CN113990749A - Polishing device for processing USB chip of data adapter - Google Patents
Polishing device for processing USB chip of data adapter Download PDFInfo
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- CN113990749A CN113990749A CN202111309508.6A CN202111309508A CN113990749A CN 113990749 A CN113990749 A CN 113990749A CN 202111309508 A CN202111309508 A CN 202111309508A CN 113990749 A CN113990749 A CN 113990749A
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- outlet hole
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- 238000005498 polishing Methods 0.000 title claims abstract description 105
- 239000007788 liquid Substances 0.000 claims abstract description 137
- 230000001965 increasing effect Effects 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000001105 regulatory effect Effects 0.000 claims 3
- 239000011550 stock solution Substances 0.000 claims 2
- 239000000463 material Substances 0.000 abstract description 43
- 230000009471 action Effects 0.000 abstract description 16
- 230000007246 mechanism Effects 0.000 abstract description 9
- 238000003754 machining Methods 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 2
- 238000005213 imbibition Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 230000005484 gravity Effects 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of machining, and discloses a polishing device for processing a USB chip of a data adapter. According to the invention, the hydraulic material ejecting mechanism is arranged, so that when the polishing disc rotates at a certain rotating speed and the polishing liquid in the middle of the polishing disc flows outwards under the action of centrifugal force, part of the polishing liquid flows into the liquid suction cavity through the annular liquid distribution groove, and under the action of gradually increasing pressure in the liquid suction cavity, the solution in the liquid suction cavity is discharged outwards through the liquid outlet hole, and upward thrust is applied to the material on the upper surface of the liquid outlet hole, so that the material drives the ejecting block to overcome the elastic force of the spring to move upwards for a certain distance, and the bottom surface of the material is always in a state of being in contact with the polishing liquid, thereby polishing the material.
Description
Technical Field
The invention relates to the technical field of machining, in particular to a polishing device for processing a USB chip of a data adapter.
Background
The USB is an external bus standard for standardizing the connection and communication between a computer and external devices, and is an interface technology applied in the field of PCs, and the main structure is an internal chip, and the chip usually needs to be polished for the subsequent processing of the chip when being manufactured.
The semiconductor polishing equipment comprises a chemical polishing machine and the like, the surface of the material is polished by chemical solution, and due to microscopic inconsistency of the surface of the part, microscopic convex parts on the surface are preferentially dissolved, and the dissolving rate is greater than that of concave parts; and the dissolution of the film and the formation of the film are always carried out simultaneously, but the speed is different, so that the surface roughness of the material is leveled, a smooth and bright surface is obtained, the polishing processing is finished, and no nick or grinding mark exists.
Chemical polishing machine is owing to polish the material through solution, make need carry out the centre gripping to the material through centre gripping equipment, so that the material can remain on the solution surface throughout, but traditional fixed centre gripping and magnetism inhale the method solution of centre gripping and cause the extrusion to the surface of material, make its phenomenon of taking place the harm, influence the processingquality of material, and because solution is through polishing dish rotation mode outdiffusion, make outside and inboard centrifugal force different, thereby lead to outside solution velocity of flow faster, and inboard solution velocity of flow is slower, make the polishing effect of material uneven, though can be through rotating the polishing for a long time in order to ensure polishing quality, but caused the energy waste, and influence machining efficiency.
Disclosure of Invention
Aiming at the defects of the existing chemical polishing machine in the use process in the background technology, the invention provides the polishing device for processing the USB chip of the data adapter, which has the advantages of hydraulic material ejection and inclined speed regulation and solves the technical problems that the chemical polishing machine is inconvenient to clamp materials and has different polishing efficiency at the inner side and the outer side during normal processing.
The invention provides the following technical scheme: the utility model provides a throw and grind device for handling data adapter USB chip, includes the organism, the middle part movable mounting of organism upper end has the polishing dish, and the middle part of polishing dish is the basin form, the middle part of polishing dish has been seted up and has been discoid minute liquid groove, one side movable mounting of polishing dish upper surface has the centre gripping dish, and the centre gripping dish is located the inclined plane of polishing dish, the kicking block has been cup jointed in the inner chamber activity of centre gripping dish, the upper surface of kicking block and the top surface of centre gripping dish inner chamber pass through spring swing joint, the imbibition chamber has been seted up to the inner chamber of polishing dish side, and imbibition chamber and minute liquid groove intercommunication, the inner chamber of polishing dish is seted up the play liquid hole with imbibition chamber and external intercommunication, it is located the inclined plane of organism to go out the liquid hole, the top fixed mounting at polishing dish middle part has the inlet tube.
Preferably, the upper end of the liquid outlet hole is inclined inwards, and the inclination amplitude is gradually increased inwards and outwards.
Preferably, the middle part of the liquid suction cavity is movably sleeved with a liquid pressing block, the upper surface of the machine body is fixedly connected with a fixing block located right below the clamping disc, the fixing block is located below the liquid pressing block, and two sides of the fixing block are inclined planes.
Preferably, the inner cavity of the polishing disc is movably sleeved with an adjusting block located in the middle of the liquid outlet hole, the opening diameter in the middle of the adjusting block is the same as the diameter of the liquid outlet hole, a liquid storage cavity located on the inner side of the adjusting block is formed in the inner cavity of the polishing disc, and evaporation liquid is filled in the liquid storage cavity.
Preferably, the number of the liquid suction cavities is four to six, and the liquid suction cavities are arranged at equal angles with the circle center of the polishing disk.
The invention has the following beneficial effects:
1. according to the invention, the hydraulic material ejecting mechanism is arranged, so that when the polishing disc rotates at a certain rotating speed and the polishing liquid in the middle of the polishing disc flows outwards under the action of centrifugal force, part of the polishing liquid flows into the liquid suction cavity through the annular liquid distribution groove, and under the action of gradually increasing pressure in the liquid suction cavity, the solution in the liquid suction cavity is discharged outwards through the liquid outlet hole, and upward thrust is applied to the material on the upper surface of the liquid outlet hole, so that the material drives the ejecting block to overcome the elastic force of the spring to move upwards for a certain distance, and the bottom surface of the material is always in a state of being in contact with the polishing liquid, thereby polishing the material.
2. The polishing disc comprises a polishing disc, a clamping disc, a liquid outlet hole, a liquid pushing mechanism, a liquid outlet hole and a liquid outlet hole, wherein the liquid outlet hole is arranged on the bottom surface of the clamping disc, the liquid outlet hole is arranged on the bottom surface of the liquid outlet hole, the liquid outlet hole is arranged on the bottom surface of the clamping disc, the bottom surface of the clamping disc is arranged on the bottom surface of the clamping disc, the clamping disc is arranged on the bottom surface of the clamping disc, the clamping disc is arranged on the bottom surface of the clamping disc, the bottom surface of the clamping disc, the bottom surface of the clamping disc, the bottom surface of the clamping disc, the bottom surface of the clamping disc is arranged on the bottom surface of the clamping disc, the bottom surface of the clamping disc, the bottom surface of the clamping disc, and the bottom surface of the clamping disc, and the clamping disc, the clamping.
3. According to the invention, the ejection enhancing mechanism is arranged, so that the polishing disc is far away from the clamping disc, the pressure liquid block in the inner cavity of the polishing disc can move downwards under the action of gravity, the volume of the liquid suction cavity is increased, more liquid can be sucked in the liquid suction cavity, and when the pressure liquid block rotates to the position above the fixed block, the pressure liquid block slowly moves upwards under the action of the inclined planes on the two sides of the fixed block, so that the polishing liquid in the liquid suction cavity is extruded, the discharge rate of the polishing liquid at the liquid outlet hole is further improved, the ejection capability of the hydraulic ejection mechanism is further enhanced, the polishing liquid can be discharged outwards only through one side provided with the clamping disc, and the consumption of the polishing liquid is saved.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention;
FIG. 2 is a schematic perspective view of a fixing block according to the present invention;
FIG. 3 is an enlarged view of the structure at A in FIG. 1 according to the present invention.
In the figure: 1. a body; 2. a polishing disk; 3. a clamping plate; 4. a top block; 5. a spring; 6. a liquid separating tank; 7. a liquid outlet hole; 8. an adjusting block; 9. a liquid storage cavity; 10. a liquid suction chamber; 11. a fixed block; 12. pressing the liquid block; 13. a liquid inlet pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 3, a polishing device for processing a USB chip of a data adapter comprises a body 1, a polishing plate 2 movably mounted in the middle of the upper end of the body 1, and the middle of the polishing plate 2 is in a basin shape, so that when a polishing solution flows through an inclined plane on the upper surface of the polishing plate 2, the polishing solution can keep its flow velocity in a relatively balanced state all the time under the action of gravity and centrifugal force, a disc-shaped liquid separating groove 6 is formed in the middle of the polishing plate 2, a holding plate 3 is movably mounted on one side of the upper surface of the polishing plate 2, the holding plate 3 is located on the inclined plane of the polishing plate 2, a top block 4 is movably sleeved in an inner cavity of the holding plate 3, so that a material to be processed can be placed below the top block 4, and under the action of limiting the material by the side wall of the inner cavity of the holding plate 3, the material cannot run, and under the action of smoothing the surface of the polishing plate 2, the bottom surface of a material cannot be abraded, the upper surface of the top block 4 is movably connected with the top surface of the inner cavity of the clamping disc 3 through the spring 5, so that after the material moves upwards for a certain distance under the action of external force, the material can be kept at a position contacted with polishing liquid all the time through the downward pressure of the spring 5 on the top block 4 and the material, the inner cavity of the side surface of the polishing disc 2 is provided with the liquid suction cavities 10, the liquid suction cavities 10 are communicated with the liquid separating groove 6, so that part of the polishing liquid can flow into the liquid suction cavities 10 along the liquid separating groove 6 under the action of rational flow, the number of the liquid suction cavities 10 is four to six, the liquid suction cavities 10 are arranged at equal angles with the circle center of the polishing disc 2, when the polishing disc 2 rotates to any position, one liquid suction cavity 10 is positioned below the clamping disc 3, the inner cavity of the polishing disc 2 is provided with the liquid outlet 7 for communicating the liquid suction cavities 10 with the outside, so that the hydraulic pressure in the liquid suction cavities 10 reaches a certain strength, can make the partial polishing solution in imbibition chamber 10 extrude outward through going out liquid hole 7 under follow-up hydraulic effect, go out liquid hole 7 and be located organism 1's inclined plane for the polishing solution that extrudes outward through going out liquid hole 7 can exert certain ascending thrust to the material of treating that is located 3 bottom surfaces of grip pads, thereby makes the material of treating to process rebound, makes the polishing solution can be with the bottom surface perfect contact of material, thereby polishes, the top fixed mounting in polishing dish 2 middle part has inlet tube 13.
Referring to fig. 1 and 3, the upper end of the liquid outlet hole 7 is inclined inward, and the inclination amplitude is gradually increased inward and outward, so that when the flow rate of the polishing disc 2 is large and the gravity cannot balance the flow rate, and when the liquid is discharged outward through the liquid outlet hole 7 by the hydraulic material ejecting mechanism, the impact force of the liquid to the inside is counteracted, so as to further ensure the polishing quality of the material.
Referring to fig. 1-2, a liquid pressing block 12 is movably sleeved in the middle of the liquid suction cavity 10, so that the volume of the inner cavity of the machine body 1 can be adjusted by the up-and-down movement of the liquid pressing block 12, a fixing block 11 is fixedly connected to the upper surface of the machine body 1 and located right below the clamping disc 3, the fixing block 11 is located below the liquid pressing block 12, and both sides of the fixing block 11 are inclined planes, so that when the liquid pressing block 12 rotates to the side of the fixing block 11, the liquid pressing block 12 can be slowly lifted upwards through the inclined planes, so that the volume of the liquid suction cavity 10 is reduced, and the polishing liquid sucked in the liquid suction cavity 10 is further squeezed outwards.
Please refer to fig. 1 and fig. 3, wherein, the inner cavity of the polishing disc 2 is movably sleeved with an adjusting block 8 located in the middle of the liquid outlet hole 7, and the opening diameter in the middle of the adjusting block 8 is the same as the diameter of the liquid outlet hole 7, so that the adjusting block 8 can move, and further the size of the opening of the liquid outlet hole 7 can be adjusted, the inner cavity of the polishing disc 2 is provided with a liquid storage cavity 9 located inside the adjusting block 8, and the liquid storage cavity 9 is filled with evaporating liquid, so that the temperature rises rapidly due to long-time processing of the polishing liquid, which is not beneficial to polishing processing, under the vaporization effect of the evaporating liquid in the liquid storage cavity 9, the adjusting block 8 is pushed outwards, so that the opening of the liquid outlet hole 7 is reduced, thereby the upward thrust of the material to be processed by the hydraulic material pushing mechanism is increased, and the material is kept away from the polishing liquid.
The using method of the invention is as follows:
hydraulic ejection: when the polishing disc 2 rotates at a certain rotating speed to enable polishing liquid in the middle of the polishing disc to flow outwards under the action of centrifugal force, part of the polishing liquid flows into the liquid absorption cavity 10 through the annular liquid separation groove 6, and under the action of gradually increasing pressure in the liquid absorption cavity 10, the solution in the liquid absorption cavity 10 is discharged outwards through the liquid outlet hole 7, upward thrust is applied to the material on the upper surface of the liquid outlet hole 7, the material drives the ejector block 4 to overcome the elastic force of the spring 5 to move upwards for a certain distance, so that the bottom surface of the material is always in a state of being in contact with the polishing liquid, and the material is polished.
Oblique speed regulation: the bottom surface of the clamping disc 3 is arranged on the inclined surface of the polishing disc 2, so that the polishing liquid flowing on the inclined surface of the polishing disc 2 can be subjected to outward centrifugal force and downward gravity, the centrifugal force applied to the outer side is larger, and the applied gravity is also larger, so that the polishing liquid on the inner side and the outer side of the inclined surface of the polishing disc 2 can be kept at a relatively stable flow rate, the material can be uniformly processed, the liquid outlet holes 7 which are inclined inwards and gradually increase in inclination angle are arranged, the flow rate of the polishing disc 2 is larger, and when the flow rate cannot be balanced by the gravity, the liquid is discharged outwards through the liquid outlet holes 7 by a hydraulic material ejecting mechanism, the impact force of the liquid to the inner side is counteracted, and the polishing quality of the material is further guaranteed;
and (3) material ejection enhancement: keep away from the pad 3 position the imbibition chamber 10 in the pressure liquid piece 12 can be at the effect of gravity downstream down, thereby the increase of the volume of imbibition chamber 10, and then make imbibition chamber 10 internal energy absorb more liquid, and when pressure liquid piece 12 rotates to fixed block 11 top, be under the effect on inclined plane at fixed block 11 both sides, make pressure liquid piece 12 slowly rebound, thereby polish in the imbibition chamber 10 extrudees, thereby make the discharge rate of play liquid hole 7 department polish further promote, further strengthen the liftout ability of hydraulic pressure liftout mechanism, and enable polish and only can outwards discharge through the one side of installing pad 3, the consumption of polish has been saved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A polishing device for processing a USB chip of a data adapter comprises a machine body (1), and is characterized in that: the polishing machine is characterized in that a polishing disc (2) is movably mounted in the middle of the upper end of the machine body (1), the middle of the polishing disc (2) is basin-shaped, a disc-shaped liquid separating groove (6) is formed in the middle of the polishing disc (2), a clamping disc (3) is movably mounted on one side of the upper surface of the polishing disc (2), the clamping disc (3) is located on the inclined plane of the polishing disc (2), a top block (4) is movably sleeved on the inner cavity of the clamping disc (3), the upper surface of the top block (4) is movably connected with the top surface of the inner cavity of the clamping disc (3) through a spring (5), a liquid suction cavity (10) is formed in the inner cavity of the side surface of the polishing disc (2), the liquid suction cavity (10) is communicated with the liquid separating groove (6), a liquid outlet hole (7) which is communicated with the liquid suction cavity (10) and the outside is formed in the inner cavity of the polishing disc (2), and the liquid outlet hole (7) is located on the inclined plane of the machine body (1), a liquid inlet pipe (13) is fixedly arranged above the middle part of the polishing disc (2).
2. The polishing apparatus for processing a data adaptor USB chip as claimed in claim 1, wherein: the upper end of the liquid outlet hole (7) is inclined inwards, and the inclination amplitude is gradually increased inwards and outwards.
3. The polishing apparatus for processing a data adaptor USB chip as claimed in claim 1, wherein: the liquid pressing block (12) is movably sleeved in the middle of the liquid suction cavity (10), a fixing block (11) located right below the clamping disc (3) is fixedly connected to the upper surface of the machine body (1), the fixing block (11) is located below the liquid pressing block (12), and two sides of the fixing block (11) are inclined planes.
4. The polishing apparatus for processing a data adaptor USB chip as claimed in claim 1, wherein: the inner chamber activity of polishing dish (2) is cup jointed and is located regulating block (8) in liquid hole (7) middle part, and regulating block (8) middle part opening diameter is the same with liquid hole (7) diameter, the inner chamber of polishing dish (2) is seted up and is located inboard stock solution chamber (9) of regulating block (8), and stock solution chamber (9) intussuseption is filled with the evaporating liquid.
5. The polishing apparatus for processing a data adaptor USB chip as claimed in claim 1, wherein: the number of the liquid suction cavities (10) is four to six, and the liquid suction cavities are arranged at equal angles with the circle center of the polishing disc (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111309508.6A CN113990749B (en) | 2021-11-06 | 2021-11-06 | Polishing device for processing USB chip of data adapter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111309508.6A CN113990749B (en) | 2021-11-06 | 2021-11-06 | Polishing device for processing USB chip of data adapter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113990749A true CN113990749A (en) | 2022-01-28 |
| CN113990749B CN113990749B (en) | 2022-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111309508.6A Active CN113990749B (en) | 2021-11-06 | 2021-11-06 | Polishing device for processing USB chip of data adapter |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000042882A (en) * | 1998-07-29 | 2000-02-15 | Komatsu Koki Kk | Mirror finishing device for semiconductor wafer |
| JP2000263405A (en) * | 1999-03-17 | 2000-09-26 | Komatsu Electronic Metals Co Ltd | Method for polishing notch-chamfered surface of semiconductor wafer and wafer polishing device |
| JP2001162513A (en) * | 1999-12-09 | 2001-06-19 | Daido Steel Co Ltd | Lapping surface truing device for single-side lapping machine |
| JP2003173992A (en) * | 2001-12-05 | 2003-06-20 | Hitachi Ltd | Chemical mechanical polisher |
| JP2003340712A (en) * | 2002-05-24 | 2003-12-02 | Hamai Co Ltd | Inclined plane polishing apparatus |
| CN206834156U (en) * | 2017-03-17 | 2018-01-02 | K.C.科技股份有限公司 | Substrate board treatment |
| CN113319734A (en) * | 2021-07-06 | 2021-08-31 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chemical polishing apparatus and method |
-
2021
- 2021-11-06 CN CN202111309508.6A patent/CN113990749B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000042882A (en) * | 1998-07-29 | 2000-02-15 | Komatsu Koki Kk | Mirror finishing device for semiconductor wafer |
| JP2000263405A (en) * | 1999-03-17 | 2000-09-26 | Komatsu Electronic Metals Co Ltd | Method for polishing notch-chamfered surface of semiconductor wafer and wafer polishing device |
| JP2001162513A (en) * | 1999-12-09 | 2001-06-19 | Daido Steel Co Ltd | Lapping surface truing device for single-side lapping machine |
| JP2003173992A (en) * | 2001-12-05 | 2003-06-20 | Hitachi Ltd | Chemical mechanical polisher |
| JP2003340712A (en) * | 2002-05-24 | 2003-12-02 | Hamai Co Ltd | Inclined plane polishing apparatus |
| CN206834156U (en) * | 2017-03-17 | 2018-01-02 | K.C.科技股份有限公司 | Substrate board treatment |
| CN113319734A (en) * | 2021-07-06 | 2021-08-31 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Chemical polishing apparatus and method |
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| CN113990749B (en) | 2022-11-18 |
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