CN113966162B - Conductive foam, electronic equipment and manufacturing method of conductive foam - Google Patents
Conductive foam, electronic equipment and manufacturing method of conductive foam Download PDFInfo
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- CN113966162B CN113966162B CN202010708197.XA CN202010708197A CN113966162B CN 113966162 B CN113966162 B CN 113966162B CN 202010708197 A CN202010708197 A CN 202010708197A CN 113966162 B CN113966162 B CN 113966162B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
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- Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The application provides a cotton, electronic equipment of electrically conductive bubble and cotton manufacturing method of electrically conductive bubble relates to electric connection technical field, makes the cotton of electrically conductive bubble install in the gap that the width is less. The conductive foam is formed by alternately stacking and fixing foam layers and conductive layers in sequence; the conductive foam is provided with a first surface and a second surface which are opposite, the conductive layer is provided with a first edge and a second edge which are opposite, the first edge is positioned on the first surface, the second edge is positioned on the second surface, and the conductive layer is obliquely arranged relative to the first surface and the second surface; the conductive layers can transmit an electric signal input by one edge of the first edge and the second edge to the other edge of the first edge and the second edge, and the distance between every two adjacent conductive layers in the direction parallel to the first surface and perpendicular to the first edge is larger than or equal to the width of the conductive layers from the first edge to the second edge. The conductive foam provided by the application is used for electrostatic protection or electromagnetic shielding grounding.
Description
Technical Field
The application relates to the technical field of electric connection structures, in particular to a conductive foam, electronic equipment and a manufacturing method of the conductive foam.
Background
In electronic devices such as mobile phones, televisions, monitors, notebooks, handheld computers, car navigation systems, etc., the conductive foam is often used to fill a gap between an external space and an internal circuit space of the electronic device and connect to a reference ground to avoid external electrostatic interference to the electronic device, or used to electrically connect a metal shell or a metal cover of an electronic component inside the electronic device to a reference ground (e.g., a center frame) to avoid electromagnetic interference (EMI) between the electronic component and other electronic components (e.g., antennas) inside the electronic device.
Fig. 1 is a schematic structural diagram of a conductive foam provided in the prior art. As shown in fig. 1, the conductive foam comprises a foam core 01 and a conductive wrapping layer 02. The foam core 01 is of a compressible structure, and the conductive wrapping layer 02 is made of a metal material or a non-metal material subjected to surface conductive treatment and is of a deformable but incompressible structure. The conductive wrapping layer 02 is wrapped and adhered to the periphery of the foam core 01 for a circle through a hot melt adhesive 03, so that the thickness d of the conductive foam shown in fig. 1 in a limit compression state (shown in fig. 2) is equal to the sum of the thicknesses of the two conductive wrapping layers 02 and the thickness of the foam core 01 in a limit compression state, wherein the thickness of the hot melt adhesive 03 is very small and can be ignored. In recent years, as electronic devices have been reduced in size and thickness, the width of the gap for mounting the conductive foam in the electronic devices has become smaller, and the conductive foam shown in fig. 1 cannot be mounted in the gap having a smaller width.
Disclosure of Invention
The embodiment of the application provides a conductive foam, electronic equipment and a manufacturing method of the conductive foam, so that the conductive foam can be installed in a gap with a small width.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, some embodiments of the present application provide a conductive foam, which is formed by alternately stacking and fixing foam layers and conductive layers in sequence; the conductive foam is provided with a first surface and a second surface which are opposite, the conductive layer is provided with a first edge and a second edge which are opposite, the first edge is positioned on the first surface, the second edge is positioned on the second surface, and the conductive layer is obliquely arranged relative to the first surface and the second surface; the conductive layers can transmit an electric signal input by one edge of the first edge and the second edge to the other edge of the first edge and the second edge, and the distance between every two adjacent conductive layers in the direction parallel to the first surface and perpendicular to the first edge is larger than or equal to the width of the conductive layers from the first edge to the second edge.
When the conductive foam provided by the embodiment of the application is applied to a gap between two structural members in electronic equipment, the conductive foam can realize the electrical connection between the two structural members through the conductive layer. When the conductive foam provided by the embodiment of the application is applied to a gap between two structural members in an electronic device and a pressing force perpendicular to the first surface or the second surface is applied to the conductive foam, the foam layer is compressed, the conductive layer is turned to be close to the first surface or the second surface, and when the conductive foam is compressed to the limit state, the conductive layer is turned to be approximately in the same plane with the first surface or the second surface. And because the distance between two adjacent conductive layers in the direction parallel to the first surface and perpendicular to the first edge is greater than the width of the conductive layers from the first edge to the second edge, when the conductive foam is compressed to the limit state, the thickness of the conductive foam is approximately equal to the sum of the thickness of a single-layer conductive layer and the thickness of the foam layer when the conductive foam is compressed to the limit state, and on the premise that the thickness of the conductive foam from the first surface to the second surface in the free state is approximately consistent with the thickness of the conductive foam shown in fig. 1 and the structure of the conductive layer is consistent with the structure of the single-layer conductive wrapping layer in the conductive foam shown in fig. 1, the conductive foam provided by the application has a smaller thickness when the conductive foam is compressed to the limit state than the conductive foam shown in fig. 1, and can be installed in a gap with a smaller width.
Optionally, the conductive layer is a conductive sheet.
Optionally, the conductive sheet is a metal sheet or a non-metal sheet subjected to surface conduction treatment.
Optionally, the material of the metal sheet includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.
Alternatively, the material of the non-metallic sheet includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon.
Optionally, the non-metal sheet subjected to surface conductivity treatment is a conductive cloth, a tin-plated polyimide film or a gold-plated polyimide film.
Optionally, the conductive layer is a conductive mesh.
Optionally, the conductive mesh is a metal mesh or a non-metal mesh subjected to surface conduction treatment.
Optionally, the material of the metal mesh includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.
Alternatively, the material of the non-metallic mesh includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon.
Optionally, the non-metallic mesh subjected to surface electro-conductive treatment is a gold-plated non-metallic mesh or a nickel-plated non-metallic mesh.
Optionally, the conductive layer is laid out of conductive fibers.
Optionally, the conductive fibers are metal fibers or nonmetal fibers subjected to surface conductive treatment.
Alternatively, the material of the metal fibers includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.
Alternatively, the material of the non-metallic fibers includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon.
Optionally, the non-metallic fibers subjected to surface conductivity treatment are gold-plated non-metallic fibers or nickel-plated non-metallic fibers.
Optionally, the conductive layer is inclined at an angle of 30 ° to 80 ° with respect to the first and second surfaces. Like this, the inclination of conducting layer is moderate, can effectively guide the conducting layer to the direction upset of being close to first surface and second surface when receiving the extrusion force of perpendicular to first surface or second surface, can also avoid the conducting layer to lead to the cotton volume of electrically conductive bubble too big by the width of first border to second border simultaneously.
Optionally, the conductive layer and the foam layer are in direct contact and bonded together. Specifically, the foam layer has certain viscosity during the foaming process, so that the viscosity can be bonded with the conductive layer. Therefore, the conductive foam is simple in structure and low in cost.
Optionally, the conductive layer and the foam layer are bonded together through a glue layer. Therefore, the formed foam layer is assembled with the conductive layer, the operation is simple, and the relative position precision between the foam layer and the conductive layer in the conductive foam is easy to ensure.
Alternatively, the material of the adhesive layer includes, but is not limited to, hot melt adhesives, epoxy adhesives, polyurethane adhesives, acrylate adhesives, anaerobic adhesives, and silicone adhesives.
In a second aspect, some embodiments of the present application further provide an electronic device, which includes a reference ground, an electronic component, and a conductive foam; the electronic component is arranged at intervals with the reference ground and is provided with a metal shell; the conductive foam is the conductive foam according to any one of the above technical solutions, the conductive foam is disposed in a gap between the electronic component and the reference ground, a first surface of the conductive foam faces the electronic component and is electrically connected with a metal shell of the electronic component, and a second surface of the conductive foam faces the reference ground and is electrically connected with the reference ground.
Therefore, the metal shell of the electronic component is of an electromagnetic shielding structure, the conductive foam is of a grounding connection structure of the metal shell, and the metal shell of the electronic component is connected with a reference ground through the conductive foam, so that the electromagnetic interference of the electronic component on other electronic components (such as an antenna) in the electronic equipment can be avoided, or the electromagnetic interference of other electronic components in the electronic equipment on the electronic component can be avoided. Meanwhile, as the conductive foam in the electronic equipment is any one of the technical schemes, the conductive foam can be installed in a gap with a small width, so that the structural compactness of the electronic equipment is increased, and the requirement of the electronic equipment on the volume miniaturization or thinning design is easily met.
In a third aspect, some embodiments of the present application further provide a method for manufacturing a conductive foam, where the method for manufacturing a conductive foam includes:
alternately stacking and fixing the foam layer and the conductive layer in sequence to form a multilayer stacked structure;
cutting the multilayer stacking structure to form conductive foam;
the conductive layer in the conductive foam is obliquely arranged relative to the first surface and the second surface, the conductive layer in the conductive foam can transmit an electric signal input by one of the first edge and the second edge to the other one of the first edge and the second edge, and the distance between every two adjacent conductive layers in the conductive foam in the direction parallel to the first surface and vertical to the first edge is greater than or equal to the width from the first edge to the second edge of the conductive layer in the conductive foam.
When the conductive foam manufactured by the manufacturing method provided by the embodiment of the application is applied to a gap between two structural members in electronic equipment, the conductive foam can realize the electrical connection between the two structural members through the conductive layer. When the conductive foam manufactured by the manufacturing method provided by the embodiment of the application is applied to a gap between two structural members in electronic equipment, and the conductive foam is applied with an extrusion force vertical to the first surface or the second surface, the foam layer is compressed, the conductive layer is turned over to be close to the first surface or the second surface, and when the conductive foam is compressed to the limit state, the conductive layer is turned over to be approximately coplanar with the first surface or the second surface. And because the distance between two adjacent conductive layers in the direction parallel to the first surface and perpendicular to the first edge is greater than the width of the conductive layers from the first edge to the second edge, when the conductive foam is compressed to the limit state, the thickness of the conductive foam is approximately equal to the sum of the thickness of a single-layer conductive layer and the thickness of the foam layer when the foam layer is compressed to the limit state, and on the premise that the thickness of the conductive foam from the first surface to the second surface in the free state is approximately consistent with the thickness of the conductive foam shown in fig. 1, and the structure of the conductive layer is consistent with the structure of the single-layer conductive wrapping layer in the conductive foam shown in fig. 1, the conductive foam manufactured by the manufacturing method provided by the application has a smaller thickness when the conductive foam is compressed to the limit state than the conductive foam shown in fig. 1, and can be mounted in a gap with a smaller width.
Optionally, alternately stacking and fixing the foam layer and the conductive layer in sequence includes: alternately pile up bubble cotton layer, glue film, conducting layer and glue film in proper order to pass through the glue film bonds together bubble cotton layer and conducting layer. Therefore, the formed foam layer is assembled with the conductive layer, the operation is simple, and the relative position precision between the foam layer and the conductive layer in the conductive foam is easy to ensure.
Optionally, alternately stacking and fixing the foam layer and the conductive layer in sequence includes: alternately stacking a material layer to be foamed and a conductive layer on a support substrate in sequence to form a stacked structure to be foamed; and carrying out foaming molding treatment on the stacked structure to be foamed so that the material layer to be foamed is foamed to form a foam layer and is directly bonded with the conductive layer. Therefore, the conductive foam is simple in structure and low in cost.
Drawings
Fig. 1 is a schematic structural diagram of a conductive foam provided in the prior art;
FIG. 2 is a schematic view of the conductive foam of FIG. 1 in an extreme compressed state;
fig. 3 is a schematic structural diagram of an electronic device according to some embodiments of the present application;
fig. 4 is a schematic view of an assembly structure among the display screen, the middle frame and the conductive foam in the electronic device shown in fig. 3;
fig. 5 is a schematic structural diagram of an electronic device according to further embodiments of the present application;
fig. 6 is a schematic structural diagram of an electronic device according to still other embodiments of the present application;
fig. 7 is a schematic structural diagram of a conductive foam according to some embodiments of the present disclosure;
fig. 8 is a schematic structural diagram of a conductive foam according to still other embodiments of the present application;
FIG. 9 is a schematic structural diagram of a portion I of the conductive foam shown in FIG. 8;
FIG. 10 is a schematic view of a portion II of the conductive foam shown in FIG. 8;
FIG. 11 is a schematic view of the conductive foam of FIG. 7 in an extreme compressed state;
fig. 12 is a schematic structural diagram of a conductive foam according to still other embodiments of the present application;
fig. 13 is a schematic structural diagram of a conductive foam according to still other embodiments of the present application;
fig. 14 is a flowchart of a method for manufacturing conductive foam according to some embodiments of the present disclosure;
fig. 15 is a schematic structural diagram of a multilayer stacked structure obtained in a method for manufacturing conductive foam according to some embodiments of the present application;
fig. 16 is a schematic structural diagram of a conductive foam obtained in a method for manufacturing a conductive foam according to some embodiments of the present application;
fig. 17 is a flowchart of a method for manufacturing conductive foam according to still other embodiments of the present application;
fig. 18 is a schematic structural diagram of a stacked structure to be foamed obtained in a method for manufacturing conductive foam according to some embodiments of the present application.
Reference numerals:
01-foam cotton core; 02-a conductive wrapping layer; 03-hot melt adhesive; 1-a display screen; 2-middle frame; 21-a metal moiety; 22-a non-metallic moiety; 3-conductive foam; 4-clearance; 5-electronic components; 6-reference ground; 7-a metal shield; 8-a circuit board; 31-a foam layer; 32-a conductive layer; 321-a first edge; 322-a second edge; 100-a first surface; 200-a second surface; 31 a-a layer of material to be foamed; 33-supporting the substrate.
Detailed Description
In the embodiments of the present application, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
The application relates to a conductive foam, an electronic device and a manufacturing method of the conductive foam, and the concept related to the application is briefly explained as follows:
soaking cotton: the foam is a material obtained by foaming and molding plastic particles, silica gel particles or rubber particles, and the foam includes but is not limited to Polyurethane (PU) foam, silica gel foam, polyethylene (PE) foam, polypropylene (PP) foam, styrene-butadiene rubber foam, acrylate foam, vinyl acetate foam, vinylidene chloride foam, butyronitrile foam, organosilicon foam, acrylamide foam, natural rubber foam, polyvinyl chloride foam, polysulfide rubber foam, styrene-acrylate copolymer foam, vinyl acetate-acrylate copolymer foam, organosilicon-acrylate copolymer foam and modified organosilicon-acrylate copolymer foam.
Foaming and forming: the cellular or cellular structure is formed by adding and reacting a physical foaming agent or a chemical foaming agent in a foaming forming process or a foaming polymer material.
Foaming agent: the foaming agent is a material that can gasify inside plastic, silica gel, or rubber to generate bubbles and make the material porous, and includes, but is not limited to, azo compounds, sulfonyl hydrazide compounds, nitroso compounds, sodium bicarbonate, sodium carbonate, n-pentane, n-hexane, n-heptane, petroleum ether (also called naphtha), trichlorofluoromethane, dichlorodifluoromethane, and dichlorotetrafluoroethane.
An electronic device: the electronic device is a device which is composed of electronic components such as an integrated circuit, a transistor, an electronic tube and the like and plays a role by applying electronic technology software, and the electronic device comprises but is not limited to a mobile phone, a television, a display, a notebook computer, a palm computer and a vehicle-mounted navigation system.
An electronic component: refers to electronic components and small components, which are generally composed of several parts and can be commonly used in the same kind of products. Electronic components include, but are not limited to, cameras, shielding covers, display screens, sensors, and earphones, and some electronic components susceptible to EMI signals (such as cameras and display screens) have a metal housing or an outer housing with a metal cover that is connected to a reference ground through a conductive foam to enable signal shielding.
Static electricity: the electrostatic phenomenon is a common phenomenon in human life, and refers to electric charges accumulated on the surface of an object, and the accumulation of the electrostatic charges can generate a higher electric potential on the surface of the object. With the increasing functions of electronic equipment, the distance between a circuit inside the electronic equipment and the surface of the electronic equipment is closer and closer, and static electricity on the surface of the electronic equipment or static electricity on the surface of an external object can enter the electronic equipment through a gap on the surface of the electronic equipment to influence the normal work of electronic components.
Electromagnetic interference (EMI): there are both conducted and radiated interference. Conducted interference refers to coupling signals on one electrical network to another electrical network through a conductive medium. Radiated interference refers to interference sources coupling their signals through space to another electrical network. The electromagnetic interference in the embodiments of the present application refers to radiation interference. In the design of high-speed Printed Circuit Boards (PCBs) and systems, high-frequency signal lines, integrated circuit pins, various connectors, etc. may become radiation interference sources with antenna characteristics, and may emit electromagnetic waves and affect the normal operation of other systems or other subsystems in the system.
In electronic devices such as mobile phones, televisions, monitors, notebooks, palmtop computers, car navigation systems, etc., the conductive foam is often used to fill gaps of the electronic devices and connect to a reference ground, or used to electrically connect a shielding case or shielding cover of electronic components inside the electronic devices to the reference ground. With the development of electronic equipment towards miniaturization and thinning, the width of a gap for installing the conductive foam in the electronic equipment is smaller and smaller, and the existing conductive foam structure cannot be installed in the gap with the smaller width.
In order to solve the above problems, the present application provides an electronic device including, but not limited to, a mobile phone, a television, a display, a notebook, a palm top computer, and a car navigation system. The electronic device includes a conductive foam that functions as an electrostatic shielding structure or as a ground connection structure for an electromagnetic shielding structure.
Fig. 3 is a schematic structural diagram of an electronic device according to some embodiments of the present application, where the electronic device is a mobile phone, and fig. 4 is a schematic structural diagram of an assembly among a display screen, a middle frame, and a conductive foam in the electronic device shown in fig. 3. As shown in fig. 3 and 4, the mobile phone includes a display screen 1, a middle frame 2 (including a metal part 21 and a non-metal part 22), and a conductive foam 3, a gap 4 communicating an external space of the mobile phone and an internal circuit space of the mobile phone is provided between an edge of the display screen 1 and the middle frame 2, the conductive foam 3 is disposed in the gap 4, and the conductive foam 3 is electrically connected to a reference ground. This reference is, by way of example, a metal part 21 of the middle frame 2. In this way, the conductive foam 3 is used as an electrostatic shielding structure, and static electricity outside the mobile phone is introduced into a reference ground through the conductive foam 3, so that the surface of the mobile phone and the static electricity outside the mobile phone are prevented from entering the internal circuit space of the mobile phone from the gap between the edge of the display screen 1 and the middle frame 2 to affect the internal circuit of the mobile phone.
Fig. 5 is a schematic structural diagram of an electronic device according to still other embodiments of the present application. As shown in fig. 5, the electronic device includes an electronic component 5, a conductive foam 3, and a reference ground 6. The reference ground 6 may be a metal middle frame, a metal shell, a metal back shell, etc., and is not particularly limited herein. The electronic component 5 may be a camera, a display screen, a receiver, etc., and is not limited in particular. The electronic component 5 has a metal housing, and the electronic component 5 is spaced apart from a reference ground 6. The conductive foam 3 is arranged in a gap between the electronic component 5 and the reference ground 6, and the metal shell of the electronic component 5 is electrically connected with the reference ground 6 through the conductive foam 3. Like this, electronic components 5's metal casing is electromagnetic shield structure, and the cotton 3 ground connection structure for this metal casing of electrically conductive bubble is connected reference ground with electronic components 5's metal casing through the cotton 3 of electrically conductive bubble, can avoid electronic components 5 to produce electromagnetic interference to other electronic components (for example antenna) in the electronic equipment, perhaps avoid other electronic components in the electronic equipment to produce electromagnetic interference to this electronic components 5.
Fig. 6 is a schematic structural diagram of an electronic device according to still other embodiments of the present application. As shown in fig. 6, the electronic device includes an electronic component 5, a circuit board 8, a metal shield 7, a conductive foam 3, and a reference ground 6. The reference ground 6 may be a metal middle frame, a metal shell, a metal back shell, etc., and is not particularly limited herein. The electronic component 5 is arranged on the circuit board 8, the metal shielding cover 7 covers the electronic component 5 and is connected to the circuit board 8, and the metal shielding cover 7 and the reference ground 6 are arranged at intervals. The conductive foam 3 is disposed in a gap between the metal shielding can 7 and the reference ground 6, and the metal shielding can 7 is electrically connected to the reference ground 6 through the conductive foam 3. Like this, metal shield cover 7 is used for shielding protection to electronic components 5, and this metal shield cover 7 is electromagnetic shield structure, and electrically conductive bubble cotton 3 is the ground connection structure of this metal shield cover 7, connects reference ground 6 with metal shield cover 7 through electrically conductive bubble cotton 3, can avoid electronic components 5 to produce electromagnetic interference to other electronic components (for example the antenna) outside metal shield cover 7, perhaps avoids other electronic components outside metal shield cover 7 to produce electromagnetic interference to this electronic components 5.
It is known that, in an electronic device, the conductive foam may be used as a grounding connection structure for an electrostatic shielding structure or an electromagnetic shielding structure, and may also be used for other applications, such as an electrical connection structure between two electronic components.
This application still provides a conductive bubble is cotton, and this conductive bubble is cotton for the conductive bubble in the above-mentioned electronic equipment.
Fig. 7 is a schematic structural diagram of a conductive foam according to some embodiments of the present disclosure. As shown in fig. 7, the conductive foam 3 is formed by alternately stacking and fixing foam layers 31 and conductive layers 32 in sequence. The foam layer 31 enables the conductive foam 3 to have elastic compressibility, and the conductive layer 32 enables the conductive foam 3 to have conductivity.
The shape of the conductive foam 3 in a free state (i.e., a state without being pressed) may be a cubic shape, a rectangular shape, a square shape, or the like, which is not limited herein. Fig. 7 merely shows an example in which the shape of the conductive foam 3 in the free state is a rectangular block shape, and is not to be considered as limiting the configuration of the present application.
Fig. 8 is a schematic structural diagram of a conductive foam according to still other embodiments of the present application, fig. 9 is a schematic structural diagram of a portion I in the conductive foam shown in fig. 8, and fig. 10 is a schematic structural diagram of a portion II in the conductive foam shown in fig. 8. As shown in fig. 8 to 10, the conductive foam 3 is square, and the conductive foam 3 may be disposed in a gap between a periphery of an edge of an electronic component and another electronic component, for example, in a gap between a periphery of an edge of a display screen of a mobile phone and a middle frame.
The material of the foam layer 31 is foam, and specifically, the material of the foam layer 31 includes, but is not limited to, polyurethane (PU) foam, silicone foam, polyethylene (PE) foam, polypropylene (PP) foam, styrene-butadiene rubber foam, acrylate foam, vinyl acetate foam, vinylidene chloride foam, butyronitrile foam, silicone foam, acrylamide foam, natural rubber foam, polyvinyl chloride foam, polysulfide rubber foam, styrene-acrylate copolymer foam, vinyl acetate-acrylate copolymer foam, silicone-acrylate copolymer foam, and modified silicone-acrylate copolymer foam. In some embodiments, the foam layer 31 is made of PU foam or silica gel foam, and the PU foam and the silica gel foam have moderate elastic modulus, and can effectively support the conductive layer 32, so that the conductive layer 32 and the connected structure are effectively contacted and electrically connected.
The conductive foam 3 has opposing first and second surfaces 100 and 200. When the conductive foam 3 is applied to a gap between two structural members in the electronic device, the first surface 100 faces one of the structural members, the second surface 200 faces the other structural member, and the conductive foam 3 is compressed and deformed in a direction perpendicular to the first surface 100 and the second surface 200.
As shown in fig. 7, the conductive layer 32 has a first edge 321 and a second edge 322 opposite to each other, the first edge 321 is located on the first surface 100, the second edge 322 is located on the second surface 200, and the conductive layer 32 is capable of transmitting an electrical signal input from one of the first edge 321 and the second edge 322 to the other of the first edge 321 and the second edge 322.
In this way, when the conductive foam 3 is applied to the gap between two structural members in the electronic device, the conductive foam 3 can realize the electrical connection between the two structural members through the conductive layer 32.
As shown in fig. 7, the conductive layers 32 are disposed obliquely relative to the first surface 100 and the second surface 200, and a direction (i.e. a direction F in fig. 7) parallel to the first surface 100 and perpendicular to the first edge 321 is between two adjacent conductive layers 32 1 ) The distance D is greater than or equal to the width W of the conductive layer 32 from the first edge 321 to the second edge 322.
Thus, the conductive foam 3 is applied to the gap between the two structural members in the electronic device, and the conductive foam 3 is appliedWhen the conductive foam 3 is compressed to the limit state, as shown in fig. 11, the conductive layer 32 is inverted to a position approximately coplanar with the first surface 100 or the second surface 200. And because the direction between two adjacent conductive layers 32 is parallel to the first surface 100 and perpendicular to the first edge 321 (i.e. the direction F in fig. 7) 1 ) The distance D is greater than the width W of the conductive layer 32 from the first edge 321 to the second edge 322, so when the conductive foam 3 is compressed to the limit state, the thickness of the conductive foam 3 is approximately equal to the sum of the thickness of the single-layer conductive layer 32 and the thickness of the foam layer 31 when compressed to the limit state, and on the premise that the thickness of the conductive foam 3 from the first surface 100 to the second surface 200 in the free state is approximately consistent with the thickness of the conductive foam shown in fig. 1 and the structure of the conductive layer 32 is consistent with the structure of the single-layer conductive wrapping layer in the conductive foam shown in fig. 1, the conductive foam 3 provided by the present application has a smaller thickness when compressed to the limit state than the conductive foam shown in fig. 1, and can be installed in a gap with a smaller width.
The conductive layer 32 may be a conductive sheet, a conductive mesh, a conductive fiber, or the like, and is not particularly limited herein. Fig. 7 is merely an example of the conductive layer 32 being a conductive sheet and should not be construed as limiting the present application.
As shown in fig. 7, the conductive layer 32 is a conductive sheet, which may be a metal sheet or a non-metal sheet with a surface treated by conductivity. The material of the metal sheet includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. The material of the non-metallic sheet includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon. The surface electro-conductive treatment process of the non-metal sheet includes but is not limited to electroplating and chemical deposition. The metal material on the surface of the non-metal sheet includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. In some embodiments, the non-metal sheet subjected to surface conduction treatment is a conductive cloth, a tin-plated polyimide film, or a gold-plated polyimide film.
Fig. 12 is a schematic structural diagram of a conductive foam according to still other embodiments of the present application. As shown in fig. 12, the conductive layer is a conductive mesh. The conductive mesh may be a metal mesh or a non-metal mesh subjected to surface conduction treatment. The material of the metal mesh includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. The material of the non-metallic mesh includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon. Surface electro-conductive treatment processes for non-metallic networks include, but are not limited to, electroplating and chemical deposition. The metallic material of the non-metallic mesh surface includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. In some embodiments, the surface-conductively treated non-metallic network is a gold-plated non-metallic network or a nickel-plated non-metallic network.
Fig. 13 is a schematic structural diagram of a conductive foam according to still other embodiments of the present application. As shown in fig. 13, the conductive layer is laid with conductive fibers. The conductive fiber can be a metal fiber or a nonmetal fiber with surface treated by electric conduction. The material of the metal fibers includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. The material of the non-metallic fibers includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon. Surface electro-conductive treatment processes for non-metallic fibers include, but are not limited to, electroplating and chemical deposition. The metal material on the surface of the non-metal fiber includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium and rhodium. In some embodiments, the non-metallic fibers subjected to surface electro-conduction treatment are gold-plated non-metallic fibers or nickel-plated non-metallic fibers.
It can be known that, since the conductive layer 32 can transmit the electrical signal input from one of the first edge 321 and the second edge 322 to the other of the first edge 321 and the second edge 322, when the conductive layer 32 is formed by laying conductive fibers and two adjacent conductive fibers are not in contact, one end of each conductive fiber in the length direction of the conductive fiber should be located at the first edge 321, and the other end of the conductive fiber in the length direction of the conductive fiber should be located at the second edge 322, so that the conductive layer 32 can transmit the electrical signal input from one of the first edge 321 and the second edge 322 to the other of the first edge 321 and the second edge 322.
The inclination angle of the conductive layer 32 with respect to the first surface 100 and the second surface 200 may be 20 °, 30 °, 85 °, and the like, and is not particularly limited herein. In some embodiments, the conductive layer 32 is inclined at an angle of 30 ° to 80 ° with respect to the first surface 100 and the second surface 200. Therefore, the inclination angle of the conductive layer 32 is moderate, so that when the conductive layer 32 is subjected to a pressing force perpendicular to the first surface 100 or the second surface 200, the conductive layer 32 can be effectively guided to turn towards the direction close to the first surface 100 and the second surface 200, and meanwhile, the conductive layer 32 can be prevented from being too large in size due to too large width from the first edge 321 to the second edge 322.
The foam layer 31 is secured to the conductive layer 32, and in some embodiments, the foam layer 31 is in direct contact with and bonded to the conductive layer 32. Specifically, the foam layer 31 has a certain viscosity during the foam molding process, which is advantageous for the adhesion to adhere to the conductive layer 32. Therefore, the conductive foam 3 has a simple structure and low cost.
In other embodiments, the foam layer 31 and the conductive layer 32 are bonded together by a glue layer. Therefore, the foam layer 31 is assembled with the conductive layer 32 after being formed, the operation is simple, and the relative position precision between the foam layer 31 and the conductive layer 32 in the conductive foam 3 is easily ensured.
In the above embodiments, the material of the adhesive layer includes, but is not limited to, hot melt adhesive, epoxy adhesive, polyurethane adhesive, acrylate adhesive, anaerobic adhesive, and silicone adhesive.
The present application further provides a method for manufacturing the conductive foam 3 according to any of the above embodiments, and the following embodiments only take the manufacturing of the conductive foam 3 shown in fig. 7 as an example, which should not be construed as limiting the present application.
Fig. 14 is a flowchart of a method for manufacturing a conductive foam according to some embodiments of the present application, and as shown in fig. 14, the method for manufacturing a conductive foam includes:
s100: the foam layers 31 and the conductive layers 32 are alternately stacked and fixed in sequence to form a multi-layer stacked structure, and fig. 15 is a schematic structural view of the multi-layer stacked structure according to some embodiments of the present disclosure.
The material of the foam layer 31 is foam, and specifically, the material of the foam layer 31 includes, but is not limited to, polyurethane (PU) foam, silicone foam, polyethylene (PE) foam, polypropylene (PP) foam, styrene-butadiene rubber foam, acrylate foam, vinyl acetate foam, vinylidene chloride foam, butyronitrile foam, silicone foam, acrylamide foam, natural rubber foam, polyvinyl chloride foam, polysulfide rubber foam, styrene-acrylate copolymer foam, vinyl acetate-acrylate copolymer foam, silicone-acrylate copolymer foam, and modified silicone-acrylate copolymer foam. In some embodiments, the foam layer 31 is made of PU foam or silicone foam.
In addition, the conductive layer 32 may be a conductive sheet, a conductive mesh, a conductive fiber, or the like, and is not particularly limited herein. Fig. 7 merely illustrates that the conductive layer 32 is a conductive sheet and is not to be considered as limiting the composition of the present application.
In some embodiments, the conductive layer 32 is a conductive sheet, which may be a metal sheet or a non-metal sheet having a surface treated with a conductive agent. The material of the metal sheet includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. The material of the non-metallic sheet includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon. The surface electro-conductive treatment process of the non-metal sheet includes but is not limited to electroplating and chemical deposition. The metal material on the surface of the non-metal sheet includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. In some embodiments, the non-metal sheet subjected to surface conduction treatment is a conductive cloth, a tin-plated polyimide film, or a gold-plated polyimide film.
In still other embodiments, the conductive layer is a conductive mesh. The conductive mesh may be a metal mesh or a non-metal mesh subjected to surface conduction treatment. The material of the metal mesh includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. The material of the non-metallic mesh includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon. Surface electro-conductive treatment processes for non-metallic networks include, but are not limited to, electroplating and chemical deposition. The metallic material of the non-metallic mesh surface includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. In some embodiments, the surface-conductively treated non-metallic network is a gold-plated non-metallic network or a nickel-plated non-metallic network.
In still other embodiments, the conductive layer is laid down from conductive fibers. The conductive fiber can be a metal fiber or a nonmetal fiber subjected to surface conductive treatment. The material of the metal fibers includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium. The material of the non-metallic fibers includes, but is not limited to, one or more of carbon, graphite, glass, polyester, polyethylene, polyacrylate, polyimide, and nylon. Surface electro-conductive treatment processes for non-metallic fibers include, but are not limited to, electroplating and chemical deposition. The metal material on the surface of the non-metal fiber includes, but is not limited to, one or more of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium and rhodium. In some embodiments, the non-metallic fibers subjected to surface electro-conduction treatment are gold-plated non-metallic fibers or nickel-plated non-metallic fibers.
Specifically, step S100 may include the following three embodiments:
the first embodiment is as follows: the step S100 includes: the foam layer 31, the gel layer, the conductive layer 32, and the gel layer are alternately stacked in this order to bond the foam layer 31 and the conductive layer 32 together through the gel layer. Therefore, the foam layer 31 is assembled with the conductive layer 32 after being formed, the operation is simple, and the relative position precision between the foam layer 31 and the conductive layer 32 in the conductive foam 3 is easily ensured.
The material of the adhesive layer includes, but is not limited to, hot melt adhesive, epoxy adhesive, polyurethane adhesive, acrylate adhesive, anaerobic adhesive, and organic silica gel.
Example two: fig. 17 is a flowchart of a method for manufacturing conductive foam according to still other embodiments of the present application. As shown in fig. 17, step S100 includes: s101: the material layer 31a to be foamed and the conductive layer 32 are stacked alternately on the supporting substrate 33 in sequence to form a stacked structure to be foamed, and fig. 18 is a schematic structural view of the stacked structure to be foamed according to some embodiments of the present disclosure. S102: and performing foaming molding treatment on the to-be-foamed stacked structure so that the to-be-foamed material layer 31a is foamed to form a foam layer 31 and is directly bonded with the conductive layer 32. Therefore, the conductive foam 3 is simple in structure and low in cost.
The material of the material layer 31a to be foamed may be silicone, plastic or rubber with foaming agent added. Blowing agents include, but are not limited to, azo compounds, sulfonylhydrazines, nitroso compounds, sodium bicarbonate, sodium carbonate, n-pentane, n-hexane, n-heptane, petroleum ether (also known as naphtha), trichlorofluoromethane, dichlorodifluoromethane, and dichlorotetrafluoroethane. Plastics include, but are not limited to, polyurethane (PU), polyethylene (PE), polypropylene (PP), styrene-butadiene rubber, acrylates, vinyl acetate, vinylidene chloride, butyronitrile, silicones, acrylamides, natural rubber, polyvinyl chloride, polysulfide rubber, styrene-acrylate copolymers, vinyl acetate-acrylate copolymers, silicone-acrylate copolymers, and modified silicone-acrylate copolymers.
In addition, the support substrate 33 may be a metal plate, a resin plate, or the like, and is not particularly limited herein.
Example three: the step S100 includes: s101': sequentially stacking a layer 31a of a material to be foamed and a layer 32 of a conductive layer on a support substrate to form a stacked unit to be foamed; s102': the to-be-foamed stacked unit is subjected to foaming molding treatment, so that the to-be-foamed material layer 31a is foamed to form a foam layer 31 and is directly bonded with the conductive layer 32 together to form a two-layer stacked unit. Steps S101 'and S102' are repeated a plurality of times on the two-layer stacked unit to form a multi-layer stacked structure.
S200: the multi-layer stacked structure is cut by a dotted line a in the multi-layer stacked structure shown in fig. 15 to form the conductive foam 3, and fig. 16 is a schematic structural view of the conductive foam according to some embodiments of the present disclosure.
Wherein, the conductive foam 3 has a first surface 100 and a second surface 200 opposite to each other, the conductive layer 32 in the conductive foam 3 has a first edge 321 and a second edge 322 opposite to each other, the first edge 321 is located on the first surface 100, the second edge 322 is located on the second surface 200, and the conductive layer 32 in the conductive foam 3 is disposed obliquely with respect to the first surface 100 and the second surface 200, the conductive layer 32 in the conductive foam 3 can transmit an electrical signal input from one of the first edge 321 and the second edge 322 to the other of the first edge 321 and the second edge 322, and a direction parallel to the first surface 100 and perpendicular to the first edge 321 (i.e. a direction F in fig. 16) is between two adjacent conductive layers 32 in the conductive foam 3 1 ) The distance D is greater than or equal to the width W from the first edge 321 to the second edge 322 of the conductive layer 32 in the conductive foam 3.
The inclination angle of the conductive layer 32 with respect to the first surface 100 and the second surface 200 may be 20 °, 30 °, 85 °, and so on, and is not particularly limited herein. In some embodiments, the conductive layer 32 is inclined at an angle of 30 ° to 80 ° with respect to the first surface 100 and the second surface 200. Therefore, the inclination angle of the conductive layer 32 is moderate, so that when the conductive layer 32 is subjected to a pressing force perpendicular to the first surface 100 or the second surface 200, the conductive layer 32 can be effectively guided to turn towards the direction close to the first surface 100 and the second surface 200, and meanwhile, the conductive layer 32 can be prevented from being too large in size due to too large width from the first edge 321 to the second edge 322.
It can be known that, since the conductive layer 32 can transmit the electrical signal input from one of the first edge 321 and the second edge 322 to the other of the first edge 321 and the second edge 322, when the conductive layer 32 is formed by laying conductive fibers and two adjacent conductive fibers are not in contact, one end of each conductive fiber along its length direction should be located at the first edge 321, and the other end of each conductive fiber along its length direction should be located at the second edge 322, so that the conductive layer 32 can transmit the electrical signal input from one of the first edge 321 and the second edge 322 to the other of the first edge 321 and the second edge 322.
When the multi-layer stacked structure is manufactured by the method described in the second and third embodiments, the supporting substrate may be removed in step S200, or may be removed before step S200, which is not particularly limited herein.
When the conductive foam 3 manufactured by the manufacturing method provided by the embodiment of the present application is applied to a gap between two structural members in an electronic device, the conductive foam 3 can realize electrical connection between the two structural members through the conductive layer 32. When the conductive foam 3 manufactured by the manufacturing method provided by the embodiment of the present application is applied to a gap between two structural members in an electronic device and a pressing force perpendicular to the first surface 100 or the second surface 200 is applied to the conductive foam 3, the foam layer 31 is compressed, the conductive layer 32 is turned over toward the first surface 100 or the second surface 200, and when the conductive foam 3 is compressed to the limit state, the conductive layer 32 is turned over to a position approximately coplanar with the first surface 100 or the second surface 200. And because the direction between two adjacent conductive layers 32 is parallel to the first surface 100 and perpendicular to the first edge 321 (i.e. the direction F in fig. 16) 1 ) The distance D is larger than the width W of the conductive layer 32 from the first edge 321 to the second edge 322, so that the conductive foam 3 is compressed to the limitIn the state, the thickness of the conductive foam 3 is approximately equal to the sum of the thickness of the single-layer conductive layer 32 and the thickness of the foam layer 31 when the conductive foam is compressed to the limit state, and on the premise that the thickness of the conductive foam 3 from the first surface 100 to the second surface 200 in the free state is approximately consistent with the thickness of the conductive foam shown in fig. 1 and the structure of the conductive layer 32 is consistent with the structure of the single-layer conductive wrapping layer in the conductive foam shown in fig. 1, the conductive foam 3 manufactured by the manufacturing method provided by the application has smaller thickness when the conductive foam is compressed to the limit state than the conductive foam shown in fig. 1, and can be installed in a gap with smaller width.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (17)
1. The conductive foam is characterized in that the conductive foam is formed by alternately stacking and fixing foam layers and conductive layers in sequence;
the conductive foam is provided with a first surface and a second surface which are opposite, the conductive layer is provided with a first edge and a second edge which are opposite, the first edge is positioned on the first surface, the second edge is positioned on the second surface, and the conductive layer is obliquely arranged relative to the first surface and the second surface;
the conductive layers can transmit an electric signal input by one edge of the first edge and the second edge to the other edge of the first edge and the second edge, and the distance between every two adjacent conductive layers in the direction parallel to the first surface and perpendicular to the first edge is larger than or equal to the width of the conductive layers from the first edge to the second edge.
2. The conductive foam of claim 1, wherein the conductive layer is a conductive sheet.
3. The conductive foam as claimed in claim 2, wherein the conductive sheet is a metal sheet or a non-metal sheet with surface conductivity.
4. The conductive foam of claim 3, wherein the non-metal sheet subjected to surface conductivity treatment is a conductive cloth, a tin-plated polyimide film or a gold-plated polyimide film.
5. The conductive foam of claim 1, wherein the conductive layer is a conductive mesh.
6. The conductive foam of claim 5, wherein the conductive mesh is a metal mesh or a non-metal mesh with a surface treated by conductivity.
7. The conductive foam of claim 6, wherein the non-metallic network subjected to surface conduction treatment is a gold-plated non-metallic network or a nickel-plated non-metallic network.
8. The conductive foam of claim 1, wherein the conductive layer is laid with conductive fibers.
9. The conductive foam of claim 8, wherein the conductive fibers are metal fibers or non-metal fibers subjected to surface conductive treatment.
10. The conductive foam of claim 9, wherein the non-metallic fibers subjected to surface conduction treatment are gold-plated non-metallic fibers or nickel-plated non-metallic fibers.
11. The conductive foam according to any one of claims 1 to 10, wherein the angle of inclination of the conductive layer with respect to the first surface and the second surface is 30 ° to 80 °.
12. The conductive foam of any of claims 1-10, wherein the conductive layer is in direct contact with and bonded to the foam layer.
13. The conductive foam of any one of claims 1 to 10, wherein the conductive layer and the foam layer are bonded together by a glue layer.
14. An electronic device, comprising:
a reference ground;
the electronic component is arranged at an interval with the reference ground and is provided with a metal shell;
the conductive foam is as claimed in any one of claims 1 to 13, and is disposed in a gap between the electronic component and the reference ground, a first surface of the conductive foam faces the electronic component and is electrically connected to a metal housing of the electronic component, and a second surface of the conductive foam faces the reference ground and is electrically connected to the reference ground.
15. A method for manufacturing conductive foam is characterized by comprising the following steps:
alternately stacking and fixing the foam layer and the conductive layer in sequence to form a multilayer stacked structure;
cutting the multilayer stacking structure to form conductive foam;
the conductive foam is provided with a first surface and a second surface which are opposite, a conductive layer in the conductive foam is provided with a first edge and a second edge which are opposite, the first edge is located on the first surface, the second edge is located on the second surface, the conductive layer in the conductive foam is obliquely arranged relative to the first surface and the second surface, the conductive layer in the conductive foam can transmit an electric signal input from one edge of the first edge and the second edge to the other edge of the first edge and the second edge, and the distance between every two adjacent conductive layers in the conductive foam in the direction parallel to the first surface and perpendicular to the first edge is larger than or equal to the width of the conductive layer in the conductive foam from the first edge to the second edge.
16. The method for manufacturing the conductive foam of claim 15, wherein the sequentially and alternately stacking and fixing the foam layer and the conductive layer comprises:
pile up bubble cotton layer, glue film, conducting layer and glue film in proper order in turn, with through the glue film will the bubble cotton layer with the conducting layer bonds together.
17. The method for manufacturing the conductive foam of claim 15, wherein the sequentially and alternately stacking and fixing the foam layer and the conductive layer comprises:
alternately stacking a material layer to be foamed and a conductive layer on a support substrate in sequence to form a stacked structure to be foamed;
and carrying out foaming forming treatment on the stacked structure to be foamed so as to enable the material layer to be foamed to form the foam layer and be directly bonded with the conductive layer.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350282A (en) * | 1993-06-08 | 1994-12-22 | Kitagawa Ind Co Ltd | Gasket for shielding electromagnetic wave |
| CN201489846U (en) * | 2009-07-21 | 2010-05-26 | 隆扬电子（昆山）有限公司 | Conductive elastomer |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003220941A1 (en) * | 2002-03-20 | 2003-09-29 | J.S.T. Mfg. Co., Ltd. | Flexible good conductive layer and anisotropic conductive sheet comprising same |
| EP2338319B1 (en) * | 2008-09-26 | 2015-02-11 | Parker-Hannifin Corporation | Electrically-conductive foam emi shield |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06350282A (en) * | 1993-06-08 | 1994-12-22 | Kitagawa Ind Co Ltd | Gasket for shielding electromagnetic wave |
| CN201489846U (en) * | 2009-07-21 | 2010-05-26 | 隆扬电子（昆山）有限公司 | Conductive elastomer |
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