CN113977112A - High-speed laser perforation method - Google Patents
High-speed laser perforation method Download PDFInfo
- Publication number
- CN113977112A CN113977112A CN202111340013.XA CN202111340013A CN113977112A CN 113977112 A CN113977112 A CN 113977112A CN 202111340013 A CN202111340013 A CN 202111340013A CN 113977112 A CN113977112 A CN 113977112A
- Authority
- CN
- China
- Prior art keywords
- workpiece
- laser
- perforation
- cutting
- equipment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000005520 cutting process Methods 0.000 claims abstract description 59
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000001301 oxygen Substances 0.000 claims abstract description 27
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 27
- 238000003754 machining Methods 0.000 claims abstract description 25
- 238000004080 punching Methods 0.000 claims abstract description 23
- 238000002360 preparation method Methods 0.000 claims abstract description 18
- 238000007664 blowing Methods 0.000 claims description 25
- 239000012535 impurity Substances 0.000 claims description 22
- 238000005086 pumping Methods 0.000 claims description 15
- 238000003698 laser cutting Methods 0.000 claims description 12
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- 239000002699 waste material Substances 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims 1
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 6
- 238000000227 grinding Methods 0.000 description 6
- 239000000835 fiber Substances 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 5
- 238000004880 explosion Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 229910002092 carbon dioxide Inorganic materials 0.000 description 3
- 239000001569 carbon dioxide Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a high-speed laser perforation method, which specifically comprises the following steps: s1, preparation of workpieces: first, a workpiece to be perforated is subjected to machining processing to adapt to a jig of a laser piercing apparatus, S2, the workpiece is mounted: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment; s3, calibration preparation, S4, primary perforation cutting, S5 and secondary perforation cutting, and the invention relates to the technical field of laser perforation. This high-speed laser perforation method increases peak power through pulse laser, improves the perforation efficiency to under the prerequisite of guaranteeing that the laser facula can not beat at the nozzle, although suitably reduce the perforation focus and come short perforation time and promote the stability of perforation, it is equivalent with cutting atmospheric pressure through control oxygen perforation atmospheric pressure, make and promote cutting efficiency, increase between multistage perforation simultaneously and stop light and blow, appear exploding the hole when avoiding perforating the thick plate, guarantee that the cutting is stable.
Description
Technical Field
The invention relates to the technical field of laser perforation, in particular to a high-speed laser perforation method.
Background
The fiber laser cutter is a laser cutter using a fiber laser generator as a light source. The optical fiber laser is a novel optical fiber laser which is newly developed internationally and outputs a laser beam with high energy density, and the laser beam is gathered on the surface of a workpiece, so that an area irradiated by a superfine focus spot on the workpiece is instantly melted and gasified, automatic cutting is realized by moving a spot irradiation position through a numerical control mechanical system, the most important advantage of the optical fiber cutting technology is the energy efficiency, the optical fiber laser cutting system has the electro-optic conversion efficiency higher than that of carbon dioxide laser cutting by virtue of a complete solid digital module and a single design of the optical fiber laser, and the actual general utilization rate is about 8-10% for each power supply unit of the carbon dioxide cutting system. While for fiber laser cutting systems, users may expect higher power efficiency, approximately between 25% and 30%, with the fiber cutting system consuming about 3 to 5 times less energy as the whole as compared to a carbon dioxide cutting system, resulting in an increase in energy efficiency to greater than 86%.
The fiber laser cutting generally adopts a pulse laser mode with high peak power to melt a small amount of materials, oxygen is commonly used for carbon steel cutting as auxiliary gas, and each pulse laser can generate smaller particle injection and gradually deepen, so that the perforation diameter is smaller, the sprayed slag is less, and the cutting start is more stable. The pulse perforation mode needs a better gas path control system to realize the fine control of gas types and gas pressure, firstly breaks an oxide layer, slag and the like on the surface of a plate in a short time and then perforates the plate at a high speed, but the prior laser perforation mode has the following defects:
1) when the thick plate is punched, the hole explosion phenomenon is easy to occur, and the problems of unstable cutting and damage to a lens and a nozzle are easy to cause;
2) in the traditional perforation mode, light is emitted according to the set parameters of power, frequency and duty ratio after reaching the set height every time, the perforation time is long, and the efficiency is low.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a high-speed laser perforation method, which solves the problems that the existing laser perforation method is easy to generate hole explosion phenomenon when perforating a thick plate, the cutting is unstable and a lens and a nozzle are damaged, and the traditional perforation method emits light according to the set parameters of power, frequency and duty ratio after reaching the set height every time, has long perforation time and low efficiency.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a high-speed laser perforation method specifically comprises the following steps:
s1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of a laser punching device;
s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment;
s3, calibration preparation: firstly, performing weighted programming on the peak power of pulse laser of the laser perforating equipment, then calibrating light, reducing the perforating focus by 0.5-0.9cm on the premise of ensuring that laser spots cannot hit a nozzle, and controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure;
s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which is installed in the step S2, performing pre-perforation on the workpiece for 1-2min to obtain a required thickness, then closing laser, and starting oxygen perforation pumping equipment in air blowing equipment to blow air at the perforation position of the workpiece;
s5, secondary perforation and cutting: and after the blowing is finished, starting the laser cutting equipment to continuously perform perforating and cutting treatment on the workpiece until the workpiece is perforated according to the required size requirement.
Preferably, the machining process of the workpiece to be perforated in step S1 includes cutting, grinding, cleaning and drying processes, wherein when the workpiece to be perforated is cut, a 3-5cm clamping portion needs to be cut and reserved on two sides of the workpiece to be perforated.
Preferably, in the step S3, the peak power of the pulsed laser of the laser perforation apparatus is increased by 0.3-0.6 KW.
Preferably, the impurities on the surface of the workpiece in step S4 are an oxide layer on the surface of the workpiece or waste residues.
Preferably, the thickness required for pre-perforating the workpiece in step S4 is one third to one half of the thickness of the workpiece.
Preferably, the laser perforating apparatuses in the steps S1-S5 are laser perforating machines with model number XH-B200.
Preferably, the time for starting the laser perforating equipment to perforate the impurities on the surface of the workpiece in the step S4 is 5-6 min.
Preferably, in the step S4, an oxygen perforation pumping device in the air blowing device is started to blow air to the perforation position of the workpiece for 3-5 min.
(III) advantageous effects
The invention provides a high-speed laser perforation method. Compared with the prior art, the method has the following beneficial effects:
(1) the high-speed laser perforation method specifically comprises the following steps: s1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of a laser punching device; s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment; s3, calibration preparation: firstly, performing weighted programming on the peak power of pulse laser of the laser perforating equipment, then calibrating light, reducing the perforating focus by 0.5-0.9cm on the premise of ensuring that laser spots cannot hit a nozzle, and controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure; s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which is installed in the step S2, performing pre-perforation on the workpiece for 1-2min to obtain a required thickness, then closing laser, and starting oxygen perforation pumping equipment in air blowing equipment to blow air at the perforation position of the workpiece; s5, secondary perforation and cutting: after blowing, starting the laser cutting equipment to continue to perforate and cut the workpiece until the workpiece is required to be perforated in required size, increasing peak power through pulse laser to improve perforating efficiency, and properly reducing a perforating focus to shorten perforating time and improve perforating stability on the premise of ensuring that laser spots cannot hit a nozzle.
(2) According to the high-speed laser perforation method, the oxygen perforation air pressure is controlled to be equivalent to the cutting air pressure, so that the cutting efficiency is improved, meanwhile, light stopping and air blowing are added between the multi-stage perforation, the hole explosion during the perforation of the thick plate is avoided, the cutting stability is ensured, and the lens and the nozzle are prevented from being damaged.
Drawings
FIG. 1 is a flow chart of an embodiment of the present invention;
FIG. 2 is a graph of experimental data for an example of an application in an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the embodiment of the present invention provides five technical solutions: a high-speed laser perforation method specifically comprises the following embodiments:
example 1
S1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of laser punching equipment, wherein the machining of the workpiece to be punched comprises the working procedures of cutting, grinding, cleaning and drying, and when the workpiece to be punched is cut, a clamping part of 3cm is reserved on two sides of the workpiece to be punched;
s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment;
s3, calibration preparation: firstly, weighting and programming the peak power of the pulse laser of the laser perforating equipment, then calibrating the light, reducing the perforating focus by 0.5cm on the premise of ensuring that laser spots cannot hit a nozzle, controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure, and increasing the peak power of the pulse laser which is weighted and programmed by 0.3 KW;
s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which are installed in the step S2, the thickness of the workpiece to be processed is required to be pre-perforated for 1min, then closing laser, starting oxygen perforation pumping equipment in air blowing equipment to blow air to the perforation position of the workpiece, wherein the impurities on the surface of the workpiece are an oxide layer or waste residues on the surface of the workpiece, the thickness of the workpiece to be pre-perforated is one third of the thickness of the workpiece, the time for starting the laser perforation equipment to perforate the impurities on the surface of the workpiece is 5min, and starting the oxygen perforation pumping equipment in the air blowing equipment to blow air to the perforation position of the workpiece for 3 min;
s5, secondary perforation and cutting: and after the blowing is finished, starting the laser cutting equipment to continuously perform perforating and cutting treatment on the workpiece until the workpiece is perforated according to the required size requirement.
Example 2
S1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of laser punching equipment, wherein the machining of the workpiece to be punched comprises the working procedures of cutting, grinding, cleaning and drying, and when the workpiece to be punched is cut, a clamping part of 3.5cm is reserved on two sides of the workpiece to be punched in a cutting mode;
s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment;
s3, calibration preparation: firstly, weighting and programming the peak power of the pulse laser of the laser perforating equipment, then calibrating the light, reducing the perforating focus by 0.6cm on the premise of ensuring that laser spots cannot hit a nozzle, controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure, and increasing the peak power of the pulse laser which is weighted and programmed by 0.4 KW;
s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which are installed in the step S2, the thickness of the workpiece to be pre-perforated is 1.25min, then closing the laser, starting oxygen perforation pumping equipment in the blowing equipment to blow air to the perforation position of the workpiece, wherein the impurities on the surface of the workpiece are an oxide layer or waste residues on the surface of the workpiece, the thickness of the workpiece to be pre-perforated is half of the thickness of the workpiece, the time for starting the laser perforation equipment to perforate the impurities on the surface of the workpiece is 5.25min, and starting the oxygen perforation pumping equipment in the blowing equipment to blow air to the perforation position of the workpiece for 3.25 min;
s5, secondary perforation and cutting: and after the blowing is finished, starting the laser cutting equipment to continuously perform perforating and cutting treatment on the workpiece until the workpiece is perforated according to the required size requirement.
Example 3
S1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of laser punching equipment, wherein the machining of the workpiece to be punched comprises the working procedures of cutting, grinding, cleaning and drying, and when the workpiece to be punched is cut, a clamping part of 4cm is reserved on two sides of the workpiece to be punched;
s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment;
s3, calibration preparation: firstly, weighting and programming the peak power of the pulse laser of the laser perforating equipment, then calibrating the light, reducing the perforating focus by 0.7cm on the premise of ensuring that laser spots cannot hit a nozzle, controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure, and increasing the peak power of the pulse laser which is weighted and programmed by 0.5 KW;
s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which are installed in the step S2, the thickness of the workpiece to be pre-perforated is 1.5min, then closing laser, starting oxygen perforation pumping equipment in air blowing equipment to blow air at the perforation position of the workpiece, wherein the impurities on the surface of the workpiece are an oxide layer or waste residues on the surface of the workpiece, the thickness of the workpiece to be pre-perforated is one third of the thickness of the workpiece, the time for starting the laser perforation equipment to perforate the impurities on the surface of the workpiece is 5.5min, and starting the oxygen perforation pumping equipment in the air blowing equipment to blow air at the perforation position of the workpiece for 4 min;
s5, secondary perforation and cutting: and after the blowing is finished, starting the laser cutting equipment to continuously perform perforating and cutting treatment on the workpiece until the workpiece is perforated according to the required size requirement.
Example 4
S1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of laser punching equipment, wherein the machining of the workpiece to be punched comprises the working procedures of cutting, grinding, cleaning and drying, and when the workpiece to be punched is cut, a clamping part of 4.5cm is reserved on two sides of the workpiece to be punched;
s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment;
s3, calibration preparation: firstly, weighting and programming the peak power of the pulse laser of the laser perforating equipment, then calibrating the light, reducing the perforating focus by 0.8cm on the premise of ensuring that laser spots cannot hit a nozzle, controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure, and increasing the peak power of the pulse laser which is weighted and programmed by 0.55 KW;
s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which are installed in the step S2, the thickness of the workpiece to be pre-perforated is 1.75min, then closing the laser, starting oxygen perforation pumping equipment in the blowing equipment to blow air to the perforation position of the workpiece, wherein the impurities on the surface of the workpiece are an oxide layer or waste residues on the surface of the workpiece, the thickness of the workpiece to be pre-perforated is half of the thickness of the workpiece, the time for starting the laser perforation equipment to perforate the impurities on the surface of the workpiece is 5.75min, and starting the oxygen perforation pumping equipment in the blowing equipment to blow air to the perforation position of the workpiece for 4.5 min;
s5, secondary perforation and cutting: and after the blowing is finished, starting the laser cutting equipment to continuously perform perforating and cutting treatment on the workpiece until the workpiece is perforated according to the required size requirement.
Example 5
S1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of laser punching equipment, wherein the machining of the workpiece to be punched comprises the working procedures of cutting, grinding, cleaning and drying, and when the workpiece to be punched is cut, a clamping part of 5cm is reserved on two sides of the workpiece to be punched;
s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment;
s3, calibration preparation: firstly, weighting and programming the peak power of the pulse laser of the laser perforating equipment, then calibrating the light, reducing the perforating focus by 0.9cm on the premise of ensuring that laser spots cannot hit a nozzle, controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure, and increasing the peak power of the pulse laser which is weighted and programmed by 0.6 KW;
s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which are installed in the step S2, the thickness of the workpiece to be processed is required to be pre-perforated for 2min, then closing laser, starting oxygen perforation pumping equipment in air blowing equipment to blow air to the perforation position of the workpiece, wherein the impurities on the surface of the workpiece are an oxide layer or waste residues on the surface of the workpiece, the thickness of the workpiece to be pre-perforated is one third of the thickness of the workpiece, the time for starting the laser perforation equipment to perforate the impurities on the surface of the workpiece is 6min, and starting the oxygen perforation pumping equipment in the air blowing equipment to blow air to the perforation position of the workpiece for 5 min;
s5, secondary perforation and cutting: and after the blowing is finished, starting the laser cutting equipment to continuously perform perforating and cutting treatment on the workpiece until the workpiece is perforated according to the required size requirement.
In the embodiment of the invention, the laser perforating devices in the steps S1-S5 all adopt a laser perforating machine with the model number XH-B200.
Examples of the applications
Pulse period: t ═ 1/frequency, pulse width: as shown in fig. 2, the pulse frequency is 500HZ, and the duty ratio is 50%, so that: the pulse period T is 1/500 ═ 2ms, and the pulse width T is 2 × 50 ═ 1 ms.
In summary, the present invention increases the peak power by the pulse laser to improve the punching efficiency, and properly reduces the punching focus to shorten the punching time and improve the punching stability on the premise of ensuring that the laser spot does not hit the nozzle, and improves the cutting efficiency by controlling the oxygen punching air pressure to be equal to the cutting air pressure, and simultaneously increases the light-stopping air blowing between the multiple stages of punching to avoid the occurrence of hole explosion when the thick plate is punched, thereby ensuring the cutting stability and preventing the lens and the nozzle from being damaged.
And those not described in detail in this specification are well within the skill of those in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A high-speed laser perforation method, characterized by: the method specifically comprises the following steps:
s1, preparation of workpieces: firstly, machining a workpiece to be punched to adapt to a clamp of a laser punching device;
s2, mounting a workpiece: mounting the workpiece to be punched after the machining in the step S1 on a workbench clamp of laser punching equipment;
s3, calibration preparation: firstly, performing weighted programming on the peak power of pulse laser of the laser perforating equipment, then calibrating light, reducing the perforating focus by 0.5-0.9cm on the premise of ensuring that laser spots cannot hit a nozzle, and controlling the oxygen perforating air pressure of the laser perforating equipment to be the same as the cutting air pressure;
s4, primary perforation and cutting: starting laser perforation equipment to perforate impurities on the surface of the workpiece to be processed, which is installed in the step S2, performing pre-perforation on the workpiece for 1-2min to obtain a required thickness, then closing laser, and starting oxygen perforation pumping equipment in air blowing equipment to blow air at the perforation position of the workpiece;
s5, secondary perforation and cutting: and after the blowing is finished, starting the laser cutting equipment to continuously perform perforating and cutting treatment on the workpiece until the workpiece is perforated according to the required size requirement.
2. A high-speed laser perforation method according to claim 1, wherein: the machining process of the workpiece to be punched in the step S1 includes cutting, polishing, cleaning, and drying processes, wherein when the workpiece to be punched is cut, a clamping portion of 3-5cm is reserved on two sides of the workpiece to be punched.
3. A high-speed laser perforation method according to claim 1, wherein: in the step S3, the peak power of the pulse laser of the laser perforation apparatus is increased by 0.3 to 0.6 KW.
4. A high-speed laser perforation method according to claim 1, wherein: and in the step S4, the impurities on the surface of the workpiece are an oxide layer on the surface of the workpiece or waste residues.
5. A high-speed laser perforation method according to claim 1, wherein: the thickness required for pre-piercing the workpiece in step S4 is one third to one half of the workpiece thickness.
6. A high-speed laser perforation method according to claim 1, wherein: the laser perforating apparatuses in the steps S1-S5 all used a laser perforating machine model XH-B200.
7. A high-speed laser perforation method according to claim 1, wherein: and in the step S4, the time for the laser perforating equipment to perforate the impurities on the surface of the workpiece is 5-6 min.
8. A high-speed laser perforation method according to claim 1, wherein: and in the step S4, starting oxygen perforation pumping equipment in the air blowing equipment to blow air for 3-5min at the perforation position of the workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111340013.XA CN113977112A (en) | 2021-11-12 | 2021-11-12 | High-speed laser perforation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111340013.XA CN113977112A (en) | 2021-11-12 | 2021-11-12 | High-speed laser perforation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113977112A true CN113977112A (en) | 2022-01-28 |
Family
ID=79748251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111340013.XA Pending CN113977112A (en) | 2021-11-12 | 2021-11-12 | High-speed laser perforation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113977112A (en) |
Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1310073A (en) * | 1994-02-24 | 2001-08-29 | 三菱电机株式会社 | Laser cutting method and apparatus |
| WO2004024384A1 (en) * | 2002-09-13 | 2004-03-25 | Tamicare Ltd. | Laser modification of complex objects |
| US20050263501A1 (en) * | 2004-06-01 | 2005-12-01 | Ddk Ltd. | Laser beam processing method and component machined by the method |
| CN102642084A (en) * | 2011-01-21 | 2012-08-22 | 莱丹科技股份公司 | Method for adjusting a laser light spot and laser assembly for carrying out the method |
| CN102962589A (en) * | 2012-11-28 | 2013-03-13 | 江苏金方圆数控机床有限公司 | Pulse laser drilling device and drilling method thereof |
| CN103962734A (en) * | 2014-05-22 | 2014-08-06 | 江苏金方圆数控机床有限公司 | Laser cutting rapid zooming mechanism and rapid zooming punching method |
| CN105583526A (en) * | 2008-03-21 | 2016-05-18 | Imra美国公司 | Laser-Based Material Processing Method And System |
| CN106271058A (en) * | 2016-08-29 | 2017-01-04 | 无锡洲翔成套焊接设备有限公司 | The cut technique less than sheet metal thickness diameter circular aperture is carried out on sheet material |
| CN107931781A (en) * | 2017-12-20 | 2018-04-20 | 西安航空学院 | Double metallic composite material electric arc increasing material manufacturing device and its manufacture method |
| CN109297976A (en) * | 2018-09-03 | 2019-02-01 | 广东工业大学 | Laser fuU penetration welding defect detection platform and method based on laser weld energy distribution |
| CN109530933A (en) * | 2018-11-15 | 2019-03-29 | 无锡洲翔激光设备有限公司 | A kind of technique of the quick perforation cuts aperture of slab |
| CN109870678A (en) * | 2018-12-06 | 2019-06-11 | 苏州镭图光电科技有限公司 | Laser radar transmission power and the Gain Automatic adjusting method of echo and regulating device |
| CN110014237A (en) * | 2019-04-10 | 2019-07-16 | 无锡洲翔激光设备有限公司 | The quick piercing process of thick stainless steel plate in one kind |
| CN209342620U (en) * | 2018-09-03 | 2019-09-03 | 广东工业大学 | Laser fuU penetration welding defect detection platform based on laser weld energy distribution |
| CN110355468A (en) * | 2018-04-10 | 2019-10-22 | 上海柏楚电子科技股份有限公司 | A kind of piercing process and its side-blown device for laser cutting |
| CN110814544A (en) * | 2019-11-18 | 2020-02-21 | 温州大学 | High-precision hole making method for double-laser composite cutting |
| CN112008236A (en) * | 2020-09-09 | 2020-12-01 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting equipment for ferrite |
| CN112077462A (en) * | 2020-09-17 | 2020-12-15 | 伯纳激光科技有限公司 | Laser perforation method applied to carbon steel |
| CN112276345A (en) * | 2020-10-10 | 2021-01-29 | 深圳市韵腾激光科技有限公司 | Laser processing system and method for monitoring laser power change |
| CN112935553A (en) * | 2021-03-23 | 2021-06-11 | 昆山华恒焊接股份有限公司 | Laser welding system, laser welding control method, laser welding control device, and storage medium |
| CN213531258U (en) * | 2020-10-29 | 2021-06-25 | 江苏乐希激光科技有限公司 | Oxygen-assisted laser cutting machine using magnetic force to remove slag |
| CN113042911A (en) * | 2021-04-22 | 2021-06-29 | 无锡市驰圣金属科技有限公司 | Method for cutting metal plate by optical fiber laser |
-
2021
- 2021-11-12 CN CN202111340013.XA patent/CN113977112A/en active Pending
Patent Citations (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1310073A (en) * | 1994-02-24 | 2001-08-29 | 三菱电机株式会社 | Laser cutting method and apparatus |
| WO2004024384A1 (en) * | 2002-09-13 | 2004-03-25 | Tamicare Ltd. | Laser modification of complex objects |
| US20050263501A1 (en) * | 2004-06-01 | 2005-12-01 | Ddk Ltd. | Laser beam processing method and component machined by the method |
| CN105583526A (en) * | 2008-03-21 | 2016-05-18 | Imra美国公司 | Laser-Based Material Processing Method And System |
| CN102642084A (en) * | 2011-01-21 | 2012-08-22 | 莱丹科技股份公司 | Method for adjusting a laser light spot and laser assembly for carrying out the method |
| CN102962589A (en) * | 2012-11-28 | 2013-03-13 | 江苏金方圆数控机床有限公司 | Pulse laser drilling device and drilling method thereof |
| CN103962734A (en) * | 2014-05-22 | 2014-08-06 | 江苏金方圆数控机床有限公司 | Laser cutting rapid zooming mechanism and rapid zooming punching method |
| CN106271058A (en) * | 2016-08-29 | 2017-01-04 | 无锡洲翔成套焊接设备有限公司 | The cut technique less than sheet metal thickness diameter circular aperture is carried out on sheet material |
| CN107931781A (en) * | 2017-12-20 | 2018-04-20 | 西安航空学院 | Double metallic composite material electric arc increasing material manufacturing device and its manufacture method |
| CN110355468A (en) * | 2018-04-10 | 2019-10-22 | 上海柏楚电子科技股份有限公司 | A kind of piercing process and its side-blown device for laser cutting |
| CN209342620U (en) * | 2018-09-03 | 2019-09-03 | 广东工业大学 | Laser fuU penetration welding defect detection platform based on laser weld energy distribution |
| CN109297976A (en) * | 2018-09-03 | 2019-02-01 | 广东工业大学 | Laser fuU penetration welding defect detection platform and method based on laser weld energy distribution |
| CN109530933A (en) * | 2018-11-15 | 2019-03-29 | 无锡洲翔激光设备有限公司 | A kind of technique of the quick perforation cuts aperture of slab |
| CN109870678A (en) * | 2018-12-06 | 2019-06-11 | 苏州镭图光电科技有限公司 | Laser radar transmission power and the Gain Automatic adjusting method of echo and regulating device |
| CN110014237A (en) * | 2019-04-10 | 2019-07-16 | 无锡洲翔激光设备有限公司 | The quick piercing process of thick stainless steel plate in one kind |
| CN110814544A (en) * | 2019-11-18 | 2020-02-21 | 温州大学 | High-precision hole making method for double-laser composite cutting |
| CN112008236A (en) * | 2020-09-09 | 2020-12-01 | 大族激光科技产业集团股份有限公司 | Laser cutting method and laser cutting equipment for ferrite |
| CN112077462A (en) * | 2020-09-17 | 2020-12-15 | 伯纳激光科技有限公司 | Laser perforation method applied to carbon steel |
| CN112276345A (en) * | 2020-10-10 | 2021-01-29 | 深圳市韵腾激光科技有限公司 | Laser processing system and method for monitoring laser power change |
| CN213531258U (en) * | 2020-10-29 | 2021-06-25 | 江苏乐希激光科技有限公司 | Oxygen-assisted laser cutting machine using magnetic force to remove slag |
| CN112935553A (en) * | 2021-03-23 | 2021-06-11 | 昆山华恒焊接股份有限公司 | Laser welding system, laser welding control method, laser welding control device, and storage medium |
| CN113042911A (en) * | 2021-04-22 | 2021-06-29 | 无锡市驰圣金属科技有限公司 | Method for cutting metal plate by optical fiber laser |
Non-Patent Citations (3)
| Title |
|---|
| 唐亮;仲元昌;张成祥;王军强;: "激光无线传能关键技术研究现状及发展趋势", 激光杂志 * |
| 畅雪苹;王丹丹;王谦;: "浅析激光切割技术的应用", 汽车实用技术 * |
| 花银群,陈瑞芳,张永康,杨继昌: "激光切割表面质量比照判别与控制方法", 金属热处理 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR0158278B1 (en) | Method and apparatus for laser | |
| EP0213546B1 (en) | Laser-processing method | |
| WO2017210899A1 (en) | Method and device for cutting sapphire | |
| US5168143A (en) | Method for laser cutting metal plates | |
| US20220168841A1 (en) | Method for flame cutting by means of a laser beam | |
| CN108115292A (en) | The method and diced system of laser cut workpieces corner | |
| CN112453730A (en) | Laser processing system and processing method for micropores with high depth-diameter ratio | |
| US20220152744A1 (en) | Beam machining plate-like or tubular workpieces | |
| US20100072182A1 (en) | Fiber Laser Cutting Process with Multiple Foci | |
| CN104014936A (en) | Laser processing method and laser cutting systems of high molecular workpieces | |
| JPH10305384A (en) | Laser processing apparatus | |
| WO2022222429A1 (en) | Method for short-wavelength pulse laser drilling on pcb, and related drilling apparatus | |
| CN113977112A (en) | High-speed laser perforation method | |
| CN113042911A (en) | Method for cutting metal plate by optical fiber laser | |
| CN111822879A (en) | Ultrafast laser processing device and processing method for ferrite material | |
| CN109590620B (en) | Laser shearing process for spent fuel simulation element rod | |
| CN217344054U (en) | Laser beam machining apparatus for producing countersunk holes | |
| CA2034551C (en) | Method for laser cutting metal plates | |
| JP2618730B2 (en) | Laser processing method and laser processing apparatus | |
| CN113118650B (en) | Thick plate laser perforation processing method | |
| CN114871600B (en) | Laser perforation method for thick plate vanwatt-level optical fiber | |
| CN112192053A (en) | Thin steel plate laser cutting method | |
| JPH03221287A (en) | Method and device for laser beam machining | |
| JPH08118053A (en) | Workpiece cutting process | |
| JPH0263693A (en) | Laser beam machining method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220128 |