CN113990910A - Display device - Google Patents

Abstract

The application discloses display device belongs to and shows technical field. The display device includes: display panel, cover brilliant film and supporting layer. The support layer is connected with one side of the chip on film, which is far away from the display panel, and the support layer can cover at least part of the bent film of the chip on film. Therefore, after the bending film in the chip on film is bent and the second planar film in the chip on film is connected with the display panel on the back of the display panel, even if the bending film still has certain bounce, the bending film can be supported by the supporting layer, so that the supporting layer can offset the bounce applied by the bending film. Therefore, the tensile force applied to the back plate of the display panel by the bending film through the second planar film can be effectively reduced through the supporting layer, and the firmness of connection between the second planar film in the chip on film and the back plate of the display panel can be further improved.

Description

Display device

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

With the development of display technology, display devices are increasingly widely used. Common display devices include smart phones, tablet computers, televisions, displays and the like.

The display device may generally include a display panel and a driving chip. In order to reduce the size of the frame in the display device, the driving Chip in the display device is usually packaged by using a Chip On Flex (COF) packaging technology. When the driving chip is packaged by using the chip on film technology, one end of the chip on film is electrically connected with the display panel on the front side of the display panel (i.e., the side on the same side as the display surface of the display panel), and the rest of the chip on film needs to be bent to the back side of the display panel (i.e., the side opposite to the display surface of the display panel) and then is bonded with the display panel.

However, the bent portion of the flip chip has a certain bounce, which results in poor bonding firmness between the flip chip and the display panel, and the portion of the flip chip bonded to the display panel is prone to warping, and the warped flip chip may interfere with other structures in the display device, thereby seriously affecting the product yield of the display device.

Disclosure of Invention

The embodiment of the application provides a display device. The problem that the bonding firmness of the chip on film and the display panel in the display device in the prior art is poor can be solved, and the technical scheme is as follows:

there is provided a display device, the device including:

a display panel;

the chip on film comprises a bending film, a first planar film and a second planar film, wherein the first planar film and the second planar film are positioned on two sides of the bending film;

and the supporting layer is connected with one side of the chip on film, which is far away from the display panel, and covers at least part of the bent film.

Optionally, the support layer is a planar support structure.

Optionally, an outer boundary of an orthographic projection of the supporting layer on the flip chip is overlapped with an outer boundary of the flip chip.

Optionally, an outer boundary of an orthographic projection of the support layer on the flip chip is overlapped with an outer edge of a bending film in the flip chip.

Optionally, the support layer includes: and the strip structures extend along the bending direction of the bending part.

Optionally, the plurality of strip structures are arranged in parallel.

Optionally, the distance between every two adjacent stripe structures is equal.

Optionally, the support layer is made of a metal material.

Optionally, the chip on film includes: the flexible substrate, the circuit layer which is positioned on one side of the flexible substrate close to the display panel and the driving chip which is electrically connected with the circuit layer are positioned on the second planar film of the chip on film;

the supporting layer is positioned on one side of the flexible substrate far away from the circuit layer.

Optionally, the display device further includes: the gasket is bonded with the back surface of the display panel, and a groove is formed in one surface, away from the display panel, of the gasket;

one surface of the gasket, which is far away from the display panel, is bonded with the second planar film, and after the gasket is bonded with the second planar film, the driving chip is positioned in the groove.

The beneficial effects brought by the technical scheme provided by the embodiment of the application at least comprise:

a display device, comprising: display panel, cover brilliant film and supporting layer. The support layer is connected with one side of the chip on film, which is far away from the display panel, and the support layer can cover at least part of the bent film of the chip on film. Therefore, after the bending film in the chip on film is bent and the second planar film in the chip on film is connected with the display panel on the back of the display panel, even if the bending film still has certain bounce, the bending film can be supported by the supporting layer, so that the supporting layer can offset the bounce applied by the bending film. Therefore, the tensile force applied to the back plate of the display panel by the second planar film through the bending film can be effectively reduced through the supporting layer, so that the firmness of the connection between the second planar film in the chip on film and the back plate of the display panel can be improved, the probability of the phenomenon that the second planar film connected with the back plate of the display panel in the chip on film is warped is reduced, and the product yield of the display device can be improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic diagram of a display device;

FIG. 2 is a diagram illustrating the separation between a pad and a COF in the display device shown in FIG. 1;

fig. 3 is a schematic structural diagram of a display device according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a flip chip film according to an embodiment of the present disclosure when the flip chip film is not bent;

FIG. 5 is a bottom view of the flip chip on film shown in FIG. 4;

FIG. 6 is a schematic view of the flip-chip on film shown in FIG. 5 after being folded;

FIG. 7 is another bottom view of the flip chip on film shown in FIG. 4;

fig. 8 is a schematic view of the flip-chip on film shown in fig. 7 after being bent;

FIG. 9 is another bottom view of the COF shown in FIG. 4;

fig. 10 is a schematic structural diagram of another display device provided in an embodiment of the present application;

fig. 11 is a schematic structural diagram of another display device provided in an embodiment of the present application;

fig. 12 is a schematic structural diagram of another display device according to an embodiment of the present application.

Detailed Description

To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a conventional display device. The display device may include: a display panel 01 and a flip-chip film 02.

One end of the flip-chip film 02 may be electrically connected to the display panel 01 at the front side of the display panel 01 (i.e., the side on the same side as the display surface 01a of the display panel 01), and after the flip-chip film 02 is electrically connected to the display panel 01, the rest of the flip-chip film 02 may be bent to the back side of the display panel 01 (i.e., the side opposite to the display surface 01a of the display panel 01) and bonded to the back side of the display panel 01.

For example, the display device may further include: and a spacer 03 bonded to the back plate of the display panel 01. The side of the pad 03 away from the display panel 01 may be bonded to the portion of the flip-chip film 02 that is bent to the back side of the display panel 01. In this way, the bonding between the portion of the flip-chip film 02 bent to the back surface of the display panel 01 and the display panel 01 can be achieved by the spacer 03.

However, after the flip-chip film 02 is bent and bonded to the back surface of the display panel 01, the internal stress of the bent portion of the flip-chip film 02 is concentrated, so that the bent portion of the flip-chip film 02 has a certain bounce. Under the action of the elastic force, the pad 03 in the display device is pulled by the flip-chip film 02, and the bonding firmness between the pad 03 and the flip-chip film 02 is deteriorated under the action of the pulling force, so that the pad 03 and the flip-chip film 02 are separated from each other.

For example, referring to fig. 2, fig. 2 is a diagram illustrating an effect of a separation between a pad and a flip-chip on film in the display device shown in fig. 1. After the separation phenomenon occurs between the pad 03 and the cover glass 02, the portion of the cover glass 02 bonded to the pad 03 is prone to warping. The lifted flip-chip on film 02 may interfere with other structures (e.g., a rear case of the display device) in the display device, which seriously affects the yield of the display device.

The embodiment of the application provides a display device. The display device can be any electronic equipment with a display function, such as a mobile phone, a tablet computer, a notebook computer, a display or a television.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a display device according to an embodiment of the present disclosure. The display device 000 may include: a display panel 100, a flip-chip film 200, and a support layer 300.

The display panel 100 has a display surface 100 a.

The flip chip package 200 of the display device 000 may have a flex film 200a, and a first flat film 200b and a second flat film 200c disposed on both sides of the flex film 200 a.

The first planar film 200b of the chip on film 200 can be electrically connected to the display panel 100 at the front side thereof.

Illustratively, the area (also referred to as a non-display area) around the display surface 100a of the display panel 100 has a bonding structure, and the first planar film 200b in the flip-chip film 200 has a connection structure. The first planar film 200b in the flip chip 200 can be electrically connected to the bonding structure in the display panel 100 through the connection structure, so that the electrical connection between the first planar film 200b and the display panel 100 can be realized. In a possible implementation manner, the bonding structure in the display panel 100 and the connection structure in the first planar Film 200b may be bonded by an Anisotropic Conductive Film (ACF), and the Anisotropic Conductive Film not only can achieve electrical connection between the display panel 100 and the first planar Film 200b, but also can ensure that the display panel 100 and the first planar Film 200b can be fastened and connected.

After the first planar film 200b of the flip chip package 200 is electrically connected to the display panel 100, the bending film 200a of the flip chip package 200 can be bent, so that the second planar film 200c of the flip chip package 200 can be located on the back of the display panel 100. The second flat film 200c of the chip on film 200 may be connected to the display panel 100 at the back of the display panel 100.

For example, the second planar film 200c of the chip on film 200 may be connected to the display panel 100 by adhesion at the back of the display panel 100.

The front surface of the display panel 100 in the above embodiment refers to the surface of the display panel 100 on the same side as the display surface 100a, and the back surface of the display panel 100 refers to the surface of the display panel 100 opposite to the display surface 100 a.

The support layer 300 of the display device 000 may be located on a side of the flip chip 200 away from the display panel 100, and the support layer 300 may be connected to the side of the flip chip 200 away from the display panel 100. Also, the support layer 300 in the display device 000 may cover at least a portion of the flex film 200b of the flip chip film 200.

In the embodiment of the present application, due to the support layer 300 connected to the side of the flip chip film 200 away from the display panel 100, at least a portion of the bending film 200b of the flip chip film 200 can be covered. Therefore, after the bending film 200b of the flip chip package 200 is bent and the second planar film 200c of the flip chip package 200 is connected to the display panel at the back of the display panel 100, even though the internal stress of the bending film 200b is still concentrated and the bending film 200b still has a certain bounce, the supporting layer 300 can support the bending film 200b, so that the supporting layer 300 can counteract the bounce applied by the bending film 200 b.

Therefore, the tensile force applied to the back plate of the display panel 100 by the bending film 200b through the second planar film 200c can be effectively reduced through the support layer 300, so that the firmness of the connection between the second planar film 200c in the flip chip 200 and the back plate of the display panel 100 can be improved, the probability of the warping phenomenon of the second planar film 200c connected with the back plate of the display panel 100 in the flip chip 200 is reduced, and the product yield of the display device 000 can be improved.

In summary, the display device provided in the embodiment of the present application includes: display panel, cover brilliant film and supporting layer. The support layer is connected with one side of the chip on film, which is far away from the display panel, and the support layer can cover at least part of the bent film of the chip on film. Therefore, after the bending film in the chip on film is bent and the second planar film in the chip on film is connected with the display panel on the back of the display panel, even if the bending film still has certain bounce, the bending film can be supported by the supporting layer, so that the supporting layer can offset the bounce applied by the bending film. Therefore, the tensile force applied to the back plate of the display panel by the second planar film through the bending film can be effectively reduced through the supporting layer, so that the firmness of the connection between the second planar film in the chip on film and the back plate of the display panel can be improved, the probability of the phenomenon that the second planar film connected with the back plate of the display panel in the chip on film is warped is reduced, and the product yield of the display device can be improved.

In the embodiment of the present application, in order to clearly see the structure of the flip chip package 200, please refer to fig. 4, where fig. 4 is a schematic structural diagram of the flip chip package provided in the embodiment of the present application when the flip chip package is not folded. The chip on film 200 may include: the flexible circuit board comprises a flexible substrate 201, a circuit layer 202 located on one side of the flexible substrate 201, and a driving chip 203 electrically connected with the circuit layer 202.

The driving chip 203 in the chip on film 200 may be located on a side of the circuit layer 202 away from the flexible substrate 201, and the driving chip 203 may be located in the second planar film 200a in the chip on film 200. In addition, the driving chip 203 in the chip on film 200 can be electrically connected to the display panel 100 through the circuit layer 202, so that the driving chip 203 in the chip on film 200 can control the content displayed on the display panel 200.

In the present application, the support layer 300 in the display device 000 may be located on a side of the flexible substrate 201 away from the circuit layer 202, and the support layer 300 may be connected to a side of the flexible substrate 300 away from the circuit layer 202.

It should be noted that after the flip chip package 200 is connected to the display panel 100, the circuit layer 202 in the flip chip package 200 is located on one side of the flexible substrate 201 close to the display panel 100. Thus, the circuit layer 202 in the flip chip package 200 can be ensured to be normally electrically connected to the display panel 100, and the support layer 300 in the display device 000 can be ensured to be located on the side of the flexible substrate 201 away from the display panel 100, so as to ensure that the support layer 300 can effectively support at least part of the bending film 200a in the flip chip package 200.

Optionally, the flexible substrate 201 in the chip on film 200 is made of a flexible material. For example, the flexible substrate 201 of the chip on film 200 is made of Polyimide (PI).

In the embodiment of the present application, when the flexible substrate 201 in the flip chip package 200 is made of a flexible material, the flexibility of the flexible substrate 201 in the flip chip package 200 after being bent is greater. Thus, after the flex film 200a in the flip chip 200 is flexed, the portion of the flexible substrate 201 located in the flex film 200a has a strong rebound force.

Since the support layer 300 exists on the side of the flexible substrate 201 away from the circuit layer 202 in the flip chip package 200, the support layer 300 can cover the portion of the flexible substrate 201 located in the bending film 200 a. Therefore, the support layer 300 can support the portion of the flexible substrate 201 located in the bending film 200a, and the support layer 300 can cancel the repulsive force applied to the portion of the flexible substrate 201 located in the bending film 200 a. Thus, the firmness of the connection between the second flat film 200c of the flip chip 200 and the back surface of the display panel 100 can be ensured to be higher.

Alternatively, the support layer 300 in the display device 000 may be made of a metal material. By way of example, the metal material is: metallic copper, metallic aluminum, metallic silver or alloy material.

It should be noted that, when the support layer 300 in the display device 000 is made of a metal material, the support layer 300 is disposed in an insulating manner from the circuit layer 202 in the flip chip package 200. For example, the support layer 300 and the circuit layer 202 in the flip chip package 200 may be insulated by the flexible substrate 201. Thus, the support layer 300 does not participate in the electrical conduction of the flip chip package 200, and the support layer 300 only serves as a support for the flip chip package 200. Thus, the support layer 300 can improve the firmness of the connection between the second planar film 200c of the flip chip film 200 with the single circuit layer 202 and the back surface of the display panel 100.

In the embodiments of the present application, there are various structures of the support layer 300 in the display device 000, and the present application will be schematically illustrated by taking the following two alternative implementations as examples:

in a first alternative implementation, as shown in fig. 5, fig. 5 is a bottom view of the flip-chip film shown in fig. 4. The support layer 300 in the display panel 000 may be a planar support structure 301.

In this case, the planar support structure 301 can completely cover the folded film 200a of the flip chip 200, so that the planar support structure 301 can support the folded film 200a of the flip chip 200 effectively.

It should be noted that, when the support layer 300 in the display panel 000 is a planar support structure, there are various structures of the support layer 300 on the side of the flexible substrate 201 away from the circuit layer 202 in the flip chip package 200, and the embodiment of the present application is schematically described by taking the following two cases as examples:

in the first case, as shown in fig. 5 and fig. 6, fig. 6 is a schematic structural diagram of the flip chip film shown in fig. 5 after being folded. The outer boundary of the orthographic projection of the support layer 300 in the display panel 000 on the flip-chip film 200 coincides with the outer boundary of the flip-chip film 200.

In this case, a metal material layer may be formed on the side of the flexible substrate 201 away from the circuit layer 202 in the flip chip 200 by any one of a plurality of methods, such as deposition, coating, and sputtering, so as to obtain the support layer 300 shown in fig. 6.

Here, the support layer 300 may entirely cover not only the flex film 200a of the flip chip package 200 but also the first and second planar films 200b and 200c of the flip chip package 200. That is, the support layer 300 may cover the entire flip-chip film 300.

In a second case, as shown in fig. 7 and 8, fig. 7 is another bottom view of the flip chip film shown in fig. 4, and fig. 8 is a schematic structural diagram of the flip chip film shown in fig. 7 after being bent. The outer boundary of the orthographic projection of the support layer 300 in the display panel 000 on the flip chip package 200 coincides with the outer boundary of the flex film 200a in the flip chip package 200.

In this case, a metal material layer may be formed on the side of the flexible substrate 201 away from the circuit layer 202 in the flip chip 200 by any one of a plurality of methods, such as deposition, coating, and sputtering, and a patterning process is performed on the metal material layer, so as to obtain the support layer 300 shown in fig. 8. Wherein, the one-time composition process is as follows: photoresist coating, exposure, development, etching and photoresist stripping.

Here, the support layer 300 covers only the bending film 200a of the flip chip package 200, and does not cover the first and second planar films 200b and 200c of the flip chip package 200. That is, the support layer 300 covers only a portion of the flip-chip film 200.

In a second alternative implementation, as shown in fig. 9, fig. 9 is another bottom view of the flip chip film shown in fig. 4. The support layer 300 in the display panel 000 may include: a plurality of stripe structures 302. The bar-shaped structures 302 in the support layer 300 may extend along the bending direction of the bending film 200a in the flip chip film 200.

In this case, when the support layer 300 in the display panel 000 may include: when a plurality of strip structures 302 are provided, the support layer 300 may cover a portion of the bending membrane 200 a.

Optionally, the plurality of bar structures 302 in the support layer 300 are arranged in parallel. Illustratively, the plurality of bar structures 302 in the support layer 300 are all parallel to the target edge of the flip-chip film 200. The target edge of the chip on film 200 is the edge that needs to be bent.

It should be noted that the length of each of the bar structures 302 in the support layer 300 needs to be greater than the length of the target edge (i.e., the edge that needs to be bent) of the bending film 200a in the flip chip film 200. For example, the length of each of the stripe structures 302 in the support layer 300 may be equal to the length of the target edge of the flip-chip film 200. In this way, each of the bar structures 302 in the support layer 300 can effectively support the flex film 200a in the flip chip film 200.

In the embodiment of the present application, the distance between each two adjacent stripe structures 302 in the support layer 300 is equal. In this way, the plurality of bar structures 302 in the support layer 300 can be uniformly distributed on the side of the flexible substrate 201 away from the circuit layer 202 in the flip chip package 200. Thus, the effect of supporting the flex film 200a in the flip chip package 200 can be further improved by the plurality of bar structures 302 in the support layer 300.

In this case, a metal material layer may be formed on the side of the flexible substrate 201 away from the circuit layer 202 in the flip chip 200 by any one of a plurality of methods, such as deposition, coating, and sputtering, and a patterning process is performed on the metal material layer, so as to obtain the support layer 300 shown in fig. 10. Wherein, the one-time composition process is as follows: photoresist coating, exposure, development, etching and photoresist stripping.

It should be noted that, in the first optional implementation manner and the second optional implementation manner, the material of the metal material layer may be: metallic copper, metallic aluminum, metallic silver or alloy material.

Alternatively, as shown in fig. 10, fig. 10 is a schematic structural diagram of another display device provided in the embodiment of the present application. The display device 000 may further include: and a spacer 400 adhered to the rear surface of the display panel 100. One surface of the spacer 400 away from the display panel 100 may be bonded to the second planar film 200c of the flip-chip film 200. In this way, the display device 000 can achieve the adhesion between the display panel 100 and the second planar film 200c in the flip-chip film 200 through the spacer 400.

In the present application, since the support layer 300 in the display device 000 can support the bending film 200b in the flip chip package 200, it can counteract the bounce of the bending film 200 b. Therefore, the second planar film 200c in the flip chip package 200 does not exert a pulling force on the pad 400, thereby effectively improving the bonding firmness between the second planar film 200c in the flip chip package 200 and the pad 400 and preventing the second planar film 200c in the flip chip package 200 and the pad 400 from being separated.

Optionally, the display panel 100 of the display device 000 may be a display panel prepared based on an Organic Light-Emitting Diode (OLED) display technology, or may be a display panel prepared based on a liquid crystal display technology. For this reason, the embodiments of the present application will be described by taking the following two exemplary implementations as examples:

in a first exemplary implementation manner, as shown in fig. 10, when the display panel 100 is a display panel prepared based on an OLED display technology, the display panel 100 may include: a panel body 101, and a heat dissipation film 102 connected to a side of the panel body 101 away from the display surface 100 a.

In this case, the spacer 400 in the display device 000 may be bonded to the side of the heat dissipation film 102 away from the panel body 101.

The panel body 101 may include a plurality of OELD light emitting devices, and a plurality of pixel driving circuits electrically connected to the OELD light emitting devices in a one-to-one correspondence.

The heat dissipation film 102 is formed of a material having a good thermal conductivity. For example, the heat dissipation film 102 may include single heat conductive foam, and the heat dissipation film 102 may also include buffer foam and aluminum foil stacked together, and the aluminum foil faces away from the panel body 101 relative to the buffer foam. The heat dissipation film 102 in the display panel 100 can dissipate heat generated by the OLED light emitting device in the panel body 101 during light emitting, so as to improve the light emitting efficiency of the OLED light emitting device.

In a second exemplary implementation manner, as shown in fig. 11, fig. 11 is a schematic structural diagram of another display device provided in an embodiment of the present application. When the display panel 100 is a display panel prepared based on a liquid crystal display technology, the display panel 100 may include: a liquid crystal panel 103, and a backlight module 104 located on a side of the liquid crystal panel 103 away from the display surface 100 a.

In this case, the spacer 400 in the display device 000 may be bonded to the side of the backlight assembly 104 away from the liquid crystal panel 103.

Among them, the liquid crystal panel 103 may include: the liquid crystal display panel comprises an array substrate, a color film substrate and a liquid crystal layer, wherein the array substrate and the color film substrate are oppositely arranged, and the liquid crystal layer is positioned between the array substrate and the color film substrate.

The backlight module 104 is used for the liquid crystal panel 103 to provide a light source, so that the light emitted by the backlight module 104 can present a corresponding display picture after being regulated by the liquid crystal panel 103 and being emitted from the display surface 100 a.

Alternatively, as shown in fig. 10 and 11, the side of the gasket 400 facing away from the display panel 100 in the display device 000 has a groove 401. After the pad 400 is bonded to the second planar film 200c in the chip on film 200, the driving chip 203 on the second planar film 200c can be located in the groove 401 of the pad 400. After the driver chip 203 is located in the groove 401, a gap exists between the outer surface of the driver chip 203 and the groove surface of the groove 401. Thus, contact interference between the driver chip 203 and the spacer 400 can be prevented, and the driver chip 203 can be prevented from being crushed by the spacer 400.

In this case, the spacer 400 in the display device 000 may be a double-sided tape having a certain thickness. For example, the spacer 400 in the display device 000 may be double-sided foam cotton.

Alternatively, as shown in fig. 12, fig. 12 is a schematic structural diagram of another display device provided in the embodiment of the present application. The display device 000 may further include: a control circuit board 500. The control circuit board 500 may be adhered to the back surface of the display panel 100 by a double-sided adhesive tape a. After the second planar film 200c in the flip chip 200 is bonded to the pad 400, the circuit layer 203 in the second planar film 200c may be electrically connected to the control circuit board 500. Here, the control circuit board 500 can control the driving chip 203 through the through hole to control the screen displayed by the display panel 100.

In the embodiment of the present application, as shown in fig. 12, the display device 000 may further include: a touch panel 600 located on the front surface of the display panel 100, and a flexible circuit board 700 electrically connected to the touch panel 600. The touch panel 600 may be adhered to the display panel 100 through the first adhesive layer B on the front surface of the display panel 100. After one end of the flexible circuit board 700 is electrically connected to the touch panel 100, the other portion of the flexible circuit board 700 may be bent to the back of the display panel 100 and electrically connected to the control circuit board 500. Here, the control circuit board 500 is electrically connected to the touch panel 600 through the flexible circuit board 700, and can detect a touch position on the touch panel 600.

Alternatively, as shown in fig. 12, the display device 000 may further include: and a protective cover 800 positioned on a side of the touch panel 600 away from the display panel 100. The protective cover 800 may be bonded to a surface of the touch panel 600 away from the display panel 100 through the second adhesive layer C.

In summary, the display device provided in the embodiment of the present application includes: display panel, cover brilliant film and supporting layer. The support layer is connected with one side of the chip on film, which is far away from the display panel, and the support layer can cover at least part of the bent film of the chip on film. Therefore, after the bending film in the chip on film is bent and the second planar film in the chip on film is connected with the display panel on the back of the display panel, even if the bending film still has certain bounce, the bending film can be supported by the supporting layer, so that the supporting layer can offset the bounce applied by the bending film. Therefore, the tensile force applied to the back plate of the display panel by the second planar film through the bending film can be effectively reduced through the supporting layer, so that the firmness of the connection between the second planar film in the chip on film and the back plate of the display panel can be improved, the probability of the phenomenon that the second planar film connected with the back plate of the display panel in the chip on film is warped is reduced, and the product yield of the display device can be improved.

It is noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. Also, it will be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or layer or intervening layers may also be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element or intervening layers or elements may also be present. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it can be the only layer between the two layers or elements, or there can be more than one intermediate layer or element. Like reference numerals refer to like elements throughout.

In this application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The term "plurality" means two or more unless expressly limited otherwise.

The above description is intended to be exemplary only, and not to limit the present application, and any modifications, equivalents, improvements, etc. made within the spirit and scope of the present application are intended to be included therein.

Claims (10)

1. A display device, comprising:

a display panel;

the chip on film comprises a bending film, a first planar film and a second planar film, wherein the first planar film and the second planar film are positioned on two sides of the bending film;

and the supporting layer is connected with one side of the chip on film, which is far away from the display panel, and covers at least part of the bent film.

2. The display device according to claim 1, wherein the support layer is a planar support structure.

3. The display device according to claim 2, wherein an outer boundary of an orthographic projection of the support layer on the flip-chip film coincides with an outer boundary of the flip-chip film.

4. The display device according to claim 2, wherein an outer boundary of an orthographic projection of the support layer on the flip-chip film coincides with an outer edge of a flex-film in the flip-chip film.

5. The display device according to claim 1, wherein the support layer comprises: and the strip structures extend along the bending direction of the bending part.

6. The display device according to claim 5, wherein the plurality of stripe structures are arranged in parallel.

7. A display device as claimed in claim 6, characterized in that the distance between every two adjacent stripe-like structures is equal.

8. A display device as claimed in any one of claims 2 to 7, characterized in that the support layer is made of a metallic material.

9. The display device according to any one of claims 1 to 7, wherein the flip-chip film comprises: the flexible substrate, the circuit layer which is positioned on one side of the flexible substrate close to the display panel and the driving chip which is electrically connected with the circuit layer are positioned on the second planar film of the chip on film;

the supporting layer is positioned on one side of the flexible substrate far away from the circuit layer.

10. The display device according to claim 9, further comprising: the gasket is bonded with the back surface of the display panel, and a groove is formed in one surface, away from the display panel, of the gasket;

one surface of the gasket, which is far away from the display panel, is bonded with the second planar film, and after the gasket is bonded with the second planar film, the driving chip is positioned in the groove.

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