

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Publication number
CN114005785A
CN114005785A CN202111389231.2A CN202111389231A CN114005785A CN 114005785 A CN114005785 A CN 114005785A CN 202111389231 A CN202111389231 A CN 202111389231A CN 114005785 A CN114005785 A CN 114005785A
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CN
China
Prior art keywords
wafer
assembly
torque motor
hollow torque
hollow
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CN202111389231.2A
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Chinese (zh)
Inventor
崔剑锋
张洪华
罗帅
赵刚
费康杰
兰珺琳
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Suzhou Keyun Laser Technology Co Ltd
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Suzhou Keyun Laser Technology Co Ltd
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Priority to CN202111389231.2A priority Critical patent/CN114005785A/en
Publication of CN114005785A publication Critical patent/CN114005785A/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7618—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本发明涉及晶圆加工技术领域，尤其涉及一种旋转平台和晶圆裂片设备，一种旋转平台包括第一驱动组件，所述第一驱动组件沿第一方向设置；中空力矩电机，呈圆环状，所述中空力矩电机的中部具有中空腔，所述中空力矩电机设置在所述第一驱动组件上，所述第一驱动组件能够带动所述中空力矩电机沿所述第一方向往复移动；晶圆片能够放置在所述中空力矩电机上，所述中空力矩电机能够带动所述晶圆片旋转；支撑组件，所述支撑组件设置在所述中空力矩电机的中空腔中，用于支撑所述晶圆片；限位组件，所述限位组件设置在所述中空力矩电机上，用于对所述晶圆片进行限位。本发明能够提升重复定位精度和平面度，从而保证晶圆的裂片加工效果。

Figure 202111389231

The invention relates to the technical field of wafer processing, and in particular to a rotary platform and wafer splitting equipment. A rotary platform includes a first driving component, and the first driving component is arranged along a first direction; a hollow torque motor, in the shape of a ring The hollow torque motor has a hollow cavity in the middle, the hollow torque motor is arranged on the first drive assembly, and the first drive assembly can drive the hollow torque motor to reciprocate along the first direction; The wafer can be placed on the hollow torque motor, and the hollow torque motor can drive the wafer to rotate; a support assembly, which is arranged in the hollow cavity of the hollow torque motor, is used to support the The wafer; a limit component, the limit component is arranged on the hollow torque motor, and is used to limit the wafer. The invention can improve the repeated positioning accuracy and flatness, so as to ensure the wafer splitting processing effect.

Figure 202111389231

Description

Rotary platform and wafer splitting equipment
Technical Field
The invention relates to the technical field of wafer processing, in particular to a rotary platform and wafer splitting equipment.
Background
The wafer need be placed on rotary platform at the lobe of a leaf course of working, and the microscope carrier that is used for placing the wafer on current rotary platform adopts gear drive to drive the microscope carrier rotation, because during gear engagement transmission, there is the clearance between the teeth of a cogwheel, thereby leads to the repeated positioning accuracy lower, and in addition, at the in-process of gear assembly, because the error of assembly leads to the plane degree of microscope carrier relatively poor.
Therefore, a rotary platform and a wafer breaking apparatus are needed to solve the above technical problems.
Disclosure of Invention
The invention aims to provide a rotary platform and wafer splitting equipment, which can improve repeated positioning precision and flatness so as to ensure the splitting processing effect of a wafer.
In order to achieve the purpose, the invention adopts the following technical scheme:
a rotary platform, comprising:
a first drive assembly disposed along a first direction;
the hollow torque motor is annular, a hollow cavity is formed in the middle of the hollow torque motor, the hollow torque motor is arranged on the first driving assembly, and the first driving assembly can drive the hollow torque motor to move back and forth along the first direction; a wafer can be placed on the hollow torque motor, and the hollow torque motor can drive the wafer to rotate;
the supporting component is arranged in a hollow cavity of the hollow torque motor and used for supporting the wafer;
and the limiting assembly is arranged on the hollow torque motor and used for limiting the wafer.
Further, first drive assembly includes first driving piece and transmission assembly, transmission assembly includes first lead screw and first screw, first lead screw with first driving piece transmission is connected, first screw with first lead screw spiro union, cavity torque motor sets up on the first screw.
Further, the hollow torque motor is arranged on a mounting plate, and the mounting plate is fixedly arranged on the first driving assembly.
Further, still include first slip subassembly, first slip subassembly includes first slide rail and first slider, first slide rail is followed the first direction sets up, first slider slides and sets up on the first slide rail, the mounting panel sets up on the slider.
Further, still include locating component, locating component compresses tightly cylinder and spacer including the location, the location compresses tightly the cylinder and fixes and is set up on the mounting panel, be provided with the spacer on the piston rod that the location compressed tightly the cylinder, the spacer can with the wafer butt is in order to fix the wafer.
Further, a plurality of positioning assemblies are arranged at intervals along the circumferential direction of the wafer.
Furthermore, the limiting assembly comprises a plurality of limiting pins, and the limiting pins are arranged on the hollow torque motor at intervals along the circumferential direction of the wafer.
Further, the support assembly comprises a first support assembly and a second support assembly, the first support assembly and the second support assembly are arranged along the first direction, the first support assembly and the second support assembly are arranged oppositely, and the first support assembly and the second support assembly can move towards or away from each other to support different positions of the wafer.
Further, the sliding device further comprises a second sliding assembly, the second sliding assembly comprises a second sliding rail, a second sliding block and a third sliding block, the second sliding rail is arranged along the first direction, the second sliding block and the third sliding block are arranged on the second sliding rail in a sliding mode, the first supporting assembly is arranged on the second sliding block, and the second supporting assembly is arranged on the third sliding block.
A wafer cracking device comprises the rotating platform.
The invention has the beneficial effects that:
according to the rotating platform provided by the invention, the first driving assembly is provided with the hollow torque motor which is annular and provided with the hollow cavity, the hollow torque motor is used for driving the wafer to rotate, the hollow torque motor is provided with the limiting assembly for limiting the position of the wafer, and the hollow cavity of the hollow torque motor is internally provided with the supporting assembly for supporting the wafer. When the wafer is processed, the first driving assembly and the hollow torque motor can adjust the position of the wafer, and the limiting assembly can ensure that the position of the wafer on the hollow torque motor cannot change in the processing process. Through adopting the hollow torque motor to replace original gear drive structure to avoid the clearance that exists between the teeth of a cogwheel, promoted the repeated positioning accuracy, the wafer sets up on hollow torque motor moreover, because hollow torque motor's plane degree is higher, can guarantee the plane degree of wafer, thereby guarantees the lobe of a leaf processing effect of wafer.
The wafer splitting equipment provided by the invention comprises the rotary platform, and can improve the repeated positioning precision and the flatness, so that the splitting processing effect of the wafer is ensured.
Drawings
FIG. 1 is a general schematic view of a rotary platform of the present invention;
FIG. 2 is a schematic illustration of a hollow torque motor and positioning assembly in a rotary platform according to the present invention;
FIG. 3 is a schematic view of a first drive assembly and support assembly in a rotary platform of the present invention.
In the figure:
1. a work table; 2. a first drive assembly; 21. a first driving member; 22. a first lead screw; 23. a first screw nut; 3. a first slide assembly; 31. a first slide rail; 32. a first slider; 4. a first support assembly; 41. a second driving member; 42. a second lead screw; 43. a second screw; 44. a first support member; 5. a second support assembly; 51. a third driving member; 52. a third lead screw; 53. a third screw; 54. a second support member; 6. a second slide assembly; 61. a second slide rail; 62. a second slider; 7. a hollow torque motor; 71. mounting a plate; 72. a spacing pin; 8. a positioning assembly; 81. positioning a compaction cylinder; 82. and (6) a positioning sheet.
Detailed Description
The technical scheme of the invention is further explained by combining the attached drawings and the embodiment. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some but not all of the elements associated with the present invention are shown in the drawings.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the process of splitting a wafer, in order to improve the repeated positioning precision of the wafer and ensure the processing effect, as shown in fig. 1 to 3, the invention provides a rotary platform. This rotary platform includes: workstation 1, first drive assembly 2, hollow torque motor 7, supporting component and spacing subassembly.
The first driving assembly 2 is arranged on the workbench 1 along a first direction, the workbench 1 is made of marble, and the workbench 1 is arranged on wafer splitting equipment; the hollow torque motor 7 is annular, a hollow cavity is formed in the middle of the hollow torque motor 7, the hollow torque motor 7 is arranged on the first driving assembly 2, and the first driving assembly 2 can drive the hollow torque motor 7 to move back and forth along a first direction; the wafer can be placed on the hollow torque motor 7, and the hollow torque motor 7 can drive the wafer to rotate; the supporting component is arranged in the hollow cavity of the hollow torque motor 7 and used for supporting the wafer; the limiting component is fixedly arranged on the hollow torque motor 7 and used for limiting the wafer.
When a wafer is processed, the first driving assembly 2 and the hollow torque motor 7 can adjust the position of the wafer, and the limiting assembly can ensure that the position of the wafer on the hollow torque motor 7 cannot be changed in the processing process. Through adopting hollow torque motor 7 to replace original gear drive structure to avoid the error that the clearance that exists between the teeth of a cogwheel caused, promoted the repeated positioning accuracy, the wafer sets up on hollow torque motor 7 moreover, because hollow torque motor 7's plane degree is higher, can guarantee the plane degree of wafer, thereby guarantee the lobe of a leaf processing effect of wafer.
Further, the first driving assembly 2 comprises a first driving member 21 and a transmission assembly, the transmission assembly comprises a first lead screw 22 and a first nut 23, the first lead screw 22 is in transmission connection with the first driving member 21, the first nut 23 is in threaded connection with the first lead screw 22, and the hollow torque motor 7 is arranged on the first nut 23. Specifically, first driving piece 21 is the motor, and the output shaft of motor passes through the shaft coupling and is connected with first lead screw 22 transmission, thereby the motor rotates through the drive first lead screw 22 and drives first screw 23 motion, thereby first screw 23 can drive hollow torque motor 7 and drive the wafer motion. By adopting the screw rod and nut structure, the precise transmission ratio can be ensured, thereby ensuring the moving precision of the wafer. In other embodiments, a ball screw structure, a synchronous belt transmission structure, or a rack and pinion structure may be used, but not limited thereto.
Further, the hollow torque motor 7 is provided on a mounting plate 71, and the mounting plate 71 is fixedly provided on the nut of the first drive assembly 2. The mounting plate 71 is arranged to facilitate the mounting and fixing of the hollow torque motor 7, thereby facilitating the mounting of the rotary platform.
Further, the rotating platform further comprises a first sliding assembly 3, the first sliding assembly 3 comprises a first sliding rail 31 and a first sliding block 32, the first sliding rail 31 is arranged along the first direction, the first sliding block 32 is arranged on the first sliding rail 31 in a sliding manner, and the mounting plate 71 is arranged on the sliding block. Through setting up first slip subassembly 3, can lead the motion of mounting panel 71, guarantee the smoothness nature and the stationarity that first drive assembly 2 drove the motion of mounting panel 71 moreover. In this embodiment, the first sliding assemblies 3 are provided in two sets, and the two sets of first sliding assemblies 3 are arranged in parallel at intervals.
Further, in order to limit the movement distance of the first slider 32 on the first slide rail 31, so as to prevent the wafer from being abnormal in the processing process, in this embodiment, limit switches are fixedly disposed at both ends of the first slide rail 31, and when the first slider 32 touches the limit switches, the limit switches can send signals to control the first transmission member to stop rotating, so as to protect the wafer. In order to further improve the limiting effect, limiting protrusions can be arranged at the two ends of the first sliding rail 31, and the limiting protrusions play a role in mechanical hard limiting.
In the prior art, a sucking disc is adopted to fix the position of a wafer, but in the process of splitting the wafer, the wafer is moved at a high speed and impacted by a riving knife under high frequency, and the sucking disc adsorbs the wafer, so that the hidden danger of flying and offset exists. In order to solve the problem, the rotating device further comprises a positioning assembly 8, the positioning assembly 8 comprises a positioning pressing cylinder 81 and a positioning piece 82, the positioning pressing cylinder 81 is fixedly arranged on the mounting plate 71, the positioning piece 82 is fixedly arranged on a piston rod of the positioning pressing cylinder 81, and the positioning piece 82 can abut against the wafer to fix the wafer. When the positioning and compressing device is used, the positioning plate 82 is driven by the positioning and compressing cylinder 81 to fix the wafer, so that the relative position of the wafer on the hollow torque motor 7 is not changed, and the phenomena of wafer flying and deviation are effectively avoided.
In order to further improve the positioning effect of the wafer and further eliminate the phenomena of flying and deviation of the wafer, thereby ensuring the processing quality, a plurality of positioning assemblies 8 are further arranged at intervals along the circumferential direction of the wafer. In this embodiment, the wafer includes body and wafer frame, and the body setting has circular arc limit and plain edge in the wafer frame, and the spacer 82 and the butt of circular arc limit drive wafer pivoted in-process at hollow torque motor 7, and the spacer 82 can not produce with the wafer and interfere.
Further, the limiting component comprises a plurality of limiting pins 72, and the plurality of limiting pins 72 are arranged on the hollow torque motor 7 at intervals along the circumferential direction of the wafer. Specifically, the positioning pins are used to limit the flat edges of the wafer frame, and the limit pins 72 also rotate along with the wafer in the process that the hollow torque motor 7 drives the wafer to rotate. The situation of displacement in the process of processing the wafer can be avoided by arranging the limiting pin 72, so that the positioning stability of the wafer is further improved.
Further, the support assembly comprises a first support assembly 4 and a second support assembly 5, the first support assembly 4 and the second support assembly 5 are arranged on the workbench 1 along a first direction, the first support assembly 4 and the second support assembly 5 are arranged oppositely, and the first support assembly 4 and the second support assembly 5 can move towards or away from each other to support different positions of the wafer. The flexibility of supporting the wafer can be improved by arranging the first supporting component 4 and the second supporting component 5, so that the effect of processing the wafer is ensured.
Specifically, the first support member 4 includes: the second driving part 41 is arranged on the workbench 1 and is in transmission connection with the second lead screw 42, the second lead screw 42 is arranged along a first direction, the second lead screw 43 is in threaded connection with the second lead screw 42, the first supporting part 44 is connected with the second lead screw 43, the second lead screw 42 is driven by the second driving part 41, and the second lead screw 42 drives the second lead screw 43 to move, so that the first supporting part 44 is driven to realize the position adjustment of the first supporting part 44. In this embodiment, the second driving member 41 is a motor.
The second support member 5 includes: the third driving part 51 is arranged on the workbench 1 and is in transmission connection with the third lead screw 52, the third lead screw 52 is arranged along a first direction, the third lead screw 53 is in threaded connection with the third lead screw 52, the second supporting part 54 is connected with the third lead screw 53, the third lead screw 52 is driven by the third driving part 51, and the third lead screw 52 drives the third lead screw 53 to move, so that the second supporting part 54 is driven to realize the position adjustment of the second supporting part 54. In this embodiment, the third driving member 51 is a motor.
Further, the rotating platform further includes a second sliding assembly 6, the second sliding assembly 6 includes a second sliding rail 61, a second sliding block 62 and a third sliding block, the second sliding rail 61 is disposed along the first direction, the second sliding block 62 and the third sliding block are both slidably disposed on the second sliding rail 61, the first supporting member 44 is fixedly disposed on the second sliding block 62, and the second supporting member 54 is fixedly disposed on the third sliding block. By providing the second sliding assembly 6, the fluency of the movement of the first support 44 and the second support 54 can be further improved.
The embodiment also provides wafer lobe of a leaf equipment, including above rotary platform, can promote repeated positioning accuracy and plane degree to guarantee the lobe of a leaf processing effect of wafer.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1.一种旋转平台，其特征在于，包括：1. a rotating platform, is characterized in that, comprises: 第一驱动组件(2)，所述第一驱动组件(2)沿第一方向设置；a first drive assembly (2), the first drive assembly (2) is arranged along a first direction; 中空力矩电机(7)，呈圆环状，所述中空力矩电机(7)的中部具有中空腔，所述中空力矩电机(7)设置在所述第一驱动组件(2)上，所述第一驱动组件(2)能够带动所述中空力矩电机(7)沿所述第一方向往复移动；晶圆片能够放置在所述中空力矩电机(7)上，所述中空力矩电机(7)能够带动所述晶圆片旋转；The hollow torque motor (7) is annular, the middle of the hollow torque motor (7) has a hollow cavity, the hollow torque motor (7) is arranged on the first drive assembly (2), and the first drive assembly (2) is provided. A drive assembly (2) can drive the hollow torque motor (7) to reciprocate along the first direction; the wafer can be placed on the hollow torque motor (7), and the hollow torque motor (7) can driving the wafer to rotate; 支撑组件，所述支撑组件设置在所述中空力矩电机(7)的中空腔中，用于支撑所述晶圆片；a support assembly, which is arranged in the hollow cavity of the hollow torque motor (7) and used to support the wafer; 限位组件，所述限位组件设置在所述中空力矩电机(7)上，用于对所述晶圆片进行限位。A limit assembly, which is arranged on the hollow torque motor (7), is used to limit the wafer. 2.根据权利要求1所述的一种旋转平台，其特征在于，所述第一驱动组件(2)包括第一驱动件(21)和传动组件，所述传动组件包括第一丝杠(22)和第一丝母(23)，所述第一丝杠(22)与所述第一驱动件(21)传动连接，所述第一丝母(23)与所述第一丝杠(22)螺接，所述中空力矩电机(7)设置在所述第一丝母(23)上。2. A rotating platform according to claim 1, characterized in that the first drive assembly (2) comprises a first drive member (21) and a transmission assembly, and the transmission assembly includes a first lead screw (22) ) and a first screw nut (23), the first screw (22) is drivingly connected with the first drive member (21), the first screw nut (23) is connected with the first screw (22) ) screw connection, the hollow torque motor (7) is arranged on the first thread nut (23). 3.根据权利要求1所述的一种旋转平台，其特征在于，所述中空力矩电机(7)设置在安装板(71)上，所述安装板(71)固定设置在所述第一驱动组件(2)上。3. A rotating platform according to claim 1, characterized in that, the hollow torque motor (7) is arranged on a mounting plate (71), and the mounting plate (71) is fixedly arranged on the first drive on component (2). 4.根据权利要求3所述的一种旋转平台，其特征在于，还包括第一滑动组件(3)，所述第一滑动组件(3)包括第一滑轨(31)和第一滑块(32)，所述第一滑轨(31)沿所述第一方向设置，所述第一滑块(32)滑动设置在所述第一滑轨(31)上，所述安装板(71)设置在所述滑块上。4. A rotating platform according to claim 3, characterized in that further comprising a first sliding assembly (3), the first sliding assembly (3) comprising a first sliding rail (31) and a first sliding block (32), the first sliding rail (31) is arranged along the first direction, the first sliding block (32) is slidably arranged on the first sliding rail (31), and the mounting plate (71) ) on the slider. 5.根据权利要求3所述的一种旋转平台，其特征在于，还包括定位组件(8)，所述定位组件(8)包括定位压紧气缸(81)和定位片(82)，所述定位压紧气缸(81)固定设置在所述安装板(71)上，所述定位压紧气缸(81)的活塞杆上设置有定位片(82)，所述定位片(82)能够与所述晶圆片抵接以固定所述晶圆片。5. A rotary platform according to claim 3, further comprising a positioning assembly (8), the positioning assembly (8) comprising a positioning and pressing cylinder (81) and a positioning piece (82), the A positioning and pressing cylinder (81) is fixedly arranged on the mounting plate (71), a positioning piece (82) is provided on the piston rod of the positioning and pressing cylinder (81), and the positioning piece (82) can be connected with all The wafer is abutted to fix the wafer. 6.根据权利要求5所述的一种旋转平台，其特征在于，沿所述晶圆片的周向间隔设置多个所述定位组件(8)。6. A rotary platform according to claim 5, characterized in that a plurality of the positioning assemblies (8) are arranged at intervals along the circumferential direction of the wafer. 7.根据权利要求1所述的一种旋转平台，其特征在于，所述限位组件包括多个限位销(72)，多个所述限位销(72)沿所述晶圆片的周向间隔设置在所述中空力矩电机(7)上。7 . The rotary platform according to claim 1 , wherein the limiting component comprises a plurality of limiting pins (72), and the plurality of limiting pins (72) are located along the surface of the wafer. 8 . Circumferential intervals are provided on the hollow torque motor (7). 8.根据权利要求1所述的一种旋转平台，其特征在于，所述支撑组件包括第一支撑组件(4)和第二支撑组件(5)，所述第一支撑组件(4)和所述第二支撑组件(5)沿所述第一方向设置，且所述第一支撑组件(4)和所述第二支撑组件(5)相对设置，所述第一支撑组件(4)与所述第二支撑组件(5)能够相向或者相离运动以对所述晶圆片的不同位置进行支撑。8. A rotating platform according to claim 1, characterized in that the support assembly comprises a first support assembly (4) and a second support assembly (5), the first support assembly (4) and the The second support assembly (5) is disposed along the first direction, and the first support assembly (4) and the second support assembly (5) are disposed opposite to each other, the first support assembly (4) and the The second support assembly (5) can move toward or away from each other to support different positions of the wafer. 9.根据权利要求8所述的一种旋转平台，其特征在于，还包括第二滑动组件(6)，所述第二滑动组件(6)包括第二滑轨(61)、第二滑块(62)和第三滑块，所述第二滑轨(61)沿所述第一方向设置，所述第二滑块(62)和所述第三滑块均滑动设置在所述第二滑轨(61)上，所述第一支撑组件(4)设置在所述第二滑块(62)上，所述第二支撑组件(5)设置在所述第三滑块上。9 . The rotating platform according to claim 8 , further comprising a second sliding assembly ( 6 ), the second sliding assembly ( 6 ) comprising a second sliding rail ( 61 ), a second sliding block (62) and a third sliding block, the second sliding rail (61) is arranged along the first direction, and both the second sliding block (62) and the third sliding block are slidably arranged on the second sliding block (62) and the third sliding block. On the slide rail (61), the first support assembly (4) is arranged on the second slider (62), and the second support assembly (5) is arranged on the third slider. 10.一种晶圆裂片设备，其特征在于，包括如权利要求1-9任一项所述的旋转平台。10. A wafer splitting equipment, characterized in that it comprises the rotating platform according to any one of claims 1-9.
CN202111389231.2A 2021-11-22 2021-11-22 Rotary platform and wafer splitting equipment Pending CN114005785A (en)

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