CN113990784A - Multi-compatibility wafer carrier feeding station, feeding device and detection method - Google Patents

Multi-compatibility wafer carrier feeding station, feeding device and detection method Download PDF

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Publication number
CN113990784A
CN113990784A CN202111246252.9A CN202111246252A CN113990784A CN 113990784 A CN113990784 A CN 113990784A CN 202111246252 A CN202111246252 A CN 202111246252A CN 113990784 A CN113990784 A CN 113990784A
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China
Prior art keywords
wafer
carrier
transmitting end
sensors
wafer carrier
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CN202111246252.9A
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Chinese (zh)
Inventor
刘恩龙
张菊
董怀宝
张加峰
张贤龙
曹洁
中岛隆志
川辺哲也
杨琦
武一鸣
马刚
董阳
李莹莹
乐佳浩
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Shanghai Guangchuan Technology Co ltd
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Shanghai Guangchuan Technology Co ltd
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Priority to CN202111246252.9A priority Critical patent/CN113990784A/en
Publication of CN113990784A publication Critical patent/CN113990784A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a multi-compatibility wafer carrier loading station which can be compatible with wafer carriers of M sizes; m is an integer greater than 2; the device comprises a carrier mounting plate, a carrier front baffle, 2M-1 transmitting end sensors, 2M-1 receiving end sensors and M rear reference blocks, wherein the carrier front baffle, the 2M-1 transmitting end sensors, the 2M-1 receiving end sensors and the M rear reference blocks are positioned on the carrier mounting plate; the front baffle of the carrier is positioned right ahead the carrier mounting plate, the transmitting end sensors comprise 1 datum transmitting end sensor and 2M-2 side transmitting end sensors, the datum transmitting end sensors are positioned in the center of the front end of the carrier mounting plate, and the side transmitting end sensors are symmetrically distributed on two sides of the datum transmitting end sensors. The invention provides a multi-compatibility wafer carrier feeding station, a feeding device and a detection method, which are mainly used for solving the technical problems of the requirement of multi-specification wafers and the requirement of wafer protrusion detection under the condition that a multi-specification wafer calibration mark has both Notch and Flat.

Description

Multi-compatibility wafer carrier feeding station, feeding device and detection method
Technical Field
The invention belongs to the field of semiconductor devices, and particularly relates to a multi-compatibility wafer carrier loading station, a multi-compatibility wafer carrier loading device and a multi-compatibility wafer carrier detection method.
Background
With the rapid development of the integrated circuit industry, end customers of process equipment have placed ever more stringent requirements on the ability of the equipment to process wafers of various sizes and dimensions. At present, two loading modes of wafer carriers in the industry are mainly adopted, one mode is automatic loading and is realized by mainly placing the wafer carriers on a loading device through automatic equipment such as an OHT (OHT), an AGV (automatic guided vehicle), an MGV (media gateway) and the like, and the other mode is non-automatic loading and is realized by manually moving the wafer carriers to load and unload the wafers.
Wafers with specifications of 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches are commonly used in the industry, at present, the domestic wafer production line mainly comprises 8 inches and 12 inches, but with the continuous application of other specifications of wafers in the fields of glue coating, developing, cleaning, glue removing and the like, the requirements of correspondingly matched transmission and process equipment are continuously increased, and particularly, higher and stricter requirements are provided for the capability of simultaneously processing wafers with various specifications. The wafer carrier of 8 and 12 inches is standardized and technically mature no matter automatic feeding and discharging or manual feeding and discharging, the wafer of other specifications is also called small-size wafer, mainly use manual feeding and discharging as the main and material loading fixed interface does not have unified standard, in addition, the carrier material of small-size wafer mainly is that plastics materials such as PP, PE, PC are moulded plastics and is formed, carrier base part dimensional tolerance is great, the fixed of carrier has brought very big difficulty for the material loading time, in addition, 4 inches and 6 inches wafer calibration sign have not only Notch but also have Flat, this wafer outstanding detection to loading attachment has also proposed very high requirement.
At present, most of the feeding devices for small-size wafers in the industry can load carriers with 2 specifications at most, and the feeding devices which can be compatible with the carriers for 3 or more specifications simultaneously have the defects of not mature technology, inconvenient adjustment operation and the like. In addition, the feeding devices for the small-sized wafers have a common functional defect that the feeding devices do not have a wafer protrusion detection function, and are especially unwieldy when wafer calibration marks of wafers of various specifications have both Notch and Flat.
Disclosure of Invention
In order to solve the above problems, the present invention provides a multi-compatible wafer carrier loading station, a loading device and a detection method, which are mainly used for solving the technical problems of the multi-specification wafer requirement and the wafer protrusion detection requirement under the condition that the multi-specification wafer calibration mark has both Notch and Flat.
In order to achieve the purpose, the invention adopts the following technical scheme: a multi-compatible wafer carrier loading station is compatible with wafer carriers of M sizes; m is an integer greater than 2; the device comprises a carrier mounting plate, a carrier front baffle, 2M-1 transmitting end sensors, 2M-1 receiving end sensors and M rear reference blocks, wherein the carrier front baffle, the 2M-1 transmitting end sensors, the 2M-1 receiving end sensors and the M rear reference blocks are positioned on the carrier mounting plate;
the carrier front baffle is positioned right in front of the carrier mounting plate and used for fixing the front position of the wafer carrier, and the carrier front baffle comprises M clamping grooves;
the transmitting end sensors comprise a reference transmitting end sensor and side transmitting end sensors, the reference transmitting end sensor is positioned in the center of the front end of the carrier mounting plate, and the side transmitting end sensors are symmetrically distributed on two sides of the reference transmitting end sensor; receiving end sensors are fixed above the carrier mounting plate and correspond to the transmitting end sensors in a line connecting direction one by one;
the M rear reference blocks are located right behind the carrier mounting plate and are respectively used for fixing the rear positions of the corresponding wafer carriers, and the distances from the M rear reference blocks to the front baffle of the carrier are different.
Further, baffle before the carrier includes baffle before left side and the baffle before the right side, and all contain M and the not draw-in groove of the wafer carrier one-to-one of unidimensional in baffle before left side and the baffle before the right side.
Furthermore, the transmitting end sensor is fixed on a transmitting end sensor adjusting block, and the position of the transmitting end sensor is adjusted by changing the position of the transmitting end sensor adjusting block.
The wafer carrier is characterized by further comprising M left side fixing blocks and M right side fixing blocks, wherein the M left side fixing blocks are respectively used for fixing the left sides of the M wafer carriers; the M right side fixing blocks are respectively used for fixing the right sides of the M wafer carriers.
The wafer carrier positioning device further comprises M in-place detection sensors, wherein the M in-place detection sensors are fixed on the carrier mounting plate in a front-back sequence, correspond to the tail end positions of the M wafer carriers one by one and are respectively used for detecting the in-place states of the M wafer carriers.
Furthermore, the front ends of the wafers in the M wafer carriers are aligned in the vertical direction; two side edge transmitting end sensors which are at the same distance from the reference transmitting end sensor form a protrusion detection pair, and each protrusion detection is used for performing protrusion detection on a wafer in one wafer carrier; assuming that the connecting line direction of the two side edge transmitting end sensors in each protrusion detection pair is a first direction, and the second direction is perpendicular to the first direction and is positioned in the plane where the protrusion detection pair is positioned; and the distance between the two side edge transmitting end sensors in each protrusion detection pair and the corresponding wafer in the second direction is less than a distance threshold value.
A multi-compatible wafer loading device comprises at least one wafer carrier loading station and further comprises a base unit, wherein the base unit comprises a base plate and a mounting base plate, the mounting base plate is basically fixed above the base plate through a support column, and the at least one wafer carrier loading station is fixed on the base plate.
Furthermore, a receiving end sensor in the wafer carrier loading station is positioned on a protruding detection plate, and the protruding detection plate is fixed right above the carrier mounting plate through a support column.
When the calibration mark of the wafer in the wafer carrier is Notch, the protrusion detection function corresponding to the wafer in the wafer carrier is realized through a reference transmitting end sensor and paired receiving end sensors.
When the calibration mark of a wafer in the wafer carrier is Flat, the wafer protrusion detection function is realized by side emitting end sensors which are positioned at the two sides of a reference emitting end sensor and correspond to the wafer carrier and receiving end sensors which are used in pairs.
The invention has the following beneficial effects: the invention can be compatible with the loading of 3 or more specifications of wafer carriers, and can realize the wafer protrusion detection function under the condition that the calibration marks of wafers with various specifications have both Notch and Flat; the invention has strong compatibility, convenient adjustment and wide application range, can be applied to IC industry and other semiconductor industry such as LED and the like.
Drawings
FIG. 1 is a schematic structural diagram of a wafer carrier loading device according to the present invention;
FIG. 2 is a schematic structural diagram of a loading station of a wafer carrier according to the present invention;
FIG. 3 is a top view of a loading station of a wafer carrier according to the present invention;
FIG. 4 is an isometric view of the present invention loaded with a 3 inch wafer carrier;
FIG. 5 is an isometric view of the present invention loaded with a 4 inch wafer carrier;
FIG. 6 is an isometric view of the present invention loaded with a 6 inch wafer carrier;
FIG. 7 is a top view of a wafer carrier loading apparatus according to the present invention;
FIG. 8 is a first axial side view of a wafer carrier loading apparatus according to the present invention;
FIG. 9 is a second axial side view of the loading device of the wafer carrier of the present invention;
in the figure: 1, adjusting a plate; 2, a base plate; 3 a bottom circular pillar; 4 mounting a substrate; 5 a wafer carrier loading station; 6 top circular support; 7, a left protruding detection plate; 8, a detection plate protrudes rightwards; 9 sensor adjusting block; 10 receiving a terminal sensor; 11 a carrier mounting plate; 12 carrier left front stop; 13 carrier right front stop; a right fixed block of the 146 inch wafer carrier; a left fixing block of the 156-inch wafer carrier; a 164 inch wafer carrier right fixed block; a 174 inch wafer carrier left mounting block; a 183 inch wafer carrier right fixed block; a 193 inch wafer carrier left fixed block; a 203 inch wafer carrier rear datum block; a 214 inch wafer carrier rear datum block; a 226 inch wafer carrier rear datum block; 23-27 transmitting end sensor adjusting blocks; 28-32 transmitting end sensors; 33-35 in-situ detection sensors; a 363 inch wafer carrier; 373 inch wafers; a 384 inch wafer carrier; 394 inch wafer, 406 inch wafer carrier, 416 inch wafer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
The wafer carrier of the present invention may be one or more of 2 inch, 3 inch, 4 inch, 6 inch, 8 inch and 12 inch wafer carriers; the specific size design of each size of wafer carrier is correspondingly enlarged based on the size of the loaded wafer.
The multi-compatibility wafer carrier loading station provided by the invention can be compatible with wafer carriers of M sizes; m is an integer greater than 2; the device comprises a carrier mounting plate, a carrier front baffle positioned on the carrier mounting plate, 2M-1 transmitting end sensors, 2M-1 receiving end sensors and M rear reference blocks. The carrier front baffle is positioned right in front of the carrier mounting plate and used for fixing the front position of the wafer carrier, and the carrier front baffle comprises M clamping grooves; the M rear reference blocks are positioned right behind the carrier mounting plate and are respectively used for fixing the rear positions of the corresponding wafer carriers, and the distances from the M rear reference blocks to the front baffle of the carrier are different. The front baffle and the rear reference block are used for fixing the front and rear positions of the M wafer carriers, the position of the corresponding rear reference block is adjusted according to the specific size of each wafer carrier, and the position of the front baffle is always fixed in the process. That is, the M wafer carriers share one front baffle, so the front baffle needs to include slots for fixing the M wafer carriers; in order to better carry out the place ahead to the wafer carrier of not unidimensional fixed, baffle before the carrier includes baffle before left side and the baffle before the right side, and all contain M and the draw-in groove of the wafer carrier one-to-one of not unidimensional in baffle before left side and the baffle before the right side. Each rear reference block only needs to fix one wafer carrier, so that only one clamping groove or fixing device in each rear reference block can be arranged. The position of the rear reference block is set according to the length of the wafer carrier to be fixed.
The invention can limit the front and the back of the wafer, and can limit the left and the right sides of the wafer carrier through the left fixing plate and the right fixing plate. The carrier mounting plate also comprises M left side fixing blocks and M right side fixing blocks, and the M left side fixing blocks are respectively used for fixing the left sides of the M wafer carriers; the M right side fixed blocks are respectively used for fixing the right sides of the M wafer carriers. The positions of the left fixing block and the right fixing block are set according to the width of a wafer carrier to be fixed.
The loading station of the invention not only realizes the fixing function of the wafer carrier, but also has the wafer carrier detection function, namely, the loading station can detect whether the wafer with the corresponding size is installed in place. The carrier mounting plate also comprises M in-place detection sensors, wherein the M in-place detection sensors are fixed on the carrier mounting plate in a front-back sequence, correspond to the tail end positions of the M wafer carriers one by one and are respectively used for detecting the in-place states of the M wafer carriers. As mentioned above, the sizes of the wafers loaded on the wafer carriers are different, and the corresponding sizes are also different, and in-situ detection in the invention is to use the different end positions of the wafer carriers with different sizes to install in-situ detection sensors on the end positions thereof, so as to realize the detection of the wafer carrier with the size corresponding to the size and determine whether the wafer carrier is installed in place. The specific in-place detection sensor can be any in-place detection sensor in the prior art. Preferably, a signal receiving sensor corresponding to the in-situ detection sensor may be fixed at the end of the wafer carrier, and when the signal receiving sensor is successfully matched with the in-situ detection sensor, it is indicated that the corresponding wafer carrier is installed in place.
The loading station also needs to have a wafer protrusion detection function, wherein the wafer protrusion detection refers to detecting whether a wafer loaded in the wafer carrier is loaded in place or not, an opening of the wafer carrier is arranged right in front, namely at the same side with a front baffle of the carrier, the wafer is moved in and out of the wafer carrier at the opening, the wafer may not be placed in place during the moving in and out process, and if the rear end of the wafer is not completely embedded into a clamping groove of the wafer carrier, the front end of the wafer has a protrusion problem. In order to facilitate the realization of the outstanding detection function, the invention firstly ensures that the front positions of the wafers in the M wafer carriers are flush in the vertical direction.
In order to realize the wafer protrusion detection function in the wafer carrier, the invention is provided with the following structures: the transmitting end sensors comprise a reference transmitting end sensor and side transmitting end sensors, the reference transmitting end sensor is positioned in the center of the front end of the carrier mounting plate, and the side transmitting end sensors are symmetrically distributed on two sides of the reference transmitting end sensor; and the receiving end sensors are fixed above the carrier mounting plate and correspond to the transmitting end sensors in the line connecting direction one by one.
It should be noted that the distance threshold in the present invention is varied according to the wafer carrier size and the wafer mark type, and is not a fixed value, and when the wafer carrier size and the wafer mark type are fixed, the distance threshold can be a fixed value under the condition of the same tolerance protrusion error value. The distance threshold refers to the minimum distance between the reference transmitting end sensor or the side transmitting end sensor and the wafer in the corresponding wafer carrier in the direction perpendicular to the connecting line of the reference transmitting end sensor and the side transmitting end sensor. For convenience of description, the distance thresholds in the detection processes of different wafer sizes and different wafer marks are collectively named as distance thresholds, and it should be understood by those skilled in the art that the values represented by the distance thresholds vary with the detection object.
The reference transmitting end sensor is used for detecting the wafer with the Notch mark, because the wafer part with the Notch mark except the mark is of a circular structure, a distance threshold is set for the wafer with the size and the depth of the Notch mark, the distance threshold needs to be designed according to the depth of the Notch mark when the distance threshold is set, and the distance threshold is slightly larger than the depth of the Notch mark and is within the tolerable range of the protruding error value. And simultaneously adjusting the distance between the reference transmitting end sensor and the wafer to be smaller than the distance threshold value.
When the wafer part except the Notch mark is positioned right in front of the wafer carrier, the distance between the position of the reference transmitting end sensor and the front end of the wafer is smaller than the distance threshold value through reasonably setting the distance threshold value, and once the reference transmitting end sensor detects the wafer, the wafer is indicated to be protruded; when a Notch mark in a wafer is located right in front of the wafer carrier, the wafer protrusion can be also indicated once the datum-emitting-end sensor detects the wafer, because the distance threshold value comprehensively considers the depth of the Notch mark and the tolerable protrusion error value. Therefore, the reference emitter sensor and the corresponding receiver sensor of the invention can be used to detect the protrusion of the wafer with the Notch marks in each wafer carrier.
The side emitting end sensor is used for detecting the wafer with the Flat mark, and the wafer with the Flat mark comprises a tangent line which may be directly opposite to the front of the wafer carrier, may not be directly in front of the wafer carrier at all, and may be partially positioned in front of the wafer carrier. The depth of the Flat mark and the length of the tangent line determine the mounting position of the side-emitting end sensor, because the distance between the two side-emitting end sensors is slightly longer than the length of the tangent line, is closer to the center of the wafer, and is within the tolerable range of the outstanding error value.
For convenience of description, two side edge transmitting end sensors with the same distance from a reference transmitting end sensor are defined to form a protrusion detection pair, and each protrusion detection is used for performing protrusion detection on a wafer in a wafer carrier; the connecting line direction of the two side edge transmitting end sensors in each protrusion detection pair is assumed to be a first direction, and a second direction is perpendicular to the first direction and is located in a plane where the protrusion detection pair is located. The distance between the two side edge transmitting end sensors in each protrusion detection pair and the corresponding wafer in the second direction is smaller than the distance threshold value.
When the Flat mark in the wafer is not positioned right in front of the wafer carrier, the distance threshold value is reasonably set, so that the position of the distance from the side transmitting end sensor to the wafer in the second direction is smaller than the distance threshold value, and once the side transmitting end sensor detects the wafer, the wafer is indicated to be protruded.
When the Flat mark in the wafer is completely positioned right in front of the wafer carrier and the tangential direction is parallel to the first direction, and the two side emitting end sensors detect the wafer together, the wafer is protruded, because the depth of the Flat mark is very large and is far greater than the tolerable protrusion error value.
When the Flat mark in the wafer is completely or partially located right in front of the wafer carrier and the tangential direction is not parallel to the first direction, once one of the reference emitter sensors detects the wafer, it indicates that the wafer is protruded, because the distances between the two symmetrical side emitter sensors and the wafer in the second direction are different, we need to consider the detection situation of the side emitter sensor that is closer, and the distance threshold value already comprehensively considers the depth of the Flat mark and the tolerable protrusion error value, at this time, one of the side emitter sensors can also detect the wafer, which indicates that the wafer is not reasonably located.
In view of the fact that the tolerable outburst error value can change, the transmitting end sensor is fixed on the transmitting end sensor adjusting block, and the position of the transmitting end sensor adjusting block can move, so that when the distance threshold value changes, the position of the transmitting end sensor can be adjusted accordingly, and correspondingly, the position of the receiving end sensor also needs to be adjusted along with the position of the corresponding transmitting end sensor.
The side emitting end sensor performs the protruding detection corresponding to the size of the wafer with the Flat mark, and in view of the fact that the position of the side emitting end sensor can be adjusted, the side emitting end sensor can be provided with a protruding detection pair for detecting all wafers with the Flat mark, and at the moment, the adjusting block of the side emitting end sensor can move in the first direction and the second direction simultaneously; aiming at different distance thresholds, the positions of the transmitting end sensor and the wafer can be adjusted by adjusting the position of the transmitting end sensor adjusting block corresponding to the side transmitting end sensor. The invention can also be provided with a plurality of protrusion detection pairs, and at the moment, the adjusting block of the sensor at the transmitting end can move in the first direction; the method includes the steps that a protrusion detection pair is arranged for each wafer, only the distance of the side emitting end sensors in the first direction needs to be adjusted, and the specific number of the side emitting end sensors can be determined according to the number of the wafers with the Flat marks.
The invention also provides a multi-compatible wafer loading device, which comprises at least a wafer carrier loading station and a base unit, wherein the base unit comprises a base plate and a mounting base plate, the mounting base plate is basically fixed above the base plate through a support column, and the base plate is fixedly provided with at least one wafer carrier loading station. A receiving end sensor in the wafer carrier loading station is positioned on a protruding detection plate, and the protruding detection plate is fixed right above a carrier mounting plate through a support column.
The carrier of the feeding device is not limited to a wafer box for silicon-based semiconductors and compound semiconductors, and can be a carrier which is loaded by other industries and made of sapphire, quartz and the like and has a shape similar to a wafer.
The type of sensor used for wafer protrusion detection according to the present invention is not limited to a correlation sensor, but may be a reflection sensor or other sensor capable of performing the function.
The application industry of the feeding device of the invention is not limited to the integrated circuit industry, and the feeding device can also be applied to other industries of semi-conductors, such as flat panel display, LED, solar battery and other industries.
The loading device of the invention loads at least three wafer carriers, and can also be series carriers with different specifications of wafers, such as different materials, different Slot numbers, different process requirements and the like. In addition, the increase of compatible wafer carriers based on the design theory of the present invention is also included.
For convenience of understanding, the present disclosure is further explained in the following embodiments 1-3, and it should be noted that, in the embodiments 1-3, three compatible wafer carriers are taken as an example for description, and when the number of compatible carriers is greater than 3, the specific structure can be obtained by analogy with the embodiments 1-3 and by combining the above description. The three wafer carriers compatible in the following examples are a 3-inch wafer carrier, a 4-inch wafer carrier and a 6-inch wafer carrier
Example 1
Referring to fig. 1-9, a wafer carrier loading station 5 of the present invention is composed of a carrier mounting plate 11, a carrier left front block 12, a carrier right front block 13, transmitting end sensors 28-32, transmitting end sensor adjusting blocks 23-27, in-situ detection sensors 33-35, a 3-inch wafer carrier rear reference block 20, a 4-inch wafer carrier rear reference block 21, a 6-inch wafer carrier rear reference block 22, a 3-inch wafer carrier left fixing block 19, a 3-inch wafer carrier right fixing block 18, a 4-inch wafer carrier left fixing block 17, a 4-inch wafer carrier right fixing block 16, a 6-inch wafer carrier left fixing block 15, and a 6-inch wafer carrier right fixing block 14. Among the transmitting end sensors 28 to 32, the transmitting end sensor 30 is a reference transmitting end sensor, and the rest are side transmitting end sensors.
In the invention, a carrier left front stop block 12 is fixedly connected on a carrier mounting plate 11 through a long hole, a carrier right front stop block 13 is also fixedly connected on the carrier mounting plate 11 through a long hole, transmitting end sensors 28-32 are respectively and fixedly connected on transmitting end sensor adjusting blocks 23-27, the transmitting end sensor adjusting blocks 23-27 are fixedly connected on the carrier mounting plate 11 through long holes, the reasonable light intensity value is achieved by adjusting the positions of the transmitting end sensors back and forth, the requirements for wafer protrusion detection are realized, in-situ detection sensors 33-35 are fixedly connected on the carrier mounting plate 11, a 3-inch wafer carrier rear reference block 20, a 4-inch wafer carrier rear reference block 21 and a 6-inch wafer carrier rear reference block 22 are fixedly connected on the carrier mounting plate 11 through long holes, a 3-inch wafer carrier left fixing block 19, a 3-inch wafer carrier right fixing block 18, The 4-inch wafer carrier left fixing block 17, the 4-inch wafer carrier right fixing block 16, the 6-inch wafer carrier left fixing block 15 and the 6-inch wafer carrier right fixing block 14 are all fixedly connected to the carrier mounting plate 11 through strip holes.
The carrier left front block 12 and the carrier right front block 13 are the reference for loading of the 3-inch wafer carrier 36, the 4-inch wafer carrier 38 and the 6-inch wafer carrier 40, so that when the 3-inch wafer carrier 36, the 4-inch wafer carrier 38 and the 6-inch wafer carrier 40 are loaded with wafer loading with Notch calibration marks, the front edges of the 3-inch wafer 37, the 4-inch wafer 39 and the 6-inch wafer 41 are overlapped in a tangent mode.
The 3-inch wafer carrier rear datum block 20 of the present invention can be adjusted in the fore-aft direction based on the actual size of the 3-inch wafer carrier 36 to achieve fore-aft fixation of the 3-inch wafer carrier 36.
The left fixing block 19 and the right fixing block 20 of the 3-inch wafer carrier can be adjusted in the left-right direction according to the actual size of the 3-inch wafer carrier 36 to clamp and fix the 3-inch wafer carrier 36 in the left-right center.
The rear reference block 21 of the 4-inch wafer carrier of the present invention can be adjusted in the front-rear direction according to the actual size of the 4-inch wafer carrier 38 to fix the 4-inch wafer carrier 38 in the front-rear direction.
The left fixing block 17 and the right fixing block 18 of the 4-inch wafer carrier can be adjusted in the left-right direction according to the actual size of the 4-inch wafer carrier 38, so that the 4-inch wafer carrier 38 can be clamped and fixed in the left-right center mode.
The rear reference block 22 of the 6-inch wafer carrier of the present invention can be adjusted in the front-rear direction according to the actual size of the 6-inch wafer carrier 40 to fix the 6-inch wafer carrier 40 in the front-rear direction.
The left fixing block 15 and the right fixing block 16 of the 6-inch wafer carrier can be adjusted in the left-right direction according to the actual size of the 6-inch wafer carrier 40 to clamp and fix the 6-inch wafer carrier 40 in the left-right center.
The in-situ sensors 33-35 of the present invention can respectively determine whether a 3-inch wafer carrier 36, a 4-inch wafer carrier 38 and a 6-inch wafer carrier 40 are present, specifically, the in-situ sensor 33 can detect whether the 4-inch wafer carrier 38 is loaded, the in-situ sensor 34 can detect whether the 3-inch wafer carrier 36 is loaded, and the in-situ sensor 35 can detect whether the 6-inch wafer carrier 40 is loaded.
Example 2
The transmitting end sensors 28-32 and the receiving end sensor 10 are used in pairs, and the wafer protrusion detection requirements under the condition that the calibration marks of wafers with various specifications have both Notch and Flat are realized through different combinations. Two main cases are distinguished: in the first case, when the alignment marks of the 3-inch wafer 37, the 4-inch wafer 39 and the 6-inch wafer 41 are all Notch, no matter what wafer carrier is loaded, the whole wafer loading station 5 only needs the reference transmitting end sensor 30 and the paired receiving end sensors 10 to achieve the wafer protrusion detection function. For wafers of different sizes and tolerable protrusion error values, a determined distance threshold may be set, where the distance threshold is slightly greater than the depth of the Notch mark and is within the tolerable protrusion error value range. Meanwhile, the position of the reference transmitting end sensor 30 is adjusted through the transmitting end sensor adjusting block 25, so that the distance between the reference transmitting end sensor 30 and the wafer is smaller than a distance threshold value; thereby realizing the wafer protrusion detection function. The specific detection principle is as described above and will not be described in detail here.
The second case is that when the 3-inch wafer 37 is calibrated to be Notch and the 4-inch wafers 39 and 6-inch wafers 41 are calibrated to be Flat, the wafer loading station 5 performs the function of detecting the protrusion of the 3-inch wafer 37 by the reference emitter sensor 30 and the paired receiver sensors 10, performs the function of detecting the protrusion of the 4-inch wafer 39 by the side emitter sensors 29 and 31 and the paired receiver sensors 10, and finally performs the function of detecting the protrusion of the 6-inch wafer 41 by the side emitter sensors 28 and 32 and the paired receiver sensors 10. For wafers of different sizes and tolerable protrusion error values, a determined distance threshold may be set, where the distance threshold is slightly greater than the depth of the Flat mark and is within the tolerable protrusion error value range. Meanwhile, the position of the corresponding side edge transmitting end sensor is adjusted through the transmitting end sensor adjusting block, so that the distance between the side edge transmitting end sensor and the wafer in the second direction is smaller than a distance threshold value; thereby realizing the wafer protrusion detection function. The specific detection principle is as described above and will not be described in detail here.
Example 3
The invention provides a feeding device compatible with wafer carriers of various specifications, which comprises a base unit, a wafer carrier feeding unit and a wafer protrusion detection unit, wherein the base unit consists of an adjusting plate 1, a base plate 2, a bottom circular pillar 3 and a mounting base plate 4, the wafer carrier feeding unit consists of two wafer carrier feeding stations 5 which are symmetrically arranged in the left-right direction and are completely identical, and the wafer protrusion detection unit consists of a top circular pillar 6, a left protrusion detection plate 7, a right protrusion detection plate 8, a sensor adjusting block 9 and a receiving end sensor 10.
In the invention, a base plate 2 is fixedly connected to an adjusting plate 1, a bottom circular support column 3 is fixedly connected to the base plate 2, and a mounting base plate 4 is fixedly connected to the bottom circular support column 3. Furthermore, the regulation of the left and right directions of the installation base plate 4 can be realized through the strip-shaped fixing holes in the base plate 2, and the base plate 2 can be used for horizontally regulating the installation base plate 4 through regulating jackscrew screws.
The left protruding detection plate 7 and the right protruding detection plate 8 are fixedly connected to the top circular support 6, and the top circular support 6 is fixedly connected to the mounting base plate 4. The receiving end sensor 10 is fixedly connected to the sensor adjusting block 9, and the sensor adjusting block 9 is fixedly connected to the left protruding detection plate 7 and the right protruding detection plate 8 through strip holes.
The invention can be compatible with the loading of 3 or more specifications of wafer carriers, and can realize the wafer protrusion detection function under the condition that the calibration marks of wafers with various specifications have both Notch and Flat; the invention has strong compatibility, convenient adjustment and wide application range, can be applied to IC industry and other semiconductor industry such as LED and the like.
The above description is only a preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all equivalent structural changes made by using the contents of the specification and the drawings of the present invention should be included in the scope of the appended claims.

Claims (10)

1. A multi-compatible wafer carrier loading station is compatible with wafer carriers of M sizes; m is an integer greater than 2; the device is characterized by comprising a carrier mounting plate, a carrier front baffle, 2M-1 transmitting end sensors, 2M-1 receiving end sensors and M rear reference blocks, wherein the carrier front baffle, the 2M-1 transmitting end sensors, the 2M-1 receiving end sensors and the M rear reference blocks are positioned on the carrier mounting plate;
the carrier front baffle is positioned right in front of the carrier mounting plate and used for fixing the front position of the wafer carrier, and the carrier front baffle comprises M clamping grooves;
the transmitting end sensors comprise a reference transmitting end sensor and side transmitting end sensors, the reference transmitting end sensor is positioned in the center of the front end of the carrier mounting plate, and the side transmitting end sensors are symmetrically distributed on two sides of the reference transmitting end sensor; receiving end sensors are fixed above the carrier mounting plate and correspond to the transmitting end sensors in a line connecting direction one by one;
the M rear reference blocks are located right behind the carrier mounting plate and are respectively used for fixing the rear positions of the corresponding wafer carriers, and the distances from the M rear reference blocks to the front baffle of the carrier are different.
2. The multi-compatible wafer carrier loading station of claim 1, wherein the front carrier baffle comprises a left front baffle and a right front baffle, and each of the left front baffle and the right front baffle comprises M slots corresponding to different sizes of wafer carriers.
3. The multi-compatible wafer carrier loading station of claim 1, wherein the launch end sensor is fixed to a launch end sensor adjustment block, and wherein the position adjustment of the launch end sensor is achieved by changing the position of the launch end sensor adjustment block.
4. The multi-compatible wafer carrier loading station of claim 1, further comprising M left side fixing blocks and M right side fixing blocks, the M left side fixing blocks being respectively for fixing the left sides of the M wafer carriers; the M right side fixing blocks are respectively used for fixing the right sides of the M wafer carriers.
5. The multi-compatible wafer carrier loading station of claim 1, further comprising M in-place detection sensors, wherein the M in-place detection sensors are sequentially mounted on the carrier mounting plate in a front-to-back order, and are in one-to-one correspondence with end positions of the M wafer carriers, and are respectively configured to detect in-place states of the M wafer carriers.
6. A multi-compatible wafer carrier loading station as claimed in claim 1 wherein the front positions of the wafers in said M wafer carriers are vertically level; two side edge transmitting end sensors which are at the same distance from the reference transmitting end sensor form a protrusion detection pair, and each protrusion detection is used for performing protrusion detection on a wafer in one wafer carrier; assuming that the connecting line direction of the two side edge transmitting end sensors in each protrusion detection pair is a first direction, and the second direction is perpendicular to the first direction and is positioned in the plane where the protrusion detection pair is positioned; and the distance between the two side edge transmitting end sensors in each protrusion detection pair and the corresponding wafer in the second direction is less than a distance threshold value.
7. A multi-compatible wafer loading apparatus comprising at least one wafer carrier loading station as recited in any of claims 1-5, further comprising a base unit comprising a base plate and a mounting base plate, the mounting base plate being secured over the base plate by posts, the base plate securing the at least one wafer carrier loading station thereon.
8. A multi-compatibility wafer loading apparatus according to claim 7, wherein said receiving end sensor of said wafer carrier loading station is located on a protruding sensing plate, said protruding sensing plate being secured directly above the carrier mounting plate by posts.
9. A method of performing bump detection using the wafer carrier loading station of claim 6, wherein when the alignment mark of a wafer in a wafer carrier is Notch, the bump detection function corresponding to the wafer in the wafer carrier is performed by the reference emitter sensor and the paired receiver sensors.
10. A method of performing a bump detection using the wafer carrier loading station of claim 6, wherein when the wafer alignment mark in the wafer carrier is Flat, the wafer bump detection function is performed by side edge emitting sensors located on both sides of the reference emitting sensor and corresponding to the wafer carrier and paired receiving sensors.
CN202111246252.9A 2021-10-26 2021-10-26 Multi-compatibility wafer carrier feeding station, feeding device and detection method Pending CN113990784A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111246252.9A CN113990784A (en) 2021-10-26 2021-10-26 Multi-compatibility wafer carrier feeding station, feeding device and detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111246252.9A CN113990784A (en) 2021-10-26 2021-10-26 Multi-compatibility wafer carrier feeding station, feeding device and detection method

Publications (1)

Publication Number Publication Date
CN113990784A true CN113990784A (en) 2022-01-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN113990784A (en)

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