CN113966165B - Encapsulation mechanism and encapsulation method for electronic components - Google Patents
Encapsulation mechanism and encapsulation method for electronic components Download PDFInfo
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- CN113966165B CN113966165B CN202111041327.XA CN202111041327A CN113966165B CN 113966165 B CN113966165 B CN 113966165B CN 202111041327 A CN202111041327 A CN 202111041327A CN 113966165 B CN113966165 B CN 113966165B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/80—Packaging reuse or recycling, e.g. of multilayer packaging
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- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses a packaging mechanism and a packaging method of an electronic component, and relates to the field of electronic component packaging. The mechanism comprises a frame, a mounting component arranged on the frame, and a fixed block arranged on the mounting component, wherein the fixed component is arranged under the fixed block and comprises a first buffer spring, a connecting column and a first electromagnet. According to the invention, the positioning column is arranged below the second electromagnet, the plug is arranged on the positioning column and is required to be inserted into the jack of the second electromagnet, the cylindrical protruding block contacts with the inner wall of the jack around the plug, so that the friction force between the plug and the jack is increased, the electronic components are protected from being damaged, and the service life of the electronic components is prolonged.
Description
Technical Field
The present invention relates to the field of electronic component packaging technology, and in particular, to a packaging mechanism for an electronic component and a packaging method thereof.
Background
The electronic components are components of electronic components, small-sized machines and instruments, and are generally composed of a plurality of parts, and the electronic components are generally divided into circuit components and connection components, wherein the circuit components are generally components such as resistors, capacitors and diodes, and the connection components are generally connectors, connection cables, PCBs, sockets and the like.
With the development of the era, more and more electronic components develop towards miniaturization, intellectualization, chip type, environmental protection, energy saving, integration and high performance, and with the gradual commercialization of the next generation of Internet, new generation of mobile communication and digital television, the upgrading and upgrading of the electronic complete machine industry will bring great market opportunity for the development of electronic materials and component industry.
The utility model discloses an electronic components detects encapsulation all-in-one in CN112918739A, loading mechanism places the electronic components who has detected on the carrier tape, cover area feed mechanism carries the top of carrier tape with the cover area, and cover the cover area on the carrier tape, encapsulation mechanism encapsulates electronic components between carrier tape and cover area, receive the accomodate of electronic components that the material subassembly will encapsulate the completion, wherein, loading mechanism includes the bottom plate, set firmly adjusting seat and first adjusting bolt on the bottom plate, the screw thread end of first adjusting bolt passes the adjusting seat, the screw thread end of first adjusting bolt is connected with the regulating plate, the regulating plate slides and sets up on the bottom plate, be provided with push-and-pull electromagnet on the regulating plate, be equipped with the push-and-pull axle on the push-and-pull electromagnet, be connected with the implantation pole on the push-and-pull axle, carry out the centre gripping of electronic components through loading subassembly.
When the electronic components are packaged, the electronic components are held by the material loading mechanism, the electronic components are adsorbed by the electromagnet, but when the electronic components are adsorbed, sometimes the electronic components are offset, inaccurate adsorption is caused, the electronic components are skewed when finally packaged, the electronic components fall into the package, the speed is high, the electronic components are damaged, and the service life of the electronic components is shortened, so that the electronic components packaging mechanism and the electronic components packaging method are provided.
Disclosure of Invention
The invention aims to provide a packaging mechanism and a packaging method of electronic components, wherein the electronic components are held by using a material loading mechanism, and the electronic components are adsorbed by using an electromagnet, but when the electronic components are adsorbed, sometimes the electronic components are offset, so that the adsorption is inaccurate, and finally the electronic components are skewed when packaged, and the electronic components fall into a package, so that the speed is high, the electronic components are damaged, and the service life of the electronic components is shortened.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a packaging mechanism of an electronic component, which comprises a frame, a mounting assembly arranged on the frame and a fixed block arranged on the mounting assembly, wherein the fixed assembly is arranged below the fixed block;
the fixing assembly comprises a first buffer spring, a connecting column and a first electromagnet, wherein a mounting hole is formed in the middle of the lower part of the fixing block, the first buffer spring is arranged in the mounting hole, the connecting column is arranged below the first buffer spring, the first electromagnet is arranged at one end, far away from the first buffer spring, of the connecting column, when the electromagnet is electrified, magnetic force is generated, the first electromagnet generates magnetic force to adsorb electronic components, and the first buffer spring buffers the force to prevent the electronic components from being crushed;
four fixed orifices are arranged below the fixed block, the fixed block is of a cuboid structure, each fixed orifice is close to one corner of the fixed block, each fixed orifice is internally provided with a second buffer spring, each second buffer spring is provided with a buffer column at one end, each buffer column is provided with a second electromagnet at one end, four positioning columns are arranged below the second electromagnet, each positioning column is close to one corner of the second electromagnet, a round table-shaped plug is arranged below each positioning column, each plug outer wall is provided with a plurality of cylindrical bumps, the four second electromagnets are used for respectively sucking the periphery of the electronic component, the electronic component is adsorbed more stably, the electronic component is provided with a jack, the plug is inserted into the jack for positioning, the bumps can increase friction force between the plug and the jack of the electronic component, so that the speed is slower when the electromagnet loosens the electronic component, and impact damage of the electronic component is reduced.
Preferably, four bearing columns are arranged under the frame, each bearing column is close to one corner of the frame, one bearing foot is arranged below each bearing column, a conveyor belt is arranged in the middle of the upper portion of the frame, the bearing columns are connected with the bearing feet, the bottoms of the bearing feet are large, and the anti-skid performance is improved.
Preferably, the installation component includes mounting bracket and mounting box, mounting bracket one side is equipped with the mounting box, the inside adjusting part that is equipped with of mounting box, adjusting part includes speed reducer, driving motor and ball, and the speed reducer sets up in the inside one side of mounting box, the speed reducer input is connected with driving motor, the speed reducer output is connected with ball, the last activity of ball is equipped with the removal sleeve, and driving motor can carry out forward and reverse rotation, and forward and reverse rotation makes ball forward and reverse rotation, and ball forward and reverse rotation enables to remove the sleeve and control.
Preferably, the lifting assembly is arranged on the movable sleeve, the lifting assembly comprises a lifting box, an air cylinder and a lifting shaft, the lifting box is connected to the movable sleeve, the air cylinder is arranged above the lifting box, the output end of the air cylinder is connected with the lifting shaft, the lower end of the lifting shaft is connected with the fixed block, and the air cylinder drives the lifting shaft to move up and down and drive the fixed block to move up and down.
Preferably, the frame is provided with a heat radiation component, the heat radiation component comprises a heat radiation box and a heat radiation fan, the heat radiation box is arranged at the bottom of the frame, the heat radiation fan is arranged inside the heat radiation box, and the output end of the heat radiation fan is aligned to the upper part of the frame to radiate heat of the whole frame.
Preferably, the installation component, the adjusting component and the lifting component are all provided with two, the fixed block is provided with two, and the fixed block is connected with the installation component through the lifting component and the adjusting component, the installation component is used for installing the adjusting component, the adjusting component adjusts the fixed block to transversely move, and the lifting component is used for adjusting the longitudinal height.
A packaging method of a packaging mechanism of an electronic component comprises the following steps:
s1: the operator places the packaging shells on one side of the conveyor belt in sequence, the conveyor belt transversely moves, and the electronic components and the packaging covers are placed beside the transversely moving conveyor belt to prepare for packaging;
s2: an operator starts a driving motor, the driving motor rotates positively, the speed is reduced through a speed reducer, and a ball screw at the output end rotates to drive a moving sleeve to move towards the direction of the electronic component, so that a fixed assembly moves to the position right above the electronic component;
s3: the operator starts the air cylinder, the output end of the air cylinder is connected with the fixed block through the lifting shaft, and the fixed block is driven to move downwards, so that the first electromagnet below the fixed block adsorbs the central position of the electronic component;
s4: after the electronic component is stable, an operator starts the driving motor to rotate reversely, so that the moving sleeve drives the fixed block to move in the moving process, and when the fixed block moves to the position right below the packaging shell, the air cylinder is started again, so that the electronic component moves downwards, and the electronic component is placed in the packaging shell;
s5: the operator operates the cylinder to enable the first electromagnet below the fixed block to attract the center of the encapsulation cover, the second electromagnet around the first electromagnet attracts the four corners of the encapsulation cover respectively, the plug is inserted into the jack in the corner, and the encapsulation cover is lifted;
s6: after the fixation, the driving motor is started to rotate reversely, so that the movable sleeve is moved, the fixed block is driven to move, and the packaging cover is moved to the position right below the packaging shell;
s7: the operator starts the cylinder, makes the encapsulation lid remove downwards, covers encapsulation shell, and after the electronic components encapsulation was accomplished, carries out the lateral movement with the electronic components that encapsulates again through the conveyer belt and carries out.
Preferably, the second electromagnets around the fixing block respectively attract four corners of the electronic component, and the plug is inserted into the jack in the corner.
The invention has the following beneficial effects:
1. according to the invention, the positioning column is arranged below the second electromagnet, the plug is arranged on the positioning column and is required to be inserted into the jack of the second electromagnet, the cylindrical protruding block is in contact with the inner wall of the jack around the plug, the friction force between the plug and the jack is increased, the falling speed of the electronic component when the magnetic force of the electromagnet disappears is slowed down, the electronic component is enabled to fall into the packaging shell relatively gently, the electronic component is protected from being damaged, and the service life of the electronic component is prolonged.
2. According to the invention, the second electromagnets for assisting in adsorption are arranged around the first electromagnets, and the second electromagnets adsorb the periphery of the electronic components respectively, so that the electronic components are adsorbed more stably, and the positioning columns are arranged around the second electromagnets, so that the electronic components cannot deviate during adsorption, and the electronic components are ensured to be more stable during encapsulation.
Of course, it is not necessary for any one product to practice the invention to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic elevational view of the structure shown in FIG. 1;
FIG. 3 isbase:Sub>A schematic cross-sectional view of the invention at A-A in FIG. 2;
FIG. 4 is a schematic cross-sectional view of the invention at B-B in FIG. 2;
FIG. 5 is a schematic cross-sectional view of the invention at C-C in FIG. 2;
FIG. 6 is an enlarged view of a portion of the invention at D in FIG. 2;
FIG. 7 is an enlarged view of a portion of FIG. 4 at E in accordance with the present invention;
FIG. 8 is an enlarged view of a portion of the invention at F in FIG. 5;
fig. 9 is a flow chart of a packaging method of a packaging mechanism for electronic components according to the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
110. a frame; 120. a load-bearing column; 130. a carrying foot; 140. a conveyor belt; 210. a fixed block; 220. a first buffer spring; 230. a connecting column; 240. a first electromagnet; 250. a second buffer spring; 260. a buffer column; 270. a second electromagnet; 310. positioning columns; 320. a plug; 330. a bump; 410. a mounting frame; 420. a mounting box; 430. a speed reducer; 440. a driving motor; 450. a ball screw; 460. moving the sleeve; 510. a lifting box; 520. a cylinder; 530. a lifting shaft; 610. a heat radiation box; 620. a heat radiation fan.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "upper," "middle," "outer," "inner," and the like indicate an orientation or a positional relationship, and are merely for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1-9, the present embodiment includes a frame 110, a mounting assembly disposed on the frame 110, and a fixing block 210 disposed on the mounting assembly, wherein the fixing assembly is disposed under the fixing block 210;
the fixing assembly comprises a first buffer spring 220, a connecting column 230 and a first electromagnet 240, wherein a mounting hole is formed in the middle of the lower part of the fixing block 210, the first buffer spring 220 is arranged in the mounting hole, the connecting column 230 is arranged below the first buffer spring 220, the first electromagnet 240 is arranged at one end, far away from the first buffer spring 220, of the connecting column 230, when the electromagnet is electrified, magnetic force is generated, the first electromagnet 240 generates magnetic force to absorb electronic components, and the first buffer spring 220 buffers the force to prevent the electronic components from being crushed;
four fixing holes are formed below the fixing block 210, the fixing block 210 is of a cuboid structure, each fixing hole is close to one corner of the fixing block 210, a second buffer spring 250 is arranged inside each fixing hole, one end of each second buffer spring 250 is provided with a buffer column 260, one end of each buffer column 260 is provided with a second electromagnet 270, four positioning columns 310 are arranged below each second electromagnet 270, each positioning column 310 is close to one corner of the second electromagnet 270, a round table-shaped plug 320 is arranged below each positioning column 310, a plurality of cylindrical bumps 330 are arranged on the outer wall of each plug 320, the four second electromagnets 270 are respectively attracted around the electronic component, the electronic component is adsorbed more stably, the electronic component is provided with a jack, the plug 320 is inserted into the jack for positioning, the cylindrical bumps 330 can increase friction force between the plug 320 and the jack of the electronic component, so that when the electromagnet loosens the electronic component, the speed is slower, and impact damage of the electronic component is reduced.
Four bearing columns 120 are arranged under the frame 110, each bearing column 120 is close to one corner of the frame 110, a bearing foot 130 is arranged under each bearing column 120, a conveyor belt 140 is arranged in the middle of the upper part of the frame 110, the bearing columns 120 are connected with the bearing feet 130, the bottom surfaces of the bearing feet 130 are large, and the anti-skid performance is improved.
The installation component includes mounting bracket 410 and mounting box 420, mounting bracket 410 one side is equipped with mounting box 420, the inside adjusting part that is equipped with of mounting box 420, adjusting part includes speed reducer 430, driving motor 440 and ball 450, speed reducer 430 sets up in the inside one side of mounting box 420, speed reducer 430 input is connected with driving motor 440, the speed reducer 430 output is connected with ball 450, the last activity of ball 450 is equipped with and removes sleeve 460, driving motor 440 can carry out forward and reverse rotation, forward and reverse rotation makes ball 450 just reverse rotation, ball just reverse rotation 450 enables to remove sleeve 460 and controls the removal.
The lifting assembly is arranged on the movable sleeve 460 and comprises a lifting box 510, an air cylinder 520 and a lifting shaft 530, the lifting box 510 is connected to the movable sleeve 460, the air cylinder 520 is arranged above the lifting box 510, the output end of the air cylinder 520 is connected with the lifting shaft 530, the lower end of the lifting shaft 530 is connected with the fixed block 210, and the air cylinder 520 drives the lifting shaft 530 to move up and down and drive the fixed block 210 to move up and down.
The frame 110 is provided with a heat dissipation component, the heat dissipation component comprises a heat dissipation box 610 and a heat dissipation fan 620, the heat dissipation box 610 is arranged at the bottom of the frame 110, the heat dissipation fan 620 is arranged inside the heat dissipation box 610, and the output end of the heat dissipation fan 620 is aligned to the upper part of the frame 110 to dissipate heat of the whole frame 110.
Installation component, adjusting part and lifting unit all are equipped with two, fixed block 210 is equipped with two, and fixed block 210 passes through lifting unit and adjusting part and is connected with installation component, installation component is used for installing adjusting part, adjusting part adjusts fixed block 210 lateral shifting, lifting unit is used for adjusting vertical height, second electro-magnet 270 below sets up reference column 310, set up plug 320 on the reference column 310, plug 320 needs to insert in the jack of second electro-magnet 270, cylindric lug 330 contacts with the inner wall of jack around plug 320, increase plug 320 and the frictional force of jack, slow down the whereabouts speed of electronic components when the electro-magnet disappears magnetic force, make electronic components fall in encapsulation shell gently, protect electronic components not damaged, improve electronic components's life.
A packaging method of a packaging mechanism of an electronic component comprises the following steps:
s1: the operator places the packaging shells on one side of the conveyor belt 140 in sequence, the conveyor belt 140 moves transversely, and the electronic components and the packaging covers are placed beside the conveyor belt 140 which moves transversely to prepare for packaging;
s2: the operator starts the driving motor 440, the driving motor 440 rotates forward, the speed is reduced by the speed reducer 430, the ball screw 450 at the output end rotates, the moving sleeve 460 is driven to move towards the direction of the electronic component, and the fixed component is driven to move right above the electronic component;
s3: the operator starts the air cylinder 520, the output end of the air cylinder 520 is connected with the fixed block 210 through the lifting shaft 530, and the fixed block 210 is driven to move downwards, so that the first electromagnet 240 below the fixed block 210 adsorbs the central position of the electronic component;
s4: after the electronic component is stabilized, an operator starts the driving motor 440 to rotate reversely, so that the moving sleeve 460 drives the fixed block 210 to move in the moving process, and when the fixed block 210 moves to the position right below the packaging shell, the air cylinder 520 is started again, so that the electronic component moves downwards, and the electronic component is placed in the packaging shell;
s5: the operator operates the cylinder 520 to make the first electromagnet 240 under the fixing block 210 suck the center position of the packing cover, and the surrounding second electromagnets 270 suck the four corners of the packing cover respectively, and the plug 320 is inserted into the insertion hole in the corner to lift the packing cover;
s6: after the fixation, the driving motor 440 is started to rotate reversely, so that the moving sleeve 460 moves to drive the fixed block 210 to move, and the packaging cover moves to the position right below the packaging shell;
s7: the operator activates the air cylinder 520 to move the encapsulation cover downward to cover the encapsulation case, and then, after the encapsulation of the electronic components is completed, the encapsulated electronic components are moved out laterally by the conveyor belt 140.
The second electromagnet 270 for assisting in adsorption is arranged around the first electromagnet 240, and the second electromagnet 270 adsorbs the periphery of the electronic components respectively, so that the electronic components are adsorbed more stably, and the positioning column 310 is arranged around the second electromagnet, so that the electronic components cannot deviate during adsorption, and the electronic components are ensured to be more stable during encapsulation.
The second electromagnets 270 around the fixing block 210 are attracted to the four corners of the encapsulation cover, respectively, and the plugs 320 are inserted into the insertion holes in the corners.
In the description of the present specification, the descriptions of the terms "one embodiment," "example," "specific example," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended only to assist in the explanation of the invention. The preferred embodiments are not exhaustive or to limit the invention to the precise form disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best understand and utilize the invention. The invention is limited only by the claims and the full scope and equivalents thereof.
Claims (8)
1. An encapsulation mechanism of an electronic component, which is characterized in that: the device comprises a frame (110), a mounting assembly arranged on the frame (110) and a fixed block (210) arranged on the mounting assembly, wherein the fixed assembly is arranged below the fixed block (210);
the fixing assembly comprises a first buffer spring (220), a connecting column (230) and a first electromagnet (240), wherein a mounting hole is formed in the middle of the lower portion of the fixing block (210), the first buffer spring (220) is arranged in the mounting hole, the connecting column (230) is arranged below the first buffer spring (220), and the first electromagnet (240) is arranged at one end, far away from the first buffer spring (220), of the connecting column (230);
four fixed orifices are arranged below the fixed block (210), the fixed block (210) is of a cuboid structure, each fixed orifice is close to one corner of the fixed block (210), each fixed orifice is internally provided with a second buffer spring (250), each second buffer spring (250) is provided with a buffer column (260) at one end, each buffer column (260) is provided with a second electromagnet (270), four positioning columns (310) are arranged below each second electromagnet (270), each positioning column (310) is close to one corner of the second electromagnet (270), each positioning column (310) is provided with a round table-shaped plug (320) below, and a plurality of cylindrical protruding blocks (330) are arranged on the outer wall of each plug (320).
2. The packaging mechanism for electronic components of claim 1, wherein: four bearing columns (120) are arranged under the frame (110), each bearing column (120) is close to one corner of the frame (110), one bearing foot (130) is arranged below each bearing column (120), and a conveying belt (140) is arranged in the middle of the upper part of the frame (110).
3. The packaging mechanism for electronic components of claim 1, wherein: the installation component includes mounting bracket (410) and mounting box (420), mounting bracket (410) one side is equipped with mounting box (420), inside adjusting part that is equipped with of mounting box (420), adjusting part includes speed reducer (430), driving motor (440) and ball (450), and speed reducer (430) set up in inside one side of mounting box (420), speed reducer (430) input is connected with driving motor (440), speed reducer (430) output is connected with ball (450), the activity is equipped with on ball (450) and removes sleeve (460).
4. A packaging mechanism for electronic components as claimed in claim 3, wherein: the lifting assembly is arranged on the movable sleeve (460), the lifting assembly comprises a lifting box (510), an air cylinder (520) and a lifting shaft (530), the lifting box (510) is connected to the movable sleeve (460), the air cylinder (520) is arranged above the lifting box (510), the lifting shaft (530) is connected to the output end of the air cylinder (520), and the lower end of the lifting shaft (530) is connected with the fixed block (210).
5. The packaging mechanism for electronic components of claim 1, wherein: the cooling device is characterized in that a cooling assembly is arranged on the frame (110), the cooling assembly comprises a cooling box (610) and a cooling fan (620), the cooling box (610) is arranged at the bottom of the frame (110), and the cooling fan (620) is arranged inside the cooling box (610).
6. The electronic component packaging mechanism of claim 4, wherein: the installation assembly, the adjusting assembly and the lifting assembly are all provided with two, the fixed blocks (210) are provided with two, and the fixed blocks (210) are connected with the installation assembly through the lifting assembly and the adjusting assembly.
7. A packaging method using the packaging mechanism for electronic components according to claim 4, characterized in that: the method comprises the following steps: s1: the operator places the packaging shells on one side of the conveyor belt (140) in sequence, the conveyor belt (140) transversely moves, and the electronic components and the packaging covers are placed beside the conveyor belt (140) transversely moving to prepare for packaging;
s2: an operator starts a driving motor (440), the driving motor (440) rotates positively, the speed is reduced by a speed reducer (430), a ball screw (450) at the output end rotates, a moving sleeve (460) is driven to move towards the direction of the electronic component, and a fixed component is driven to move right above the electronic component;
s3: an operator starts an air cylinder (520), the output end of the air cylinder (520) is connected with a fixed block (210) through a lifting shaft (530), and the fixed block (210) is driven to move downwards, so that a first electromagnet (240) below the fixed block (210) adsorbs the central position of an electronic component;
s4: after the electronic component is stable, an operator starts the driving motor (440) to rotate reversely, so that the moving sleeve (460) drives the fixed block (210) to move in the moving process, and when the fixed block (210) moves to the position right below the packaging shell, the air cylinder (520) is started again, so that the electronic component moves downwards, and the electronic component is placed in the packaging shell;
s5: an operator operates the air cylinder (520) to enable the first electromagnet (240) below the fixed block (210) to suck the central position of the packaging cover, the surrounding second electromagnets (270) respectively suck the four corners of the packaging cover, the plug (320) is inserted into the insertion holes in the corners, and the packaging cover is lifted;
s6: after the fixation, the driving motor (440) is started to rotate reversely, so that the moving sleeve (460) is moved to drive the fixed block (210) to move, and the packaging cover is moved to the position right below the packaging shell;
s7: the operator activates the cylinder (520) to move the encapsulation cover downwards to cover the encapsulation shell, and after the encapsulation of the electronic components is completed, the encapsulated electronic components are moved out transversely through the conveyor belt (140).
8. A packaging method using the packaging mechanism for electronic components according to any one of claims 1 to 6, characterized in that: and second electromagnets (270) around the fixing block (210) respectively absorb four corners of the electronic component, and plugs (320) are inserted into jacks in the corners.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041327.XA CN113966165B (en) | 2021-09-07 | 2021-09-07 | Encapsulation mechanism and encapsulation method for electronic components |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111041327.XA CN113966165B (en) | 2021-09-07 | 2021-09-07 | Encapsulation mechanism and encapsulation method for electronic components |
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| CN113966165A CN113966165A (en) | 2022-01-21 |
| CN113966165B true CN113966165B (en) | 2023-04-25 |
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| CN213026056U (en) * | 2020-08-26 | 2021-04-20 | 台州微标电子有限公司 | Novel electronic components encapsulation equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111975726A (en) * | 2020-08-29 | 2020-11-24 | 温州宇岚科技有限公司 | Intelligent operation room shift unit |
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