CN110125773A - A kind of PCB polisher lapper - Google Patents
A kind of PCB polisher lapper Download PDFInfo
- Publication number
- CN110125773A CN110125773A CN201910460066.1A CN201910460066A CN110125773A CN 110125773 A CN110125773 A CN 110125773A CN 201910460066 A CN201910460066 A CN 201910460066A CN 110125773 A CN110125773 A CN 110125773A
- Authority
- CN
- China
- Prior art keywords
- disk
- pcb
- polishing
- work top
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of PCB polisher lappers.The technical scheme is that a kind of PCB polisher lapper, including rack, work top is provided in the rack, grinding and polishing disk group and precise cross-shaped slide unit are provided on the work top, elevating mechanism is provided on the precise cross-shaped slide unit, the elevating mechanism is connected with the clamping jaw cylinder that can clamp PCB, outlet is provided on the elevating mechanism, the grinding and polishing disk group includes the rough lapping disk motor-driven by work top bottom is arranged in, middle abrasive disk, fine lapping disk and polishing disk, Pneumatic vibrator is also provided with below work top in the rack, the rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk are provided centrally with carrier fluid pond, the Pneumatic vibrator drives the vibration of carrier fluid pond by connecting tube.The good precision of scheme grinding polishing effect provided by the invention is high and prevents lapping liquid polishing fluid from splashing out and precipitating.
Description
Technical field
The present invention relates to polishing grinding equipment field, in particular to a kind of PCB polisher lapper.
Background technique
When the laboratory of PCB checks product structure, it is necessary to carry out position to be checked to the slice sample of sampling
Prior calibration (usually best to check that position is selected to be intended to observed hole center), setting and behaviour by man-machine interface
Make the processing such as completion automatic cutting, grinding, polishing, so that its structure inspection demand for meeting printed circuit board.However, right at present
The working process of cutting, the grinding, polishing of sample is checked in PCB, is mainly carried out respectively by manual type, for what is checked
Hole center is also visually to be judged by underhand polish process, and not only efficiency is lower for such mode, and it is quasi- to lack preferable processing
True property and continuity.The PCB polisher lapper of the prior art has the drawback that cutting action directly results in subsequent grinding effect
Fruit is bad, low precision and lapping liquid polishing fluid flows from the top down, is easy to produce liquid splash.
Summary of the invention
In view of the deficienciess of the prior art, that the main purpose of the present invention is to provide a kind of grinding polishing effects is good accurate
Degree is high and prevents the PCB polisher lapper of lapping liquid polishing fluid spillage and precipitating.
To achieve the above object, the present invention provides the following technical scheme that a kind of PCB polisher lapper, including rack, institute
It states and is provided with work top in rack, grinding and polishing disk group and precise cross-shaped slide unit are provided on the work top, it is described
Elevating mechanism is provided on precise cross-shaped slide unit, the elevating mechanism is connected with the clamping jaw cylinder that can clamp PCB, the lifting
Outlet is provided in mechanism, the grinding and polishing disk group includes by the motor-driven thick of work top bottom is arranged in
Abrasive disk, middle abrasive disk, fine lapping disk and polishing disk are also provided with air pressure vibration in the rack below work top
Device, the rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk are provided centrally with carrier fluid pond, the Pneumatic vibrator
The vibration of carrier fluid pond is driven by connecting tube.
Preferably, the elevating mechanism is that servo goes up and down electric cylinders, in servo lifting electric cylinders on the precise cross-shaped slide unit
Lower part is provided with close to switch.
Preferably, the rough lapping disk, middle abrasive disk, fine lapping disk and the polishing disk rectangular array on work top
It is arranged.
Preferably, the rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk are arranged by independent support plate
On work top.
The present invention has the following advantages compared with the prior art, a kind of PCB polisher lapper of this programme, relative to existing
The advantages of technology, is the good precision height of grinding polishing effect and prevents lapping liquid polishing fluid from splashing out.Specifically, it has been abandoned directly
The process for connecing cutting, it is rough lapping, middle grinding and fine lapping process, maximized raising that cutting and grinding process originally, which is expanded,
Grinding effect, rough lapping disk, middle abrasive disk and fine lapping disk are driven by motor to be rotated, and is respectively provided with surface roughness not
Same grinding wheel, gradually can carry out precision ground for PCB.In this programme by precise cross-shaped slide unit cooperate elevating mechanism with
And clamping jaw cylinder can transmit PCB between each process, wherein outlet can power on and connect outside
Location position equipment, it can allied industry magnifying glass and CCD vision-based detection guarantee the precision of the position PCB.Machine
Pneumatic vibrator is also provided on frame below work top, on rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk
It is provided with carrier fluid pond, Pneumatic vibrator connect by pipeline with carrier fluid pond, and carrier fluid pond is arranged in rough lapping disk, middle abrasive disk, carefully
Inside abrasive disk and polishing disk, it is able to spray lapping liquid and polishing fluid, topples over grinding from the top down compared to more traditional
The mode of liquid or polishing fluid can prevent liquid from splashing out and precipitating.Pneumatic vibrator is pneumatic type, is able to drive in pipeline
Lapping liquid or polishing fluid be cycling in and out, avoid liquid splash.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of PCB polisher lapper of the invention；
Fig. 2 is a kind of grinding and polishing disk group of PCB polisher lapper of the invention and the side view of precise cross-shaped slide unit；
Fig. 3 is a kind of grinding and polishing disk group of PCB polisher lapper of the invention and the top view of precise cross-shaped slide unit；
Fig. 4 is that a kind of grinding and polishing disk group of PCB polisher lapper and the overall structure of precise cross-shaped slide unit of the invention are shown
It is intended to.
In figure: 1, rack；2, work top；3, grinding and polishing disk group；4, precise cross-shaped slide unit；5, elevating mechanism；6, it presss from both sides
Pawl cylinder；7, outlet；8, motor；9, polishing disk；10, Pneumatic vibrator；11, carrier fluid pond；12, support plate.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings.
As shown in Figure 1, a kind of PCB polisher lapper, including rack 1, it is provided with work top 2 in the rack 1, it is described
It is provided with grinding and polishing disk group 3 and precise cross-shaped slide unit 4 on work top 2, is provided with lifting on the precise cross-shaped slide unit 4
Mechanism 5, the elevating mechanism 5 are connected with the clamping jaw cylinder 6 that can clamp PCB, are provided with outlet on the elevating mechanism 5
7, the grinding and polishing disk group 3 include by be arranged in the rough lapping disk of 2 bottom of work top driven by motor 8, middle abrasive disk,
Fine lapping disk and polishing disk 9 are also provided with Pneumatic vibrator 10 in the lower section of work top 2 in the rack 1, described slightly to grind
Mill, middle abrasive disk, fine lapping disk and polishing disk 9 are provided centrally with carrier fluid pond 11, and the Pneumatic vibrator 10 passes through company
Adapter tube drives carrier fluid pond 11 to shake.
A kind of PCB polisher lapper of this programme, compared with the existing technology the advantages of be that grinding polishing effect is good accurate
Degree is high and prevents lapping liquid polishing fluid from splashing out.Specifically, its process for having abandoned direct cutting, cutting and grinding process originally are opened up
Exhibition is rough lapping, middle grinding and fine lapping process, maximumlly improves grinding effect, rough lapping disk, middle abrasive disk and
Fine lapping disk drives rotation by motor 8, is respectively provided with the different grinding wheel of surface roughness, can gradually carry out PCB
Precision ground.Cooperate elevating mechanism 5 and clamping jaw cylinder 6 can be by PCB in each work by precise cross-shaped slide unit 4 in this programme
It is transmitted between sequence, wherein outlet 7 can power on and connect external location position equipment, it can allied industry
Magnifying glass and CCD vision-based detection guarantee the precision of the position PCB.Referring to attached drawing 2 to 4, also in workbench in rack 1
The lower section in face 2 is provided with Pneumatic vibrator 10, is provided with carrier fluid on rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk 9
Pond 11, Pneumatic vibrator 10 are connect by pipeline with carrier fluid pond 11, and carrier fluid pond 11 is arranged in rough lapping disk, middle abrasive disk, carefully grinds
Inside mill and polishing disk 9, it is able to spray lapping liquid and polishing fluid, topples over lapping liquid from the top down compared to more traditional
Or the mode of polishing fluid, it can prevent liquid from splashing out and precipitating.Pneumatic vibrator 10 is pneumatic type, and being able to drive pipeline makes
The lapping liquid or polishing fluid obtained in carrier fluid pond 11 floats convenient for contacting with PCB, can be avoided liquid splash and precipitating.
Preferably, rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk 9 are equipped with independent Pneumatic vibrator 10, rough lapping
Disk, middle abrasive disk, fine lapping disk are respectively grinding wheel, and polishing disk 9 is that circle shape polishes hairbrush.
Preferably, the elevating mechanism 5 is that servo goes up and down electric cylinders, goes up and down electric cylinders in servo on the precise cross-shaped slide unit 4
Lower part be provided with close to switch.Servo lifting electric cylinders, which can be realized, accurately to pump, accurate to control clamping jaw cylinder 6
And the height of PCB, the setting close to switch are the dead points of determining down position, prevent damage PCB.Wherein polishing disk 9 is located at
Rearmost position, other positions are respectively that rough lapping disk, middle abrasive disk and fine lapping disk arbitrarily distribute.Further, clamping jaw
Cylinder can grab the pcb board of different number, as long as the height of control servo lifting electric cylinders.Arranging in pairs or groups micro-adjusting mechanism can be real
Now more accurate position adjustment.
Preferably, the rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk 9 are in rectangle battle array on work top 2
Column are arranged.The benefit being arranged in this way is can to save space.
Preferably, the rough lapping disk, middle abrasive disk, fine lapping disk and polishing disk 9 are set by independent support plate 12
It sets on work top 2.The benefit being arranged in this way is the interference that can be avoided between each process, and prevents Pneumatic vibrator 10
Interference to other process.
The above is only a preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
Those of ordinary skill for, several improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of PCB polisher lapper, including rack, work top is provided in the rack, it is characterised in that: the work
It is provided with grinding and polishing disk group and precise cross-shaped slide unit on table top, is provided with elevating mechanism on the precise cross-shaped slide unit, institute
It states elevating mechanism and is connected with the clamping jaw cylinder that can clamp PCB, outlet is provided on the elevating mechanism, the grinding is thrown
CD group includes rough lapping disk motor-driven, middle abrasive disk, fine lapping disk and the throwing by work top bottom is arranged in
CD is also provided with Pneumatic vibrator in the rack below work top, and the rough lapping disk, is carefully ground middle abrasive disk
Mill and polishing disk are provided centrally with carrier fluid pond, and the Pneumatic vibrator passes through connecting tube and drives the vibration of carrier fluid pond.
2. a kind of PCB polisher lapper according to claim 1, it is characterised in that: the elevating mechanism is servo lifting
Electric cylinders are provided with close to switch on the precise cross-shaped slide unit in the lower part of servo lifting electric cylinders.
3. a kind of PCB polisher lapper according to claim 1, it is characterised in that: the rough lapping disk, middle abrasive disk,
Fine lapping disk and the polishing disk rectangular array on work top are arranged.
4. a kind of PCB polisher lapper according to claim 1, it is characterised in that: the rough lapping disk, middle abrasive disk,
Fine lapping disk and polishing disk are arranged on work top by independent support plate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920583784 | 2019-04-26 | ||
| CN2019205837843 | 2019-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110125773A true CN110125773A (en) | 2019-08-16 |
Family
ID=67582782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910460066.1A Pending CN110125773A (en) | 2019-04-26 | 2019-05-30 | A kind of PCB polisher lapper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110125773A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110962038A (en) * | 2019-12-11 | 2020-04-07 | 深圳市奥特姆自动化设备有限公司 | Grinding polisher |
| CN114393497A (en) * | 2022-01-27 | 2022-04-26 | 麦伟俊 | Polishing device for stainless steel products |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557591A (en) * | 1991-08-30 | 1993-03-09 | Olympus Optical Co Ltd | Polishing method and device |
| JP2000288928A (en) * | 1999-03-31 | 2000-10-17 | Hitachi Seiki Co Ltd | Grinder control method and grinder |
| JP2003136405A (en) * | 2001-10-24 | 2003-05-14 | Applied Materials Inc | Grinding solution transporting device |
| CN202200151U (en) * | 2011-08-01 | 2012-04-25 | 沈阳机床成套设备有限责任公司 | Multistation cross-shaped sliding table-type polishing machine structure |
| CN103722473A (en) * | 2014-01-10 | 2014-04-16 | 南京宁庆数控机床制造有限公司 | Numerical control full-automatic polishing and grinding machine |
| CN203592387U (en) * | 2013-10-29 | 2014-05-14 | 南昌欧菲光学技术有限公司 | Glass grinding device |
| CN105538110A (en) * | 2015-12-31 | 2016-05-04 | 厉志安 | Dual-purpose flexible processing device used for grinding and polishing of substrate processing |
| CN106475868A (en) * | 2016-12-08 | 2017-03-08 | 东北大学 | A kind of optical surface processing five axle two-dimensional ultrasound burnishing machines and its using method |
| CN206216469U (en) * | 2016-11-23 | 2017-06-06 | 福州恒光光电有限公司 | A kind of optical element precise finiss dish structure |
| CN107378707A (en) * | 2017-08-01 | 2017-11-24 | 昆山寰升电子有限公司 | PCB surface trimming polisher lappers |
| CN208100095U (en) * | 2018-04-10 | 2018-11-16 | 惠州五和实业有限公司 | A kind of feed bin for melamine resin product unhairing edge equipment is located separately mechanism |
| CN109015335A (en) * | 2018-09-27 | 2018-12-18 | 德淮半导体有限公司 | Chemical mechanical polishing device and its working method |
-
2019
- 2019-05-30 CN CN201910460066.1A patent/CN110125773A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557591A (en) * | 1991-08-30 | 1993-03-09 | Olympus Optical Co Ltd | Polishing method and device |
| JP2000288928A (en) * | 1999-03-31 | 2000-10-17 | Hitachi Seiki Co Ltd | Grinder control method and grinder |
| JP2003136405A (en) * | 2001-10-24 | 2003-05-14 | Applied Materials Inc | Grinding solution transporting device |
| CN202200151U (en) * | 2011-08-01 | 2012-04-25 | 沈阳机床成套设备有限责任公司 | Multistation cross-shaped sliding table-type polishing machine structure |
| CN203592387U (en) * | 2013-10-29 | 2014-05-14 | 南昌欧菲光学技术有限公司 | Glass grinding device |
| CN103722473A (en) * | 2014-01-10 | 2014-04-16 | 南京宁庆数控机床制造有限公司 | Numerical control full-automatic polishing and grinding machine |
| CN105538110A (en) * | 2015-12-31 | 2016-05-04 | 厉志安 | Dual-purpose flexible processing device used for grinding and polishing of substrate processing |
| CN206216469U (en) * | 2016-11-23 | 2017-06-06 | 福州恒光光电有限公司 | A kind of optical element precise finiss dish structure |
| CN106475868A (en) * | 2016-12-08 | 2017-03-08 | 东北大学 | A kind of optical surface processing five axle two-dimensional ultrasound burnishing machines and its using method |
| CN107378707A (en) * | 2017-08-01 | 2017-11-24 | 昆山寰升电子有限公司 | PCB surface trimming polisher lappers |
| CN208100095U (en) * | 2018-04-10 | 2018-11-16 | 惠州五和实业有限公司 | A kind of feed bin for melamine resin product unhairing edge equipment is located separately mechanism |
| CN109015335A (en) * | 2018-09-27 | 2018-12-18 | 德淮半导体有限公司 | Chemical mechanical polishing device and its working method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110962038A (en) * | 2019-12-11 | 2020-04-07 | 深圳市奥特姆自动化设备有限公司 | Grinding polisher |
| CN114393497A (en) * | 2022-01-27 | 2022-04-26 | 麦伟俊 | Polishing device for stainless steel products |
| CN114393497B (en) * | 2022-01-27 | 2023-12-19 | 江门市鸿华金属制品有限公司 | Polishing device for stainless steel products |
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