CN111690933B - Deplating solution and deplating method for unqualified cadmium-plated layer - Google Patents
Deplating solution and deplating method for unqualified cadmium-plated layer Download PDFInfo
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- CN111690933B CN111690933B CN202010591234.3A CN202010591234A CN111690933B CN 111690933 B CN111690933 B CN 111690933B CN 202010591234 A CN202010591234 A CN 202010591234A CN 111690933 B CN111690933 B CN 111690933B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
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Abstract
The invention provides a deplating solution and a deplating method for a cadmium-plated layer of an unqualified steel part, wherein the deplating solution comprises the following components in percentage by mass: 60-200 g/L of sulfuric acid, 20-60 g/L of 2, 4-dinitrobenzene sulfonic acid hydrate and 10-50 g/L of hexamethylenetetramine. The process conditions are as follows: and immersing the unqualified plated piece into the deplating solution at room temperature for deplating until the plated layer is completely deplated, and then washing with water. The stripping solution does not contain high-toxicity hexavalent chromium, and solves the problem of high pollution caused by chromic acid stripping solution in the prior art.
Description
Technical Field
The invention belongs to the technical field of electroplating, and particularly relates to a deplating solution and a deplating method for an unqualified cadmium-plated layer.
Background
The cadmium plating process is used for preparing a high-resistance protective layer for aerospace enterprises, and a deplating solution containing chromic acid and sulfuric acid is generally adopted for deplating unqualified cadmium-plated layers. Hexavalent chromium is carcinogenic to human bodies, is a highly toxic substance, and the use of hexavalent chromium compounds is being strictly limited by the electroplating industry. If the cadmium plating layer is removed by hydrochloric acid, the steel substrate can be damaged, so that the plated piece is scrapped, the speed of removing the cadmium plating layer by sulfuric acid is slow, and the substrate exposed after the thinner cadmium plating layer is removed can be corroded to cause damage due to larger thickness difference of the cadmium plating layer.
Disclosure of Invention
Therefore, a new disqualified cadmium plating layer stripping method is needed to be provided, and the problem of high pollution caused by a chromic acid stripping method in the prior art is solved.
In order to achieve the purpose, the invention provides the following technical scheme:
the deplating liquid for unqualified cadmium-plated layer comprises the following components in percentage by weight:
the mass concentration of the sulfuric acid is 60-200 g/L, the mass concentration of the 2, 4-dinitrobenzenesulfonic acid hydrate is 20-60 g/L, and the mass concentration of the hexamethylenetetramine is 5-20 g/L.
In some embodiments, the deplating solution is prepared by the following method:
adding 60-200 g/L sulfuric acid, 20-60 g/L2, 4-dinitrobenzene sulfonic acid hydrate and 5-20 g/L hexamethylenetetramine into water, stirring, and dissolving to obtain the deplating solution.
In some embodiments, the stripping solution comprises the following components in parts by weight:
the mass concentration of the sulfuric acid is 100-150 g/L, the mass concentration of the 2, 4-dinitrobenzenesulfonic acid hydrate is 30-40 g/L, and the mass concentration of the hexamethylenetetramine is 5-15 g/L.
A deplating method of unqualified cadmium-plated layers comprises the following steps:
and immersing the unqualified plated piece into the deplating solution at room temperature for deplating until the plated layer is completely deplated, and then washing with water.
In some of these embodiments, the cadmium plating layer is plated on a steel substrate.
In a dilute sulfuric acid medium, 2, 4-dinitrobenzene sulfonic acid hydrate can quickly oxidize a cadmium plating layer into cadmium ions to be dissolved in a deplating solution. Hexamethylenetetramine has a corrosion inhibition effect on the steel matrix, 2, 4-dinitrobenzene sulfonic acid hydrate has a certain passivation effect on the steel matrix, and the corrosion of sulfuric acid on the steel is slow originally, so that the stripping solution only slightly corrodes the steel matrix within a limited time for stripping the cadmium-plated layer, and the quality of the cadmium-plated layer is not influenced.
Based on the technical scheme, the invention has the following beneficial effects:
1. the corrosion inhibition effect of hexamethylenetetramine on the steel matrix and the passivation effect of the 2, 4-dinitrobenzenesulfonic acid hydrate on the steel matrix are utilized, so that the corrosion speed of sulfuric acid on the steel matrix is reduced, and the steel matrix is ensured not to be damaged in deplating.
2. The deplating solution and the deplating method for the unqualified cadmium-plated layer are green and environment-friendly, and overcome the technical defect that the existing deplating solution for the cadmium-plated layer uses hexavalent chromium.
Detailed Description
In order that the invention may be more readily understood, reference will now be made to the following more particular description of the invention, examples of which are set forth below. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
The disqualified cadmium plating layer deplating solution and the deplating method used in the following embodiments of the invention are as follows:
stripping liquid: the mass concentration of the sulfuric acid is 60-200 g/L, the mass concentration of the 2, 4-dinitrobenzenesulfonic acid hydrate is 20-60 g/L, and the mass concentration of the hexamethylenetetramine is 5-20 g/L. Adding 60-200 g/L sulfuric acid, 20-60 g/L2, 4-dinitrobenzene sulfonic acid hydrate and 5-20 g/L hexamethylenetetramine into water, stirring, and dissolving to obtain the deplating solution.
The deplating method comprises the following steps: and immersing the unqualified plated piece into the deplating solution at room temperature for deplating until the plated layer is completely deplated, and then washing with water.
Example 1:
a deplating solution and a deplating method for unqualified cadmium-plated layers are as follows:
preparing a deplating solution: the mass concentration of sulfuric acid is 130g/L, the mass concentration of 2, 4-dinitrobenzene sulfonic acid hydrate is 40g/L, the mass concentration of hexamethylene tetramine is 10g/L, and the components are added into water according to the content and stirred uniformly.
The thickness of the unqualified cadmium plating layer is 10 mu m, the unqualified plating piece is immersed into the deplating solution for deplating for 12min at room temperature, the cadmium plating layer is observed to be removed after the deplating piece is taken out, and the cadmium plating layer is dried after being cleaned by water. And (5) inspecting the deplated piece, wherein the surface of the substrate has no corrosion defects.
Example 2:
a deplating solution and a deplating method for unqualified cadmium-plated layers are as follows:
preparing a deplating solution: the mass concentration of sulfuric acid is 80g/L, the mass concentration of 2, 4-dinitrobenzene sulfonic acid hydrate is 30g/L, the mass concentration of hexamethylene tetramine is 5g/L, and the components are added into water according to the content and stirred uniformly.
The thickness of the unqualified cadmium plating layer is 10 μm, the unqualified plated piece is immersed into the deplating solution at room temperature for deplating for 15min, the cadmium plating layer is observed to be removed after the deplated piece is taken out, and the cadmium plating layer is dried after being washed by water. And inspecting the deplated piece, wherein the surface of the substrate has no corrosion defects.
Example 3:
a deplating solution and a deplating method for unqualified cadmium-plated layers are as follows:
preparing a deplating liquid: the mass concentration of the sulfuric acid is 180g/L, the mass concentration of the 2, 4-dinitrobenzene sulfonic acid hydrate is 60g/L, the mass concentration of the hexamethylene tetramine is 15g/L, and the components are added into water according to the content and stirred uniformly.
The thickness of the unqualified cadmium plating layer is 10 mu m, the unqualified plated piece is immersed into the deplating solution at room temperature for deplating for 10min, the cadmium plating layer is observed to be removed after the deplated piece is taken out, and the cadmium plating layer is dried after being washed by water. And inspecting the deplated piece, wherein the surface of the substrate has no corrosion defects.
Example 4:
a deplating solution and a deplating method for unqualified cadmium-plated layers are as follows:
preparing a deplating solution: the mass concentration of the sulfuric acid is 60g/L, the mass concentration of the 2, 4-dinitrobenzene sulfonic acid hydrate is 20g/L, the mass concentration of the hexamethylene tetramine is 8g/L, and the components are added into water according to the content and stirred uniformly.
The thickness of the unqualified cadmium plating layer is 10 mu m, the unqualified plating piece is immersed into the deplating solution for deplating for 20min at room temperature, the cadmium plating layer is observed to be removed after the deplating piece is taken out, and the cadmium plating layer is dried after being cleaned by water. And inspecting the deplated piece, wherein the surface of the substrate has no corrosion defects.
Example 5:
the deplating solution and the deplating method for the unqualified cadmium-plated layer are as follows:
preparing a deplating solution: the mass concentration of sulfuric acid is 200g/L, the mass concentration of 2, 4-dinitrobenzene sulfonic acid hydrate is 40g/L, the mass concentration of hexamethylene tetramine is 20g/L, and the components are added into water according to the content and are stirred uniformly.
The thickness of the unqualified cadmium plating layer is 10 mu m, the unqualified plating piece is immersed into the deplating solution for deplating for 8min at room temperature, the cadmium plating layer is observed to be removed after the deplating piece is taken out, and the cadmium plating layer is dried after being cleaned by water. And inspecting the deplated piece, wherein the surface of the substrate has no corrosion defects.
Example 6:
a deplating solution and a deplating method for unqualified cadmium-plated layers are as follows:
preparing a deplating solution: the mass concentration of sulfuric acid is 100g/L, the mass concentration of 2, 4-dinitrobenzene sulfonic acid hydrate is 60g/L, the mass concentration of hexamethylene tetramine is 6g/L, and the components are added into water according to the content and stirred uniformly.
The thickness of the unqualified cadmium plating layer is 10 mu m, the unqualified plating piece is immersed into the deplating solution for deplating for 12min at room temperature, the cadmium plating layer is observed to be removed after the deplating piece is taken out, and the cadmium plating layer is dried after being cleaned by water. And inspecting the deplated piece, wherein the surface of the substrate has no corrosion defects.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (5)
1. The deplating solution for the unqualified cadmium-plated layer is characterized by comprising the following components in percentage by weight:
the mass concentration of the sulfuric acid is 60-200 g/L, the mass concentration of the 2, 4-dinitrobenzenesulfonic acid hydrate is 20-60 g/L, and the mass concentration of the hexamethylenetetramine is 5-20 g/L.
2. The deplating solution for the unqualified cadmium-plated layer according to claim 1, which is characterized in that the preparation method of the deplating solution comprises the following steps:
adding 60-200 g/L sulfuric acid, 20-60 g/L2, 4-dinitrobenzene sulfonic acid hydrate and 5-20 g/L hexamethylenetetramine into water, stirring, and dissolving to obtain the deplating solution.
3. The stripping solution for the unqualified cadmium plating layer according to claim 1, which is characterized by comprising the following components in percentage by weight:
the mass concentration of the sulfuric acid is 100-150 g/L, the mass concentration of the 2, 4-dinitrobenzenesulfonic acid hydrate is 30-40 g/L, and the mass concentration of the hexamethylenetetramine is 5-15 g/L.
4. The deplating method of the unqualified cadmium-plated layer is characterized by comprising the following steps:
a disqualified plated article is immersed in the deplating solution according to any one of claims 1 to 3 at room temperature for deplating until the plating layer is removed, and then washed with water.
5. The method for deplating a nonconforming cadmium-plated layer according to claim 4, wherein:
the cadmium plating layer is plated on the steel substrate.
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| CN202010591234.3A CN111690933B (en) | 2020-06-24 | 2020-06-24 | Deplating solution and deplating method for unqualified cadmium-plated layer |
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| CN103924245A (en) * | 2014-04-10 | 2014-07-16 | 北京工业大学 | Chemical stripping solution and stripping method |
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| CN103924245A (en) * | 2014-04-10 | 2014-07-16 | 北京工业大学 | Chemical stripping solution and stripping method |
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