CN113969403B - Etching solution and method for nickel-titanium superalloy - Google Patents
Etching solution and method for nickel-titanium superalloy Download PDFInfo
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- CN113969403B CN113969403B CN202111258689.4A CN202111258689A CN113969403B CN 113969403 B CN113969403 B CN 113969403B CN 202111258689 A CN202111258689 A CN 202111258689A CN 113969403 B CN113969403 B CN 113969403B
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- 238000005530 etching Methods 0.000 title claims abstract description 77
- 229910000601 superalloy Inorganic materials 0.000 title claims abstract description 13
- HZEWFHLRYVTOIW-UHFFFAOYSA-N [Ti].[Ni] Chemical compound [Ti].[Ni] HZEWFHLRYVTOIW-UHFFFAOYSA-N 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title claims abstract description 10
- 229910001000 nickel titanium Inorganic materials 0.000 title claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 28
- 238000000576 coating method Methods 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000005238 degreasing Methods 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims description 27
- 238000007639 printing Methods 0.000 claims description 20
- 239000002253 acid Substances 0.000 claims description 15
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 14
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- MIMUSZHMZBJBPO-UHFFFAOYSA-N 6-methoxy-8-nitroquinoline Chemical compound N1=CC=CC2=CC(OC)=CC([N+]([O-])=O)=C21 MIMUSZHMZBJBPO-UHFFFAOYSA-N 0.000 claims description 7
- 235000019270 ammonium chloride Nutrition 0.000 claims description 7
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 7
- 239000003504 photosensitizing agent Substances 0.000 claims description 7
- 238000002203 pretreatment Methods 0.000 claims description 7
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 6
- 239000007888 film coating Substances 0.000 claims description 6
- 238000009501 film coating Methods 0.000 claims description 6
- 229920002472 Starch Polymers 0.000 claims description 5
- 239000008213 purified water Substances 0.000 claims description 5
- 239000008107 starch Substances 0.000 claims description 5
- 235000019698 starch Nutrition 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 2
- 229920002678 cellulose Polymers 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 abstract description 32
- 229910045601 alloy Inorganic materials 0.000 abstract description 31
- 239000000956 alloy Substances 0.000 abstract description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 12
- 238000012545 processing Methods 0.000 abstract description 9
- 229910052759 nickel Inorganic materials 0.000 abstract description 6
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 5
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 229910052750 molybdenum Inorganic materials 0.000 abstract description 3
- 239000011733 molybdenum Substances 0.000 abstract description 3
- 229910052758 niobium Inorganic materials 0.000 abstract description 3
- 239000010955 niobium Substances 0.000 abstract description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052715 tantalum Inorganic materials 0.000 abstract description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010936 titanium Substances 0.000 abstract description 3
- 229910052719 titanium Inorganic materials 0.000 abstract description 3
- 239000012670 alkaline solution Substances 0.000 abstract description 2
- 238000003486 chemical etching Methods 0.000 abstract description 2
- 238000011161 development Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 238000005406 washing Methods 0.000 description 12
- 239000000203 mixture Substances 0.000 description 6
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/26—Acidic compositions for etching refractory metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/28—Acidic compositions for etching iron group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The invention provides an etching solution and an etching technology capable of precisely etching nickel and titanium-based superalloy. The etching tolerance is small and controllable, and can be used for high-efficiency processing of various complex workpieces. The method can also be used for precision etching and large etching amount processing of corrosion-resistant nickel-based superalloy containing niobium, tantalum, molybdenum and other elements. The etching solution has high solubility to high-temperature alloy, long service life and stable effect. The technology comprises the steps of carrying out conventional cleaning and degreasing on a nickel-titanium high-temperature alloy to clean the surface, coating photoresist on the surface, exposing the photoresist according to a processing pattern, then carrying out development treatment, corroding the exposed metal by using a chemical etching solution, removing the surface adhesive by using a strong alkaline solution after the corrosion process is finished, and finally cleaning by using water to obtain an etching processing workpiece product.
Description
Technical Field
The invention relates to an etching solution and a method for nickel and titanium superalloy, in particular to a method for etching nickel and titanium superalloy by utilizing wet etching solution and etching technology (mainly acid etching solution).
Background
The process flow closest to the patent CN 1757794A, CN 1743508A is as follows: and (3) conventionally cleaning and degreasing the nickel-titanium high-temperature alloy to clean the surface, coating photoresist on the surface, exposing the photoresist according to a processing pattern, performing development treatment, corroding the exposed metal by using a chemical etching solution, removing the surface photoresist by using a strong alkaline solution after the corrosion process is finished, and finally cleaning by using water to obtain an etched workpiece product. While patent CN 1757794A, CN 1743508A is an etching solution for etching titanium alloy, nickel-titanium-based superalloy cannot be etched. The etching solution can realize the precise etching of the nickel-titanium-based alloy, and the etching rate can be regulated and controlled through the components of the etching solution.
The defects and shortcomings of the prior art are as follows:
1. at present, no related nickel-titanium-based superalloy etching solution patent is searched.
Disclosure of Invention
This section includes the following three small points:
the invention aims at solving the technical problems:
the invention can realize the precise etching of the nickel-titanium-based superalloy, has small and controllable etching tolerance, and can be used for high-efficiency processing of various complex workpieces.
The invention can also be used for precise etching and large etching amount processing of corrosion-resistant nickel-based superalloy containing niobium, tantalum, molybdenum and other elements.
The etching solution disclosed by the invention has the advantages of high solubility to high-temperature alloy and long service life.
In order to solve the technical problems or achieve the purpose of the invention, the technical scheme of the invention comprises the following contents:
firstly, pre-treatment cleaning, namely, alkaline cleaning, electrolytic degreasing, acid cleaning, cleaning with water and drying a workpiece.
And step two, roll coating, namely, coating a film on a workpiece, roll coating with printing ink with main components of resin and photosensitizer, and drying the workpiece in a tunnel furnace after the printing ink is coated with a printing ink protective layer.
And thirdly, exposing, namely placing the workpiece into a film negative (the negative is a workpiece design drawing), and taking out the workpiece after exposure by an exposure machine.
And fourthly, developing, namely developing the exposed workpiece, developing the pattern to be etched, and drying.
Fifthly, etching, namely placing the developed workpiece into an etching machine, determining etching parameters (the pressure is 1.5-3kg, the temperature is 35-50 ℃ and the spraying time is 10-30 min), and then carrying out batch spraying etching.
Etching solution composition: the etching solution comprises 8-15 wt% of ammonium bifluoride, 12-20 wt% of ammonium chloride, 10-20 wt% of ferric trichloride, 1-2 wt% of starch or cellulose, 5-10 wt% of phosphoric acid and the balance of purified water.
And sixthly, film stripping, namely stripping the protective layer after the etched product passes through alkaline stripping liquid, and washing with acid, washing with clean water and drying.
And seventh, inspecting and packaging, namely detecting the product on a secondary element detector, and packaging after the product is qualified in size.
The technical effects of the present invention or advantages of the present invention over the prior art are described, and the effects achieved by the present invention are described with specific data, and are specifically and practically described.
(1) The invention provides an etching solution capable of precisely etching nickel-titanium-based superalloy. The etching tolerance is small and controllable, and can be used for high-efficiency processing of various complex workpieces. The method can also be used for precise etching and large etching amount processing of corrosion-resistant nickel-based superalloy containing niobium, tantalum, molybdenum and other elements. The etching solution has high solubility to high-temperature alloy, long service life and stable effect.
(2) The etching liquid has low damage to the photosensitive resin coating film, and can still ensure the etching quality under the working condition of long etching time.
(3) Compared with the operation temperature of other patents which cannot be higher than 40 ℃, the invention has a wider range of operation temperature, which can reach 60 ℃ at most.
Drawings
FIG. 1 is a graph showing the seam width measurement of the product of example 1 of the present invention. As can be seen, the edge of the etched seam of the product is flat and sharp, and the side etching and tolerance is 0.01mm and the seam width is 0.2mm.
FIG. 2 is a graph showing the seam width measurement of the product of example 2 of the present invention. As can be seen from the figure, the edge of the etched seam of the product is flat and sharp, the side etching and the side etching tolerance are smaller than 0.01, and the seam width is 0.2mm.
Detailed Description
The present invention will be described more fully hereinafter in order to facilitate an understanding of the present invention, and preferred embodiments of the present invention are set forth. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Example 1
Firstly, pre-treatment cleaning, alkali cleaning, electrolytic degreasing and acid cleaning of a high-temperature alloy plate (with the thickness of 0.15 mm),
cleaning with water and drying.
And (II) roll coating, namely performing film coating treatment on the high-temperature alloy plate, roll coating with printing ink with main components of resin and photosensitizer, and drying the printing ink after roll coating with a printing ink protective layer. The thickness of the coating is 20-40 microns.
And thirdly, exposing, namely placing the high-temperature alloy plate into a film negative (the negative is a workpiece design drawing), and taking out the film negative after exposing by an exposure machine.
And (IV) developing, namely developing the exposed high-temperature alloy plate by using 1% sodium bicarbonate, and developing and drying the pattern to be etched.
Fifthly, etching, namely placing the developed high-temperature alloy plate into an etching machine table with the pressure of 2.5kg/cm 2 Spraying at 50deg.C for 20min.
Etching solution composition: the etching solution comprises ammonium bifluoride (10wt%), ammonium chloride (18wt%), ferric trichloride (15wt%), starch (1wt%), phosphoric acid (5wt%) and the balance of purified water.
And (sixth) film stripping, namely, immersing the etched product in 10% sodium hydroxide solution at 80 ℃ for 1 hour, removing the protective layer, then washing with acid, washing with clean water and drying.
And (seventh) detecting the product on a secondary element detector, wherein the line width of the product is 0.20mm, and the lateral erosion and the tolerance are smaller than 0.01mm, thereby meeting the design requirements.
Example 2
Firstly, pre-treatment cleaning, alkali cleaning, electrolytic degreasing and acid cleaning of a high-temperature alloy plate (the thickness is 0.2 mm),
cleaning with water and drying.
And (II) roll coating, namely performing film coating treatment on the high-temperature alloy plate, roll coating with printing ink with main components of resin and photosensitizer, and drying the printing ink after roll coating with a printing ink protective layer. The thickness of the coating is 20-40 microns.
And thirdly, exposing, namely placing the high-temperature alloy plate into a film negative (the negative is a workpiece design drawing), and taking out the film negative after exposing by an exposure machine.
And (IV) developing, namely developing the exposed high-temperature alloy plate by using 1% sodium bicarbonate, and developing and drying the pattern to be etched.
Fifthly, etching, namely placing the developed high-temperature alloy plate into an etching machine table with the pressure of 2.5kg/cm 2 Spraying at 45deg.C for 22min.
Etching solution composition: the etching solution comprises ammonium bifluoride (10wt%), ammonium chloride (18wt%), ferric trichloride (15wt%), starch (1wt%), phosphoric acid (5wt%) and the balance of purified water.
And (sixth) film stripping, namely, immersing the etched product in 10% sodium hydroxide solution at 80 ℃ for 1 hour, removing the protective layer, then washing with acid, washing with clean water and drying.
And (seventh) detecting the product on a secondary element detector, wherein the line width of the product is 0.20mm, and the lateral erosion and the tolerance are smaller than 0.01mm, thereby meeting the design requirements.
Example 3
Firstly, pre-treatment cleaning, alkali cleaning, electrolytic degreasing and acid cleaning of a high-temperature alloy plate (the thickness is 0.3 mm),
cleaning with water and drying.
And (II) roll coating, namely performing film coating treatment on the high-temperature alloy plate, roll coating with printing ink with main components of resin and photosensitizer, and drying the printing ink after roll coating with a printing ink protective layer. The thickness of the coating is 20-40 microns.
And thirdly, exposing, namely placing the high-temperature alloy plate into a film negative (the negative is a workpiece design drawing), and taking out the film negative after exposing by an exposure machine.
And (IV) developing, namely developing the exposed high-temperature alloy plate by using 1% sodium bicarbonate, and developing and drying the pattern to be etched.
Fifthly, etching, namely placing the developed high-temperature alloy plate into an etching machine table with the pressure of 3kg/cm 2 Spraying at 50deg.C for 25min.
Etching solution composition: the etching solution comprises ammonium bifluoride (10wt%), ammonium chloride (18wt%), ferric trichloride (15wt%), starch (1wt%), phosphoric acid (5wt%) and the balance of purified water.
And (sixth) film stripping, namely, immersing the etched product in 10% sodium hydroxide solution at 80 ℃ for 1 hour, removing the protective layer, then washing with acid, washing with clean water and drying.
And (seventh) detecting the product on a secondary element detector, wherein the width of the product stripe is 0.25mm, and the lateral erosion and tolerance are less than 0.01mm, so that the product meets the design requirement.
Example 4
Firstly, pre-treatment cleaning, alkali cleaning, electrolytic degreasing and acid cleaning of a high-temperature alloy plate (with the thickness of 0.15 mm),
cleaning with water and drying.
And (II) roll coating, namely performing film coating treatment on the high-temperature alloy plate, roll coating with printing ink with main components of resin and photosensitizer, and drying the printing ink after roll coating with a printing ink protective layer. The thickness of the coating is 20-40 microns.
And thirdly, exposing, namely placing the high-temperature alloy plate into a film negative (the negative is a workpiece design drawing), and taking out the film negative after exposing by an exposure machine.
And (IV) developing, namely developing the exposed high-temperature alloy plate by using 1% sodium bicarbonate, and developing and drying the pattern to be etched.
Fifthly, etching, namely placing the developed high-temperature alloy plate into an etching machine table with the pressure of 2.5kg/cm 2 Spraying at 50deg.C for 20min.
Etching solution composition: the etching solution comprises ammonium bifluoride (10wt%), ammonium chloride (18wt%), ferric trichloride (15wt%), and pure water.
And (sixth) film stripping, namely, immersing the etched product in 10% sodium hydroxide solution at 80 ℃ for 1 hour, removing the protective layer, then washing with acid, washing with clean water and drying.
And (seventh) checking, namely detecting the product on a secondary element detector, wherein the line width of the product is 0.2mm, the side etching and tolerance are smaller than 0.015mm, and compared with the case 1, the side etching is large, the line width is narrowed, and the etching efficiency is reduced.
Example 5
Firstly, pre-treatment cleaning, alkali cleaning, electrolytic degreasing and acid cleaning of a high-temperature alloy plate (with the thickness of 0.15 mm),
cleaning with water and drying.
And (II) roll coating, namely performing film coating treatment on the high-temperature alloy plate, roll coating with printing ink with main components of resin and photosensitizer, and drying the printing ink after roll coating with a printing ink protective layer. The thickness of the coating is 20-40 microns.
And thirdly, exposing, namely placing the high-temperature alloy plate into a film negative (the negative is a workpiece design drawing), and taking out the film negative after exposing by an exposure machine.
And (IV) developing, namely developing the exposed high-temperature alloy plate by using 1% sodium bicarbonate, and developing and drying the pattern to be etched.
Fifthly, etching, namely placing the developed high-temperature alloy plate into an etching machine table with the pressure of 2.5kg/cm 2 Spraying at 50deg.C for 20min.
Etching solution composition: the etching solution comprises ammonium bifluoride (15 wt%), ammonium chloride (18 wt%), ferric trichloride (15 wt%), phosphoric acid (5 wt%), and pure water as the rest.
And (sixth) film stripping, namely, immersing the etched product in 10% sodium hydroxide solution at 80 ℃ for 1 hour, removing the protective layer, then washing with acid, washing with clean water and drying.
And (seventh) detecting the product on a secondary element detector, wherein the line width of the product is 0.22mm, the side etching and the tolerance are smaller than 0.02mm, and compared with the case 4, the side etching is large, the line width is widened, and the etching speed is improved.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (1)
1. The etching method of the nickel-titanium superalloy is characterized by comprising the following specific technical routes:
firstly, pre-treatment cleaning, namely, performing alkaline cleaning, electrolytic degreasing, acid cleaning, cleaning with water and drying on a workpiece;
step two, roll coating, namely performing film coating treatment on a workpiece, roll coating with printing ink with main components of resin and photosensitizer, and drying the workpiece in a tunnel furnace after the printing ink protective layer is roll coated;
thirdly, exposing, namely placing the workpiece into a film negative, exposing by an exposure machine, and taking out, wherein the film negative is a workpiece design drawing;
developing, namely developing the exposed workpiece, developing the pattern to be etched, and drying;
fifthly, etching, namely placing the developed workpiece into an etching machine, and carrying out batch spray etching after determining etching parameters, wherein the etching parameters are that the pressure is 1.5-3kg, the temperature is 35-50 ℃, and the spraying time is 10-30min;
the etching solution comprises the following components: 8 to 15 weight percent of ammonium bifluoride, 12 to 20 weight percent of ammonium chloride, 10 to 20 weight percent of ferric trichloride, 1 to 2 weight percent of starch or cellulose, 5 to 10 weight percent of phosphoric acid and the balance of purified water;
sixthly, film stripping, namely, after the etched product passes through alkaline release liquid, the protective layer falls off, and the product is washed by acid, washed by clean water and dried;
and seventh, inspecting and packaging, namely detecting the product on a secondary element detector, and packaging after the product is qualified in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111258689.4A CN113969403B (en) | 2021-10-27 | 2021-10-27 | Etching solution and method for nickel-titanium superalloy |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111258689.4A CN113969403B (en) | 2021-10-27 | 2021-10-27 | Etching solution and method for nickel-titanium superalloy |
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| Publication Number | Publication Date |
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| CN113969403A CN113969403A (en) | 2022-01-25 |
| CN113969403B true CN113969403B (en) | 2023-10-31 |
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| CN114717559A (en) * | 2022-03-03 | 2022-07-08 | 深圳市金泉益科技有限公司 | Titanium etching solution and application thereof |
| CN114990551A (en) * | 2022-06-10 | 2022-09-02 | 湖北可俐星科技有限公司 | Manufacturing method of lightweight metal folding screen lining plate |
| CN115637432B (en) * | 2022-09-30 | 2023-08-22 | 东莞赛诺高德蚀刻科技有限公司 | Manufacturing method of workpiece with holes and high-aspect-ratio grooves and metal workpiece |
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|---|---|---|---|---|
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| JP2005307325A (en) * | 2004-04-26 | 2005-11-04 | Nippon Decor Inc | Etching method |
| CN1733974A (en) * | 2004-08-13 | 2006-02-15 | 上海埃蒙迪材料科技有限公司 | Chemical process of nickel-titanium alloy material |
| CN1743508A (en) * | 2005-09-21 | 2006-03-08 | 中国海洋大学 | Chemical etching solution for titanium and titanium alloy |
| JP2014211960A (en) * | 2013-04-17 | 2014-11-13 | 進和工業株式会社 | Current collector material |
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| CN104962921A (en) * | 2015-05-22 | 2015-10-07 | 江苏大学 | Production method of nickel-titanium alloy surface nickel-free layer |
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