CN114551311A - Loading device of wafer transmission system - Google Patents
Loading device of wafer transmission system Download PDFInfo
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- CN114551311A CN114551311A CN202210134672.6A CN202210134672A CN114551311A CN 114551311 A CN114551311 A CN 114551311A CN 202210134672 A CN202210134672 A CN 202210134672A CN 114551311 A CN114551311 A CN 114551311A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a feeding device of a wafer transmission system.A cover body is in an open state to expose a feeding table, a cover plate seals a window, and a wafer box is provided with a plurality of substrates and is placed on the feeding table; and the cover body is in a closed state to cover the wafer box, the cover plate opens the window, and the substrates pass through the window and are conveyed into the wafer conveying system. The invention realizes the accurate positioning of the wafer box by arranging the wafer box clamping unit, meanwhile, the wafer box is accommodated in the cover body to isolate the internal environment and the external environment and avoid cross contamination, and in addition, the invention also carries out position detection on the substrate in the wafer box by arranging the substrate detection sensor. The feeding device has the advantages of strong compatibility, convenient adjustment and wide application range.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a feeding device of a wafer transmission system.
Background
With the rapid development of the integrated circuit industry, the wafer manufacturers and process equipment manufacturers have placed ever more stringent requirements on the ability of automated equipment to load multiple wafer carriers.
Currently, wafer carriers in the industry are mainly classified into two main types, one is a non-open wafer box such as foup (front Opening unified), fosb (front Opening shifting box) which can protect, transport and store wafers, and the non-open wafer box can reduce wafer dust pollution and loss caused by different process steps, thereby promoting yield, improving yield, and avoiding wafer damage caused by static electricity and dust, and is often applied to loading of 8-inch and 12-inch wafers. Whether automatic feeding or manual feeding, an automatic feeding device Load Port meeting SEMI standard is available in the industry, and the standardized Load Port feeding device is widely integrated and applied to semiconductor automation equipment.
The other type is an Open Cassette type wafer Cassette, a wafer receiving part of the Open Cassette type wafer Cassette is in an Open state, the Open Cassette type wafer Cassette is often used for loading wafers, the environmental cleanliness requirement is not high, the Open Cassette type wafer Cassette is mainly used for transporting wafers in acid-base processes of a semiconductor etching department, wafers with common specifications of 2 inches, 3 inches, 4 inches, 6 inches, 8 inches and 12 inches are all provided with the wafer Cassette type wafer Cassette, and the number of wafer cassettes with small sizes is large. The technology of a feeding device for an open wafer box is not standardized, the positioning of the wafer box is realized by adjusting a limiting block in the industry, but the wafer box is mainly made of PP, PE, PC and other plastic materials through injection molding, the size tolerance of a carrier base part is large, great difficulty is brought to the fixation of a wafer carrier, the fixation precision is poor, the feeding precision of a wafer is poor indirectly caused, and the feeding device does not have the wafer position detection function.
When the open type wafer box is used for feeding, strict precision requirements are placed on the feeding position of the wafer box, strict requirements are placed on the micro-dust pollution of the wafer, and when the position detection of the wafer is required after the wafer is fed, the existing feeding device cannot perfectly perform.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a feeding device of a wafer transmission system.
In order to achieve the above object, the present invention provides a feeding device of a wafer conveying system, comprising: the base unit comprises a partition plate, a feeding table and a support frame, the feeding table is arranged at the top of the support frame, the partition plate is provided with a front surface and a back surface which are opposite, a window is arranged at the upper part of the partition plate, and the front surface is fixedly connected with the feeding table and the support frame; the outer cover unit comprises a cover body, the cover body is movably covered on the feeding table and is provided with a side opening opposite to the window; the lifting door unit comprises a cover plate, and the cover plate corresponds to the window and is movably arranged on the back of the partition plate; the cover body is in an open state to expose the feeding table, the cover plate seals the window, and the wafer box is provided with a plurality of substrates and is placed on the feeding table; and the cover body is in a closed state to cover the wafer box, the cover plate opens the window, and the substrates pass through the window and are conveyed into the wafer conveying system.
Preferably, the support frame includes bottom plate, left side support plate and right side support plate, the bottom plate set firmly in the bottom of baffle, left side support plate reaches right side support plate is relative and divide to be located the both sides of bottom plate, and all link firmly the baffle, the material loading platform is relative the bottom plate is located on the left side support plate and on the right side support plate.
Preferably, the center of the bottom of the wafer box is provided with a first positioning hole, the feeding table is provided with a mounting hole corresponding to the first positioning hole, the feeding device further comprises a wafer box clamping unit, and the wafer box clamping unit comprises a first cylinder and a plurality of clamping jaws; the clamping jaws are arranged on the first cylinder, the first cylinder is fixedly arranged in the mounting hole, and the clamping jaws are driven to expand outwards from the hole cores of the mounting hole so as to tension the wafer box and retract so as to loosen the wafer box.
Preferably, the clamping jaws are uniformly distributed along the circumferential direction of the first cylinder, and the number of the clamping jaws is more than or equal to 3.
Preferably, spool box centre gripping unit still includes the mount pad, the mount pad is located in the mounting hole, and can dismantle the connection the material loading platform, first cylinder can dismantle the connection the mount pad.
Preferably, the outer cover unit further comprises a left vertical beam plate, a right vertical beam plate, a cross beam and a torque hinge, the cross beam is fixedly arranged at the top end of the partition plate, the left vertical beam plate and the right vertical beam plate are opposite and respectively arranged at two sides of the cross beam and are fixedly connected with the partition plate, and the torque hinge is fixedly connected with the cross beam and the cover body and is provided with a rotating shaft parallel to the cross beam; the cover body covers the feeding platform around the rotating shaft movable cover.
Preferably, the housing unit further includes at least one hovering component, the hovering component is disposed on the left side and/or the right side of the housing, and when the housing moves to a preset height around the rotating shaft, the hovering component hovers the housing.
Preferably, the hovering assembly comprises a nitrogen spring, one end of the nitrogen spring is hinged to the left vertical beam plate or the right vertical beam plate, and the other end of the nitrogen spring is fixedly connected with the cover body.
Preferably, the film cassette is equipped with a plurality of draw-in grooves from bottom to top, the substrate corresponds the draw-in groove is located in the film cassette the base unit still includes substrate detection sensor, substrate detection sensor links firmly the curb plate, and detect each the substrate for the substrate position error of draw-in groove.
Preferably, the bottom of the sheet box is also provided with a plurality of second positioning holes around the first positioning hole, and the feeding table is provided with at least one sheet box detection sensor and a plurality of positioning blocks corresponding to the second positioning holes; the locating block is clamped in the second locating hole, the film box is arranged on the feeding platform, and the film box detection sensor detects the position error of the film box relative to the feeding platform.
The invention realizes the accurate positioning of the wafer box by arranging the wafer box clamping unit, meanwhile, the outer cover unit is used for accommodating the wafer box to isolate the internal environment and the external environment and avoid cross contamination, and in addition, the invention also carries out position detection on the substrate in the wafer box by arranging the substrate detection sensor. The feeding device has strong compatibility, convenient adjustment and wide application range, can be applied to the IC industry and can also be applied to other general semiconductor industries such as LED and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a first structural schematic diagram of a feeding device according to an embodiment of the invention;
FIG. 2 is a second schematic structural diagram of the feeding device according to the embodiment of the present invention;
FIG. 3 is a schematic structural diagram of the feeding device of the embodiment of the invention after feeding;
FIG. 4 is a schematic diagram of a cassette according to an embodiment of the present invention;
FIG. 5 is a schematic view of the bottom of a cassette according to an embodiment of the present invention;
FIG. 6 is an isometric view of a base unit of a loading unit according to an embodiment of the present invention;
FIG. 7 is an exploded view of the base unit of the loading unit of the embodiment of the present invention;
FIG. 8 is an enlarged partial view of a loading station of the base unit of an embodiment of the present invention;
FIG. 9 is a side elevational view of a closed state of a sheet cassette holding unit of the loading apparatus according to the embodiment of the present invention;
FIG. 10 is a side elevational view of a cassette holding unit of a loading apparatus in an open state according to an embodiment of the present invention;
FIG. 11 is an isometric view of a housing unit of a loading device according to an embodiment of the present invention;
FIG. 12 is an isometric view of a lift gate unit of a loading unit in accordance with an embodiment of the present invention;
description of reference numerals: 1, a box of boxes; 2 a base unit; 3 a housing unit; 4 a sheet cassette holding unit; 5 lifting the door unit; 6, side plates; 7 left side support plate; 8, a right support plate; 9 a bottom plate; 10, a feeding table; 11, arranging a decorative cover; 12 lower decorative cover; 13 left and right adjusting mechanism; 14 front and rear adjusting mechanisms; 15 a substrate detection sensor; a 16-cassette detection sensor; 17, positioning blocks; 18 left side vertical beam panel; 19 right side vertical beam panel; 20 a cross beam; 21 a torque hinge; 22 a cover body; 23 outer cover reinforcing ribs; 24 nitrogen gas spring; 25 a handle; 26 a first cylinder fixing plate; 27 a first cylinder connecting plate; 28 a first cylinder; 29 clamping jaws; 30 a second cylinder; 31 a cylinder connecting plate; a 32-side connecting plate; 33 a transverse plate; 34 a cover plate; 100 a substrate; 101 a first positioning hole; 102 second positioning hole.
Detailed Description
In order to make the contents of the present invention more comprehensible, the present invention is further described below with reference to the accompanying drawings. The invention is of course not limited to this particular embodiment, and general alternatives known to those skilled in the art are also covered by the scope of the invention.
In the following detailed description of the embodiments of the present invention, in order to clearly illustrate the structure of the present invention and to facilitate explanation, the structure shown in the drawings is not drawn to a general scale and is partially enlarged, deformed and simplified, so that the present invention should not be construed as limited thereto.
Referring to fig. 1 to 3, a cassette 1 is disposed on a base unit 2, and an outer cover unit 3 is opened to accommodate the cassette 1 and closed to isolate the influence of external environment on the cassette 1, and prevent the wafer transmission system from being polluted by environmental factors such as particles and dust.
In this embodiment, the feeding device further includes a sheet cassette holding unit 4 for fixing the sheet cassette 1.
As shown in fig. 4, the magazine 1 is provided with a plurality of card slots (not shown) from bottom to top, each substrate 100 is disposed in the magazine 1 corresponding to the card slot, and the substrates 100 may be one or a combination of 2 inches, 4 inches, 6 inches, 8 inches, and 12 inches.
The cassette 1 is provided with a cassette opening from which the substrate 100 is put in or taken out of the cassette 1. The two sides of the box opening are provided with a box handle so as to facilitate the operation personnel to take and place the box.
The wafer cassette 1 is not limited to a wafer cassette for silicon-based semiconductors and compound semiconductors, and may be a carrier for loading a wafer having a shape similar to that of a sapphire wafer, a quartz wafer, or the like in other industries.
As shown in fig. 5, a first positioning hole 101 is formed in the center of the bottom of the magazine 1, and a plurality of second positioning holes 102 are further formed in the bottom of the magazine around the first positioning hole.
In this embodiment, the second positioning hole 102 is used for cooperating with a positioning block to roughly position the cassette. The first positioning hole 101 is used to cooperate with cassette holding unit 4 to finely position the cassette 1. After coarse positioning and fine positioning, the sheet box 1 is arranged on the base unit 2.
Referring to fig. 6 and 7, the base unit includes a partition plate 6, a feeding table 10 and a supporting frame, the feeding table 10 is disposed on the top of the supporting frame, and the supporting frame is used for bearing the feeding table 10. The partition plate 6 is provided with a front face and a back face which are opposite to each other, a window is arranged at the upper part of the partition plate, and the lower part of the front face is fixedly connected with the feeding table 10 and the supporting frame.
In this embodiment, the support frame links firmly baffle 6 to including left side support plate 7, right side support plate 8 and bottom plate 9, bottom plate 9 set firmly in the bottom of baffle 6, left side support plate 7 reaches right side support plate 8 is relative and divide and locate the both sides of bottom plate 9, and all link firmly baffle 6, material loading platform 10 is relative bottom plate 9 is located on the left side support plate 7 and on the right side support plate 8.
The upper decorative cover 11 and the lower decorative cover 12 are fixedly connected to the mounting substrate 6. The wafer transmission system is provided with a left-right adjusting mechanism 13 and/or a front-back adjusting mechanism 14. The left-right adjustment mechanism 13 and the front-rear adjustment mechanism 14 are the mounting standards of the loading device.
Specifically, when the loading device is installed in the wafer transmission system, the left-right adjusting mechanism 13 and/or the front-back adjusting mechanism 14 needs to be installed and fixed in the wafer transmission system, and then the loading device is installed on the left-right adjusting mechanism 13 and/or the front-back adjusting mechanism 14.
The left and right adjusting mechanism 13 not only has the function of bearing the feeding device, but also can adjust the levelness of the feeding platform 10. The front-back adjusting mechanism 14 is fixedly connected to the feeding device through a screw (not shown), and the front-back direction of the feeding table 10 is adjusted by adjusting the extension length of the screw.
The base unit can also be provided with a substrate detection sensor 15, and the substrate detection sensor 15 is fixedly connected with the side plate 6.
In this embodiment, the substrate detection sensor 15 is fixed to the top of the window, and detects the position error of each substrate 100 with respect to the card slot. The substrate detection sensor 15 is not limited to a correlation sensor, and may be a reflection sensor or other sensor that can perform this function.
As shown in fig. 8, a mounting hole is formed in the center of the feeding table 10, and the cassette clamping unit 4 is correspondingly disposed in the mounting hole. In this embodiment, the size and shape of the mounting hole may be determined according to the size of the cassette holding unit 4, and is not limited herein.
The tablet box clamping unit 4 is arranged on the feeding table 10, in the embodiment, the positioning block is used for roughly positioning the tablet box 1, and then the tablet box clamping unit 4 clamps the tablet box 1 to be precisely aligned to the tablet box 1, so that the alignment precision of the tablet box 1 is improved, and the tablet breaking is avoided.
The feeding table 10 is provided with a film box detection sensor 16 and a plurality of positioning blocks 17 corresponding to second positioning holes in the bottom of the film box 1.
The locating piece card is located the second locating hole, the magazine 1 is arranged in on the material loading platform 10, the magazine detects sensor 16 detects the magazine position error of magazine 1 relative to material loading platform 10.
As shown in fig. 8, the cassette detection sensor 16 is fixed to the loading table 10 in a first preset layout to detect whether the position state of the cassette 1 is correct. The positioning block 17 is fixed on the feeding table 10 according to a second preset layout, and when the film box 1 is fed, the positioning block 17 is embedded in the second positioning hole, so that the film box 1 is roughly positioned.
The film box clamping unit 4 can further comprise a mounting seat, the mounting seat is arranged in the mounting hole and is detachably connected with the feeding table 10.
Referring to fig. 9 and 10, the cassette holding unit 4 includes a first cylinder 28 and a plurality of holding jaws 29. The first cylinder 28 is detachably connected to the mounting base, and the mounting base includes a first connecting plate 26 and a second connecting plate 27.
The top end of the first connecting plate 26 is fixedly connected with the feeding table 10, the bottom end of the first connecting plate is fixedly connected with the second connecting plate 27, the first air cylinder 28 is fixedly arranged on the second connecting plate 27 and fixedly arranged in the mounting hole through the first connecting plate 26 and the second connecting plate 27, and the taking and the placing are convenient.
Each clamping jaw 29 is arranged on the first cylinder 28, the first cylinder 28 is fixedly arranged in the mounting hole, and drives each clamping jaw 29 to expand outwards from the hole center of the mounting hole so as to tension the film box 1 and retract so as to loosen the film box 1.
In this embodiment, the first connecting plate 26 is fixedly connected to the second connecting plate 27 through a screw, and the first cylinder 28 is fixedly connected to the first connecting plate 26 through a screw.
The clamping jaws 29 are uniformly distributed along the circumferential direction of the first cylinder 28, and the number of the clamping jaws is more than or equal to 3.
3 clamping jaws 29 are fixedly connected with the first air cylinder 28 through screws, and the first air cylinder 28 pushes the clamping jaws 29 to move back and forth along the radial direction of the mounting hole from the hole center of the mounting hole.
The mode of fixing the wafer box by the wafer box clamping unit 4 is not limited to the mode of tensioning by the pneumatic claw cylinder, and other modes such as cylinder clamping and pressing with similar functions can be adopted.
In this embodiment, first connecting plate 26 links firmly material loading platform 10 through the screw, and then realizes the fixed connection of spool box clamping unit 4 and base unit 2. When the film box 1 is placed on the feeding device, the clamping jaw 29 of the film box clamping unit 4 is in a closed state and can stretch into the first positioning hole 101 of the film box 1, when the film box 1 needs to be clamped and fixed, the clamping jaw 29 of the film box clamping unit 4 is in an open state through air circuit control, and then the film box is fastened and fixed through expansion of the film box 1, and the purpose of strictly controlling the precision of the feeding position is achieved.
As shown in fig. 11, the housing unit 3 includes a housing 22, the housing 22 movably covers the feeding table 10 and has a side opening opposite to the window, and the housing unit 3 further includes a left vertical beam plate 18, a right vertical beam plate 19, a cross beam 20, and a torque hinge 21. After the sheet box is fed, the outer cover unit 3 achieves the purpose of isolating the external environment.
The cross beam 20 is fixedly arranged at the top end of the partition board. The left vertical beam plate 18 and the right vertical beam plate 19 are opposite and respectively arranged at two sides of the cross beam 20 and are fixedly connected with the partition plate 6.
The left side vertical beam plate 18, the right side vertical beam plate 19, and the cross beam 20 constitute a main body frame of the enclosure unit 3.
In this embodiment, the outer cover unit 3 includes a cover body 22 and an outer cover reinforcing rib 23, the outer cover reinforcing rib 23 is disposed at the bottom end of the cover body 22, the cover body 22 is fixed on the outer cover reinforcing rib 23 by screws, and the cover body 22 is not easily deformed in the switching process between the open state and the closed state.
The torque hinge 21 is fixedly connected with the cross beam 20 and the cover 22, and has a rotating shaft parallel to the cross beam 20, the torque hinge 21 is fixedly connected with the cross beam 20 and the cover 22 through a screw (not shown),
the cover body 22 covers the feeding table 10 around the rotating shaft.
The handle 25 is fixedly connected with the cover 22 through a screw, and an operator switches the opening state and the closing state of the cover 22 through the handle 25.
The housing unit 3 further includes at least one hovering component, the hovering component is disposed on the left side and/or the right side of the cover 22, and when the cover 22 moves to a preset height around the rotating shaft, the hovering component hovers the cover 22.
In this embodiment, the hovering assembly includes a nitrogen spring 24, one end of the nitrogen spring 24 is hinged to the left vertical beam plate 18 or the right vertical beam plate 19, and the other end is fixedly connected to the cover 22.
The fixed ends of the two nitrogen springs 24 are fixedly connected with the left vertical beam plate 18 and the right vertical beam plate 19 respectively through screws (not shown), the moving ends are fixedly connected with the cover 22 through screws, and when the cover 22 is in an open state, the cover 22 can hover under the action of the nitrogen springs 21 and cannot fall off due to self weight.
The part of the outer cover unit of the feeding device, which realizes the suspension of the cover body at any position, is not limited to a nitrogen spring, and can also be other mechanisms such as a ratchet wheel with similar functions.
As shown in fig. 12, the lift gate unit includes a cover plate 34, and the cover plate 34 corresponds to the window and is movably disposed on the back of the partition plate.
A second cylinder 30 is fixedly attached to the side plate and drives the cover plate 34 to rise to close the window and fall to open the window.
In this embodiment, the second cylinder 30 includes a rodless cylinder, the movable end of the rodless cylinder is fixedly connected to the cylinder connecting plate 31, and the cylinder connecting plate 31 is fixedly connected to the cover plate 34 through the side connecting plate 32 and the transverse plate 33, so as to realize the fixed connection between the lift gate unit 5 and the base unit 2.
The cover 22 is opened to expose the loading platform 10, the cover plate 34 is closed to close the window, and the cassette 1 contains a plurality of substrates 100 and is placed on the loading platform 10. The cover 22 is closed to cover the cassette 1 and the cover 34 is open to open the window through which each substrate 100 is transferred into the wafer transport system.
In this embodiment, when the film box 1 is loaded, the outer cover unit 3 is in an open state, the lifting door unit 5 is lifted up the cover plate 34 to close the window, so that the isolation of the internal and external environments of the wafer transmission system is realized, and thus, the internal high-cleanliness environment of the wafer transmission system is well protected from being influenced by the external low-cleanliness environment in the loading process.
After the material loading of spool box 1 ended, dustcoat unit 3 was in the closed condition this moment, and overhead door unit 5 descends apron 34 is in order to open the window has realized the isolation of wafer transmission system internal and external environment once more, from this, in material loading and unloading process, makes the spool box all is in the high cleanliness degree environment, and has protected the inside high cleanliness degree environment of equipment well.
The second cylinder 30 is not limited to a rodless cylinder, and may be an electric cylinder, a servo-screw, or other mechanism having a similar function.
The application industry of the feeding device of the invention is not limited to the integrated circuit industry, and the feeding device can also be applied to other industries of semi-conductors, such as flat panel display, LED, solar battery and other industries.
Through setting up spool box centre gripping unit, realize the accurate positioning of spool box, simultaneously, the dustcoat unit is used for holding and establishes the spool box to keep apart interior external environment, avoid cross contamination, in addition, still through setting up substrate detection sensor, carry out position detection to the substrate in the spool box. The feeding device has strong compatibility, convenient adjustment and wide application range, can be applied to the IC industry and can also be applied to other general semiconductor industries such as LED and the like.
The above description is only for the preferred embodiment of the present invention, and the embodiment is not intended to limit the scope of the present invention, so that all the equivalent structural changes made by using the contents of the description and the drawings of the present invention should be included in the scope of the present invention.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A loading device of a wafer transmission system is characterized by comprising:
the base unit comprises a partition plate, a feeding table and a support frame, the feeding table is arranged at the top of the support frame, the partition plate is provided with a front surface and a back surface which are opposite, a window is arranged at the upper part of the partition plate, and the front surface is fixedly connected with the feeding table and the support frame;
the outer cover unit comprises a cover body, the cover body is movably covered on the feeding table and is provided with a side opening opposite to the window;
the lifting door unit comprises a cover plate, and the cover plate corresponds to the window and is movably arranged on the back of the partition plate; wherein the content of the first and second substances,
the cover body is in an open state to expose the feeding table, the cover plate seals the window, and the sheet box is provided with a plurality of substrates and is placed on the feeding table; and a process for the preparation of a coating,
the cover body is in a closed state to cover the wafer box, the cover plate opens the window, and the substrates pass through the window and are conveyed into the wafer conveying system.
2. The loading device as claimed in claim 1, wherein the supporting frame comprises a bottom plate, a left supporting plate and a right supporting plate, the bottom plate is fixedly arranged at the bottom end of the partition plate, the left supporting plate and the right supporting plate are arranged at two opposite sides of the bottom plate respectively and fixedly connected with the partition plate, and the loading platform is arranged on the left supporting plate and the right supporting plate relative to the bottom plate.
3. The loading device according to claim 1, wherein a first positioning hole is formed in the center of the bottom of the wafer box, a mounting hole corresponding to the first positioning hole is formed in the loading platform, and the loading device further comprises a wafer box clamping unit which comprises a first air cylinder and a plurality of clamping jaws; wherein, the first and the second end of the pipe are connected with each other,
each the clamping jaw is arranged on the first cylinder, the first cylinder is fixedly arranged in the mounting hole and drives each clamping jaw to expand outwards from the hole center of the mounting hole so as to tension the film box and retract so as to loosen the film box.
4. The feeding device according to claim 3, wherein the clamping jaws are uniformly distributed along the circumferential direction of the first cylinder, and the number of the clamping jaws is greater than or equal to 3.
5. The loading device according to claim 3, wherein the cassette holding unit further comprises a mounting seat, the mounting seat is disposed in the mounting hole and detachably connected to the loading platform, and the first cylinder is detachably connected to the mounting seat.
6. The loading device according to claim 1, wherein the outer cover unit further comprises a left vertical beam plate, a right vertical beam plate, a cross beam and a torque hinge, the cross beam is fixedly arranged at the top end of the partition plate, the left vertical beam plate and the right vertical beam plate are opposite and respectively arranged at two sides of the cross beam and are fixedly connected with the partition plate, and the torque hinge is fixedly connected with the cross beam and the cover body and is provided with a rotating shaft parallel to the cross beam; wherein the content of the first and second substances,
the cover body covers the feeding table around the rotating shaft movable cover.
7. The loading device according to claim 6, wherein the housing unit further comprises at least one hovering component, the hovering component is disposed at the left side and/or the right side of the housing, and when the housing moves to a preset height around the rotating shaft, the hovering component hovers the housing.
8. The loading device of claim 7, wherein the hovering assembly comprises a nitrogen spring, one end of the nitrogen spring is hinged to the left vertical beam plate or the right vertical beam plate, and the other end of the nitrogen spring is fixedly connected with the cover body.
9. The loading device according to claim 1, wherein said magazine is provided with a plurality of slots from bottom to top, said substrate is disposed in said magazine corresponding to said slots, said base unit further comprises a substrate detection sensor, said substrate detection sensor is fixedly connected to said side plate, and detects a substrate position error of each said substrate with respect to said slot.
10. The loading device according to claim 1, wherein, around the first positioning hole, the bottom of the cassette is further provided with a plurality of second positioning holes, and the loading platform is provided with at least one cassette detection sensor and a plurality of positioning blocks corresponding to the second positioning holes; wherein the content of the first and second substances,
the warp the locating piece card is located the second locating hole, the film cassette is arranged in the material loading bench, film cassette test sensor detects the film cassette for the film cassette position error of material loading bench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210134672.6A CN114551311A (en) | 2022-02-14 | 2022-02-14 | Loading device of wafer transmission system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210134672.6A CN114551311A (en) | 2022-02-14 | 2022-02-14 | Loading device of wafer transmission system |
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| CN114551311A true CN114551311A (en) | 2022-05-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210134672.6A Pending CN114551311A (en) | 2022-02-14 | 2022-02-14 | Loading device of wafer transmission system |
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| JP2005209986A (en) * | 2004-01-26 | 2005-08-04 | Tdk Corp | Pod clamp unit of pod opener, pod clamp mechanism employing pod clamp unit and clamping method |
| JP2015050410A (en) * | 2013-09-04 | 2015-03-16 | ローツェ株式会社 | Load port for detecting a plurality of kinds of semiconductor wafers |
| CN209087796U (en) * | 2018-12-29 | 2019-07-09 | 深圳中科飞测科技有限公司 | A kind of detection device and wafer cassette loading attachment |
| CN211687330U (en) * | 2019-12-19 | 2020-10-16 | 思维自动化设备（天津）有限公司 | Anti-drop type sucking disc grabbing device convenient to adjust |
| CN214692137U (en) * | 2021-05-12 | 2021-11-12 | 北京锐洁机器人科技有限公司 | Loading platform |
| CN218101206U (en) * | 2022-02-14 | 2022-12-20 | 上海广川科技有限公司 | Loading device of wafer transmission system |
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2022
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|---|---|---|---|---|
| JP2005209986A (en) * | 2004-01-26 | 2005-08-04 | Tdk Corp | Pod clamp unit of pod opener, pod clamp mechanism employing pod clamp unit and clamping method |
| JP2015050410A (en) * | 2013-09-04 | 2015-03-16 | ローツェ株式会社 | Load port for detecting a plurality of kinds of semiconductor wafers |
| CN209087796U (en) * | 2018-12-29 | 2019-07-09 | 深圳中科飞测科技有限公司 | A kind of detection device and wafer cassette loading attachment |
| CN211687330U (en) * | 2019-12-19 | 2020-10-16 | 思维自动化设备（天津）有限公司 | Anti-drop type sucking disc grabbing device convenient to adjust |
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