CN113977437A - Polishing device and gold finger surface polishing method using same - Google Patents
Polishing device and gold finger surface polishing method using same Download PDFInfo
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- CN113977437A CN113977437A CN202111179233.9A CN202111179233A CN113977437A CN 113977437 A CN113977437 A CN 113977437A CN 202111179233 A CN202111179233 A CN 202111179233A CN 113977437 A CN113977437 A CN 113977437A
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
Abstract
The invention belongs to the technical field of printed circuit board processing, and particularly relates to a polishing device and a gold finger surface polishing method using the same, wherein the polishing device comprises a rack, a plurality of clamping components, a dry polishing device and a control device, the clamping components are arranged on the rack and are used for clamping a workpiece, the dry polishing device is used for polishing the workpiece, the dry polishing device is positioned above the clamping components, the dry polishing device comprises a polishing component and a first driving component connected with the polishing component, a flexible polishing layer is arranged on the bottom surface of the polishing component, the first driving component is electrically connected with the control device, and the first driving component drives the polishing component and the flexible polishing layer to move relative to the workpiece; and the qualification rate of the workpiece can be automatically detected through the detection device, and the production efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of printed circuit board processing, and particularly relates to a polishing device and a gold finger surface polishing method using the same.
Background
The golden fingers generally refer to a plurality of golden conductive contact pieces arranged in fingers on the surface of a printed circuit board, and are generally used for signal transmission in PCB plugs of electronic devices such as memory bars, display cards and memory cards. The surface of the golden finger is generally a metal coating, such as a gold coating or a copper coating, which has strong oxidation resistance, can protect the internal circuit from corrosion, and does not cause signal loss.
Because the gap between two adjacent conductive contact pieces of the golden finger is relatively small, in the production process, metal chips or other foreign matters are found to be remained in the gap between the two adjacent conductive contact pieces in the Surface Mounting Technology (SMT), so that the golden finger is polluted, the abrasion resistance of the golden finger is further influenced, the contact resistance is increased, and the situations of poor contact or short circuit of an electronic device are caused; in addition, the metal coating on the surface of the conductive contact piece also has the probability of generating oxidation, and poor contact between electronic devices can be caused after the metal coating is oxidized; generally, the gold fingers in the production process can only be scrapped after being polluted, so that the yield of electronic devices is greatly increased and reduced, production raw materials are wasted, and the production cost is increased; in the existing scheme, the surfaces of the golden fingers are treated by adopting a water washing or oil washing mode, for example, a full-automatic circuit board polishing and cleaning system disclosed in the Chinese patent CN203109769U, if the golden fingers are used for polishing the golden fingers, because the golden fingers are made of metal materials, after the golden fingers are contacted with water or oil, even if the golden fingers are dried after being cleaned, the corrosion probability of the golden fingers is increased, and the use of electronic devices is further influenced; and after polishing and cleaning, whether the circuit board is qualified or not can be judged only by manpower, the efficiency is low, and the misjudgment rate is high.
Disclosure of Invention
The invention aims to overcome at least one defect in the prior art, and provides a polishing device and a golden finger surface polishing method using the same.
In order to solve the technical problems, the invention adopts the technical scheme that:
the utility model provides a polishing device, including the frame and all set up a plurality of centre gripping subassemblies that are used for the centre gripping work piece in the frame, a dry-type burnishing device and a controlling means for polishing the work piece, dry-type burnishing device is located the top of centre gripping subassembly, dry-type burnishing device includes polishing subassembly and the first drive assembly who is connected with polishing subassembly, the polishing subassembly bottom surface is provided with flexible polishing layer, first drive assembly is connected with controlling means electricity, first drive assembly drives polishing subassembly and the relative work piece motion of flexible polishing layer.
In the scheme, the oxidation layer, foreign matters and the like on the surface of the workpiece are removed through the relative friction between the flexible polishing layer and the workpiece, so that the corrosion risk caused by the treatment of the workpiece by adopting liquid is avoided; when in grinding, the flexible polishing layer has the soft characteristic, and can generate adaptive deformation when being rubbed with the surface of a workpiece, so that the surface of the workpiece can be contacted in a wider range, the polishing effect is improved, and the workpiece can not be damaged excessively and unnecessarily; in addition, the workpiece can be detected by the detection device to judge whether the workpiece is qualified or not, so that misjudgment caused by visual detection is avoided, and the yield is improved; simultaneously, controlling means controls whole device in order to produce line automation, improves whole efficiency.
Preferably, the polishing assembly comprises a polishing disk and a magnet arranged inside the polishing disk, the polishing disk is connected with the first driving assembly, the flexible polishing layer comprises magnetic particles and abrasive materials, and the magnetic particles clamp and adsorb the abrasive materials to the bottom surface of the polishing disk.
In another preferred embodiment, the polishing assembly includes a polishing disc, and the flexible polishing layer includes a rubber, and the rubber is fixedly disposed at the bottom of the polishing disc.
Preferably, the rack is provided with a height adjusting mechanism for adjusting the distance between the bottom surface of the polishing disk and the clamping surface of the clamping assembly.
Preferably, the height adjusting mechanism comprises a moving platform and a second driving assembly connected with the moving platform and driving the moving platform to move up and down, the second driving assembly is mounted on the frame, and the first driving assembly is mounted on the moving platform.
Preferably, the polishing device further comprises a detection device for detecting whether the workpiece is qualified or not and a conveying device for conveying the workpiece between the detection device and the dry polishing device, the plurality of clamping assemblies are distributed on the conveying device, the detection device is located above the clamping assemblies, and the detection device and the conveying device are electrically connected with the control device.
Preferably, the air gun is further fixedly arranged on the rack, and an extension line of the air outlet direction of the air gun is intersected with the clamping surface of the clamping assembly.
The invention also provides a golden finger surface polishing method using the polishing device, wherein the detection device comprises a CCD camera fixedly arranged on the frame and facing the clamping component and a processing module in communication connection with the CCD camera, the processing module is in communication connection with the control device, and the method comprises the following steps:
s1: the clamping assembly clamps the workpiece with the golden finger, and the surface to be processed of the golden finger is placed away from the clamping assembly;
s2: the conveying device receives the signal from the control device and drives the clamping assembly to move to the position right below the dry-type polishing device;
s3: the first driving assembly receives a signal from the control device and drives the polishing assembly to rotate, and the flexible polishing layer on the bottom surface of the polishing assembly rubs the gold finger on the workpiece to obtain a pre-polished part;
s4: the conveying device receives a signal from the control device and drives the clamping assembly clamping the pre-polishing piece to move to the position below the detection device;
s5: the detection device receives a signal from the control device to detect the surface of the pre-polished part to obtain detection data, and judges whether the pre-polished part is qualified or not according to the detection data; if yes, go to step S6, otherwise, go back to step S2;
s6: and the conveying device drives the clamping assembly to move to the next procedure to obtain the polishing piece.
After the pre-polished piece is obtained through polishing, whether the pre-polishing is qualified or not is analyzed through the detection device, so that the judgment accuracy and yield are improved, and the production efficiency is improved.
Preferably, the step S1 further includes a pre-detection step for determining whether the workpiece needs to be polished, and the pre-detection step specifically includes:
the conveying device receives a signal from the control device and drives the clamping assembly clamping the workpiece to move to the position below the detection device;
a CCD camera in the detection device receives a signal from the control device to perform pre-detection on the surface of the workpiece to obtain pre-detection data, and transmits the obtained pre-detection data to a processing module in the detection device;
the processing module judges whether the workpiece is qualified or not according to the pre-detection data, and if so, the step S2 is carried out; if not, the process goes to step S6.
Preferably, before the step S5 is started, the method further includes a cleaning step, where the cleaning step specifically includes: the air gun receives a signal from the control device and blows air to the pre-polishing piece on the clamping assembly.
Compared with the prior art, the beneficial effects are:
the polishing device disclosed by the invention is used for polishing and cleaning the golden finger by virtue of the flexible polishing layer formed by mixing the magnetic particles and the abrasive material, and no liquid participates in the polishing process, so that the probability of rusting of the golden finger can be reduced; in addition, the distance between the bottom surface of the polishing disc and the clamping surface of the clamping assembly can be adjusted through the height adjusting mechanism, and the phenomenon that the pressure of the grinding materials on the golden finger is too large due to too small distance between the bottom surface of the polishing disc and the clamping surface of the clamping assembly is avoided, so that redundant scratches of the golden finger caused by polishing processing are reduced; on the other hand, the polishing method can judge whether the workpiece is qualified or not through the detection device, and can greatly improve the detection efficiency and the yield.
Drawings
FIG. 1 is a schematic view of the structure of a polishing apparatus according to example 1 of the present invention;
FIG. 2 is an enlarged schematic view of section A of FIG. 1;
FIG. 3 is a schematic block diagram showing the electrical connection of the polishing apparatus according to example 1 of the present invention;
FIG. 4 is a schematic view showing the action of the magnet and the magnetic particles and the abrasive in the polishing apparatus according to example 1 of the present invention; wherein the arrows indicate the magnetic field direction;
FIG. 5 is a schematic view of the structure of a polishing member of a polishing apparatus according to example 2 of the present invention;
FIG. 6 is a schematic block diagram of the flow chart of the gold finger surface polishing method in embodiment 3 of the present invention.
Detailed Description
The drawings are for illustration purposes only and are not to be construed as limiting the invention; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the invention.
The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar components; in the description of the present invention, it should be understood that if there are terms such as "upper", "lower", "left", "right", "long", "short", etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the drawings, it is only for convenience of description and simplicity of description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the terms may be understood by those skilled in the art according to specific situations.
The technical scheme of the invention is further described in detail by the following specific embodiments in combination with the attached drawings:
example 1:
as shown in fig. 1 to 4, a first embodiment of a polishing apparatus includes a frame 1, 4 clamping assemblies, a dry polishing apparatus 3 and a control apparatus 5, wherein the clamping assemblies are disposed on the frame 1 and used for clamping a workpiece 8, the dry polishing apparatus 3 is used for polishing the workpiece 8, the dry polishing apparatus 3 is disposed above the clamping assembly 21, the dry polishing apparatus 3 includes a polishing assembly and a first driving assembly 32 connected to the polishing assembly 31, a flexible polishing layer 33 is disposed on a bottom surface of the polishing assembly, the first driving assembly 32 is electrically connected to the control apparatus, and the first driving assembly 32 drives the polishing assembly and the flexible polishing layer 33 to move relative to the workpiece 8.
The polishing machine further comprises a detection device 4 for detecting whether the workpiece 8 is qualified and a conveying device 2 for conveying the workpiece 8 between the detection device 4 and the dry polishing device, wherein the detection device 4 and the conveying device 2 are both mounted on the frame 1, the four clamping assemblies 21 are distributed on the conveying device 2, the detection device 4 is located above the clamping assemblies 21, and the detection device 4 and the conveying device 2 are both electrically connected with the control device 5.
It should be noted that the conveying device 2 in this embodiment may adopt a structure in which a conveying wheel drives a conveying belt, and this should not be understood as a limitation to this embodiment, and it is also within the scope of this embodiment to adopt other types of conveying devices 2 to drive the clamping assembly 21 or the workpiece 8 to move; in addition, the number of the clamping assemblies 21 is only used as a reference and can be increased or decreased according to actual use conditions.
The polishing assembly in this embodiment includes a polishing disk 31 and a magnet 311 disposed inside the polishing disk 31, the polishing disk 31 is connected to the first driving assembly, the flexible polishing layer 33 includes nanometer-sized magnetic particles 331 and an abrasive material 332, and the magnetic particles 331 clamp and adhere the abrasive material 332 to the bottom surface of the polishing disk 31. Specifically, the magnetic particles 331 may be made of materials such as iron, nickel, cobalt, and the like, preferably iron, the number of the magnetic particles may be multiple, and the magnetic particles may be arranged as required, and the magnetic field strength may be selected from a range of 0.1T to 0.5T; abrasive 332 is preferably diamond. Because the magnetic particles 331 and the abrasive material 332 are nanoscale, under the action of the magnetic field of the magnet 311, after the magnetic particles 331 clamp the abrasive material 332, the magnetic particles 331 and the abrasive material 332 are both adsorbed on the magnetic poles of the magnet 311, when the polishing disc 31 and the workpiece 8 move relatively, the magnetic particles 331 and the abrasive material 332 rub against the workpiece 8, and meanwhile, the magnetic particles 331 and the abrasive material 332 can also move like a fluid, and change along with the surface shape of the workpiece 8, so that the pressure of the abrasive material 332 on the surface of the workpiece 8 is effectively controlled, and thus, the surface of the workpiece 8 cannot be damaged too much; and because the flexible polishing layer 33 does not contain other liquid or chemical substances, the gold finger does not contact the liquid during the polishing process, thereby greatly reducing the probability of the gold finger rusting. It should be noted that the flexible polishing layer 33 formed by mixing the magnet, the magnetic particles 331 and the abrasive 332 in the present embodiment is only a preferred embodiment, and is not to be construed as a limitation to the present embodiment, and in the specific implementation process, the flexible polishing layer 33 may be formed by using other flexible materials.
The first driving assembly 32 in this embodiment includes a driving motor 321 and a transmission shaft 322 fixedly connected to an output shaft of the driving motor 321, the driving motor 321 is installed on the frame 1, and the polishing disc 31 is fixedly connected to the transmission shaft 322. The control device 5 can automatically control the driving motor 321 to rotate, so that the automatic control of the whole system can be conveniently realized, the control device 5 sends a signal to the driving motor 321, and the driving motor 321 drives the polishing disc 31 to rotate through the transmission shaft 322, so that the abrasive 332 and the magnetic particles 331 on the polishing disc 31 are driven to rub against the workpiece 8 on the clamping component 21, and the polishing of the workpiece 8 is realized. Wherein, the selectable range of the rotating speed of the polishing disk 31 is 50 rpm-400 rpm, and the selectable range of the polishing time is 1-5 min.
Because the magnetic material and the abrasive 332 have higher hardness, if the distance between the clamping surface and the bottom surface of the polishing disk 31 is smaller, the magnetic material and the abrasive 332 scratch the workpiece 8 greatly, which causes damage to the workpiece 8, and the thicknesses of different workpieces 8 may be different; therefore, the frame 1 of the present embodiment is provided with a height adjusting mechanism 6 for adjusting the distance between the bottom surface of the polishing platen 31 and the holding surface of the holding unit 21. In a specific embodiment, the height adjusting mechanism 6 comprises a moving platform 61, a second driving assembly 62 connected to the moving platform 61 and driving the moving platform to move up and down, the second driving assembly 62 is installed on the frame 1, a driving motor 321 is installed on the moving platform 61, wherein, the second driving component 62 adopts a cylinder, the base of the cylinder is arranged on the frame 1, the telescopic arm of the cylinder is fixedly connected with the mobile platform 61, the axial lead of the telescopic arm is vertically arranged, the moving platform 61 is driven to move up and down by the telescopic motion of the cylinder, so as to drive the driving motor 321 fixed on the moving platform 61 to move up and down, because the polishing disc 31 is fixedly connected with the driving motor 321 through the transmission shaft 322, the polishing disc 31 also moves up and down along with the driving motor 321, further, the distance between the bottom surface of the polishing disc 31 and the clamping surface of the clamping assembly 21 can be adjusted, so that the device is more adaptive; wherein, the optional range of the distance between the bottom surface of the polishing disc 31 and the clamping surface of the clamping component 21 is 0.4 mm-1.6 mm.
The detecting device 4 in this embodiment includes a CCD camera 41 fixedly disposed on the frame 1 and facing the holding assembly 21, and a processing module 42 communicatively connected to the CCD camera 41, and the processing module 42 is communicatively connected to the control device 5. The CCD camera 41 is used for acquiring image information of the surface of the workpiece 8, the image information is transmitted to the processing module 42, the processing module 42 identifies the workpiece 8 in the image through an identification algorithm, and whether foreign matters or corrosion marks exist on the surface of the workpiece 8 is judged; specifically, the processing module 42 is provided with a comparison library, which includes a plurality of standard images without corrosion, and can determine whether there is corrosion according to the color distribution in the images, and determine whether there is a foreign object by comparing the images collected by the CCD camera 41 with the standard images. Therefore, the detection efficiency and the detection precision of the workpiece 8 can be greatly improved, and the working efficiency is improved.
In the process of rubbing the flexible polishing layer 33 and the surface of the workpiece 8, the magnetic particles 331 or the abrasive 332 in the flexible polishing layer 33 fall off and remain on the surface of the workpiece 8, so that secondary pollution is caused, therefore, the air gun 7 is further fixedly arranged on the rack 1 in the embodiment, the air gun 7 is electrically connected with the control device 5, the extension line of the air outlet direction of the air gun 7 intersects with the clamping surface of the clamping assembly 21, residual substances on the surface of the workpiece 8 are blown away by low-pressure air flow blown out by the air gun 7, the surface of the workpiece 8 is cleaned, and the condition that the substances on the residual surface influence the qualification rate of the workpiece 8 is avoided; additionally, the air gun 7 can also avoid the contact between the workpiece 8 and the liquid in a blowing mode, so that the corrosion probability of the workpiece 8 is further reduced.
In this embodiment, the flexible polishing layer 33 is formed by the magnetic particles 331 and the abrasive 332, and under the action of the magnetic field of the magnet 311, the magnetic particles 331 and the abrasive 332 are adsorbed on the bottom surface of the polishing disk 31; on one hand, the workpiece 8 is polished by rubbing the magnetic particles 331 and the abrasive material 332 with the workpiece 8, and since the abrasive material 332 and the magnetic particles 331 are adsorbed on the polishing disc 31 by magnetic force, the abrasive material 332 and the magnetic particles 331 can move like fluid in the rubbing process, so that the surface of the workpiece 8 can be polished; on the other hand, the flexible polishing layer 33 does not contain any liquid, and finally the surface of the workpiece 8 is cleaned by the air gun 7, so that the corrosion risk caused by the contact of the workpiece 8 and the liquid in the polishing process is avoided.
Example 2
As shown in fig. 5, this embodiment is a second embodiment of a polishing apparatus, and the only difference between this embodiment and the first embodiment is that the polishing assembly in this embodiment includes a polishing pad 31, and the flexible polishing layer includes a rubber 333, and the rubber is fixedly disposed at the bottom of the polishing pad 31, and since the hardness of the rubber 333 is lower than that of the magnetic particles 331 or the abrasive 332, the flexible polishing layer 33 will cause less damage to the workpiece 8.
Example 3
Fig. 6 shows a method for polishing a gold finger surface using the polishing apparatus of embodiment 1 or embodiment 2, comprising the steps of:
s1: the clamping component 21 clamps the workpiece 8 with the golden fingers, and the golden fingers are placed away from the clamping component 21;
s2: the conveying device 2 receives the signal from the control device 5 and drives the clamping assembly 21 to move to the position right below the dry-type polishing device 3;
s3: the first driving component 32 receives the signal from the control device 5 and drives the polishing component to rotate, and the flexible polishing layer 33 on the bottom surface of the polishing disc 31 rubs the gold finger on the workpiece 8 to obtain a pre-polished part;
s4: the conveying device 2 receives a signal from the control device 5, and drives the clamping assembly 21 clamping the pre-polishing piece to move to the position below the detection device 4;
s5: the detection device 4 receives the signal from the control device 5 to detect the surface of the pre-polished part to obtain detection data, and judges whether the pre-polished part is qualified or not according to the detection data; if yes, go to step S6, otherwise, go back to step S2;
s6: the conveying device 2 drives the clamping assembly 21 to move to the next process, and a polishing piece is obtained.
In order to improve the working efficiency and avoid unnecessary energy waste, step S1 of this embodiment further includes a pre-detection step for determining whether the workpiece 8 needs to be polished, and before polishing the workpiece 8, the pre-detection step specifically includes:
the conveying device 2 receives a signal from the control device 5 and drives the clamping component 21 clamping the workpiece 8 to move below the detection device 4;
a CCD camera 41 in the detection device 4 receives a signal from the control device 5 to perform pre-detection on the surface of the workpiece 8 to obtain pre-detection data, and transmits the obtained pre-detection data to a processing module 42 in the detection device 4;
the processing module 42 determines whether the workpiece 8 is qualified according to the pre-detection data, and if so, the process goes to step S2; if not, the process goes to step S6.
Since the magnetic particles 331 and the abrasive 332 in the flexible polishing layer 33 may fall off and remain on the surface of the workpiece 8 during the polishing process, the present embodiment further includes a cleaning step before the step S5, where the cleaning step specifically includes: the air gun 7 receives a signal from the control device 5 to blow air to the pre-polishing piece on the clamping assembly 21, and the retained magnetic particles 331 or abrasive 332 are blown away, so that the influence of the magnetic particles 331 and the abrasive 332 on the qualification rate of the workpiece 8 during detection is avoided.
In the polishing process, the control device 5 sends a signal to the second driving assembly 62 to adjust the gap between the bottom surface of the polishing disc 31 and the surface of the workpiece 8, wherein the selectable range of the gap is 0.4 mm-1.6 mm, so that the proper polishing pressure is controlled, and the surface of a golden finger is prevented from being scratched excessively. Of course, the control device 5 may also control the polishing time, the rotational speed of polishing, etc., and will not be described in detail here.
The present invention has been described with reference to flowchart illustrations or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the application, and it is understood that each flow or block of the flowchart illustrations or block diagrams, and combinations of flows or blocks in the flowchart illustrations or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. The polishing device is characterized by comprising a rack (1), a plurality of clamping assemblies (21) which are arranged on the rack (1) and used for clamping a workpiece (8), a dry polishing device (3) used for polishing the workpiece (8) and a control device (5), wherein the dry polishing device (3) is positioned above the clamping assemblies (21), the dry polishing device (3) comprises a polishing assembly and a first driving assembly (32) connected with the polishing assembly, a flexible polishing layer (33) is arranged on the bottom surface of the polishing assembly, the first driving assembly (32) is electrically connected with the control device (5), and the first driving assembly (32) drives the polishing assembly and the flexible polishing layer (33) to move relative to the workpiece (8).
2. A polishing apparatus according to claim 1, wherein the polishing assembly comprises a polishing disk (31) and a magnet (311) disposed inside the polishing disk (31), the polishing disk (31) is connected to the first driving assembly (32), the flexible polishing layer (33) comprises magnetic particles (331) and abrasive materials (332), and the magnetic particles (331) hold and adhere the abrasive materials (332) to the bottom surface of the polishing disk (31).
3. A polishing device according to claim 1, characterized in that the polishing assembly comprises a polishing disc (31), the flexible polishing layer (33) comprises a rubber (333), and the rubber (333) is fixedly arranged at the bottom of the polishing disc (31).
4. A polishing apparatus according to claim 2 or 3, characterized in that the frame (1) is provided with a height adjusting mechanism (6) for adjusting the distance between the bottom surface of the polishing disk (31) and the holding surface of the holding unit (21).
5. A polishing apparatus as claimed in claim 4, characterized in that the height adjusting mechanism (6) comprises a movable platform (61), and a second driving unit (62) connected to the movable platform (61) and moving the movable platform up and down, the second driving unit (62) being mounted on the frame (1), and the first driving unit (32) being mounted on the movable platform (61).
6. A polishing device as claimed in claim 5, characterized by further comprising a detection device (4) for detecting whether the workpiece (8) is acceptable and a conveying device (2) for conveying the workpiece (8) between the detection device (4) and the dry polishing device, wherein the detection device (4) and the conveying device (2) are both mounted on the frame (1), a plurality of clamping assemblies (21) are distributed on the conveying device (2), the detection device (4) is located above the clamping assemblies (21), and the detection device (4) and the conveying device (2) are both electrically connected with the control device (5).
7. A polishing device according to claim 6, characterized in that an air gun (7) is further fixedly arranged on the frame (1), the air gun (7) is electrically connected with the control device (5), and an extension line of an air outlet direction of the air gun (7) intersects with the clamping surface of the clamping assembly (21).
8. A gold finger surface polishing method using the polishing device of claim 6 or 7, characterized in that the detection device (4) comprises a CCD camera (41) fixedly arranged on the frame (1) and facing the clamping assembly (21) and a processing module (42) in communication connection with the CCD camera (41), the processing module (42) is in communication connection with the control device (5), and the method comprises the following steps:
s1: the clamping assembly (21) clamps the workpiece with the golden finger, and the surface to be processed of the golden finger is placed away from the clamping assembly (21);
s2: the conveying device (2) receives a signal from the control device (5) and drives the clamping assembly (21) to move to the position right below the dry-type polishing device (3);
s3: the first driving component (32) receives a signal from the control device (5) and drives the polishing component to rotate, and the flexible polishing layer (33) on the bottom surface of the polishing component rubs the golden finger on the workpiece to obtain a pre-polishing piece;
s4: the conveying device (2) receives a signal from the control device (5) and drives the clamping assembly (21) clamping the pre-polishing piece to move to the position below the detection device (4);
s5: the detection device (4) receives a signal from the control device (5) to detect the surface of the pre-polished part to obtain detection data, and judges whether the pre-polished part is qualified or not according to the detection data; if yes, go to step S6, otherwise, go back to step S2;
s6: the conveying device (2) drives the clamping assembly (21) to move to the next procedure, and a polishing piece is obtained.
9. The method for polishing the surface of a gold finger according to claim 8, wherein the step S1 further comprises a pre-detection step for determining whether the workpiece needs to be polished, the pre-detection step specifically comprises:
the conveying device (2) receives a signal from the control device (5) and drives the clamping component (21) clamping the workpiece to move to the position below the detection device (4);
a CCD camera (41) in the detection device (4) receives a signal from the control device (5) to carry out pre-detection on the surface of the workpiece to obtain pre-detection data, and the obtained pre-detection data is transmitted to a processing module (42) in the detection device (4);
the processing module (42) judges whether the workpiece is qualified or not according to the pre-detection data, if so, the step S2 is carried out; if not, the process goes to step S6.
10. The method for polishing the surface of a gold finger according to claim 9, further comprising a cleaning step before the step S5 is started, wherein the cleaning step specifically comprises: the air gun (7) receives signals from the control device (5) and blows air to the pre-polishing piece on the clamping assembly (21).
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Application publication date: 20220128 |