CN113966165A - Electronic component packaging mechanism and packaging method thereof - Google Patents
Electronic component packaging mechanism and packaging method thereof Download PDFInfo
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- CN113966165A CN113966165A CN202111041327.XA CN202111041327A CN113966165A CN 113966165 A CN113966165 A CN 113966165A CN 202111041327 A CN202111041327 A CN 202111041327A CN 113966165 A CN113966165 A CN 113966165A
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- packaging
- electronic component
- fixed block
- mounting
- electromagnet
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/80—Packaging reuse or recycling, e.g. of multilayer packaging
Abstract
The invention discloses a packaging mechanism and a packaging method of an electronic component, and relates to the field of electronic component packaging. The mechanism comprises a rack, a mounting component arranged on the rack and a fixed block arranged on the mounting component, wherein the fixed component is arranged below the fixed block and comprises a first buffer spring, a connecting column and a first electromagnet. According to the invention, the positioning column is arranged below the second electromagnet, the plug is arranged on the positioning column, the plug needs to be inserted into the jack of the second electromagnet, and the cylindrical convex block is contacted with the inner wall of the jack around the plug, so that the friction force between the plug and the jack is increased, the electronic component is protected from being damaged, and the service life of the electronic component is prolonged.
Description
Technical Field
The invention relates to the technical field of electronic component packaging, in particular to a packaging mechanism and a packaging method of an electronic component.
Background
Electronic components are components of electronic components, small-sized machines and instruments, and generally include several parts, the electronic components are generally classified into circuit components and connection components, the circuit components are generally resistors, capacitors, diodes and the like, and the connection components are generally connectors, connection cables, PCBs, sockets and the like.
With the development of the times, more and more electronic components are developed towards the direction of miniaturization, intellectualization, chip type, environmental protection, energy conservation, integration and high performance, and with the gradual commercialization of the next generation of internet, the new generation of mobile communication and digital television, the upgrading and updating of the electronic complete machine industry will bring huge market opportunities for the development of the electronic material and component industry.
The ' electronic component detects encapsulation all-in-one ' disclosed in CN112918739A, the electronic component that the material loading mechanism will have detected is placed on the carrier band, the top of carrier band is carried with the lid area to lid area feed mechanism, and cover the lid area on the carrier band, encapsulation mechanism encapsulates electronic component between carrier band and lid area, receive the accomodation of the electronic component that the material subassembly will encapsulate and accomplish, wherein, material loading mechanism includes the bottom plate, it adjusts seat and first adjusting bolt to set firmly on the bottom plate, the threaded end of first adjusting bolt passes adjusts the seat, the threaded end of first adjusting bolt is connected with the regulating plate, the regulating plate slides and sets up on the bottom plate, be provided with the push-and-pull electro-magnet on the regulating plate, be equipped with the push-and-pull axle on the push-and-pull axle, be connected with the implantation pole on the push-pull axle, carry out electronic component's centre gripping through the material loading subassembly.
Above-mentioned device is when encapsulating electronic components, uses to carry the material mechanism and holds, adsorbs electronic components with electromagnet, but when adsorbing, electronic components can take place the skew sometimes, leads to adsorbing inaccurate, can be crooked when encapsulating at last to electronic components drops in the packing, and is fast, can lead to electronic components to take place the damage, makes its life reduce, so we provide an electronic components's packaging mechanism and packaging method.
Disclosure of Invention
The invention aims to provide a packaging mechanism and a packaging method of an electronic component, wherein a material loading mechanism is used for containing the electronic component, the electronic component is adsorbed by an electromagnet, but during adsorption, the electronic component sometimes deviates to cause inaccurate adsorption and finally deflects during packaging, and the electronic component falls into a package at a high speed to cause damage to the electronic component, so that the service life of the electronic component is shortened.
In order to solve the technical problems, the invention is realized by the following technical scheme:
the invention relates to a packaging mechanism of an electronic component, which comprises a rack, a mounting assembly arranged on the rack and a fixed block arranged on the mounting assembly, wherein the fixed block is provided with a fixed assembly below;
the fixing assembly comprises a first buffer spring, a connecting column and a first electromagnet, a mounting hole is formed in the middle position below the fixing block, the first buffer spring is arranged in the mounting hole, the connecting column is arranged below the first buffer spring, the first electromagnet is arranged at one end, away from the first buffer spring, of the connecting column, the electromagnet is electrified to generate magnetic force, the first electromagnet generates magnetic force to adsorb the electronic component, and the first buffer spring buffers the force to prevent the electronic component from being crushed;
four fixing holes are arranged below the fixing block, the fixing block is of a cuboid structure, each fixing hole is close to one corner of the fixing block, a second buffer spring is arranged inside each fixing hole, one end of each second buffer spring is provided with a buffer column, one end of each buffer column is provided with a second electromagnet, four positioning columns are arranged below each second electromagnet, each positioning column is close to one corner of the second electromagnet, a round platform-shaped plug is arranged below each positioning column, the outer wall of each plug is provided with a plurality of cylindrical convex blocks, the four second electromagnets respectively suck the periphery of the electronic component to enable the electronic component to be adsorbed more stably, the electronic component is provided with jacks, the plugs are inserted into the jacks for positioning, and the cylindrical convex blocks can increase the friction force between the plugs and the jacks of the electronic component, when the electromagnet loosens the electronic components, the speed is lower, and the impact damage of the electronic components is reduced.
Preferably, the frame has four bearing posts, and every bearing post is close to a corner of frame, every bearing post below is equipped with one and bears the foot, and frame top intermediate position is equipped with the conveyer belt, and bearing post connects and bears the foot, bears the foot bottom surface great, has promoted anti-skidding performance.
Preferably, the installation component includes mounting bracket and mounting box, mounting bracket one side is equipped with the mounting box, the inside adjusting part that is equipped with of mounting box, the adjusting part includes speed reducer, driving motor and ball, and the speed reducer sets up in the inside one side of mounting box, the speed reducer input is connected with driving motor, the speed reducer output is connected with ball, the ball is gone up the activity and is equipped with the traveling sleeve, and driving motor can carry out just reversal, and just reversal makes ball just reversal, and ball just reversal can make the traveling sleeve remove about.
Preferably, be equipped with lifting unit on the movable sleeve, lifting unit includes lift box, cylinder and lift axle, the lift box is connected on the movable sleeve, lift box top is equipped with the cylinder, the cylinder output is connected with the lift axle, lift axle lower extreme is connected with the fixed block, and cylinder drive lift axle reciprocates, drives the fixed block and reciprocates.
Preferably, a heat dissipation assembly is arranged on the rack and comprises a heat dissipation box and a heat dissipation fan, the heat dissipation box is arranged at the bottom of the rack, the heat dissipation fan is arranged inside the heat dissipation box, and the output end of the heat dissipation fan is aligned to the upper portion of the rack to dissipate heat of the whole rack.
Preferably, installation component, adjusting part and lifting unit all are equipped with two, the fixed block is equipped with two, and the fixed block passes through lifting unit and adjusting part and is connected with the installation component, and the installation component is used for installing the adjusting part, and the adjusting part adjusts the fixed block lateral shifting, and lifting unit is used for adjusting vertical height.
A packaging method of a packaging mechanism of an electronic component comprises the following steps:
s1: an operator places the packaging shells on one side of the conveyor belt one by one in sequence, the conveyor belt moves transversely, and the electronic components and the packaging covers are placed beside the conveyor belt which moves transversely to prepare for packaging;
s2: an operator starts a driving motor, the driving motor rotates forwards, the speed is reduced by a speed reducer, a ball screw at the output end rotates automatically, a movable sleeve is driven to move towards the direction of the electronic component, and the fixed assembly is moved to the position right above the electronic component;
s3: an operator starts the air cylinder, the output end of the air cylinder is connected with the fixed block through the lifting shaft, and the fixed block is driven to move downwards, so that the first electromagnet below the fixed block adsorbs the central position of the electronic component;
s4: after the electronic components are stabilized, an operator starts the driving motor to rotate reversely, so that the fixed block is driven to move in the moving process of the movable sleeve, and when the fixed block moves to the position right below the packaging shell, the air cylinder is started again to enable the electronic components to move downwards, and the electronic components are placed in the packaging shell;
s5: an operator operates the air cylinder to enable the first electromagnet below the fixed block to suck the central position of the packaging cover, the second electromagnets around the fixed block respectively suck four corners of the packaging cover, the plug is inserted into the insertion holes in the corners, and the packaging cover is lifted;
s6: after the stability is achieved, the driving motor is started to rotate reversely, so that the movable sleeve moves to drive the fixing block to move, and the packaging cover is moved to the position right below the packaging shell;
s7: the operator starts the cylinder, makes the encapsulation lid move down, covers the encapsulation shell, and after electronic components encapsulation was accomplished, carries out the horizontal removal with the electronic components who encapsulates again and transports through the conveyer belt.
Preferably, the second electromagnets around the fixed block respectively attract four corners of the electronic component, and the plug is inserted into the insertion hole in the corner.
The invention has the following beneficial effects:
1. according to the invention, the positioning column is arranged below the second electromagnet, the plug is arranged on the positioning column, the plug needs to be inserted into the jack of the second electromagnet, and the cylindrical convex block is contacted with the inner wall of the jack around the plug, so that the friction force between the plug and the jack is increased, the falling speed of the electronic component when the magnetic force of the electromagnet disappears is slowed down, the electronic component is slightly fallen into the packaging shell, the electronic component is protected from being damaged, and the service life of the electronic component is prolonged.
2. According to the invention, the second electromagnets for assisting adsorption are arranged around the first electromagnet, and the second electromagnets are respectively adsorbed around the electronic component, so that the electronic component is more stably adsorbed, and the positioning columns are arranged around the second electromagnets, so that the electronic component is not deviated during adsorption, and the stability during packaging is ensured.
Of course, it is not necessary for any product in which the invention is practiced to achieve all of the above-described advantages at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic front view of the structure shown in FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along line A-A of FIG. 2 in accordance with the present invention;
FIG. 4 is a schematic cross-sectional view taken along line B-B of FIG. 2 in accordance with the present invention;
FIG. 5 is a schematic cross-sectional view taken at C-C of FIG. 2 in accordance with the present invention;
FIG. 6 is an enlarged view of a portion of FIG. 2 in accordance with the present invention;
FIG. 7 is an enlarged view of a portion of the invention at E in FIG. 4;
FIG. 8 is an enlarged view of a portion of the invention shown at F in FIG. 5;
fig. 9 is a schematic flow chart of a packaging method of a packaging mechanism of an electronic component according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
110. a frame; 120. a load bearing column; 130. a carrying foot; 140. a conveyor belt; 210. a fixed block; 220. a first buffer spring; 230. connecting columns; 240. a first electromagnet; 250. a second buffer spring; 260. a buffer column; 270. a second electromagnet; 310. a positioning column; 320. a plug; 330. a bump; 410. a mounting frame; 420. mounting a box; 430. a speed reducer; 440. a drive motor; 450. a ball screw; 460. moving the sleeve; 510. a lifting box; 520. a cylinder; 530. a lifting shaft; 610. a heat dissipation box; 620. a heat dissipation fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "middle", "outer", "inner", and the like, indicate orientations or positional relationships, are used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referenced components or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1 to 9, the present embodiment includes a frame 110, a mounting assembly disposed on the frame 110, and a fixing block 210 disposed on the mounting assembly, wherein the fixing assembly is disposed below the fixing block 210;
the fixing assembly comprises a first buffer spring 220, a connecting column 230 and a first electromagnet 240, a mounting hole is formed in the middle position below the fixing block 210, the first buffer spring 220 is arranged in the mounting hole, the connecting column 230 is arranged below the first buffer spring 220, the first electromagnet 240 is arranged at one end, far away from the first buffer spring 220, of the connecting column 230, magnetic force is generated when the electromagnet is electrified, the magnetic force generated by the first electromagnet 240 adsorbs electronic components, and the first buffer spring 220 buffers the force to prevent the electronic components from being damaged;
four fixing holes are arranged below the fixing block 210, the fixing block 210 is of a cuboid structure, each fixing hole is close to one corner of the fixing block 210, a second buffer spring 250 is arranged inside each fixing hole, one end of each second buffer spring 250 is provided with a buffer column 260, one end of each buffer column 260 is provided with a second electromagnet 270, four positioning columns 310 are arranged below each second electromagnet 270, each positioning column 310 is close to one corner of the second electromagnet 270, a truncated cone-shaped plug 320 is arranged below each positioning column 310, the outer wall of each plug 320 is provided with a plurality of cylindrical bumps 330, the four second electromagnets 270 respectively suck the periphery of the electronic component to enable the electronic component to be adsorbed more stably, each electronic component is provided with a jack, the plug 320 is inserted into the jack for positioning, and the cylindrical bumps 330 can increase the friction force between the plug 320 and the jacks of the electronic component, when the electromagnet loosens the electronic components, the speed is lower, and the impact damage of the electronic components is reduced.
Four bearing columns 120 are arranged below the rack 110, each bearing column 120 is close to one corner of the rack 110, a bearing foot 130 is arranged below each bearing column 120, a conveying belt 140 is arranged in the middle of the upper portion of the rack 110, the bearing columns 120 are connected with the bearing feet 130, the bottom surfaces of the bearing feet 130 are large, and the anti-skidding performance is improved.
The installation component includes installation frame 410 and mounting box 420, installation frame 410 one side is equipped with mounting box 420, the inside regulating assembly that is equipped with of mounting box 420, the regulating assembly includes speed reducer 430, driving motor 440 and ball 450, speed reducer 430 sets up in the inside one side of mounting box 420, the speed reducer 430 input is connected with driving motor 440, the speed reducer 430 output is connected with ball 450, the activity is equipped with removal sleeve 460 on the ball 450, driving motor 440 can carry out just reversing, just reversing makes ball 450 just reversing, ball 450 just reversing 450 can make removal sleeve 460 control.
Be equipped with lifting unit on the movable sleeve 460, lifting unit includes lift box 510, cylinder 520 and lift axle 530, and lift box 510 is connected on movable sleeve 460, and lift box 510 top is equipped with cylinder 520, and the cylinder 520 output is connected with lift axle 530, and lift axle 530 lower extreme is connected with fixed block 210, and cylinder 520 drive lift axle 530 reciprocates, drives fixed block 210 and reciprocates.
The rack 110 is provided with a heat dissipation assembly, the heat dissipation assembly includes a heat dissipation box 610 and a heat dissipation fan 620, the heat dissipation box 610 is disposed at the bottom of the rack 110, the heat dissipation fan 620 is disposed inside the heat dissipation box 610, and an output end of the heat dissipation fan 620 is aligned to the upper side of the rack 110 to dissipate heat of the whole rack 110.
The installation component, adjusting part and lifting unit all are equipped with two, fixed block 210 is equipped with two, and fixed block 210 passes through lifting unit and adjusting part and is connected with the installation component, the installation component is used for installing the adjusting part, adjusting part adjusts fixed block 210 lateral shifting, lifting unit is used for adjusting longitudinal height, second electro-magnet 270 below sets up reference column 310, set up plug 320 on the reference column 310, plug 320 need insert in the jack of second electro-magnet 270, cylindric lug 330 contacts with the inner wall of jack around plug 320, increase the frictional force of plug 320 and jack, slow down the falling speed of electronic components when the electro-magnet disappears magnetic force, make electronic components more gently fall in the encapsulation shell, protect electronic components not damaged, improve electronic components's life.
A packaging method of a packaging mechanism of an electronic component comprises the following steps:
s1: an operator places the package housings one by one on one side of the conveyor belt 140 in order, the conveyor belt 140 moves laterally, and the electronic components and the package lids are placed beside the laterally moving conveyor belt 140 to be packaged;
s2: an operator starts the driving motor 440, the driving motor 440 rotates forwards, the speed is reduced through the speed reducer 430, the ball screw 450 at the output end rotates automatically, the movable sleeve 460 is driven to move towards the direction of the electronic component, and the fixed assembly moves to the position right above the electronic component;
s3: an operator starts the air cylinder 520, the output end of the air cylinder 520 is connected with the fixed block 210 through the lifting shaft 530, and the fixed block 210 is driven to move downwards, so that the first electromagnet 240 below the fixed block 210 adsorbs the central position of the electronic component;
s4: after the electronic components are stabilized, an operator starts the driving motor 440 to rotate reversely, so that the fixed block 210 is driven to move in the movement process of the movable sleeve 460, and when the fixed block 210 moves to the position right below the packaging shell, the air cylinder 520 is started again, so that the electronic components move downwards and are placed in the packaging shell;
s5: an operator operates the cylinder 520 to make the first electromagnet 240 below the fixed block 210 suck the center position of the encapsulation cover, the second electromagnets 270 around the fixed block respectively suck four corners of the encapsulation cover, the plug 320 is inserted into the insertion hole in the corner, and the encapsulation cover is lifted;
s6: after the fixing, the driving motor 440 is started to rotate reversely, so that the movable sleeve 460 moves to drive the fixed block 210 to move, and the packaging cover is moved to the position right below the packaging shell;
s7: the operator activates the cylinder 520 to move the encapsulating cover downward to cover the encapsulating housing, and after the electronic component is encapsulated, the encapsulated electronic component is transported out by the conveyor belt 140 in a transverse movement manner.
Set up supplementary adsorbed second electro-magnet 270 around first electro-magnet 240, and second electro-magnet 270 adsorbs electronic components respectively around, makes electronic components adsorb more stably, and has reference column 310 around, makes electronic components can not take place the skew when adsorbing, and is more stable when guaranteeing the encapsulation.
The second electromagnets 270 around the fixed block 210 respectively suck the four corners of the encapsulation cover and the plugs 320 are inserted into the insertion holes in the corners.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (8)
1. The utility model provides an electronic components's packaging mechanism which characterized in that: the device comprises a rack (110), a mounting assembly arranged on the rack (110), and a fixed block (210) arranged on the mounting assembly, wherein the fixed assembly is arranged below the fixed block (210);
the fixing assembly comprises a first buffer spring (220), a connecting column (230) and a first electromagnet (240), a mounting hole is formed in the middle position below the fixing block (210), the first buffer spring (220) is arranged inside the mounting hole, the connecting column (230) is arranged below the first buffer spring (220), and the first electromagnet (240) is arranged at one end, far away from the first buffer spring (220), of the connecting column (230);
fixed block (210) below is equipped with four fixed orificess, fixed block (210) are the cuboid structure, every the fixed orifices is close to a corner of fixed block (210), every the inside second buffer spring (250) that is equipped with of fixed orifices, every second buffer spring (250) one end is equipped with one bumping post (260), every bumping post (260) one end is equipped with one second electro-magnet (270), every second electro-magnet (270) below is equipped with four reference columns (310), and every reference column (310) is close to a corner of second electro-magnet (270), every reference column (310) have plug (320) of a round platform form, every plug (320) outer wall is equipped with a plurality of cylindric lug (330).
2. A packaging mechanism for electronic components as claimed in claim 1, wherein: four bearing columns (120) are arranged below the rack (110), each bearing column (120) is close to one corner of the rack (110), each bearing column (120) is provided with one bearing foot (130) below, and a conveying belt (140) is arranged in the middle of the upper portion of the rack (110).
3. A packaging mechanism for electronic components as claimed in claim 1, wherein: the mounting assembly comprises a mounting frame (410) and a mounting box (420), wherein the mounting box (420) is arranged on one side of the mounting frame (410), an adjusting assembly is arranged inside the mounting box (420), the adjusting assembly comprises a speed reducer (430), a driving motor (440) and a ball screw (450), the speed reducer (430) is arranged on one side inside the mounting box (420), the input end of the speed reducer (430) is connected with the driving motor (440), the output end of the speed reducer (430) is connected with the ball screw (450), and a movable sleeve (460) is movably arranged on the ball screw (450).
4. A packaging mechanism for electronic components as claimed in claim 3, wherein: be equipped with lifting unit on movable sleeve (460), lifting unit is including lift box (510), cylinder (520) and lift axle (530), lift box (510) are connected on movable sleeve (460), lift box (510) top is equipped with cylinder (520), cylinder (520) output is connected with lift axle (530), lift axle (530) lower extreme is connected with fixed block (210).
5. A packaging mechanism for electronic components as claimed in claim 1, wherein: be equipped with radiator unit on frame (110), radiator unit includes heat dissipation case (610) and radiator fan (620), heat dissipation case (610) sets up in frame (110) bottom, radiator fan (620) set up inside heat dissipation case (610).
6. A packaging mechanism for electronic components as claimed in claim 3, wherein: the mounting assembly, the adjusting assembly and the lifting assembly are all provided with two, the fixed blocks (210) are provided with two, and the fixed blocks (210) are connected with the mounting assembly through the lifting assembly and the adjusting assembly.
7. A method for packaging an electronic component, comprising: the method comprises the following steps:
s1: an operator places the packaging shells on one side of the conveyor belt (140) one by one in sequence, the conveyor belt (140) moves transversely, and the electronic components and the packaging covers are placed beside the conveyor belt (140) which moves transversely to prepare for packaging;
s2: an operator starts the driving motor (440), the driving motor (440) rotates forwards and decelerates through the speed reducer (430), the ball screw (450) at the output end rotates automatically to drive the movable sleeve (460) to move towards the direction of the electronic component, and the fixed assembly moves to the position right above the electronic component;
s3: an operator starts the air cylinder (520), the output end of the air cylinder (520) is connected with the fixed block (210) through the lifting shaft (530), and the fixed block (210) is driven to move downwards, so that the first electromagnet (240) below the fixed block (210) adsorbs the central position of the electronic component;
s4: after the electronic component is stabilized, an operator starts the driving motor (440) to rotate reversely, so that the movable sleeve (460) drives the fixed block (210) to move in the moving process, and when the fixed block (210) moves to the position right below the packaging shell, the air cylinder (520) is started again to enable the electronic component to move downwards, and the electronic component is placed in the packaging shell;
s5: an operator operates the air cylinder (520) to enable the first electromagnet (240) below the fixed block (210) to suck the central position of the packaging cover, the second electromagnets (270) around the fixed block respectively suck four corners of the packaging cover, and the plug (320) is inserted into the insertion holes in the corners to lift the packaging cover;
s6: after the stability is achieved, the driving motor (440) is started to rotate reversely, so that the movable sleeve (460) moves to drive the fixed block (210) to move, and the packaging cover is moved to the position right below the packaging shell;
s7: the operator starts the cylinder (520), so that the packaging cover moves downwards to cover the packaging shell, and after the electronic component is packaged, the packaged electronic component is transversely moved and conveyed out through the conveyor belt (140).
8. A method for packaging an electronic component as claimed in claim 7, wherein: the second electromagnets (270) around the fixed block (210) respectively suck four corners of the electronic component, and the plug (320) is inserted into the insertion holes in the corners.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111041327.XA CN113966165B (en) | 2021-09-07 | 2021-09-07 | Encapsulation mechanism and encapsulation method for electronic components |
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| CN202111041327.XA CN113966165B (en) | 2021-09-07 | 2021-09-07 | Encapsulation mechanism and encapsulation method for electronic components |
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| CN113966165A true CN113966165A (en) | 2022-01-21 |
| CN113966165B CN113966165B (en) | 2023-04-25 |
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| CN107718032A (en) * | 2017-11-17 | 2018-02-23 | 广东天机工业智能系统有限公司 | Robot automatic loading/unloading handgrip |
| CN109911294A (en) * | 2019-04-25 | 2019-06-21 | 怀化学院 | A kind of packaging facilities using packing box packaging electronic information component |
| CN211685891U (en) * | 2020-01-23 | 2020-10-16 | 广州来硕智能科技有限公司 | Heat sealing device for electronic components |
| CN213026056U (en) * | 2020-08-26 | 2021-04-20 | 台州微标电子有限公司 | Novel electronic components encapsulation equipment |
| CN111975726A (en) * | 2020-08-29 | 2020-11-24 | 温州宇岚科技有限公司 | Intelligent operation room shift unit |
| CN213616688U (en) * | 2020-09-23 | 2021-07-06 | 无锡先导智能装备股份有限公司 | Protective cover taking and placing device and battery welding equipment |
| CN112518792A (en) * | 2020-11-23 | 2021-03-19 | 聚和(天津)智能制造有限公司 | Electromagnetic material taking and placing heavy-load gripper with buffering function |
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| CN113966165B (en) | 2023-04-25 |
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