CN113970688A - General test platform and test method for IGBT power module - Google Patents

General test platform and test method for IGBT power module Download PDF

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Publication number
CN113970688A
CN113970688A CN202111250841.4A CN202111250841A CN113970688A CN 113970688 A CN113970688 A CN 113970688A CN 202111250841 A CN202111250841 A CN 202111250841A CN 113970688 A CN113970688 A CN 113970688A
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test
upper computer
igbt
power module
voltage
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王武
马天骄
彭柏龄
李印
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TBEA Xinjiang Sunoasis Co Ltd
TBEA Xian Electric Technology Co Ltd
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TBEA Xinjiang Sunoasis Co Ltd
TBEA Xian Electric Technology Co Ltd
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    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices

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Abstract

A universal test platform and a test method for an IGBT power module are disclosed, the test platform comprises an upper computer software system, a DSP control panel is controlled by an upper computer through an RS485 bus, the DSP control panel can control a peripheral accompanying and testing and power distribution system, the upper computer controls the output of a high-voltage direct-current programming power supply through a communication interface, the upper computer controls a program-controlled heating table through the communication interface to heat a UUT module, the DSP control panel controls the start and stop of a cooling fan, an FPGA drive wave-emitting plate is connected to the drive side of the UUT module after photoelectric isolation, a temperature and humidity collector uploads collected information to the upper computer through the communication interface, and an oscilloscope reports collected voltage and current waveform data of the UUT module to the upper computer through the communication interface to analyze and calculate.

Description

General test platform and test method for IGBT power module
Technical Field
The invention relates to the technical field of testing of IGBT power modules in the power electronic industry, in particular to a universal testing platform and a testing method for the IGBT power modules, which are suitable for products such as flexible direct-current power transmission, photovoltaic grid-connected inverters, SVG, energy storage converters, wind power converters and the like.
Background
IGBT: an Insulated Gate Bipolar Transistor (IGBT) is a composite fully-controlled voltage-driven power semiconductor device consisting of a Bipolar Junction Transistor (BJT) and an insulated Gate field effect transistor (MOS), and has the advantages of high input impedance of the MOSFET and low conduction voltage drop of the GTR.
In order to study the characteristics of power devices and newly introduced devices of different manufacturers, taking an inverter manufacturer as an example, a series of tests are required to be performed on a core converter device IGBT to examine the characteristics of the following aspects:
1. and comparing parameters of IGBTs of different manufacturers, such as parameters of products of different series of the same brand, or differences between performances of mutual replacement devices of different brands.
2. The main parameters of the IGBT in the switching process are obtained to evaluate whether the selection of the values of Rgon (on resistance) and Rgoff (off resistance) is appropriate, and whether an absorption circuit needs to be provided or not is considered.
3. Consider the actual behavior of an IGBT when operating in a converter. For example, whether the reverse recovery current of the diode is proper, whether the voltage spike is proper when the diode is turned off, whether the switching process has improper oscillation, and the like.
In order to meet the test requirements, a set of test platform is required to be designed, whether the electrical performance parameters of the power module are qualified or not is inspected through a series of tests through full-automatic design, and functions such as automatic test are realized.
If the steps are skipped to develop and apply the product, the service life of the IGBT power module may be reduced or even damaged in practical application, resulting in waste of efficiency and cost. In order to more efficiently and safely verify the reliability of the IGBT power module, it is necessary to design an intelligent automatic test platform for the above routine test.
Currently, most of the IGBT power module test systems in the research and comparison field have the following defects:
1. different peripheral test circuits can only be constructed in a manual mode, in the test process, an operator performs manual switching to detect signal parameters at different positions, the difference of test methods possibly causes inaccuracy of test results, the test results need to be manually and manually adjusted to capture waveforms to be manually recorded and then analyzed and calculated, the test period is long, and the calculation is complex.
2. The compatibility is poor, when the topology and the parameter to be tested of the power modules of different products with different power grades are different greatly, a new test platform can only be built again, the reusability rate is low, and the waste of personnel and material cost is caused.
3. The test result is calculated manually by personnel, cannot be recorded automatically, has poor traceability, and cannot meet the test requirements in the research and development process, the mass production process and the quality incoming material inspection.
Disclosure of Invention
The invention aims to overcome the defects of the IGBT power module test system in the prior art and provides a universal test platform and a test method for an IGBT power module.
In order to achieve the purpose, the invention adopts the following technical scheme:
a universal test platform for an IGBT power module comprises a DSP control panel, an upper computer, a peripheral accompanying circuit, a high-voltage direct-current programming power supply, a program-controlled heating table, an FPGA driving wave-emitting plate, a temperature and humidity collector and an oscilloscope; the DSP control board is connected with the upper computer, and the digital quantity input and output of the DSP control board are connected with the corresponding digital quantity output and input of the peripheral accompanying circuit; the upper computer controls the output of the high-voltage direct-current programming power supply and then sends the output to the bus capacitor side of the peripheral accompanying circuit; the FPGA driving wave generating plate is connected with the driving side of the IGBT power module UUT; the temperature and humidity collector is used for monitoring the temperature and humidity information of the test environment of the IGBT power module UUT; the oscilloscope is connected with the test point of the IGBT power module UUT, and the test result is uploaded to the upper computer through communication.
Furthermore, the DSP control board is used for receiving a test instruction sent by the upper computer, controlling the peripheral accompanying circuit to be used for controlling the corresponding contactor switching circuit to construct a corresponding test loop according to different test topologies, starting the program-controlled heating table to heat, simultaneously controlling the high-voltage direct-current programming power supply to be set and output according to the test voltage level by the upper computer, controlling the FPGA to drive the wave-transmitting board to finish sending out test pulses of the IGBT power module UUT when the upper computer detects that the temperature sensor of the IGBT power module UUT reaches an expected test temperature, carrying out waveform grabbing by the oscilloscope after the IGBT power module UUT responds, and carrying out calculation analysis on data tested by the oscilloscope through communication with the oscilloscope by the upper computer.
Furthermore, the direct-current voltage output by the high-voltage direct-current programming power supply is continuously adjustable within the range of 0-6000V.
Furthermore, the peripheral accompanying circuit comprises a discharge resistor, a load inductor, a bus capacitor and a high-voltage switching contactor, wherein the load inductor is a variable inductor, and the bus capacitor is an adjustable capacitor.
Further, still include cooling fan, warm table and cooling fan possess programme-controlled function, according to the temperature that the test needs set up, calculate and adjust heating power and cooling power by the host computer.
Furthermore, the FPGA driving wave-emitting plate has the functions of photoelectric isolation, 30-path independent wave emission, on-line continuous adjustment of duty ratio between 0 and 100 percent and on-line continuous adjustment of wave-emitting pulse width between 0 and 500 us.
The IGBT power module test method based on the test platform is characterized by comprising the following steps: the method comprises the following steps:
step 1: the test of the UUT module of the IGBT power module comprises the following three parts:
1) and (3) charging control: the upper computer controls peripheral soft start, charging and construction of an accompanying circuit according to topology and test conditions of the UUT, then controls the high-voltage direct-current programming power supply to charge the bus capacitor, and controls and heats the IGBT test heating table until the charging voltage of the bus capacitor and the heating table reach set values;
2) and (3) IGBT dynamic testing: after the bus voltage and the IGBT temperature sensor reach the expected temperature through the upper computer, starting to perform wave generation test according to the set frequency and pulse width, and if the temperature exceeds the preset temperature, cooling; before wave sending, sending an oscilloscope trigger parameter configuration instruction by an upper computer, finishing the setting of trigger parameters by a program control oscilloscope, and capturing the current and voltage waveforms of an IGBT module after a pulse is sent;
3) automatic analysis and processing of trigger waveform data: the upper computer is communicated with the oscilloscope, after test waveform data of the oscilloscope are read, on one hand, whether parameters of the IGBT driving circuit, the absorption circuit and the laminated busbar meet requirements or not is evaluated by calculating on-off parameters of an evaluation device, and on the other hand, a comparison report is generated according to test results of similar devices of different manufacturers for comparison analysis;
step 2: discharge control of completed UUT test: after the test process is completed, the upper computer sends an instruction to disconnect a loop connected with the IGBT power module UUT and the high-voltage direct-current programming power supply, then an intermediate relay on the DSP control board is controlled, and a discharging resistor is automatically switched into two ends of the bus capacitor through the high-voltage switching contactor to discharge until the discharging is completed.
Further, in step 1, when the IGBT is dynamically tested and the on-off current and voltage parameters of the IGBT are tested in the oscilloscope trigger mode, the upper computer performs remote control and data reading analysis through a communication protocol, and calculates the dynamic parameters of the IGBT.
Compared with the prior art, the invention has the following beneficial effects:
when the test platform is used for testing, a tester carries out corresponding parameter filling configuration by carrying out bus voltage, pulse width and heating temperature in the upper computer, and the upper computer can automatically calculate the trigger condition of the oscilloscope according to the input condition and carry out corresponding trigger position, amplitude and trigger period setting. After all software and hardware parameter configuration is completed, the test process and the test result output are automatically completed by the test platform, and the method has a series of advantages of high automation degree, friendly man-machine interface and the like. (ii) a
Further, the peripheral accompanying circuit includes: the high-voltage switch contactor comprises a discharge resistor, a load inductor, a bus capacitor and a high-voltage switch contactor, wherein the load inductor is a variable inductor, the bus capacitor is an adjustable capacitor, corresponding inductance values and capacitance values can be selected according to different requirements of a test object on the sizes of the load inductor and the bus capacitor, and multiple combinations are configured on an FPGA (field programmable gate array) driving wave-emitting plate by an on-resistance Ron and an off-resistance Roff according to different test objects so as to meet the test requirements of an off-power module.
Furthermore, the test platform can select three modes of all tests, specified working condition tests and special tests according to actual test requirements, and human-computer interaction selection operation is performed according to use requirements.
All tests were carried out: according to the characteristics of the IGBT power module, the peripheral accompanying circuit can respectively test the performance parameters of all the tubes in sequence, and the performance parameters comprise the IGBT switching characteristics, Vce, the reverse recovery characteristics of the diode, the switching loss under different rated Ic conditions, the loop stray inductance and the like;
the specified working condition is as follows: during testing, the dynamic characteristics of the IGBT under different bus voltages, collector currents Ic and junction temperatures can be set on an input parameter interface of the upper computer, and the dynamic characteristics of the IGBT under the condition of multiple parameters can be selected and set through a software interface, so that a test result is output;
special tests: the maximum turn-off current and the short-circuit characteristic of the IGBT power module within the actual working voltage range, the comparison and selection type, the narrow pulse characteristic and the parallel current sharing characteristic of the IGBT power module are represented, and corresponding test items are selected and set through an input interface of an upper computer.
Furthermore, the test platform control cabinet and the test cabinet are independently designed in structure, the drive part of the DSP control panel is photoelectrically isolated, safety and reliability are achieved, the test platform has single test, working condition test making and special diagnosis functions, and test records respectively and automatically generate reports and can be traced and uploaded to an MES system.
Furthermore, the heating table and the cooling fan have a program control function, and according to the temperature required to be set in the test, the upper computer automatically calculates and adjusts the heating power and the cooling power through communication, so that the test waiting time increased by temperature change can be reduced to the maximum extent.
According to the testing method, the upper computer is matched with peripheral testing equipment, and parameter testing result information of the IGBT is automatically generated after data processing: the testing method comprises the following steps of switching-on delay time td (on), rising time tr, switching-off delay time td (off), falling time tf, switching-on power consumption Eon, switching-off power consumption Eoff, short-circuit current Isc, switching-on resistor Ron, switching-off resistor Roff and voltage Vce between a collector and an emitter, and is wide in testing coverage, high in testing voltage level, wide in testable voltage range, and after testing is finished, the DSP main control automatic control discharge circuit finishes discharge of a bus capacitor.
Drawings
FIG. 1 is a system block diagram of a general test platform for IGBT power modules;
fig. 2 is a schematic diagram of a test flow of a general test platform of the IGBT power module.
Detailed Description
In order to make those skilled in the art better understand the solution of the present invention, the following will clearly and completely describe the technical solution in the embodiment of the present invention with reference to the workflow diagram in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of embodiments of the present invention, and not all embodiments. All other embodiments, which can be obtained by others skilled in the art without any inventive step based on the embodiments of the present invention, shall fall within the protection scope of the present invention.
The invention is described in further detail below with reference to the accompanying drawings:
referring to fig. 1, a test platform for an IGBT power module includes a DSP control board 1, an upper computer 2, a peripheral accompanying circuit 3, a high voltage direct current programming power supply 4, a program-controlled heating table 5, an FPGA driving wave-emitting board 6, a temperature and humidity collector 7, an oscilloscope 8, and a heat-dissipating fan 9. The DSP control panel 1 is connected with the upper computer 2 through RS 485; the digital quantity input and output ends of the DSP control board 1 are connected with the corresponding digital quantity output and input ends of the peripheral accompanying circuit 3; the communication port of the upper computer 2 is connected with the communication interface of the high-voltage direct current programming power supply 4, the output of the high-voltage direct current programming power supply 4 is connected with the high-voltage control relay of the peripheral accompanying circuit 3, and the upper computer 2 controls the output of the high-voltage direct current programming power supply 4 and then sends the output to the bus capacitor side of the peripheral accompanying circuit 3; the output of a control relay of the peripheral accompanying circuit 3 is connected with the power supply of the heat dissipation fan 9, the output of the peripheral accompanying circuit 3 is connected with the input of the IGBT power module UUT, the program-controlled heating table 5 is controlled by the peripheral accompanying circuit 3 and then heats the tested IGBT power module UUT10, and the temperature can be adjusted through communication; the PWM output channel of the FPGA-driven wave-emitting plate 6 is connected with the driving side of the IGBT power module UUT; the communication interface of the temperature and humidity collector 7 is connected with the communication interface of the upper computer 2, and the temperature and humidity collector 7 is used for monitoring the temperature and humidity information of the test environment of the IGBT power module UUT and uploading the temperature and humidity information of the test environment of the UUT to the upper computer 2; the oscilloscope 8 is connected with a test point of the UUT and an Ethernet interface of the upper computer 2, the oscilloscope 8 is mainly used for collecting voltage and current waveform data of the UUT, and a test result is uploaded to the upper computer 2 through communication to carry out numerical analysis and calculation; and the cooling fan 9 is arranged inside the heating table structure of the UUT. The cooling fan 9 is mainly used for cooling rapidly under the condition that the temperature needs to be reduced, the waiting time of the test is reduced, and the speed can be controlled through PWM output. UUT10 can be IGBT power module monomer, also can be IGBT power module.
The DSP control board 1 is used for receiving a test instruction sent by the upper computer 2, controlling the peripheral accompanying circuit 3 to control the corresponding contactor switching circuit to construct a corresponding test loop according to different test topologies, finishing the control of digital output signals and the feedback of digital input, and controlling the start and stop of the cooling fan. The upper computer 2 is mainly used for controlling the test process, reading and writing peripheral equipment, analyzing the test result and generating a test report. The upper computer 2 controls the high-voltage direct-current programming power supply 4 to perform corresponding setting and output according to the test voltage level, when the upper computer detects that a temperature sensor of the IGBT power module UUT reaches an expected test temperature, the FPGA drive wave sending plate 6 is controlled to complete sending of test pulses of the IGBT power module UUT10, the upper computer 2 ensures that a trigger mode for starting the oscilloscope and parameter configuration are completed before sending waves to the FPGA drive wave sending plate 6, automatic grabbing of test waveforms is prepared, after the IGBT power module UUT10 responds, the oscilloscope 8 performs corresponding waveform grabbing, and the upper computer 2 uploads data tested by the oscilloscope 8 to the upper computer 2 through communication with the oscilloscope for calculation and analysis.
The peripheral accompanying circuit 3 consists of a bus capacitor, a soft starter, a high-power discharge resistor, a multi-gear adjustable load inductor and a plurality of high-voltage switching contactors, wherein the load inductor is a variable inductor, and the bus capacitor is adjustable within the range of 0-20 mF. The peripheral accompanying circuit 3 is mainly used for power distribution of all equipment, charging and discharging of a bus capacitor, configuration of a load inductor and the bus capacitor, start and stop control of a cooling fan, high-voltage output control of high-voltage direct-current programming power output and a high-voltage switching contactor.
The adjustable range of the high-voltage direct-current programming power supply 4 is 0-6000VDC, and the high-voltage direct-current programming power supply is mainly used for generating direct-current voltage for the IGBT power module. The communication port of the program-controlled heating table 5 is connected with the communication interface of the upper computer 2; the heating table of the program-controlled heating table 5 is tightly connected with the heat dissipation surface of the IGBT power module UUT 10. The protective cover is arranged outside the program-controlled heating table 5, and when the protective cover and the bus capacitor are electrified to be greater than 36VDC in the testing process, the electromagnetic valve door lock cannot be opened, so that personnel can be prevented from being scalded.
The FPGA drive wave-emitting plate 6 is used for receiving a drive wave-emitting test instruction sent by the upper computer 2 and generating a drive waveform for testing the IGBT according to the test requirement. The FPGA driving wave transmitting plate 6 has the functions of photoelectric isolation, 30-path independent wave transmitting, on-line continuous adjustable duty ratio of 0-100% and on-line continuous adjustable wave transmitting pulse width of 0-500us, and the pulse width precision and the resolution are 10 ns. When the on-off current and voltage parameters of the IGBT are tested in the trigger mode of the oscilloscope 8, software built in the upper computer has the functions of remote control and data reading through a communication protocol, and dynamic parameters of the IGBT can be calculated.
The DSP control panel 1, the upper computer 2, the peripheral accompanying circuit 3, the high-voltage direct-current programming power supply 4, the program-controlled heating table 5, the FPGA driving wave-emitting plate 6, the temperature and humidity collector 7, the oscilloscope 8 and the heat-radiating fan 9 are all arranged in the test platform control cabinet, and the IGBT power module UUT10 is installed in the test cabinet. The test platform control cabinet and the test cabinet are independently designed in structure, the driving part of the DSP control panel 1 is photoelectrically isolated, safety and reliability are achieved, the test platform has single test, working condition test making and special diagnosis functions, and test records are respectively automatically generated into reports and can be traced and uploaded to an MES system.
Referring to fig. 2, the working method for the test platform for the IGBT power module is as follows:
step 1: the test of the IGBT power module UUT10 module is mainly divided into the following three parts:
and (3) charging control: the upper computer 2 controls the DSP control board 1 to automatically construct peripheral soft start, charging, bus capacitance, load inductance and discharge resistance through the control of a high-voltage switching contactor switching circuit according to the topology of UUT, then controls the high-voltage direct-current programming power supply 4 to charge the bus capacitance, controls and heats the IGBT test heating table, and waits for the charging voltage of the bus capacitance and the heating table to reach the expected values;
IGBT double-pulse dynamic test: after the bus voltage and the IGBT temperature sensor reach the expected temperature through the upper computer 2, the double-pulse wave emission test is carried out according to the set frequency and the set pulse width, and if the temperature exceeds the preset temperature, the cooling fan 9 is controlled to cool. Before wave emission, the upper computer needs to set triggering parameters through the upper computer and the program control oscilloscope, and after pulses are emitted, the current and voltage waveforms of the IGBT module are captured;
automatic analysis and processing of trigger waveform data: after the upper computer reads the test waveform data through communication with the oscilloscope, on one hand, the on-off parameters of the device can be evaluated through the calculation of a general algorithm formula integrated inside the upper computer: parameters such as Ron (turn-on resistance), Roff (turn-off resistance), Vce (between collector and emitter) voltage spike when the IGBT is turned off, diode reverse recovery current when the IGBT is turned on and the like are evaluated to determine whether parameters such as IGBT driving, absorption circuit, laminated busbar and the like are appropriate, on the other hand, a comparison report can be generated according to the test results of similar devices of different manufacturers, and visual comparison analysis can be carried out;
step 2: discharge control of completed UUT test: after the test process is completed, the upper computer 2 issues an instruction to disconnect a loop connected with the IGBT power module UUT10 and the high-voltage direct-current programming power supply 4, then the middle contactor on the DSP control board is controlled to automatically switch the discharge resistor in the peripheral configuration circuit into two ends of the bus capacitor to perform rapid discharge, the voltage values at two ends of the bus capacitor in the discharge process are displayed in real time through a digital display voltmeter uploaded by the peripheral accompanying circuit 3, and the UUT test and verification can be performed only after the discharge is completed.
And step 3: the test report is automatically generated, can be connected with a printer to be printed according to needs, and can also participate in flow quality control of intelligent manufacturing through uploading an MES system.
The above-mentioned contents are only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited thereby, and any modification made on the basis of the technical idea of the present invention falls within the protection scope of the claims of the present invention.

Claims (8)

1. A universal test platform for an IGBT power module is characterized by comprising a DSP control board (1), an upper computer (2), a peripheral accompanying circuit (3), a high-voltage direct-current programming power supply (4), a program-controlled heating table (5), an FPGA driving wave-emitting board (6), a temperature and humidity collector (7) and an oscilloscope (8); the DSP control board (1) is connected with the upper computer (2), and the digital quantity input and output of the DSP control board (1) are connected with the corresponding digital quantity output and input of the peripheral accompanying circuit (3); the upper computer (2) controls the output of the high-voltage direct-current programming power supply (4) and then sends the output to the bus capacitor side of the peripheral accompanying circuit; the FPGA driving wave-emitting plate (6) is connected with the driving side of the IGBT power module UUT (10); the temperature and humidity collector (7) is used for monitoring the temperature and humidity information of the test environment of the IGBT power module UUT; the oscilloscope (8) is connected with the test point of the IGBT power module UUT, and the test result is uploaded to the upper computer (2) through communication.
2. A generic test platform for IGBT power modules according to claim 1, the device is characterized in that the DSP control board (1) is used for receiving a test instruction sent by the upper computer (2), controlling the peripheral accompanying circuit (3) to control the corresponding contactor switching circuit to construct a corresponding test loop according to different test topologies and starting the program-controlled heating table (5) to heat, meanwhile, the upper computer (2) controls the high-voltage direct-current programming power supply (4) to set and output according to the test voltage level, when the upper computer detects that the temperature sensor of the IGBT power module UUT reaches the expected testing temperature, the wave-emitting plate (6) is driven by controlling the FPGA to complete the emission of the test pulse of the IGBT power module UUT (10), after the IGBT power module UUT (10) responds, the oscilloscope (8) captures waveforms, and the upper computer (2) is communicated with the oscilloscope to acquire data tested by the oscilloscope (8) and perform calculation analysis.
3. The universal test platform for IGBT power modules as claimed in claim 1, characterized in that the DC voltage output by the high voltage DC programming power supply (4) is continuously adjustable within the range of 0-6000V.
4. The universal test platform for IGBT power modules according to claim 1, characterized in that the peripheral accompanying circuit (3) comprises a discharge resistor, a load inductance, a bus capacitance and a high voltage switching contactor, the load inductance being a variable inductance and the bus capacitance being an adjustable capacitor.
5. The general test platform for the IGBT power module according to claim 1, further comprising a heat dissipation fan (9), wherein the heating table (5) and the heat dissipation fan (9) have a program control function, and the temperature rise power and the temperature decrease power are calculated and adjusted by the upper computer (2) according to the temperature required to be set in the test.
6. The general test platform for the IGBT power module as claimed in claim 1, wherein the FPGA-driven wave-emitting plate (6) has the functions of photoelectric isolation, 30 independent wave-emitting, on-line continuous adjustment of duty ratio at 0-100%, and on-line continuous adjustment of wave-emitting pulse width at 0-500 us.
7. The IGBT power module testing method based on the testing platform as claimed in any one of claims 1 to 6, characterized in that: the method comprises the following steps:
step 1: the module test of the IGBT power module UUT (10) comprises the following three parts:
1) and (3) charging control: the upper computer (2) controls (1) to carry out peripheral soft start, charging and construction of an accompanying circuit according to topology and test conditions of the IGBT power module UUT (10), and then controls the high-voltage direct-current programming power supply (4) to charge the bus capacitor and controls and heats the IGBT test heating table until the charging voltage of the bus capacitor and the heating table reach set values;
2) and (3) IGBT dynamic testing: after the bus voltage and the IGBT temperature sensor reach the expected temperature through reading by the upper computer (2), starting to carry out wave-generating test according to the set frequency and pulse width, and if the temperature exceeds the preset temperature, carrying out cooling; before wave sending, sending an oscilloscope trigger parameter configuration instruction by an upper computer, finishing the setting of trigger parameters by a program control oscilloscope, and capturing the current and voltage waveforms of an IGBT module after a pulse is sent;
3) automatic analysis and processing of trigger waveform data: the upper computer (2) is communicated with the oscilloscope (8), after test waveform data of the oscilloscope are read, on one hand, whether parameters of the IGBT driving circuit, the IGBT absorption circuit and the laminated busbar meet requirements or not is evaluated by calculating and evaluating on-off parameters of devices, and on the other hand, test results of similar devices of different manufacturers are generated into comparison reports for comparison analysis;
step 2: discharge control of completed UUT test: after the test process is completed, the upper computer (2) issues an instruction to disconnect a loop connected with the IGBT power module UUT (10) and the high-voltage direct-current programming power supply (4), then an intermediate relay on the DSP control board is controlled, and a discharge resistor is automatically switched into two ends of the bus capacitor through the high-voltage switching contactor to discharge until the discharge is completed.
8. The IGBT power module test method according to claim 7, wherein in the step 1, when carrying out dynamic test of the IGBT, and testing the parameters of the on-off current and voltage of the IGBT in a trigger mode of an oscilloscope (8), the upper computer carries out remote control and data reading analysis through a communication protocol, and calculates the dynamic parameters of the IGBT.
CN202111250841.4A 2021-10-26 2021-10-26 General test platform and test method for IGBT power module Pending CN113970688A (en)

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CN115078955A (en) * 2022-08-18 2022-09-20 北京芯可鉴科技有限公司 Method and device for evaluating component in circuit and circuit
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