CN113973439A - Method for solving resistance welding hole entering and enhancing tin climbing capability of hole wall - Google Patents
Method for solving resistance welding hole entering and enhancing tin climbing capability of hole wall Download PDFInfo
- Publication number
- CN113973439A CN113973439A CN202111046583.8A CN202111046583A CN113973439A CN 113973439 A CN113973439 A CN 113973439A CN 202111046583 A CN202111046583 A CN 202111046583A CN 113973439 A CN113973439 A CN 113973439A
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- CN
- China
- Prior art keywords
- hole
- laser
- wall
- solving
- solder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003466 welding Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 21
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 10
- 230000009194 climbing Effects 0.000 title claims abstract description 10
- 229910000679 solder Inorganic materials 0.000 claims abstract description 48
- 238000012545 processing Methods 0.000 claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 claims abstract description 16
- 238000001259 photo etching Methods 0.000 claims abstract description 15
- 238000011282 treatment Methods 0.000 claims abstract description 12
- 230000007547 defect Effects 0.000 claims abstract description 10
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 4
- 241001270131 Agaricus moelleri Species 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000007788 roughening Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Abstract
The invention discloses a method for solving solder resistance hole entering and enhancing tin climbing capability of a hole wall, which comprises the following steps: collecting resistance welding hole inlet data, and manufacturing engineering data: using a hole inspection machine to find out each defect point of the solder mask inlet hole on the circuit board, and manufacturing laser photoetching engineering data according to the position of each defect point of the solder mask inlet hole; step (2) laser removal: placing the circuit board on laser equipment, importing engineering data into laser processing equipment, forming processing data according to the engineering data, accurately aligning the processing data with the circuit board, and removing a solder resist in a welding hole by adopting laser photoetching; step (3), laser microprocessing: changing laser energy, and carrying out surface micro-treatment on the wall of the welding hole. The method realizes the rapid removal of the internal resistance welding agent in the welding hole, improves the hole wall quality of the welding hole, simplifies the production flow and reduces the cost.
Description
Technical Field
The invention is applied to the field of bare board manufacturing of circuit boards and component assembly, and particularly relates to a method for solving solder resistance hole feeding and enhancing tin climbing capability of hole walls.
Background
On the surface of the bare circuit board, a solder resist pattern is formed in a region covered with a solder resist. The solder resist pattern is a protective covering layer for the circuit board, is selectively coated on the surface of a finished printed board, and is coated with a solder resist at all positions except for the inner walls of the bonding pads and the metallized holes. The solder resist masks and protects the surface of the printed wire and also masks and protects the blank area of the board surface, and when the component and the circuit board are welded together, the solder resist plays a role in isolation and can prevent the short circuit phenomenon between the wires or the pads caused by the free flow of the molten solder to a certain extent.
In the actual production process of circuit board, it is downthehole that printing ink gets into the circuit board very easily, for preventing that printing ink gets into the welding hole when the silk screen printing, causes printing ink stifled hole, generally need keep off some nets according to the corresponding silk screen printing of setting preparation such as pad and welding hole before the silk screen printing, keeps off the drill way of some sheltering from the welding hole through the silk screen printing and in order to prevent that printing ink from flowing into downthehole by the fender point on the some nets. However, in actual production operation, solder resist ink may infiltrate from the edge of the partial blocking point, especially the orifice blocking point of the solder through hole, causing a problem that the solder resist ink blocks the hole in the partial solder hole. There are two current solutions. One approach is to reduce the development speed and thereby increase the development time for better removal of residual ink. However, the method reduces the production efficiency, and easily causes the side etching of the solder mask layer to be too large, thereby affecting the reliability of the circuit board. Another approach is to add a post-drilling step. The method is easy to cause the solder mask to break, and the hole position precision can not be ensured, so that the problem of ink hole blocking can not be effectively solved.
Disclosure of Invention
Aiming at the defects of the technology, the invention provides a method for solving the problems of solder resist hole entering and enhancing the tin climbing capability of the hole wall, which can realize the quick removal of the solder resist in the welding hole, improve the quality of the hole wall of the welding hole, simplify the production flow and reduce the cost.
The above object of the present invention is achieved by the following technical solutions:
a method for solving solder resistance hole entering and enhancing tin climbing capability of a hole wall is characterized by comprising the following specific steps:
(1) collecting resistance welding hole inlet data, and making engineering data: using a hole inspection machine to find out each defect point of the solder mask inlet hole on the circuit board, and manufacturing laser photoetching engineering data according to the position of each defect point of the solder mask inlet hole;
(2) laser removal: placing the circuit board on laser equipment, importing engineering data into laser processing equipment, forming processing data according to the engineering data, accurately aligning the processing data with the circuit board, and removing a solder resist in a welding hole by adopting laser photoetching;
(3) laser micro-processing: laser energy is changed by adjusting parameters such as laser output power, frequency and the like, surface micro-processing is carried out on the wall of the welded hole, so that complete removal of solder resist in the hole is ensured, and micro-roughening processing is carried out on a copper layer on the wall of the hole.
Further: in the step (2), when the residual solder resist in the hole is subjected to photoetching removal treatment, air blowing is assisted at the hole opening, and meanwhile, an air suction device is additionally arranged at the bottom to timely discharge the ionic gas and residues generated in the processing process.
Further: the laser photoetching operation in the step (2) is carried out in a protective gas environment, preferably in a nitrogen or argon environment.
Further: the wavelength range of the laser light source adopted in the steps (2) and (3) is 355-10700 nm, and the diameter of a light spot is 5-300 mu m; power: 0.5-200W; the pulse duration is 1 ps-1000 ns.
Further: and (3) performing flattop treatment and shoulder cutting shaping treatment on the laser beam projected by the laser source adopted in the step (2) and focusing the laser beam on the surface of the material after the laser beam passes through a diffraction optical element DOE.
Further: and (3) transmitting the laser beam projected by the laser source adopted in the step (2) to the processing head by adopting a coaxial blowing rotary cutting head or a galvanometer type scanning system, and then projecting the laser beam to the surface of the processed material.
The invention has the advantages and effects that:
1. the method adopts laser photoetching to remove the solder resist in the welding hole according to the collected solder resist hole defect point data, effectively solves the technical problem of solder resist hole entry, simplifies the production flow, saves the coating process of a weldable protective material and related equipment, greatly saves the material, reduces the energy consumption, reduces the investment cost and the production cost, and lightens the environmental burden
2. After the hole solder resist is removed, the hole wall is subjected to solderability treatment by laser, so that the pin tin climbing during subsequent component welding is facilitated, and the welding reliability is improved.
3. The circuit board processed by the invention can be directly subjected to wave soldering, selective soldering or manual soldering of components without OSP, hot air leveling, chemical silver and other surface coatings, or directly subjected to solder paste skip printing and SMT component assembly.
4. The invention can select various laser, can use laser with various wavelengths such as infrared, green light, ultraviolet and the like, has various selectable materials, and improves the manufacturing flexibility.
Detailed Description
The invention will be further described with reference to an embodiment. The following examples are illustrative and not intended to be limiting, and are not intended to limit the scope of the invention.
The invention discloses a method for solving solder resistance hole entering and enhancing tin climbing capability of a hole wall, which comprises the following specific steps:
collecting resistance welding hole inlet data, and manufacturing engineering data: using a hole inspection machine to find out each defect point of the solder mask inlet hole on the circuit board, and manufacturing laser photoetching engineering data according to the position of each defect point of the solder mask inlet hole;
step (2) laser removal: placing the circuit board on laser equipment, importing engineering data into laser processing equipment, forming processing data according to the engineering data, accurately aligning the processing data with the circuit board, and removing a solder resist in a welding hole by adopting laser photoetching;
step (3), laser microprocessing: the laser energy is changed by adjusting parameters such as laser output power, frequency and the like, and surface micro-processing is carried out on the wall of the welding hole, so as to ensure that the solder resist in the hole is completely removed. Meanwhile, each laser spot is tangent by adjusting the laser output frequency and the scanning speed, and a micro pit is formed on the hole wall copper layer, so that the hole wall copper layer is subjected to micro coarsening treatment.
In the step (2), when the residual solder resist in the hole is removed by photoetching, air is preferably blown into the hole, and an air suction device is additionally arranged at the bottom, so that the ionic gas and residues generated in the processing process can be timely discharged.
The laser photoetching removal operation in the step (2) can be carried out in an atmospheric environment or a protective gas environment, preferably in a nitrogen or argon protective gas environment, so that residues generated in the processing process can be blown away, the optical lens is protected from being polluted, and the copper surface is protected from being oxidized.
The wavelength range of the laser light source adopted in the steps (2) and (3) is 355-10700 nm, and the diameter of a light spot is 5-300 mu m; power: 0.5-200W; the pulse duration is 1 ps-1000 ns.
The laser beam projected by the laser source adopted in the step (2) can be projected to the surface of the material without beam shaping treatment or after the laser beam is subjected to flattop treatment, shoulder cutting shaping and other treatments and focuses by the diffractive optical element DOE, so that the energy distribution of the shaped beam is more uniform, the thermal effect influence of the outer edge area of a light spot can be avoided, and the surface quality of laser processing is improved.
And (3) transmitting the laser beam projected by the laser source adopted in the step (2) to the processing head by adopting a coaxial blowing rotary cutting head or a galvanometer type scanning system, and then projecting the laser beam to the surface of the processed material.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept, and these changes and modifications are all within the scope of the present invention.
Claims (6)
1. A method for solving solder resistance hole entering and enhancing tin climbing capability of a hole wall is characterized by comprising the following specific steps:
collecting resistance welding hole inlet data, and manufacturing engineering data: using a hole inspection machine to find out each defect point of the solder mask inlet hole on the circuit board, and manufacturing laser photoetching engineering data according to the position of each defect point of the solder mask inlet hole;
step (2) laser removal: placing the circuit board on laser equipment, importing engineering data into laser processing equipment, forming processing data according to the engineering data, accurately aligning the processing data with the circuit board, and removing a solder resist in a welding hole by adopting laser photoetching;
step (3), laser microprocessing: laser energy is changed by adjusting parameters such as laser output power, frequency and the like, surface micro-processing is carried out on the wall of the welded hole, so that complete removal of solder resist in the hole is ensured, and micro-roughening processing is carried out on a copper layer on the wall of the hole.
2. The method for solving the solder mask access hole and enhancing the tin-climbing capability of the hole wall as claimed in claim 1, wherein: in the step (2), when the residual solder resist in the hole is subjected to photoetching removal treatment, air blowing is assisted at the hole opening, and meanwhile, an air suction device is additionally arranged at the bottom to timely discharge the ionic gas and residues generated in the processing process.
3. The method for solving the solder mask access hole and enhancing the tin-climbing capability of the hole wall as claimed in claim 1, wherein: the laser photoetching operation in the step (2) is carried out in a protective gas environment, preferably in a nitrogen or argon environment.
4. The method for solving the solder mask access hole and enhancing the tin-climbing capability of the hole wall as claimed in claim 1, wherein: the wavelength range of the laser light source adopted in the steps (2) and (3) is 355-10700 nm, and the diameter of a light spot is 5-300 mu m; power: 0.5-200W; the pulse duration is 1 ps-1000 ns.
5. The method for solving the solder mask access hole and enhancing the tin-climbing capability of the hole wall as claimed in claim 1, wherein: and (3) performing flattop treatment and shoulder cutting shaping treatment on the laser beam projected by the laser source adopted in the step (2) and focusing the laser beam on the surface of the material after the laser beam passes through a diffraction optical element DOE.
6. The method for solving the solder mask access hole and enhancing the tin climbing capability of the hole wall as claimed in claim 1, wherein: and (3) transmitting the laser beam projected by the laser source adopted in the step (2) to the processing head by adopting a coaxial blowing rotary cutting head or a galvanometer type scanning system, and then projecting the laser beam to the surface of the processed material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111046583.8A CN113973439A (en) | 2021-09-07 | 2021-09-07 | Method for solving resistance welding hole entering and enhancing tin climbing capability of hole wall |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111046583.8A CN113973439A (en) | 2021-09-07 | 2021-09-07 | Method for solving resistance welding hole entering and enhancing tin climbing capability of hole wall |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113973439A true CN113973439A (en) | 2022-01-25 |
Family
ID=79586909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111046583.8A Pending CN113973439A (en) | 2021-09-07 | 2021-09-07 | Method for solving resistance welding hole entering and enhancing tin climbing capability of hole wall |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113973439A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005252155A (en) * | 2004-03-08 | 2005-09-15 | Ibiden Co Ltd | Structure, method for manufacturing the same, printed circuit board, and method for manufacturing the same |
| CN1882223A (en) * | 2005-06-14 | 2006-12-20 | 南亚电路板股份有限公司 | Printed circuit board making method |
| CN101805903A (en) * | 2010-04-12 | 2010-08-18 | 太原理工大学 | Method for cladding copper alloy layer on surface of steel substrate by laser brazing |
| CN102963146A (en) * | 2012-09-29 | 2013-03-13 | 深圳光韵达光电科技股份有限公司 | SMT (surface mounted technology) laser stencil and manufacture method thereof |
| CN103052271A (en) * | 2012-12-17 | 2013-04-17 | 天津市德中技术发展有限公司 | Method for producing resistance soldering pattern and capable of conducting solderability treatment on surface of welding area |
| CN104185355A (en) * | 2013-05-22 | 2014-12-03 | 深南电路有限公司 | Manufacturing method for circuit board and circuit board |
| CN109511230A (en) * | 2018-09-20 | 2019-03-22 | 通元科技(惠州)有限公司 | A kind of wiring board welding resistance spray printing processing method |
| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN111299842A (en) * | 2018-12-11 | 2020-06-19 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN111540687A (en) * | 2020-05-07 | 2020-08-14 | 苏州融睿电子科技有限公司 | Packaging shell, processing method and manufacturing method thereof, laser and storage medium |
-
2021
- 2021-09-07 CN CN202111046583.8A patent/CN113973439A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005252155A (en) * | 2004-03-08 | 2005-09-15 | Ibiden Co Ltd | Structure, method for manufacturing the same, printed circuit board, and method for manufacturing the same |
| CN1882223A (en) * | 2005-06-14 | 2006-12-20 | 南亚电路板股份有限公司 | Printed circuit board making method |
| CN101805903A (en) * | 2010-04-12 | 2010-08-18 | 太原理工大学 | Method for cladding copper alloy layer on surface of steel substrate by laser brazing |
| CN102963146A (en) * | 2012-09-29 | 2013-03-13 | 深圳光韵达光电科技股份有限公司 | SMT (surface mounted technology) laser stencil and manufacture method thereof |
| CN103052271A (en) * | 2012-12-17 | 2013-04-17 | 天津市德中技术发展有限公司 | Method for producing resistance soldering pattern and capable of conducting solderability treatment on surface of welding area |
| CN104185355A (en) * | 2013-05-22 | 2014-12-03 | 深南电路有限公司 | Manufacturing method for circuit board and circuit board |
| CN109511230A (en) * | 2018-09-20 | 2019-03-22 | 通元科技(惠州)有限公司 | A kind of wiring board welding resistance spray printing processing method |
| CN111299842A (en) * | 2018-12-11 | 2020-06-19 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN110337192A (en) * | 2019-07-04 | 2019-10-15 | 珠海崇达电路技术有限公司 | A kind of welding resistance layer manufacturing method thereof improving solder mask plug-hole |
| CN111540687A (en) * | 2020-05-07 | 2020-08-14 | 苏州融睿电子科技有限公司 | Packaging shell, processing method and manufacturing method thereof, laser and storage medium |
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