CN113036468B

CN113036468B - Electronic equipment

Info

Publication number: CN113036468B
Application number: CN202110174093.XA
Authority: CN
Inventors: 霍国亮
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2022-04-22
Anticipated expiration: 2039-12-26
Also published as: CN111180915A; CN111180915B; CN113036468A

Abstract

The application provides an electronic device. Relates to the technical field of shielding. This electronic equipment can include treats shield, ground structure, shield and bearing structure, wherein: the to-be-shielded part is arranged on one side of the grounding structural part; the grounding structural part is provided with a through hole penetrating through the grounding structural part; the shielding piece comprises a first insulating material layer and a conductive material layer which are overlapped, and the first insulating material layer is attached to the grounding structural piece; one part of the shielding part is arranged on one side of the grounding structural part close to the part to be shielded, and the other part of the shielding part penetrates through the through hole and is fixed on the grounding structural part; the side, facing the grounding structural member, of the conductive material layer is divided into an insulating area and a conductive area, and the first insulating material layer is arranged in the insulating area; and the support structure is used for enabling the conductive area to be in conductive contact with the grounding structural member. In this scheme, support the conductive area through bearing structure, can effectual improvement conducting material layer and the reliability of ground connection structure contact to be favorable to improving the stability of treating the shielding effect of shield.

Description

Electronic equipment

Technical Field

The present application relates to the field of shielding technologies, and in particular, to an electronic device.

Background

With the continuous development of electronic devices such as mobile phones, users have higher and higher requirements for screen occupation of the electronic devices. In order to comply with the development trend of large screen occupation ratio, various manufacturers make various efforts for realizing the design of the narrow frame of the electronic equipment, and certain achievements are obtained.

However, as the frame of the electronic device is continuously reduced, the antenna clearance area in the electronic device is also continuously reduced, and the interference of the electronic devices such as the display, the receiver, and the camera in the electronic device to the antenna is more and more obvious. Therefore, how to realize a stable shielding effect on electronic devices in electronic equipment to reduce interference generated by the electronic devices on antennas becomes a difficult problem to be solved urgently in the development process of large-screen-ratio electronic equipment.

Disclosure of Invention

The technical scheme of the application provides the electronic equipment so as to follow the development trend of narrow frame design of the electronic equipment.

The technical scheme of the application provides electronic equipment, and the electronic equipment can include waiting shield spare, ground structure spare, shield spare and bearing structure. The to-be-shielded part is arranged on one side of the grounding structural part. The grounding structural member is provided with a via hole which penetrates through the grounding structural member and can be penetrated by the shielding member. When specifically setting up the shield, the shield has first insulating material layer and the conducting material layer of looks range upon range of setting, and the shield passes through first insulating material layer and laminates mutually with the ground structure. In order to enable the shielding element to absorb the electrical signal radiated by the element to be shielded, a part of the shielding element may be disposed on a side of the grounding structure element close to the element to be shielded, and another part of the shielding element may pass through the via hole of the grounding structure element and then be fixed to the grounding structure element. In addition, one side of the conductive material layer facing the grounding structural member can be divided into a conductive region and an insulating region, so that the first insulating material layer is only arranged in the insulating region, and signal interference generated by the to-be-shielded member due to large-area contact of the conductive material layer and the grounding structural member is avoided. The conductive area of the conductive material layer is attached to the grounding structural member under the supporting effect of the supporting structure, so that the shielding member is grounded and conducted with the grounding structural member.

By adopting the scheme, the electric signal radiated by the shield can be absorbed by the conductive material layer of the shield, and the conductive material layer of the shield is tightly attached to the grounding structural member, so that the electric signal absorbed by the conductive material layer is grounded through the grounding structural member, the shield is grounded and conducted with the grounding structural member, and the shield of the shield is further realized. In addition, in the scheme, the part of the shielding piece corresponding to the conductive region is supported by the supporting structure, so that the contact reliability between the conductive material layer and the grounding structural piece can be effectively improved, and the stability of the shielding effect of the shielding piece to be treated is favorably improved.

In one possible implementation manner of the present application, when the shielding element is specifically arranged, the shielding element may pass through a portion of the via hole of the grounding structural element, and be attached to one side of the grounding structural element, which is far away from the to-be-shielded element, after being bent. The conductive area can then be arranged at that part of the grounding structure which is fastened to the side of the shielding element remote from the element to be shielded, and optionally at the end of that part of the shielding element.

In one possible implementation manner of the present application, the electronic device may further include a pressing structure, which may be, but is not limited to, a printed circuit board, a battery holder, or a rear case of the electronic device. The compressing structure and the to-be-shielded piece are respectively arranged on two sides of the grounding structural piece. In order to enable the supporting structure to support the conductive region of the shielding piece, one end of the supporting structure is fixed on the pressing structure, and the other end of the supporting structure is abutted against the shielding piece, so that the conductive region of the conductive material layer is tightly attached to the grounding structural piece. Through setting up bearing structure in compact structure, can improve bearing structure and to the stability that the shielding part supported to improve the reliability of shielding part and ground structure contact, in order to be favorable to treating that the ground connection of shielding part and ground structure switches on, and then realize shielded effect.

In a possible implementation manner of the present application, when the supporting structure is specifically arranged, the supporting structure may be an elastic structural member such as a spring or a spring, so as to avoid damage to the shielding member while supporting the shielding member. In some embodiments, the support structure may also be a rigid structural member to effectively improve the stability of its support to the shield.

In addition, the supporting structure can be a conductive structural member or an insulating structural member. When the hold-down structure is grounded, the support structure may be configured as a conductive structure, which may allow the shield to be grounded via the hold-down structure. Through selecting the electric conduction performance of the supporting structure, various shielding requirements of the to-be-shielded piece can be met, and the flexibility of the electronic equipment design is improved.

In one possible implementation manner of the present application, for the shielding element, in addition to the above arrangement manner, the shielding element may be further fixed to a hole wall of the via hole after being bent by penetrating a portion of the via hole of the grounding structural element. The conductive region may then conform to the walls of the via and, optionally, may be provided at the end of that portion of the shield.

In one possible implementation manner of the present application, when the portion of the shielding element passing through the via hole is fixed to the hole wall, one end of the supporting structure may also be fixed to a portion of the grounding structure where the shielding element is not disposed, and the other end of the supporting structure extends into the via hole and abuts against a portion of the shielding element corresponding to the conductive region. At this time, one end of the supporting structure can be fixed on one side of the grounding structural member close to the to-be-shielded member; or, one end of the supporting structure is fixed on one side of the grounding structural part far away from the to-be-shielded part. The reasonable layout can be carried out on each structure in the electronic equipment, and the utilization rate of the internal space of the electronic equipment is improved. In addition, in this implementation, the requirement of the to-be-shielded element for ground conduction can be met by selecting the conducting performance of the support structure.

In one possible implementation manner of the present application, the electronic device may further include a second insulating material layer, which is disposed between the to-be-shielded element and the grounding structural element and may be fixedly connected to the to-be-shielded element. The material of the second insulating material layer may be the same as or different from the material of the first insulating material layer, and optionally, the second insulating material layer may be an insulating glue layer. Through set up second insulating material layer between waiting shield and ground structure, can avoid waiting shield and ground structure direct contact to cause more obvious signal interference.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the prior art;

fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 3 is a schematic structural diagram of an electronic device according to another embodiment of the present application;

fig. 4 is a schematic structural diagram of an electronic device according to another embodiment of the present application;

fig. 5 is a schematic structural diagram of an electronic device according to another embodiment of the present application.

Reference numerals:

1-a grounded structural member; 101-a via hole; 2-a shield; 201-a layer of conductive material; 202-an adhesive layer;

203-a first layer of insulating material; 3-a to-be-shielded element; 4-a second layer of insulating material; 5-a support structure; 6-a compaction structure.

Detailed Description

For the convenience of understanding the electronic device provided in the embodiments of the present application, a specific application scenario thereof is first described below. The electronic device of the embodiment of the application can be but not limited to a mobile phone, a tablet computer, an intelligent wearable device, a Personal Digital Assistant (PDA) and other electronic devices which need signal shielding. At present, in order to comply with the development requirement of the large screen occupation ratio of the electronic device, manufacturers of the electronic devices generally adopt a mode of designing a frame of the electronic device to be smaller and smaller to increase the screen occupation ratio so as to meet the visual perception of users. The antenna of the electronic device is usually disposed at the frame, and when the frame of the electronic device is reduced, the clearance area of the antenna is also reduced, which may cause the interference generated by the electronic device in the electronic device to the antenna to be more and more obvious in the process of transmitting the electrical signal. To solve the above problems, shielding of the electronic device is generally required.

There are various shielding schemes for electronic devices, and referring to fig. 1, a shielding scheme for electronic equipment according to an embodiment of the prior art is shown in fig. 1. In this embodiment, the electronic apparatus includes a grounding structural member 1, a shield 2, and a to-be-shielded member 3, which are stacked. The grounding structure member 1 is grounded, the to-be-shielded member 3 can be an electronic device such as a display, a camera or a receiver, and the electronic device can transmit electric signals. The shielding part 2 is arranged between the part 3 to be shielded and the grounding structural part 1, and the electric signals radiated by the part 3 to be shielded can be absorbed by the shielding part 2 and grounded through the grounding structural part 1. In this embodiment, the shielding element 2 includes a conductive material layer 201 and an adhesive layer 202 stacked on each other, and the conductive material layer 201 can be fixed to the grounding structural member 1 through the adhesive layer 202, so that the conductive material layer 201 can be conducted with the grounding structural member 1 through the adhesive layer 202, thereby grounding the conductive material layer 201, and further achieving a shielding effect on the electronic device.

In addition to the above-described structure, the electronic apparatus may further include a second insulating material layer 4, the second insulating material layer 4 being disposed between the member to be shielded 3 and the shielding member 2. Since the to-be-shielded element 3 and the shielding element 2 are usually made of metal materials, by disposing the second insulating material layer 4 therebetween, the to-be-shielded element 3 and the shielding element 2 can be prevented from being in direct contact, and a large signal interference is generated on the to-be-shielded element 3 or the antenna.

In the above structure, when the conductive material layer 201 and the ground structure 1 are conducted through the adhesive layer 202, the conductive performance is achieved by conducting the metal particles because the adhesive layer 202 has the metal particles inside. However, the conduction between the metal particles is unstable, which may have some critical states, thereby causing the shielding of the electronic device by the shielding member 2 in this scheme to be unstable.

In order to realize a stable shielding effect for an electronic device waiting shield 3 in an electronic apparatus, the present application provides an electronic apparatus. Referring to fig. 2, the electronic device of the embodiment of the present application mainly includes: a shield 3 to be shielded, a grounding structure 1, a shield 2, a support structure 5, and a hold-down structure 6. The to-be-shielded component 3 and the compressing structure 6 are disposed on two sides of the grounding structure 1, and the to-be-shielded component 3 may be, but is not limited to, a display, such as a Liquid Crystal Display (LCD). The shielding element 3 may be an electronic device such as a camera or an earphone, which may transmit electrical signals.

When the grounding structure 1 is specifically arranged, the grounding structure 1 may be, but not limited to, a middle frame, a bracket, or the like, so as to support the to-be-shielded element 3 and the grounding structure 1, which are arranged on both sides of the grounding structure 1. In addition, with reference to fig. 2, a via hole 101 is further formed on the grounding structure 1, and the via hole 101 is disposed through the grounding structure 1. The opening position of the via hole 101 can be selected according to the specific shielding requirement of the to-be-shielded element 3, and can be at the edge of the grounding structural element 1 or at the middle. In the embodiments of the present application, parameters such as the cross-sectional shape of the via hole 101 and the size of the via hole 101 are not specifically limited, and may be adjusted according to actual situations.

With continued reference to fig. 2, the shield 2 may comprise a two-layer structure stacked on top of each other, in particular a first layer of insulating material 203 and a layer of conductive material 201 stacked on top of each other. The conductive material layer 201 may be made of a metal capable of conducting an electrical signal, such as copper, aluminum, or silver, and the first insulating material layer 203 may be a layer structure formed by an insulating paste or the like coated or adhered on the conductive material layer 201. In addition, the projection of the first insulating material layer 203 on the conductive material layer 201 may be within the boundary of the conductive material layer 201, specifically, the side of the conductive material layer 201 facing the ground structure member 1 is divided into a conductive region (a region with a length L1 on the conductive material layer 201 in fig. 2) in conductive contact with the ground structure member 1, and an insulating region other than the conductive region, where the first insulating material layer 203 is disposed. To facilitate the positioning of the first insulating material layer 203, the first insulating material layer 203 covering the conductive material layer 201 may be configured such that one end portion of the conductive material layer 201 is exposed as a conductive region, and the conductive region is disposed at the end portion of the conductive material layer.

In order to achieve the shielding effect of the shield 3, referring to fig. 2, the first insulating material layer 203 of the shield 2 may be attached to the grounding structural member 1, so that the contact instability between the conductive material layer 201 and the grounding structural member 1 due to the lack of reliable crimping force can be avoided, and the signal interference between the shield 3 and the antenna can be avoided. In addition, by attaching the first insulating material layer 203 of the shielding element 2 to the grounding structure 1, the conductive material layer 201 can be exposed, so that the conductive material layer 201 of the shielding element 2 can receive the electrical signal radiated by the element 3 to be shielded. When the shielding element 2 is specifically arranged on the grounding structural element 1, a part of the shielding element 2 is arranged on one side of the grounding structural element 1 close to the element 3 to be shielded, and the other part of the shielding element 2 passes through the via hole 101 on the grounding structural element 1 and is attached to one side of the grounding structural element 1 away from the element 3 to be shielded after being bent. The conductive region of the shielding element 2 is disposed on a side of the grounding structure 1 away from the element to be shielded 3. In this embodiment, the area of the part of the grounding structure 1, which is close to the side of the to-be-shielded element 3, where the shielding element 2 is disposed, may be selected according to the shielding requirement of the to-be-shielded element 3.

When the first insulating material layer 203 is an insulating glue, the insulating glue can be adhered to the grounding structural member 1, so as to fix the shielding element 2 to the grounding structural member 1; when the first insulating material layer 203 does not have adhesiveness, an adhesive such as an adhesive paste may be applied between the first insulating material layer 203 and the ground structure member 1 to fix the first insulating material layer 203 and the ground structure member 1. With continued reference to fig. 2, the portion of the shield 2 corresponding to the conductive area of the conductive material layer 201 may be brought into contact with the ground structure 1 by the supporting force of the support structure 5.

In particular when arranging the support structure 5, the support structure 5 may be arranged between the ground structure 1 and the compacting structure 6, see fig. 2. One end of the supporting structure 5 can be fixed on the pressing structure 6 in a bonding or welding mode; the other end of the support structure 5 abuts against the shielding element 2, so that the conductive area of the shielding element 2 is tightly attached to the grounding structure 1. In addition, when the support structure 5 is brought into abutment with the shield 2, the support structure 5 may be brought into direct abutment with the position of the corresponding conductive area of the shield 2. The contact between the support structure 5 and the shield 2 may be a point contact or a surface contact, and is not particularly limited in the embodiment of the present application. Through set up bearing structure 5 between ground connection structure 1 and compact structure 6, can make the conductive region of shield 2 and the inseparable laminating of ground connection structure 1 to can realize conducting material layer 201 and the stable of ground connection structure 1 and switch on, and then realize treating the stable shielding effect of shield 3.

With reference to fig. 2, the supporting structure 5 may be an elastic structure member such as a spring, or silica gel, so that the conductive area of the shielding member 2 is tightly attached to the grounding structure member 1 under the elastic force of the elastic structure member. In some embodiments, the supporting structure 5 may also be a hard supporting structure 5, so as to achieve stable contact between the conductive region of the shielding element 2 and the grounding structure 1 under the condition of a certain distance between the grounding structure 1 and the pressing structure 6, so as to improve the shielding effect on the to-be-shielded element 3.

In addition, the support structure 5 may be a conductive structure, and may also be an insulating structure. When the compressing structure 6 is grounded, the supporting structure 5 can be set as a conductive structure, so that the conductive material layer 201 of the shielding element 2 is conducted with the compressing structure 6 through the supporting structure 5, the shielding element 2 is grounded through the compressing structure 6, and the shielding effect of the shielding element 3 is realized.

Referring to fig. 2, when the compressing structure 6 is specifically disposed, the compressing structure 6 may be a Printed Circuit Board (PCB) of the electronic device, and since a device may be disposed on a side surface of the PCB facing the ground structure 1, a specific size of the supporting structure 5 may be adjusted according to a size of the device on the PCB, so as to avoid an increase in overall thickness of the electronic device while achieving an effect of stably supporting the conductive region of the shielding member 2. In addition, the pressing structure 6 may also be another structure that is disposed in the electronic device and can serve as a support, such as a battery holder (not shown in the figure) or a rear case (not shown in the figure) of the electronic device.

Since signal interference is likely to occur due to contact between two metal materials, the to-be-shielded member 3 and the conductive material layer 201 are usually made of metal materials. Therefore, with reference to fig. 2, in the electronic device according to the embodiment of the present application, a second insulating material layer 4 may be further disposed on a side surface of the to-be-shielded element 3 close to the grounding structure 1, wherein a material of the second insulating material layer 4 may be the same as or different from a material of the first insulating material layer 203 of the shielding element 2. Thereby avoiding direct contact of the shield 3 to the conductive material layer 201 of the shield 2 to reduce signal interference with the shield 3 and the antenna.

In the above embodiments of the present application, the conductive material layer 201 of the shielding element 2 is closely attached to the grounding structural element 1, and the electric signal, which is absorbed by the conductive material layer 201 of the shielding element 2 and radiated by the shielding element 3, can be grounded through the grounding structural element 1, so as to realize the shielding effect on the shielding element 3. In addition, the conductive region of the shielding element 2 is supported by the supporting structure 5, so that the contact reliability between the conductive material layer 201 and the grounding structural element 1 can be effectively improved, and the stability of the shielding effect of the shielding element 3 to be treated can be improved.

Referring to fig. 3, in some embodiments of the present application, the shielding element 2 may be arranged differently from the above-described embodiments, and specifically, the shielding element 2 includes a first insulating material layer 203 and a conductive material layer 201 which are stacked. The conductive material layer 201 may be made of a metal such as copper capable of conducting an electrical signal, and the first insulating material layer 203 may be a layer structure formed by an insulating adhesive or the like coated or adhered on the conductive material layer 201. In addition, the side of the conductive material layer 201 facing the ground structure member 1 may be divided into a conductive region (a region having a length L2 on the conductive material layer 201 in fig. 3) in conductive contact with the ground structure member 1, and an insulating region other than the conductive region, to which the first insulating material layer 203 is disposed.

With continued reference to fig. 3, in this embodiment, the first insulating material layer 203 of the shielding element 2 can be attached to the grounding structure 1, so that unstable contact between the conductive material layer 201 and the grounding structure 1 due to lack of reliable crimping force can be avoided, and signal interference to the shielding element 3 and the antenna can be avoided. In addition, by attaching the first insulating material layer 203 of the shielding element 2 to the grounding structural member 1, the conductive material layer 201 can be exposed, so that the conductive material layer 201 of the shielding element 2 can receive the electric signal radiated by the element 3 to be shielded conveniently.

When specifically setting up shield 2 in ground connection structure 1, the part of shield 2 sets up in the one side that is close to waiting shield 3 of ground connection structure 1, and another part of shield 2 is buckled the back and is penetrated through via hole 101 on the ground connection structure 1 to laminate mutually with the pore wall of via hole 101 on the ground connection structure 1. The conductive region of the shielding element 2 is disposed on the portion of the shielding element 2 attached to the hole wall of the via hole 101, and the area, position, etc. of the portion of the grounding structure 1 near the side of the to-be-shielded element 3 can be selected according to the shielding requirement of the to-be-shielded element 3. In this embodiment, when the first insulating material layer 203 is an insulating glue, the insulating glue may be adhered to the grounding structural member 1 to fix the shielding element 2 and the grounding structural member 1; when the first insulating material layer 203 does not have adhesiveness, an adhesive such as an adhesive paste may be applied between the first insulating material layer 203 and the ground structure member 1 to fix the first insulating material layer 203 and the ground structure member 1. With continued reference to fig. 3, the conductive region of the shielding element 2 can contact the grounding structure 1 under the supporting force of the supporting structure 5, so as to achieve stable conduction between the shielding element 2 and the grounding structure 1. In addition, this scheme of adoption still is favorable to shortening the design length of shielding part 2 to practice thrift the cost.

Referring to fig. 3, in this embodiment, the supporting structure 5 is arranged in a manner similar to that of the above-described embodiment, but slightly different therefrom, specifically, one end of the supporting structure 5 is fixed to the pressing structure 6, and the other end thereof extends into the via hole 101 of the grounding structure 1 and abuts against the portion of the shielding member 2 arranged on the wall of the via hole 101. In order to improve the contact stability of the conductive area of the shielding element 2 with the grounding structure 1, the support structure 5 may directly support the portion of the shielding element 2 corresponding to the conductive area. In addition, the contact between the support structure 5 and the shield 2 may be a point contact or a surface contact, and is not particularly limited in the embodiment of the present application.

Referring to fig. 4, in other embodiments of the present application, when the portion of the shielding element 2 penetrating through the via 101 of the grounding structure 1 is attached to the hole wall of the via 101 of the grounding structure 1, in order to attach the conductive area (the area with the length L2 on the conductive material layer 201 in fig. 4) of the conductive material layer 201 of the shielding element 2 to the grounding structure 1, the pressing structure 6 may be omitted, and instead, one end of the supporting structure 5 is fixed to the surface of the grounding structure 1 where the shielding element 2 is not disposed, and one end of the supporting structure 5 may be bent to extend into the via 101 and abut against the shielding element 2 disposed in the via 101.

Referring to fig. 4 and 5 together, when the support structure 5 is fixed to the grounding structural member 1, referring to fig. 4, the support structure 5 may be fixed to a side of the grounding structural member 1 close to the to-be-shielded member 3; as can also be seen in fig. 5, one end of the support structure 5 is fixed to the side of the grounding structure 1 remote from the to-be-shielded element 3. In addition, in the present application, the contact manner between the support structure 5 and the shield 2 is not limited, and as shown in fig. 4, the contact between the support structure 5 and the shield 2 may be point contact; alternatively, as shown in fig. 5, the support structure 5 is in surface contact with the shield 2.

In this embodiment, the support structure 5 may be a conductive structure, and may also be an insulating structure. When setting up bearing structure 5 into conductive structure spare, can make conductive material layer 201 of shield 2 switch on mutually with ground connection structure spare 1 through bearing structure 5 to can make conductive material layer 201 and the effectual contact of ground connection structure spare 1, shield 2 passes through ground connection structure spare 1 ground connection, and then reaches the effect of treating the stable shielding of shield 3.

In the above embodiments of the present application, the conductive material layer 201 of the shielding element 2 is closely attached to the grounding structural element 1, and the electric signal, which is absorbed by the conductive material layer 201 of the shielding element 2 and radiated by the shielding element 3, can be grounded through the grounding structural element 1, so as to realize the shielding effect on the shielding element 3. In addition, the conductive region of the shielding element 2 is supported by the supporting structure, so that the contact reliability between the conductive material layer 201 and the grounding structural element 1 can be effectively improved, and the stability of the shielding effect of the shielding element 3 to be treated can be improved.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising a to-be-shielded element, a grounding structure, a shielding element, and a support structure, wherein:

the to-be-shielded part is arranged on one side of the grounding structural part;

the grounding structural part is provided with a through hole, and the through hole penetrates through the grounding structural part;

one part of the shielding part is arranged on one side of the grounding structural part close to the part to be shielded, and the other part of the shielding part penetrates through the through hole and is fixed on the grounding structural part after being bent;

the supporting structure is used for supporting the shielding piece and enabling the shielding piece to be in conductive contact with the grounding structural piece;

the shielding piece comprises a conductive material layer, and the conductive material layer is attached to the grounding structural piece.

2. The electronic device of claim 1, wherein the shield further comprises a first layer of insulating material; one side, facing the grounding structural member, of the conductive material layer consists of an insulating region and a conductive region, and the first insulating material layer is arranged in the insulating region;

the supporting structure is further used for supporting the conductive material layer and enabling the conductive area to be in conductive contact with the grounding structural member.

3. The electronic device of claim 2, wherein the first layer of insulating material and the layer of conductive material are stacked, the first layer of insulating material being attached to the ground structure.

4. The electronic device of claim 2, wherein the conductive region is disposed at an end of the layer of conductive material.

5. The electronic device according to claim 2 or 3, wherein the shielding element passes through the part of the via hole and is fixed to one side of the grounding structure element far away from the element to be shielded after being bent;

the conductive region is arranged on one side of the grounding structural member far away from the to-be-shielded member.

6. The electronic device according to claim 2 or 3, wherein the shielding member is fixed to the wall of the via hole after being bent through the portion of the via hole; the conductive region is attached to the hole wall of the via hole.

7. The electronic device of claim 2, wherein one end of the support structure is fixed to the ground structure and the other end extends into the via and abuts a portion of the shield corresponding to the conductive region.

8. The electronic device of claim 7, wherein one end of the support structure is fixed to a side of the ground structure near the to-be-shielded element; or one end of the supporting structure is fixed on one side of the grounding structural part far away from the to-be-shielded part.

9. The electronic device according to claim 2 or 3, wherein the electronic device further comprises a compression structure, and the compression structure and the to-be-shielded member are arranged on two sides of the grounding structural member.

10. The electronic device of claim 9, wherein the support structure has one end fixed to the compression structure and another end abutting a portion of the shield corresponding to the conductive region.

11. The electronic device of any of claims 1-4, wherein the support structure is an elastic structure; alternatively, the support structure is a rigid structural member.

12. The electronic device of any of claims 1-4, wherein the support structure is a conductive structural member; or, the support structure is an insulating structural member.

13. The electronic device according to any one of claims 1 to 4, wherein a second insulating material layer is further disposed between the to-be-shielded member and the grounding structural member, and the second insulating material layer is fixed to the to-be-shielded member.

14. The electronic device of claim 1, wherein the ground structure is a bezel of the electronic device.