CN113993354A - Radiating fin and thermosiphon radiator - Google Patents
Radiating fin and thermosiphon radiator Download PDFInfo
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- CN113993354A CN113993354A CN202111306010.4A CN202111306010A CN113993354A CN 113993354 A CN113993354 A CN 113993354A CN 202111306010 A CN202111306010 A CN 202111306010A CN 113993354 A CN113993354 A CN 113993354A
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- 238000009833 condensation Methods 0.000 claims abstract description 61
- 230000005494 condensation Effects 0.000 claims abstract description 61
- 239000012530 fluid Substances 0.000 claims abstract description 40
- 238000004891 communication Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 abstract description 28
- 239000012071 phase Substances 0.000 abstract description 25
- 239000007791 liquid phase Substances 0.000 abstract description 17
- 238000010438 heat treatment Methods 0.000 abstract description 12
- 239000007788 liquid Substances 0.000 description 19
- 239000000758 substrate Substances 0.000 description 10
- 238000010992 reflux Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 239000007792 gaseous phase Substances 0.000 description 5
- 230000004308 accommodation Effects 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000007418 data mining Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003090 exacerbative effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a radiating fin and a thermosiphon radiator, wherein the radiating fin comprises a plate body, the radiating fin is provided with a first end and a second end, the second end is positioned at one side of the first end, a condensation cavity and at least one backflow channel are formed in the plate body, the condensation cavity is arranged close to the first end, each backflow channel comprises a first backflow section and at least one second backflow section, one end of the first backflow section is communicated with the condensation cavity, the other end of the first backflow section extends towards the direction far away from the first end, one end of the second backflow section is communicated with the first backflow section, the other end of the second backflow section extends towards the direction close to the second end, and the second backflow section is provided with a fluid outlet. By the technical scheme, the technical problem that in the prior art, a heat source correspondingly arranged at the position cannot be in contact with the liquid phase change working medium and further cannot realize heat dissipation due to the fact that a large number of bubbles generated by heating the phase change working medium are gathered at the upper part of the thermosiphon radiator is solved.
Description
Technical Field
The invention relates to the technical field of heat dissipation, in particular to a heat dissipation fin and a thermosiphon heat sink.
Background
In recent decades, with the rapid development of communication equipment, super computing, data mining, electronic commerce, artificial intelligence and other fields, the total heat dissipation capacity demand has increased dramatically. Device miniaturization further increases power density, while also exacerbating the need for efficient cooling solutions.
Thermosiphon radiator among the prior art is heated through phase change working medium and is evaporated into gas and dispel the heat to electronic equipment, when having arranged a plurality of heat sources on thermosiphon radiator along vertical direction, the bubble that phase change working medium was heated and is produced can a large amount of gathering on thermosiphon radiator's upper portion to lead to corresponding the heat source of arranging here can't contact with liquid phase change working medium, and then can't dispel the heat to this heat source through the phase change of phase change working medium.
Disclosure of Invention
Based on this, it is necessary to provide a heat dissipation fin and a thermosiphon heat sink for solving the technical problem in the prior art that a heat source correspondingly arranged at the upper portion of the thermosiphon heat sink cannot contact with a liquid phase change working medium due to a large amount of bubbles generated by heating the phase change working medium, and thus heat dissipation cannot be achieved.
To this end, a first aspect provides a heat dissipating fin comprising:
the plate body has first end and second end, the second end is located one side of first end, be formed with condensation chamber and at least one backward flow passageway in the plate body, just the condensation chamber is close to first end sets up, every backward flow passageway includes first backward flow section and at least one second backward flow section, the one end of first backward flow section with condensation chamber intercommunication, the other end to keeping away from the direction of first end extends, second backward flow section one end with first backward flow section intercommunication, the other end to being close to the direction of second end extends and has the fluid outlet.
In some embodiments of the cooling fin, the second end is provided with a fluid inlet in communication with the condensation chamber.
In some embodiments of the heat sink fin, the first and second return sections each extend linearly.
In some embodiments of the heat sink fin, the first return section and the second return section are perpendicular.
In some embodiments of the heat dissipating fin, the second backflow section is disposed obliquely, a higher end of the second backflow section is communicated with the first backflow section, and a lower end of the second backflow section forms the fluid outlet.
In some embodiments of the heat dissipating fin, the first reflow section extends linearly, and the second reflow section extends arcuately.
In some embodiments of the heat dissipation fin, the number of the second backflow sections is two or more, and the adjacent second backflow sections are spaced apart from each other and are provided with the fluid outlets.
In some embodiments of the heat dissipation fin, the number of the return channels is two or more, and the two or more second return sections are arranged at intervals between adjacent return channels.
In some embodiments of the heat dissipating fin, adjacent first backflow segments are communicated with each other through the second backflow segment, and the fluid outlet of the second backflow segment near the second end penetrates through the second end.
In some embodiments of the heat dissipation fin, a plurality of first condensation sections and a plurality of second condensation sections are formed in the condensation chamber, adjacent first condensation sections are communicated through the second condensation sections, and the first condensation sections are communicated with the first return section.
In some embodiments of the cooling fin, the number of the first condensation sections is the same as the number of the first return sections.
In some embodiments of the cooling fin, the first condensing section and the first return section are located on the same line.
The invention provides a thermosiphon heat sink, which comprises a base plate with a containing cavity and the heat dissipation fin of the first aspect, wherein the heat dissipation fin is fixed on the base plate, and the fluid inlet and the fluid outlet are both communicated with the containing cavity.
The embodiment of the invention has the following beneficial effects:
in the invention, the second ends of the radiating fins are fixed with the base plate, so that the first ends of the plate body correspond to the higher ends of the base plate; therefore, the condensation cavity arranged close to the first end can be communicated with the upper part of the containing cavity, the liquid phase-change working medium in the containing cavity is heated and evaporated to form a gaseous phase-change working medium, and the gaseous phase-change working medium flows into the condensation cavity of the radiating fin to be condensed, so that the gaseous phase-change working medium is condensed into the liquid phase-change working medium; each backflow channel comprises a first backflow section and at least one second backflow section, one end of the first backflow section is communicated with the condensation cavity, and the other end of the first backflow section extends towards the direction far away from the first end, namely the first backflow section extends from high to low, so that the liquid phase-change working medium condensed in the condensation cavity is conveniently guided into the first backflow section; one end of the second backflow section is communicated with the first backflow section, the other end of the second backflow section extends towards the direction close to the second end, and a fluid outlet is formed in the second end, namely the second backflow section is communicated with the lower part of the containing cavity through the fluid outlet, and the second backflow section is used for guiding the liquid phase change working medium in the first backflow section into the containing cavity; can install a plurality of heat sources on the base plate along vertical direction, then phase change working medium is diffused to the condensation chamber through two kinds of routes after being heated and evaporated: firstly, bubbles generated by heating the phase change working medium positioned at the lower part of the containing cavity are sequentially diffused into the second reflux section, the first reflux section and the condensation cavity through the fluid outlets at the corresponding heights, and are condensed in the condensation cavity and then flow back to the containing cavity through the first reflux section and the second reflux section to be continuously heated; namely, bubbles generated by the lower part of the phase-change working medium can be evacuated through the plurality of fluid outlets, so that the phenomenon that the bubbles are gathered above the phase-change working medium can be avoided, namely, the heat dissipation of a heat source arranged on the upper part of the substrate can not be influenced; and secondly, gas generated by heating the phase change working medium at the upper part of the accommodating cavity is directly diffused to the condensation cavity through the fluid inlet, is condensed in the condensation cavity to form a liquid phase change working medium, and then flows back to the accommodating cavity through the backflow channel and the fluid outlet in sequence to be continuously heated. By the technical scheme, the technical problem that in the prior art, a heat source correspondingly arranged at the position cannot be in contact with the liquid phase change working medium and further cannot realize heat dissipation due to the fact that a large number of bubbles generated by heating the phase change working medium are gathered at the upper part of the thermosiphon radiator is solved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
fig. 1 is a schematic view illustrating an overall structure of a thermosiphon heat sink according to the present invention;
FIG. 2 is a schematic view illustrating an exploded structure of a thermosiphon heat sink according to the present invention;
FIG. 3 shows a schematic view of a portion of a thermosiphon heat sink;
FIG. 4 is a partial schematic view of a heat sink fin;
FIG. 5 is a schematic structural view of a heat dissipating fin according to an embodiment;
FIG. 6 is a schematic structural view of a heat dissipating fin in another embodiment;
FIG. 7 is a schematic structural view showing a heat dissipating fin in another embodiment;
FIG. 8 is a schematic structural view of a heat dissipating fin in another embodiment;
FIG. 9 is a schematic structural view showing a heat dissipating fin in another embodiment;
fig. 10 shows a schematic structural diagram of a heat dissipation fin in another embodiment.
Description of the main element symbols:
100. a thermosiphon heat sink; 10. a substrate; 10a, a containing cavity; 10c, a first plate surface; 10d, a second board surface; 10e, a first communication hole; 10f, a second communication hole; 11. a main board; 12. a cover plate; 13. a second support member; 20. a heat dissipating fin; 21. a plate body; 211. a first end; 212. a second end; 213. a condensation chamber; 2131. a first condensing section; 2132. a second condensation section; 214. a return channel; 2141. a first reflux section; 2142. a second reflux section; 215. a fluid inlet; 216. a fluid outlet; 22. a first support member; 30. a heat source.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, in the embodiment of the present invention, a thermosiphon heat sink 100 is provided, where the thermosiphon heat sink 100 can dissipate heat from a heat source 30 such as a central processing unit and a chip of a power electronic device, so as to ensure that the power electronic device stably operates within a rated temperature range. The thermosiphon heat dissipation comprises a base plate 10 with a containing cavity 10a and a heat dissipation fin 20 fixed on the base plate 10 and communicated with the containing cavity 10a, wherein a phase change working medium is contained in the containing cavity 10a, a liquid phase change working medium is heated and evaporated by a heat source 30 to form a gaseous phase change working medium and flows into the heat dissipation fin 20, and the gaseous phase change working medium is condensed in the heat dissipation fin 20 to form a liquid phase change working medium and flows back to the containing cavity 10a, so that heat dissipation circulation is completed.
With reference to fig. 3 and 4, the heat dissipating fin 20 includes a plate body 21, where the plate body 21 has a first end 211 and a second end 212, and the second end 212 is located at one side of the first end 211, specifically, the second end 212 may be disposed adjacent to the first end 211, and both ends are directly connected, and of course, the second end 212 may be indirectly connected to the first end 211 through other end surfaces as long as the second end 212 is located at one side of the first end 211, for example, the second end 212 is located at the right side of the first end 211 as shown in fig. 5; a condensation cavity 213 and at least one backflow channel 214 are formed in the plate body 21, the condensation cavity 213 is disposed near the first end 211, each backflow channel 214 includes a first backflow section 2141 and at least one second backflow section 2142, one end of the first backflow section 2141 is communicated with the condensation cavity 213, the other end extends in a direction away from the first end 211, one end of the second backflow section 2142 is communicated with the first backflow section 2141, and the other end extends in a direction near the second end 212 and has a fluid outlet 216.
In the present invention, the second end 212 of the heat dissipating fin 20 is fixed to the base plate 10, so that the first end 211 of the plate body 21 corresponds to the higher end of the base plate 10; therefore, the condensation cavity 213 near the first end 211 can be communicated with the upper part of the accommodation cavity 10a, the liquid phase-change working medium in the accommodation cavity 10a is heated and evaporated to form a gaseous phase-change working medium, and the gaseous phase-change working medium flows into the condensation cavity 213 of the heat dissipation fin 20 to be condensed, so that the gaseous phase-change working medium is condensed into the liquid phase-change working medium; each of the backflow channels 214 includes a first backflow section 2141 and at least one second backflow section 2142, one end of the first backflow section 2141 is communicated with the condensation cavity 213, and the other end extends away from the first end 211, that is, the first backflow section 2141 extends from high to low, so as to facilitate guiding the liquid phase-change working medium condensed in the condensation cavity 213 into the first backflow section 2141; one end of the second backflow section 2142 is communicated with the first backflow section 2141, the other end extends towards the direction close to the second end 212, and the second end 212 is provided with a fluid outlet 216, that is, the second backflow section 2142 is communicated with the lower part of the accommodating cavity 10a through the fluid outlet 216, and the second backflow section 2142 has a function of guiding the liquid phase change working medium in the first backflow section 2141 to the recovery accommodating cavity 10 a; a plurality of heat sources 30 may be installed on the substrate 10 in a vertical direction, and the phase change working medium is heated and evaporated and then diffused to the condensation chamber 213 through two paths: firstly, bubbles generated by heating the phase change working medium positioned at the lower part of the containing cavity 10a can be sequentially diffused into the second backflow section 2142, the first backflow section 2141 and the condensation cavity 213 through the fluid outlet 216, and are condensed in the condensation cavity 213 and then flow back to the containing cavity 10a through the first backflow section 2141 and the second backflow section 2142 to continue to be heated; that is, the bubbles generated by the lower portion of the phase-change working medium can be evacuated through the fluid outlet 216, so that the phenomenon that the bubbles are gathered above the phase-change working medium can be avoided, that is, the heat dissipation of the heat source 30 disposed on the upper portion of the substrate 10 is not affected; secondly, the gas generated by heating the phase change working medium at the upper part of the accommodating chamber is directly diffused to the condensing chamber 213 through the fluid inlet 215, condensed in the condensing chamber 213 to form a liquid phase change working medium, and then sequentially flows back to the accommodating chamber 10a through the backflow channel 214 and the fluid outlet 216 to continue to be heated. By applying the technical scheme, the technical problem that in the prior art, a large amount of bubbles generated by heating the phase-change working medium are gathered at the upper part of the thermosiphon radiator 100, so that the heat source 30 correspondingly arranged at the position cannot be contacted with the liquid phase-change working medium, and further the heat radiation cannot be realized is solved.
Meanwhile, in the process that the liquid phase change flows back to the containing cavity 10a through the backflow channel 214, the phase change working medium in the backflow channel 214 further exchanges heat with the outside to reduce the temperature, the phase change working medium in the backflow channel 214 has lower temperature and higher density relative to the phase change working medium in the containing cavity 10a, and the phase change working medium in the containing cavity 10a has higher temperature and lower density relative to the phase change working medium in the backflow channel 214; therefore, the phase change working medium in the return channel 214 flows to the accommodation cavity 10a and drives the phase change working medium in the accommodation cavity 10a to move upwards, so as to form natural convection to enhance the cooling effect on the heat source 30.
In one embodiment, the second end 212 is provided with a fluid inlet 215 in communication with the condensation chamber 213. Therefore, the fluid inlet 215 and the fluid outlet 216 both extend through the second end 212, i.e. for the heat dissipating fin 20, the inflow and outflow of the phase change medium are both performed on the same side thereof, thereby facilitating the assembly of the heat dissipating fin 20 with the base plate 10.
In an embodiment, the first reflow section 2141 and the second reflow section 2142 both extend linearly, as shown in fig. 5-8, the first reflow section 2141 extends linearly to ensure that the liquid phase change working medium smoothly flows into the first reflow section 2141, and the second reflow section 2142 extends linearly to ensure that the liquid phase change working medium in the first reflow section 2141 can smoothly flow back into the accommodating cavity 10a through the second reflow section 2142; on the other hand, the first and second backflow sections 2141 and 2142 extend linearly, which is beneficial to realize the regular arrangement of the backflow channel 214.
Further, the first reflow section 2141 and the second reflow section 2142 are perpendicular. By vertically communicating the first reflow section 2141 with the second reflow section 2142, not only regular arrangement of the first reflow section 2141 and the second reflow section 2142 is further achieved, but also the reflow path of the whole reflow channel 214 can be lengthened.
In another embodiment, the second flow-back section 2142 is obliquely arranged, the higher end of the second flow-back section 2142 is communicated with the first flow-back section 2141, and the lower end of the second flow-back section 2142 forms the fluid outlet 216. Therefore, gaseous phase-change working media formed by heating in the accommodating cavity 10a and liquid phase-change working media flowing back through the return channel 214 are better exchanged, that is, bubbles are easier to diffuse into the second return section 2142, and the liquid phase-change working media in the second return section 2142 are easier to flow back to the accommodating cavity 10 a.
In this embodiment, the first reflow section 2141 may also extend along a straight line with reference to the above embodiments, so as to ensure that the liquid phase change working medium smoothly flows into the first reflow section 2141, and then flows into the second reflow section 2142.
In another embodiment, the first reflow section 2141 extends linearly, and the second reflow section 2142 extends in an arc shape. Therefore, gaseous phase-change working media formed by heating in the accommodating cavity 10a and liquid phase-change working media flowing back through the return channel 214 are better exchanged, that is, bubbles are easier to diffuse into the second return section 2142, and the liquid phase-change working media in the second return section 2142 are easier to flow back to the accommodating cavity 10 a.
It should be noted that the shape configuration of the first reflow section 2141 and the shape configuration of the second reflow section 2142 include, but are not limited to, the above.
On the basis of the above-mentioned embodiments, the features of the second reflow section 2142, the number of the reflow channels 214, and the like are further set.
In one embodiment, referring to fig. 5, the number of the second backflow sections 2142 is two or more, and the adjacent second backflow sections 2142 are spaced apart from each other and have the fluid outlets 216. That is, in the embodiment, each of the backflow channels 214 has more than two second backflow sections 2142, the liquid phase-change working medium condensed in the condensation cavity 213 flows into the first backflow section 2141, then starts to be divided to flow to each of the second backflow sections 2142, and then flows back to the accommodating cavity 10a through the fluid outlet of each of the second backflow sections 2142, so as to exchange with the gaseous phase-change working medium located in the accommodating cavity 10a at different heights, that is, the bubbles in the accommodating cavity 10a can be diffused into the backflow channel 214 through different fluid inlets 215.
Referring to fig. 5, the heat dissipation fin 20 is formed with one backflow channel 214, and the number of the second backflow sections 2142 is five, that is, the liquid phase-change working medium condensed in the condensation chamber 213 first flows into the first backflow section 2141, and then may be shunted to the five second backflow sections 2142.
In one embodiment, referring to fig. 6 and 7, the number of the backflow channels 214 is two or more, and each of the backflow channels 214 is spaced apart from each other and has one or more second backflow sections 2142. Therefore, by adding the backflow channel 214, not only the second backflow sections 2142 but also the first backflow sections 2141 are multiple, and the multiple first backflow sections 2141 can increase the speed of the liquid phase-change working medium condensed in the condensation cavity 213 flowing into the backflow channel 214, and increase the diffusion speed of the gaseous phase-change working medium heated in the accommodating cavity 10a diffusing into the condensation cavity 213 through the backflow channel 214.
In fig. 6, the number of the return channels 214 is three, and each return channel 214 has a first return section 2141 and a second return section 2142.
In fig. 7, the number of the backflow channels 214 is three, wherein one backflow channel 214 has a first backflow segment 2141 and a second backflow segment 2142, and the other two backflow channels 214 have a first backflow segment 2141 and three second backflow segments 2142.
In one embodiment, referring to fig. 8, the adjacent first reflow sections 2141 are communicated with each other through the second reflow section 2142, and the fluid outlet 216 of the second reflow section 2142 near the second end 212 penetrates through the second end 212, so that the communication between the reflow channels 214 is realized, and the reflow path of the reflow channel 214 is increased. Specifically, the plurality of first backflow sections 2141 and the plurality of second backflow sections 2142 are in cross communication, so that on one hand, the flow splitting area and the flow splitting branch of the liquid phase change working medium from the first backflow sections 2141 to the second backflow sections 2142 can be increased, and the heat exchange efficiency of the liquid phase change working medium and the heat dissipation fins 20 is improved; on the other hand, the diffusion speed of the gaseous phase-change working medium formed by heating the accommodating cavity 10a in the backflow channel 214 is accelerated after the gaseous phase-change working medium is diffused into the backflow channel 214, and on the other hand, the backflow path of the backflow channel 214 can be lengthened and the backflow path of the backflow channel 214 can be increased.
Referring to fig. 9 and 10, a plurality of first condensing sections 2131 and a plurality of second condensing sections 2132 are formed in the condensing cavity 213, wherein adjacent first condensing sections 2131 are communicated through the second condensing sections 2132, so that sufficient flow of the gaseous phase change working medium in the condensing cavity 213 is ensured to realize condensation; and the first condensing section 2131 is communicated with the first reflux section 2141 so as to guide the condensed liquid phase-change working medium into the first reflux section 2141.
In an embodiment, the number of the first condensing sections 2131 is the same as that of the first recycling sections 2141, and particularly, referring to fig. 9 and fig. 10, that is, each first condensing section 2131 is correspondingly communicated with each first recycling section 2141, so as to improve the efficiency of guiding the liquid phase-change working medium from the condensing cavity 213 to the recycling channel 214.
Further, the first condensation section 2131 and the first backflow section 2141 are located on the same straight line, specifically referring to fig. 9 and fig. 10, smoothness of communication between the first condensation section 2131 and the first backflow section 2141 is ensured, on one hand, the liquid phase change working medium in the first condensation section 2131 smoothly flows into the first backflow section 2141, and on the other hand, the first condensation section 2131 and the first backflow section 2141 can be formed at one time, that is, the processing step of the first condensation section 2131 and the processing step of the first backflow section 2141 are integrated into one processing step, so that the processing procedure of the heat dissipation fin 20 is simplified, and the processing efficiency is improved.
It should be noted that the condensing cavity 213 is always higher than the liquid level of the phase change working medium in the accommodating cavity 10a, that is, the phase change working medium is vaporized and enters the condensing cavity 213 above to be condensed, and then flows back to the return channel 214 below, referring to fig. 9 and 10, the second end 212 of the heat dissipation fin 20 is substantially entirely communicated with the accommodating cavity 10a of the substrate 10.
In one embodiment, the heat dissipating fin 20 further includes a plurality of first supporting members 22 disposed in the condensation chamber 213 and spaced from each other, and the first supporting members 22 can prevent the heat dissipating fin 20 from collapsing or bulging due to the vacuum or high pressure set in the working environment of the condensation chamber 213; the plurality of first supporting members 22 are arranged at intervals, that is, the first condensing section 2131 and the second condensing section 2132 are formed by the intervals among the plurality of first supporting members 22, so that the gaseous phase change working medium diffused into the condensing cavity 213 can move sufficiently, the resistance of the first supporting members 22 to the gaseous phase change working medium is reduced, and the fluidity and the diffusion speed of the phase change working medium are ensured.
In some specific embodiments, referring to fig. 9, the first support 22 may be configured to be rectangular; alternatively, referring to fig. 10, the first support 22 may be disposed in a hexagonal shape. It should be noted that the structure of the first support 22 includes, but is not limited to, this.
Referring to fig. 1 and 2, the base plate 10 has a first plate surface 10c and a second plate surface 10d which are oppositely arranged, the first plate surface 10c is formed with a heat dissipation station for mounting the heat source 30, and the heat dissipation fins 20 are arranged on the second plate surface 10 d. So as to avoid the heat of the heat source 30 from interfering the heat dissipation of the heat dissipating fins 20 when the heat source 30 and the heat dissipating fins 20 are located on the same side of the substrate 10, and ensure the heat exchange efficiency between the heat dissipating fins 20 and the environment.
In one embodiment, the substrate 10 includes a plurality of second supports 13 disposed in the receiving cavity 10 a. The second support 13 can prevent the substrate 10 from collapsing or bulging due to the vacuum or high pressure condition of the containing cavity 10 a; and a plurality of second strutting pieces 13 are arranged at intervals, that is, a gap is formed between a plurality of second strutting pieces 13, so that bubbles formed by heating can flow through the gap and then flow towards the condensation chamber 213 or the return channel, and the resistance to the bubbles due to the second strutting pieces 13 is reduced, thereby ensuring the flow speed of the bubbles.
In some specific embodiments, the base plate 10 is further formed with a first communication hole 10e through which the fluid inlet 215 communicates with the housing chamber 10a, and a second communication hole 10f through which the fluid outlet 216 communicates with the housing chamber 10 a.
In some embodiments, the substrate 10 includes a main board 11 and a cover plate 12 covering the main board 11, a groove is recessed in a side surface of the main board 11 facing the cover plate 12, and the cover plate 12 covers the groove of the main board 11 to form a receiving cavity 10 a.
In one embodiment, the base plate 10 is further provided with a liquid injection hole communicating with the housing chamber 10 a; wherein, the liquid injection hole can be arranged at the top end of the substrate 10.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only show some embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (14)
1. A heat dissipating fin, comprising:
the plate body has first end and second end, the second end is located one side of first end, be formed with condensation chamber and at least one backward flow passageway in the plate body, just the condensation chamber is close to first end sets up, every backward flow passageway includes first backward flow section and at least one second backward flow section, the one end of first backward flow section with condensation chamber intercommunication, the other end to keeping away from the direction of first end extends, second backward flow section one end with first backward flow section intercommunication, the other end to being close to the direction of second end extends and has the fluid outlet.
2. The fin according to claim 1, wherein the second end is provided with a fluid inlet in communication with the condensation chamber.
3. The fin according to claim 1, wherein the first and second return sections each extend linearly.
4. The fin according to claim 1 or 3, wherein the first and second flow return sections are perpendicular.
5. The fin according to claim 1 or 3, wherein the second flow-back section is disposed obliquely, a higher end of the second flow-back section communicates with the first flow-back section, and a lower end of the second flow-back section forms the fluid outlet.
6. The fin according to claim 1, wherein the first reflow section extends linearly and the second reflow section extends arcuately.
7. The heat dissipating fin according to claim 1, wherein the number of the second backflow sections is two or more, and the adjacent second backflow sections are spaced apart from each other and each have the fluid outlet.
8. The heat dissipating fin according to claim 1, wherein the number of the return channels is two or more, and each of the return channels is spaced apart from the adjacent return channel and has one or more second return sections.
9. The fin according to claim 8, wherein adjacent first flow return sections are in communication with each other through the second flow return section, and the fluid outlet of the second flow return section adjacent to the second end extends through the second end.
10. The fin according to any one of claims 1 to 9, wherein a plurality of first condensation sections and a plurality of second condensation sections are formed in the condensation chamber, adjacent first condensation sections are communicated through the second condensation sections, and the first condensation sections are communicated with the first return section.
11. The fin according to claim 10, wherein the number of the first condensation sections is the same as the number of the first return sections.
12. The fin according to claim 11, wherein the first condensing section and the first return section are located on the same line.
13. The fin as claimed in claim 1, further comprising a plurality of spaced first supports disposed in the condensation chamber.
14. A thermosiphon heat sink, comprising a base plate having a receiving cavity and a fin according to any one of claims 1 to 13, the fin being secured to the base plate, the fluid inlet and the fluid outlet each communicating with the receiving cavity.
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CN202111306010.4A CN113993354A (en) | 2021-11-05 | 2021-11-05 | Radiating fin and thermosiphon radiator |
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CN202111306010.4A CN113993354A (en) | 2021-11-05 | 2021-11-05 | Radiating fin and thermosiphon radiator |
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