CN219610395U - Wafer detects transportation bracket - Google Patents

Abstract

The utility model relates to a wafer detection transportation bracket which comprises a bottom plate, U-shaped supporting teeth on two sides above the bottom plate, bottom supporting teeth arranged in the middle above the bottom plate, a wafer clamping space formed between the U-shaped supporting teeth on two sides and above the bottom supporting teeth together, and a sensor at least arranged on one side of the U-shaped supporting teeth, which is far away from the bottom supporting teeth, for detecting a wafer in the wafer clamping space, wherein the U-shaped supporting teeth comprise first supporting teeth and second supporting teeth which are arranged at intervals along the same gradient direction, the first supporting teeth and the second supporting teeth are provided with arc-shaped supporting grooves which are arranged with the same circle center corresponding to the same wafer, the height of the first supporting teeth is higher than that of the second supporting teeth, the sensing area of the sensor is higher than that of the wafer clamping position corresponding to the arc-shaped supporting grooves, and an overlapping area is formed between the sensing area of the sensor and the wafer when the wafer is clamped so as to realize wafer detection. The utility model realizes real-time detection of the wafer state in the wafer transportation process, can realize the integration of the semiconductor wet equipment process, reduces the takt time and improves the throughput.

Description

Wafer detects transportation bracket

Technical Field

The utility model relates to the field of semiconductor equipment, in particular to a wafer detection transportation bracket.

Background

In the semiconductor industry, wafers require transport carriers in the process flow, i.e., wafer transport carriers, which are used to place or transport one or more wafers in a wafer carrier. At present, in the transmission process, the wafers need to be counted when the carrier loads the wafers into a loading area of process equipment, and the existing detection and counting modes are to fix a sensor on the end face of the wafer carrier or on a framework beam of the equipment, and the wafers are counted and detected once in situ and cannot be monitored in real time. If the wafer falls off or breaks in the process of transmission or picking and placing, the equipment cannot find that the wafer can only be detected and found after reaching the next working procedure, and the process flow is tedious and the takt time is long. In addition, if the carrier structure does not firmly hold the wafer, the wafer is prone to tilting. In the moving process, due to external force impact, the wafer on the carrier can easily deviate or fall off, when the wafer is inclined and misplaced, the wafer can be impacted to be damaged or fall off when the wafer is taken, the moving speed and the taking and placing speed of the starting end of the robot are reduced to reduce the impact, the effect of relieving can be achieved, and the problems of damage and falling off can not be fundamentally solved.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a wafer detection and transportation bracket which is used for detecting and counting wafers in real time while transporting the wafers.

The technical purpose of the utility model is realized by the following technical scheme:

the wafer detection and transportation bracket is characterized by comprising a bottom plate, U-shaped supporting teeth arranged on two sides above the bottom plate, a bottom supporting tooth arranged in the middle above the bottom plate, a wafer clamping space formed between the U-shaped supporting teeth on two sides and above the bottom supporting teeth together, and a sensor arranged on at least one side of the U-shaped supporting teeth, which is away from the bottom supporting teeth, for detecting wafers in the wafer clamping space,

the U-shaped support teeth comprise first support teeth and second support teeth which are arranged along the same gradient direction at intervals, the first support teeth and the second support teeth are provided with arc support grooves which are arranged at the same center corresponding to the same wafer, the height of the first support teeth is higher than that of the second support teeth, the sensing area of the sensor is higher than the wafer clamping position of the first support teeth corresponding to the arc support grooves, and an overlapping area is formed between the first support teeth and the wafer when the wafer is clamped, so that the wafer detection is realized.

Further, a U-shaped groove is formed between the first supporting tooth and the second supporting tooth of the same U-shaped supporting tooth, the groove bottom of the arc-shaped supporting groove of the first supporting tooth is higher than one side of the U-shaped groove, and the groove bottom of the arc-shaped supporting groove of the second supporting tooth is higher than the other side of the U-shaped groove; when the wafer is placed in the arc-shaped bracket, a gap is formed between the edge of the wafer and the bottom of the U-shaped groove.

Further, the upper end surfaces of the first support teeth and the second support teeth are arc-shaped, the arc radius of the upper end surfaces of the first support teeth and the second support teeth is smaller than the radius of the wafer, and the arc radius of the arc support groove is larger than the radius of the wafer.

Further, the upper end of the bottom support tooth is provided with a plurality of tooth grooves which are distributed in an equidistant and linear mode, the tooth grooves correspond to the wafers one by one, and the tooth grooves are supported in the middle of the bottoms of the wafers.

Further, the two sides, close to the bottom plate, of the upper end face of the bottom plate are respectively provided with a first mounting groove for mounting U-shaped supporting teeth, and the U-shaped supporting teeth are mounted in the first mounting grooves; the upper end of bottom plate still is equipped with the second mounting groove that is used for the bottom to hold in the palm the tooth installation in the middle of two first mounting grooves, and the bottom holds in the palm the tooth and installs in the second mounting groove.

Further, a limiting step for positioning the U-shaped support teeth is further arranged on one side of the lower end of the U-shaped support teeth.

Further, a sensor fixing plate used for mounting a sensor is further arranged on one side, close to the edge of the bottom plate, of the U-shaped support teeth, and the sensor is mounted and fixed on the fixing plate.

Further, the sensor comprises a photoelectric sensor.

Further, the sensors are arranged at two sides of the wafer clamping space, and the sensors at two sides of the wafer clamping space are alternately arranged.

Further, a notch is arranged at the upper end of the sensor fixing plate and corresponds to the position between the sensor signal transmitting end and the signal receiving end, and the signal transmitting end and the signal receiving end of the same sensor are respectively positioned at two sides of the notch; the bottom of the notch is not contacted with the edge of the wafer.

Further, the distance between the first and second carrier teeth is greater than 20mm.

Further, the width of the first supporting teeth is larger than the width of the second supporting teeth.

Further, the width of the first supporting teeth comprises 5-6mm, and the width of the second supporting teeth comprises 4.5-5 mm.

Compared with the prior art, the utility model has the beneficial effects that:

1. the U-shaped supporting teeth provided by the utility model have good four-point type supporting on the wafer in the transportation process, so that the stability of placing the wafer is improved, and the wafer is prevented from toppling over and collision in the transportation process;

2. the U-shaped supporting teeth of the utility model reduce the contact area between the U-shaped supporting teeth and the wafer on the basis of stably supporting the wafer, and reduce the risk of pollution caused by contact with the wafer.

3. The wafer detection counting and transportation in the existing wet method equipment are two different processes, and the wafer state is detected in real time in the wafer transportation process through the wafer detection transportation bracket, so that the process of integrating the semiconductor wet method equipment can be realized, the takt time is reduced, and the throughput is improved.

Drawings

FIG. 1 is a schematic view of a wafer inspection transport carrier holding a wafer in accordance with the present utility model.

Fig. 2 is an exploded view of the wafer inspection transport carrier assembly of the present utility model.

Fig. 3 is a schematic view of a U-shaped tooth support structure in the present utility model.

FIG. 4 is a schematic view of a U-shaped carrier tooth according to the present utility model.

Fig. 5 is an enlarged view at a in fig. 1.

Fig. 6 is a schematic view of a bottom bracket structure.

FIG. 7 is a schematic diagram of a U-shaped photoelectric switch according to the present utility model

FIG. 8 is a schematic view of the sensors of the present utility model distributed on both sides of a base plate.

FIG. 9 is a schematic view of the sensor mounting plate of the present utility model.

Fig. 10 is a schematic view of the sensor installation in the present utility model.

In the figure, 1, a wafer; 2. a sensor; 3. a fixing plate; 4. u-shaped supporting teeth; 5. bottom support teeth; 6. a bottom plate; 7. a communication module; 8. a first carrier tooth; 9. the second support teeth; 10. arc-shaped bracket; 11. arc-shaped bracket; 12. a U-shaped groove; 13. a first mounting groove; 14. a second mounting groove; 15. a limit step; 16. tooth slots; 17. a notch; 18. a signal transmitting terminal; 19. a signal receiving end; 20. a protrusion; 21. and (5) mounting holes.

Detailed Description

The technical scheme of the utility model is further described below with reference to the specific embodiments:

the wafer detection transportation bracket, as shown in figures 1 and 2, comprises a bottom plate 6, U-shaped supporting teeth 4 arranged on two sides above the bottom plate 6, and bottom supporting teeth 5 arranged in the middle above the bottom plate 6; a wafer clamping space is formed between the U-shaped supporting teeth 4 at the two sides and above the bottom supporting teeth 5 in the middle; the wafer clamping space is provided with a sensor 2 for detecting the wafer, the sensor 2 is a photoelectric sensor, the sensor 2 corresponds to the wafer in the wafer clamping space one by one, the sensor 2 comprises a signal transmitting end and a signal receiving end, the signal transmitting end and the signal receiving end are respectively arranged at two sides of the wafer 1 in the wafer clamping space, the signal transmitting end transmits signals to the corresponding signal receiving end, and the signal receiving end receives signals transmitted by the corresponding signal transmitting end; the sensor 2 is connected with a communication module 7 for processing and transmitting sensor signals.

As shown in fig. 2, two sides of the upper end surface of the bottom plate 6, which are close to the bottom plate, are respectively provided with a first mounting groove 13 for mounting the U-shaped supporting teeth, the bottom of the U-shaped supporting teeth 4 is inserted into the first mounting groove 13, and the U-shaped supporting teeth 4 and the bottom plate 6 are connected and fixed by screws corresponding to the bottom of the first mounting groove 13; the upper end of the bottom plate 6 is further provided with a second mounting groove 14 for mounting the bottom support teeth 5 in the middle of the two first mounting grooves, the lower ends of the bottom support teeth 5 are inserted into the second mounting grooves 14, and the bottom corresponding to the second mounting grooves 14 is used for connecting and fixing the bottom support teeth 5 with the bottom plate 6 through screws.

Preferably, the lower end side of the U-shaped supporting tooth 4 is further provided with a limiting step 15 for positioning the U-shaped supporting tooth 4, when the U-shaped supporting tooth 4 is installed in the first installation groove 13, the limiting step 15 is attached to the notch edge of one side of the first installation groove 13, so that on one hand, the U-shaped supporting tooth 4 can be positioned, and in addition, the side surface of the U-shaped supporting tooth 4 is flush with the side surface of the bottom plate 6, as shown in fig. 1.

Specifically, as shown in fig. 3, the U-shaped supporting teeth 4 include a first supporting tooth 8 and a second supporting tooth 9, the first supporting tooth 8 and the second supporting tooth 9 are provided with arc supporting grooves 10 and arc supporting grooves 11 which are arranged concentrically corresponding to the same wafer, and the arc supporting grooves 10 of the first supporting tooth 8 and the arc supporting grooves 11 of the second supporting tooth 9 are in one-to-one correspondence; the first carrier tooth 8 has a height which is higher than the height of the second carrier tooth 9. Preferably, as shown in fig. 4, the upper end surfaces of the first supporting teeth 8 and the second supporting teeth 9 are also arc-shaped, the radius R1 of the arc of the upper end surfaces of the first supporting teeth 8 and the second supporting teeth 9 is smaller than the radius of the wafer, the radius R2 of the arc supporting grooves 10 and 11 is larger than the radius of the wafer, the wafer is ensured to be clamped in the arc supporting grooves 10 and 11, and in addition, the U-shaped supporting teeth can be conveniently processed.

Preferably, the distance between the first supporting teeth 8 and the second supporting teeth 9 is at least 20mm, and the larger the distance is, the more uniformly distributed the supporting points for clamping the wafer are; the width D1 of the first supporting teeth 8 is greater than the width D2 of the second supporting teeth 9, in this embodiment, the width D1 of the first supporting teeth 8 is 5mm-6mm, and the width D2 of the second supporting teeth 9 is 4.5mm-5mm, as shown in fig. 4, the smaller the width is, the better the clamping effect is maintained.

In order to reduce the contact with the wafer, a U-shaped groove 12 is arranged between the first supporting tooth 8 and the second supporting tooth 9 of the same U-shaped supporting tooth 4, the groove bottom of the arc-shaped supporting groove 10 of the first supporting tooth 8 is higher than one side of the U-shaped groove 12, the groove bottom of the arc-shaped supporting groove 11 of the second supporting tooth 9 is higher than the other side of the U-shaped groove 12, and a gap is formed between the edge of the wafer and the groove bottom of the U-shaped groove 12 when the wafer 1 is placed in the arc-shaped supporting groove 10 and the arc-shaped supporting groove 11, as shown in fig. 5. Each U-shaped support tooth 4 and the wafer form a two-point support through the arc support groove 10 of the first support tooth and the arc support groove 11 of the second support tooth, so that ineffective clamping of the wafer can be reduced, contact with the wafer is reduced, and residual pollution of water stains on the surface of the wafer is reduced;

the upper end of the bottom support tooth 5 is provided with a plurality of tooth grooves 16 which are distributed in an equidistant straight line, as shown in fig. 6, the tooth grooves 16 correspond to the wafers one by one, and the tooth grooves 16 are supported in the middle of the bottom of the wafer 1, so that the wafer 1 can be prevented from swinging back and forth; the tooth grooves 16 are matched with the U-shaped supporting teeth 4 on two sides of the bottom plate to form five-point type supporting for the wafer, so that the stability of the wafer is ensured, and the wafer is prevented from toppling in the transportation process.

The sensors 2 can be arranged on one side of the clamping space and can also be arranged on two sides of the clamping space, and as the wafers 1 are finally placed in parallel at equal intervals, the corresponding sensors 2 are also arranged at equal intervals, and the distance between the sensors is required to be relatively tight on one side of the clamping space; the sensors are arranged on two sides of the clamping space, so that the sensors 2 on two sides of the clamping space can be alternately arranged, in the embodiment, the sensors are U-shaped photoelectric switches, the U-shaped photoelectric switches are infrared sensing photoelectric products, as shown in fig. 7, the U-shaped photoelectric switches are formed by combining infrared transmitting tubes (signal transmitting ends) and infrared receiving tubes (signal receiving ends), the groove width (the distance between the infrared transmitting tubes and the infrared receiving tubes) of the U-shaped photoelectric switches determines the strength of sensing received signals and the distance between the U-shaped photoelectric switches and receives and converts infrared light between a luminous body and a light receiving body by taking light as a medium, and the positions of objects are detected. For example, in the wafer inspection transport carrier of this embodiment, 25 wafers may be placed, so 25 sensors are required, and if 25 sensors are disposed on one side of the wafer clamping space, the distance between the sensors will be relatively small; the sensors are alternately arranged on two sides of the wafer clamping space, 12U-shaped photoelectric switches are arranged on the fixed plate 3 on one side of the bottom plate in the embodiment, 13U-shaped photoelectric switches are arranged on the fixed plate 3 on the other side of the bottom plate, as shown in fig. 8, the distance between the two sensors on the same side of the wafer clamping space can be properly increased, the interference between the sensors 2 is reduced, and the installation is convenient.

As shown in fig. 1 and 9, on the U-shaped supporting teeth 4 on both sides, a fixing plate 3 for sensor installation is further installed, the fixing plate 3 is installed on one side of the U-shaped supporting teeth 4 near the edge of the bottom plate, and the fixing plate 3 is fixed on the side surface of the U-shaped supporting teeth 4 by screws. The upper end of the fixed plate 3 is also provided with a plurality of notches 17, the notches 17 correspond to the mounting positions of the wafers, and after the sensor 2 is fixed on the fixed plate 3, the signal transmitting end 18 and the signal receiving end 19 of the sensor 2 are positioned at two sides of the notches 17; to avoid interfering with the inspection, the bottom of the notch 17 is not in contact with the edge of the wafer 1. Preferably, the width of the slot 17 is greater than 2mm.

As a preferred scheme, the two sides of the notch 17 are respectively provided with a bulge 20, the bulge 20 is provided with a mounting hole 21 for fixing the U-shaped switch, namely, the mounting holes 21 are arranged at two sides of the notch 17, and the U-shaped switch is mounted by penetrating screws through the mounting holes 21 at two sides of the notch 17, as shown in fig. 10; the bottom of the groove of the U-shaped switch is equal to the height of the upper end of the protrusion 20, and the bottom of the groove of the U-shaped switch is flush with the upper end surface of the protrusion 20 during installation, so that whether deviation exists in the installation position of the U-shaped switch can be determined and checked; the height of the groove bottom of the notch 17 is lower than the highest height of the arc-shaped bracket 10 of the first bracket tooth 8, and the heights of the signal transmitting end 18 and the signal receiving end 19 of the U-shaped switch are higher than the heights of the edges of the wafer 1 corresponding to the vertical upper part of the U-shaped switch, so that the wafer can fall into the detection range of the signal transmitting end 18 and the signal receiving end 19 under the condition of not missing, namely, the wafer can be in the induction zone of the sensor.

Working principle:

after the wafer is placed in the wafer clamping space by the manipulator, the wafer is clamped by the U-shaped supporting teeth and the bottom supporting teeth, the wafer is inserted between the signal transmitting end and the signal receiving end of the corresponding sensor, and if the wafer is inserted between the signal transmitting end and the signal receiving end of the sensor, the signal receiving end cannot receive signals sent by the signal transmitting end; if the wafer between the signal transmitting end and the signal receiving end is not inserted, the wafer falls off and the wafer breaks, the signal receiving end can receive the signal sent by the signal transmitting end, and the wafer at the position corresponding to the sensor is abnormal; the sensor transmits the detection signals to the communication module, the communication module calculates and processes the detection signals of all the sensors, and the communication module transmits the calculation and processing result to the system end, so that real-time detection and counting of the wafer are realized.

The present embodiment is further illustrative of the present utility model and is not to be construed as limiting the utility model, and those skilled in the art can make no inventive modifications to the present embodiment as required after reading the present specification, but only as long as they are within the scope of the claims of the present utility model.

Claims (13)

1. The utility model provides a wafer detects transportation bracket, its characterized in that includes the bottom plate, installs the U type that holds in the palm the tooth in bottom plate top both sides, installs the bottom hold in the palm the tooth in bottom in the middle part of the bottom plate top, both sides the U type hold in the palm between the tooth and the top that holds in the palm the tooth together form wafer clamping space, and set up at least in the U type hold in the palm the tooth and deviate from the one side that holds in the palm the tooth in bottom and be used for detecting the wafer in the wafer clamping space the sensor, wherein, the U type holds in the palm the tooth including first hold in the palm tooth and the second that set up along same gradient direction interval holds in the tooth, first hold in the palm tooth and the second hold in the palm the tooth and be equipped with the arc support groove that the concentric setting corresponding to same wafer, the height that highly is higher than the second held in the tooth is held in the palm the first hold in the palm the tooth in the palm the height, the sensor the sensing area place highly be higher than the first hold in the wafer clamping position that holds in the tooth corresponds the arc support groove, and have the overlapping region with the wafer when holding the wafer to realize the wafer and detect.

2. The wafer inspection transport carrier of claim 1, wherein a U-shaped groove is provided between the first and second carrier teeth of the same U-shaped carrier tooth, the groove bottom of the arc-shaped carrier groove of the first carrier tooth is higher than one side of the U-shaped groove, and the groove bottom of the arc-shaped carrier groove of the second carrier tooth is higher than the other side of the U-shaped groove; when the wafer is placed in the arc-shaped bracket, a gap is formed between the edge of the wafer and the bottom of the U-shaped groove.

3. The wafer inspection carrier of claim 1, wherein the upper end surfaces of the first and second support teeth are arcuate, the radius of the arc of the upper end surfaces of the first and second support teeth is less than the radius of the wafer, and the radius of the arc of the arcuate support slot is greater than the radius of the wafer.

4. The wafer inspection transport carrier of claim 1, wherein the upper end of the bottom carrier tooth has a plurality of equally spaced, linearly disposed tooth slots, the tooth slots being in one-to-one correspondence with the wafer, the tooth slots being supported in the middle of the bottom of the wafer.

5. The wafer inspection transport bracket according to claim 1, wherein the two sides of the upper end surface of the bottom plate, which are close to the bottom plate, are respectively provided with a first mounting groove for mounting a U-shaped supporting tooth, and the U-shaped supporting tooth is mounted in the first mounting groove; the upper end of bottom plate still is equipped with the second mounting groove that is used for the bottom to hold in the palm the tooth installation in the middle of two first mounting grooves, and the bottom holds in the palm the tooth and installs in the second mounting groove.

6. The wafer inspection transport carrier of claim 1, wherein the lower end side of the U-shaped carrier tooth further includes a stop step for positioning the U-shaped carrier tooth.

7. The wafer inspection transport carrier of claim 1, wherein the U-shaped carrier tooth is further provided with a sensor mounting plate on a side of the edge of the base plate for mounting a sensor, the sensor being mounted and secured to the mounting plate.

8. A wafer inspection transport carrier in accordance with claim 1 wherein said sensor comprises a photoelectric sensor.

9. The wafer inspection transport carrier of claim 8, wherein the sensors are disposed on opposite sides of the wafer holding space and the sensors on opposite sides of the wafer holding space are alternately disposed.

10. The wafer inspection transportation bracket according to claim 9, wherein a notch is further formed at the upper end of the sensor fixing plate at a position corresponding to the position between the signal transmitting end and the signal receiving end of the sensor, and the signal transmitting end and the signal receiving end of the same sensor are respectively located at two sides of the notch;

the bottom of the notch is not contacted with the edge of the wafer.

11. The wafer inspection transport carrier of claim 1, wherein a distance between the first and second carrier teeth is greater than 20mm.

12. The wafer inspection transport carrier of claim 1, wherein the first carrier tooth has a width greater than a width of the second carrier tooth.

13. A wafer inspection transport carrier in accordance with claim 12, wherein,

the width of the first supporting teeth comprises 5-6mm, and the width of the second supporting teeth comprises 4.5-5 mm.