CN113964060A - Packaging structure for photoelectronic device - Google Patents
Packaging structure for photoelectronic device Download PDFInfo
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- CN113964060A CN113964060A CN202111206697.4A CN202111206697A CN113964060A CN 113964060 A CN113964060 A CN 113964060A CN 202111206697 A CN202111206697 A CN 202111206697A CN 113964060 A CN113964060 A CN 113964060A
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- air inlet
- rack
- driving
- rod
- edge sealing
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 230000005693 optoelectronics Effects 0.000 claims abstract description 26
- 238000007731 hot pressing Methods 0.000 claims description 25
- 238000003825 pressing Methods 0.000 claims description 17
- 230000006835 compression Effects 0.000 claims description 6
- 238000007906 compression Methods 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 210000002469 basement membrane Anatomy 0.000 description 23
- 238000012856 packing Methods 0.000 description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 15
- 239000001301 oxygen Substances 0.000 description 15
- 229910052760 oxygen Inorganic materials 0.000 description 15
- 210000004379 membrane Anatomy 0.000 description 11
- 239000012528 membrane Substances 0.000 description 11
- 241001232787 Epiphragma Species 0.000 description 10
- 238000009423 ventilation Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 4
- 238000000605 extraction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Drying Of Gases (AREA)
Abstract
The invention relates to the technical field of optoelectronic devices, and discloses an encapsulation structure for an optoelectronic device, which comprises a rack, wherein a bottom film and a top film are sequentially paved on the rack from bottom to top; the frame is provided with air inlet holes and air outlet holes which are arranged at intervals; the air inlet and the air outlet are communicated with the bottom film; the rack is provided with a fixed frame; the fixing frame is provided with a packaging device; the packaging device comprises a sealing edge mechanism arranged on the fixing frame and an air exchange mechanism arranged on the rack; the edge sealing mechanism comprises an outer edge sealing component positioned on the outer sides of the air inlet hole and the air outlet hole, an inner edge sealing component positioned on the inner sides of the air inlet hole and the air outlet hole, and a driving component for driving the outer edge sealing component and the inner edge sealing component to perform edge sealing; the air exchange mechanism comprises an air inlet pipe communicated with the lower end of the air inlet hole, an air outlet pipe communicated with the lower end of the air outlet hole and an air inlet box arranged at the other end of the air inlet pipe; the other end of the air inlet pipe is communicated with an air inlet box; an air pump is arranged on the air inlet pipe. The invention has the effect of improving the sealing performance of the package of the optoelectronic device.
Description
Technical Field
The invention relates to the technical field of optoelectronic devices, in particular to a packaging structure for an optoelectronic device.
Background
In the production of optoelectronic components or components, in particular organic optoelectronic components such as organic light-emitting diodes or organic solar cells or photovoltaic cells, it is desirable, on the one hand, to seal the components hermetically with respect to air (in particular with respect to moisture and oxygen contained in the air) and, on the other hand, to protect the components from mechanical damage (for example scratching) in order to avoid failure of the components.
In view of the above-mentioned related technologies, the inventor of the present application finds that at least the following technical problems exist in the process of implementing the technical solution of the invention in the embodiment of the present application: when encapsulating during photoelectrons, moisture and oxygen in the air are easily encapsulated into the package, so that the optoelectronic device is easily damaged.
Disclosure of Invention
The embodiment of the application provides a be used for photoelectronic device packaging structure, has solved among the prior art and has packaged moisture and oxygen in the air to the packing easily when encapsulating photoelectronic device, and then leads to the easy problem of damaging of photoelectronic device easily, has realized when encapsulating photoelectronic device for be difficult for containing moisture and oxygen in the packing, improve the protection effect to photoelectronic device.
The embodiment of the application provides a packaging structure for an optoelectronic device, which comprises a rack, wherein a bottom film and a top film are sequentially paved on the rack from bottom to top; the frame is provided with air inlet holes and air outlet holes which are arranged at intervals; the air inlet hole and the air outlet hole are communicated with the bottom film; the rack is provided with a fixed frame; the fixing frame is provided with a packaging device; the packaging device comprises a sealing edge mechanism arranged on the fixing frame and an air exchange mechanism arranged on the rack; the edge sealing mechanism comprises an outer edge sealing component positioned on the outer sides of the air inlet hole and the air outlet hole, an inner edge sealing component positioned on the inner sides of the air inlet hole and the air outlet hole, and a driving component for driving the outer edge sealing component and the inner edge sealing component to perform edge sealing; the air exchange mechanism comprises an air inlet pipe communicated with the lower end of the air inlet hole, an air outlet pipe communicated with the lower end of the air outlet hole and an air inlet box arranged at the other end of the air inlet pipe; the other end of the air inlet pipe is communicated with the air inlet box; an air pump is arranged on the air inlet pipe.
Furthermore, an opening is formed in one side of the air inlet box; and a plurality of water-absorbing and air-permeable plates arranged at intervals are arranged in the air inlet box.
Further, the fixed frame comprises a top plate arranged above the rack; a rectangular mounting hole is formed in the center of the top plate; a transverse plate is vertically arranged at the center of each hole wall of the mounting hole; the four transverse plates are spliced into a cross shape; connecting blocks are arranged at four corners of the top plate; the four connecting blocks are connected with the rack through connecting rods.
Furthermore, the outer edge sealing component comprises an outer vertical rod inserted on the transverse plate and an outer hot pressing strip arranged at the lower end of the outer vertical rod; the outer vertical rod is sleeved with a first connecting spring; two ends of the first connecting spring are respectively and fixedly connected with the lower end surface of the transverse plate and the upper end surface of the outer hot pressing strip; the outer vertical rod is in sliding fit with the transverse plate; the four external hot pressing strips are surrounded into a rectangular frame shape.
Furthermore, the inner edge sealing component comprises an inner vertical rod inserted on the transverse plate and an inner hot pressing strip arranged at the lower end of the inner vertical rod; a second connecting spring is sleeved on the inner vertical rod; two ends of the second connecting spring are respectively and fixedly connected with the lower end surface of the transverse plate and the upper end surface of the internal hot pressing strip; the inner vertical rod is in sliding fit with the transverse plate; the four internal heat pressing strips are enclosed into a rectangular frame shape.
Furthermore, a plurality of outer edge sealing assemblies are arranged at intervals along the horizontal direction of the rack.
Furthermore, the inner hot pressing strip and the outer hot pressing strip both comprise an adjusting plate connected with the lower end of the outer vertical rod or the lower end of the inner vertical rod and a pressing rod arranged below the adjusting plate; the upper end surface of the adjusting plate is provided with an adjusting opening; a first inclined plane is formed at the bottom of the adjusting opening; the first inclined plane inclines from bottom to top to a position close to the center of the rack; the driving assembly comprises a driving strip arranged on the lower end face of the transverse plate in a sliding manner and a driving part arranged below the fixing frame and used for driving the driving strip to slide along the length direction of the transverse plate; one end of the driving strip is provided with a second inclined surface matched with the corresponding adjusting opening.
Further, the driving part comprises an electric push rod arranged on one side of the fixed frame, a first movable rod arranged below the fixed frame in a sliding manner, and a second movable rod arranged below the fixed frame in a sliding manner; a piston rod of the electric push rod is fixedly connected with the middle part of the corresponding first movable rod; two first moving rods are arranged at intervals along one side of the fixed frame; two second moving rods are arranged at intervals along the other side of the fixed frame; the adjacent first moving rod and the second moving rod are vertical to each other; two ends of the first moving rod are provided with first helical racks; two ends of the second moving rod are provided with second helical racks; the two first helical racks positioned on the same side of the fixed frame have opposite tooth trace directions; the first helical rack is meshed with the corresponding second helical rack; the four driving strips are respectively and fixedly connected with the corresponding first movable rod or the second movable rod; the length direction of the driving strip is perpendicular to the length direction of the first moving rod or the second moving rod connected with the driving strip.
Furthermore, a positioning device is arranged on the frame; the positioning device comprises a linear laser generator arranged on the upper end surface of the rack; each side of the rack is provided with a linear laser generator; and the rack is provided with a lifting mechanism for driving the fixing frame to lift.
Further, the lifting mechanism comprises four telescopic cylinders; the four telescopic cylinders are respectively positioned at four corners of the frame; piston rods of the four telescopic cylinders penetrate through the rack and are fixedly connected with the corresponding connecting rods.
The technical scheme provided in the embodiment of the application at least has the following technical effects or advantages:
1. owing to adopted packaging hardware's structure, so can be through placing the basement membrane in the frame, the basement membrane aligns with inlet port and gas outlet, carries out the banding through banding mechanism to basement membrane and epiphragma, opens air pump extraction nitrogen gas and gets into between basement membrane and the epiphragma, carries out moisture and oxygen discharge between encapsulated epiphragma and the basement membrane to photoelectronic device for be difficult for containing moisture and oxygen in the packing, effectively improve the protection effect after the encapsulation to photoelectronic device.
2. Owing to adopted outer banding subassembly and interior banding subassembly, when needs are discharged to packing inside, carry out the banding through outer banding subassembly to basement membrane and epiphragma earlier for form a cavity in the packing, the rethread mechanism of taking a breath takes a breath in to the packing, the inside moisture of exhaust packing and oxygen, the banding is carried out to the position that the basement membrane is located inlet port and venthole inboard to rethread interior banding subassembly, effectively seal the photoelectronic device, the improvement is to photoelectronic device's protection.
3. Because the driving component is adopted, the electric push rod can push a first moving rod connected with the electric push rod by starting the electric push rod, because the two ends of the first moving rod are provided with first helical racks, and second helical racks meshed with the first helical racks drive the second moving rod to approach to the center of the machine frame, so as to synchronously drive a plurality of driving strips to move, because the second inclined planes of the driving strips are matched with the first inclined planes of the adjusting openings, when the driving strips advance, the corresponding adjusting plates can be pressed to descend, so that the outer hot pressing strips descend to carry out hot-pressing edge sealing on the bottom membrane and the top membrane, the inside of the package is ventilated through the ventilation mechanism, after ventilation, the electric push rod continuously extends out to drive the first moving rod and the second moving rod to further approach to the center of the machine frame, so that the inner edge sealing component carries out hot-pressing edge sealing, and a multi-stage progressive driving component is adopted, the drive of external banding subassembly and interior banding subassembly can be realized, machining efficiency is effectively improved.
4. Due to the fact that the positioning device is adopted, the processing area can be divided on the rack before the photoelectronic device is packaged, the bottom film, the top film and the photoelectronic device arranged between the bottom film and the top film can be conveniently placed in the processing area, the processing efficiency is improved, the packaging device is lifted up through the telescopic air cylinder, the four linear laser generators emit linear laser to form the rectangular frame, and the processing area is arranged inside the rectangular frame, so that the processing is convenient.
Drawings
Fig. 1 is a schematic structural view of the whole in the embodiment of the present application;
FIG. 2 is a schematic structural diagram of a fixing frame according to an embodiment of the present application;
FIG. 3 is a schematic view of the mounting position of the packaging device in the embodiment of the present application;
FIG. 4 is an enlarged schematic view at A in FIG. 3;
FIG. 5 is a schematic structural diagram of a driving assembly in an embodiment of the present application;
in the figure: 1. a frame; 11. a panel; 12. a support leg; 13. an air inlet; 14. an air outlet; 2. a fixed mount; 21. a top plate; 211. mounting holes; 22. a transverse plate; 23. connecting blocks; 24. a connecting rod; 3. a packaging device; 4. a positioning device; 41. a linear laser generator; 42. a telescopic cylinder; 5. a sealing mechanism; 51. an outer edge sealing component; 511. an outer vertical rod; 512. external hot layering; 5121. an adjusting plate; 5122. a pressure lever; 5123. an adjustment port; 5124. a slide bar; 5125. a return spring; 513. a first connecting spring; 52. an inner edge sealing component; 521. an inner vertical rod; 522. internally heating and pressing the strips; 523. a second connecting spring; 53. a cutter; 6. a ventilation mechanism; 61. an air intake box; 62. an air inlet pipe; 63. an air outlet pipe; 64. an air pump; 65. a water-absorbing air-permeable plate; 7. a drive assembly; 71. a drive bar; 72. an electric push rod; 73. a first movable bar; 74. a second movable bar; 75. a first helical rack; 76. a second helical rack.
Detailed Description
The embodiment of the application discloses provide a be used for photoelectronic device packaging structure, through carrying out outer banding to basement membrane and apical membrane, make the edge of apical membrane and basement membrane sealed formation packing, photoelectronic device places between apical membrane and basement membrane, take a breath to packing inside through ventilation mechanism 6, moisture and oxygen in the exhaust packing, carry out interior banding through interior banding subassembly 52 to apical membrane and basement membrane, seal photoelectronic device between apical membrane and basement membrane, easily encapsulate moisture and oxygen in the air to the packing when having solved among the prior art to photoelectronic device encapsulation, and then lead to the easy problem of damaging of photoelectronic device easily, realized when encapsulating photoelectronic device, make and be difficult for containing moisture and oxygen in the packing, improve the protective effect to photoelectronic device.
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
Referring to fig. 1 and 2, the packaging structure for the optoelectronic device includes a frame 1, where the frame 1 includes a panel 11 and four legs 12, the panel 11 is in a rectangular plate shape, and the four legs 12 are respectively and fixedly mounted at four corners of the panel 11. Frame 1 upper berth is equipped with basement membrane and top membrane, photoelectronic device places between basement membrane and top membrane, seal photoelectronic device through basement membrane and top membrane, install mount 2 in 1 top in the frame, mount 2 includes roof 21, diaphragm 22, connecting block 23 and connecting rod 24, the mounting hole 211 has been seted up to the center department of roof 21, the cross-section of mounting hole 211 is the rectangle, every pore wall center of mounting hole 211 all vertically fixed has a diaphragm 22, diaphragm 22's the other end extends to one side level of the mounting hole 211 pore wall that corresponds, four diaphragm 22 concatenate into cross, and four diaphragm 22's tip interval sets up to enclose and establishes the rectangle opening, four corners of roof 21 all with a connecting block 23 fixed connection, be connected through connecting rod 24 between four connecting blocks 23 and the frame 1. And the fixing frame 2 is provided with a packaging device 3 for sealing the bottom film and the top film.
Referring to fig. 1 and 2, in order to determine a processing area and conveniently place a bottom film and a top film, a positioning device 4 is installed on a machine frame 1, the positioning device 4 includes linear laser generators 41 and a lifting mechanism, one linear laser generator 41 is fixedly installed on each of four sides of a panel 11, and each linear laser generator 41 is located at the center of each side of the panel 11. Elevating system is used for driving mount 2 to go up and down, and then can conveniently lay basement membrane and epiphragma, elevating system includes four telescopic cylinder 42, four telescopic cylinder 42 are located four corners of frame 1 respectively, four telescopic cylinder 42's piston rod all pass frame 1 and with the 24 lower extreme fixed connection of connecting rod that correspond, send linear light through four linear laser generator 41, enclose and establish rectangle processing area, the piston rod of drive telescopic cylinder 42 stretches out, drive mount 2 and keep away from the up end of frame 1, and then can conveniently place the basement membrane, epiphragma and photoelectronic device in processing area, and the efficiency of processing is improved, be convenient for follow-up carry out banding processing accurately.
Referring to fig. 3, the packaging device 3 includes a sealing mechanism 5 and a ventilation mechanism 6, the sealing mechanism 5 is installed on the fixing frame 2 and used for sealing the peripheries of the bottom film and the top film, and the ventilation mechanism 6 is installed on the frame 1 and used for ventilating the sealed interiors of the bottom film and the top film, so that moisture and oxygen in the package are reduced, and the protection of the optoelectronic device is improved.
Referring to fig. 3, 4 and 5, in the processing area on the panel 11, an air inlet 13 and an air outlet 14 are provided on the panel 11, after the bottom film is laid on the panel 11, the upper ends of the air inlet 13 and the air outlet 14 are both penetrated through the bottom film and communicated with the cavity between the bottom film and the top film, after the bottom film is laid, the photoelectronic device is placed at the center of the bottom film, and then the top film is laid on the upper surface of the photoelectronic device, so that the side wall of the top film is attached to the bottom film, and the air inlet 13 and the air outlet 14 are respectively located at the two opposite sides of the photoelectronic device. The edge sealing mechanism 5 comprises an outer edge sealing component 51, an inner edge sealing component 52 and a driving component 7, wherein the outer edge sealing component 51 is located on the outer side of the air inlet hole 13 and the outer side of the air outlet hole 14, the inner edge sealing component 52 is located on the inner side of the air inlet hole 13 and the inner side of the air outlet hole 14, and the driving component 7 is installed on the fixing frame 2 and used for driving the outer edge sealing component 51 and the inner edge sealing component 52 to carry out edge sealing.
Referring to fig. 4 and 5, the outer edge sealing assemblies 51 are mounted on the transverse plates 22, a plurality of outer edge sealing assemblies 51 are arranged on each transverse plate 22 side by side, each outer edge sealing assembly 51 includes an outer vertical rod 511, an outer hot pressing strip 512 and a first connecting spring 513, the outer vertical rods 511 are inserted into the transverse plates 22, the outer vertical rods 511 are in sliding fit with the transverse plates 22, the outer hot pressing strips 512 are fixedly mounted at the lower ends of the outer vertical rods 511, each outer edge sealing assembly 51 includes an adjusting plate 5121 and a pressing rod 5122, each outer edge sealing assembly 51 is provided with two outer vertical rods 511, the two outer vertical rods 511 are arranged at intervals along the width direction of the transverse plates 22, the first connecting springs 513 are sleeved on the outer vertical rods 511, and two ends of the first connecting springs 513 are respectively and fixedly connected with the lower end surfaces of the transverse plates 22 and the upper end surfaces of the adjusting plates 5121. An adjusting opening 5123 is formed in the upper end of the adjusting plate 5121, the lower ends of the two outer vertical rods 511 are fixedly connected with the upper end face of the adjusting plate 5121, the two outer vertical rods 511 are located on two sides of the adjusting opening 5123, a first inclined face is formed at the bottom of the adjusting opening 5123, and the first inclined face inclines from bottom to top towards a position close to the center of the rack 1. A sliding rod 5124 is fixedly mounted at the upper end of the pressing rod 5122, the upper end of the sliding rod 5124 is inserted into the adjusting plate 5121 and can slide along the height direction of the adjusting plate 5121, a return spring 5125 is sleeved on the sliding rod 5124, two ends of the return spring 5125 are respectively and fixedly connected with the upper end face of the pressing rod 5122 and the lower end face of the adjusting plate 5121, and when the bottom film and the top film are subjected to hot pressing, pressing force during hot pressing can be controlled, and safety during hot pressing is effectively improved. The compression rods 5122 around the optoelectronic device are surrounded into a rectangular frame shape, and the end parts of two adjacent compression rods 5122 are formed with third inclined surfaces which are matched with each other, so that the interior of the hot-pressed package is completely sealed.
Referring to fig. 4 and 5, the inner edge sealing assembly 52 includes an inner vertical rod 521, an inner hot pressing strip 522 and a second connecting spring 523, the inner vertical rod 521 is close to the optoelectronic device, the inner vertical rod 521 is vertically inserted into the transverse plate 22 and is in sliding fit with the transverse plate 22, the inner hot pressing strip 522 is fixedly mounted at the lower end of the inner vertical rod 521, the inner hot pressing strip 522 includes an adjusting plate 5121 and a pressing rod 5122, the inner edge sealing assembly 52 is provided with two inner vertical rods 521, the two inner vertical rods 521 are arranged at intervals along the width direction of the transverse plate 22, the second connecting spring 523 is sleeved on the inner vertical rod 521, and two ends of the second connecting spring 523 are respectively and fixedly connected to the lower end surface of the transverse plate 22 and the upper end surface of the adjusting plate 5121. An adjusting opening 5123 is formed in the upper end of the adjusting plate 5121, the lower ends of the two inner vertical rods 521 are fixedly connected with the upper end face of the adjusting plate 5121, the two inner vertical rods 521 are located on two sides of the adjusting opening 5123, a first inclined face is formed at the bottom of the adjusting opening 5123, and the first inclined face inclines from bottom to top towards a position close to the center of the rack 1. A sliding rod 5124 is fixedly mounted at the upper end of the pressing rod 5122, the upper end of the sliding rod 5124 is inserted into the adjusting plate 5121 and can slide along the height direction of the adjusting plate 5121, a return spring 5125 is sleeved on the sliding rod 5124, and two ends of the return spring 5125 are respectively and fixedly connected with the upper end surface of the pressing rod 5122 and the lower end surface of the adjusting plate 5121. The compression rods 5122 of the internal hot pressing strips 522 are spliced into a rectangular frame shape, and the peripheries of the bottom film and the top film are subjected to hot-pressing edge sealing. The cutting knife 53 is fixedly installed below the adjusting plate 5121 of the internal heat pressing strip 522, the cutting knife 53 is located on one side, far away from the optoelectronic device, of the adjusting plate 5121, the end portions of the four cutting knives 53 located on the periphery of the optoelectronic device are connected in pairs, when the internal heat pressing strip 522 is driven to carry out hot pressing on the bottom film and the top film, the outer sides of the top film and the bottom film can be cut by the cutting knife 53, sealing is formed inside the package, and the optoelectronic device is completely sealed and packaged.
Referring to fig. 3, 4 and 5, the driving assembly 7 includes a driving strip 71 and four driving portions, a length direction of the driving strip 71 is identical to a length direction of the transverse plate 22, the driving strip 71 is provided with four transverse plates 22 corresponding to the four transverse plates 22 one by one, the driving strip 71 is slidably connected to a lower end surface of the transverse plate 22, a second inclined surface is formed at one end of the driving strip 71 close to the center of the frame 1, the second inclined surface is matched with the first inclined surface, the driving portion is installed below the fixing frame 2 and is used for driving the plurality of driving strips 71 to slide along the length direction of the transverse plate 22, when the driving strip 71 moves a distance towards the center of the frame 1, the second inclined surface of the driving strip 71 is attached to an adjusting plate 5121 in the outermost outer edge sealing assembly 51, the adjusting plate 5121 is pressed to move downwards, so that the first connecting spring 513 is compressed, the pressing rod 5122 performs hot pressing on the edge sealing of the bottom film and the top film, when the driving strip 71 continues to approach towards the center of the frame 1 along the length direction of the transverse plate 22, and the edge sealing is sequentially carried out on the bottom film and the top film, when the driving strip 71 moves to the position farthest away from the edge of the top plate 21, the second inclined surface of the driving strip 71 is attached to the adjusting plate 5121 of the inner edge sealing component 52, so that the adjusting plate 5121 descends to carry out hot-pressing edge sealing on the bottom film and the top film.
Referring to fig. 3 and 5, the driving portion includes an electric push rod 72, a first moving rod 73, a second moving rod 74, a first bevel rack 75 and a second bevel rack 76, the electric push rod 72 is fixedly mounted on one side of the top plate 21, the electric push rod 72 can perform multi-stage progressive driving, so as to realize step-by-step driving of the outer sealing edge assembly 51 and the inner sealing edge assembly 52, an extending direction of the electric push rod 72 is consistent with a length direction of the transverse plate 22 located on the side of the top plate 21, the first moving rod 73 and the second moving rod 74 are both slidably connected to a lower end surface of the top plate 21, two first moving rods 73 are arranged at intervals along the extending direction of the electric push rod 72, two first moving rods 73 are respectively located on outer sides of the two transverse plates 22 which are oppositely arranged, a piston rod of the electric push rod 72 is fixedly connected with a middle portion of a corresponding one of the first moving rods 73, two second moving rods 74 are arranged at intervals along a direction perpendicular to the extending direction of the electric push rod 72, the two second moving rods 74 are respectively located outside the other two opposite transverse plates 22, the adjacent first moving rods 73 and second moving rods 74 are perpendicular to each other, the driving bar 71 corresponding to the lower part of the transverse plate 22 is fixedly connected with the middle part of the corresponding first moving rod 73 or second moving rod 74, two ends of the first moving rod 73 are fixedly connected with a first helical rack 75, two ends of the two second moving rods 74 are fixedly connected with a second helical rack 76, the tooth line directions of the two first helical racks 75 located on the same side of the fixed frame 2 are opposite, the first helical racks 75 are meshed with the corresponding second helical racks 76, the length direction of the driving bar 71 is perpendicular to the length direction of the first moving rod 73 or second moving rod 74 connected with the driving bar, when the electric push rod 72 pushes the first moving rod 73 fixedly connected with the electric push rod 72 to approach to the center of the rack 1, the first moving rod 73 drives the other moving rod to approach to the center of the rack 1, the two second moving rods 74 are both moved toward the center of the frame 1 by the first and second rack gears 75 and 76.
Referring to fig. 3, ventilation mechanism 6 includes air inlet box 61, intake pipe 62, outlet duct 63, air pump 64, and air inlet box 61 fixed mounting has been seted up respectively in one side of frame 1 to opening and export have been seted up respectively to the relative both sides of air inlet box 61, detachably fixed mounting has a plurality of ventilative boards 65 that absorb water in air inlet box 61, and a plurality of ventilative boards 65 that absorb water set up side by side between opening and export, can reduce in the moisture gets into the packing. All install a check valve on intake pipe 62 and outlet duct 63, make intake pipe 62 only can admit air, outlet duct 63 only can give vent to anger, intake pipe 62's upper end is linked together with the lower extreme of inlet port 13, intake pipe 62's the other end is linked together with the export of inlet box 61, air pump 64 is installed on intake pipe 62, let in the packing through intake pipe 62 through air pump 64 extraction nitrogen gas, moisture and oxygen in the exhaust packing, the upper end of outlet duct 63 is linked together with the lower extreme of venthole 14, let in nitrogen gas after in the packing, make original moisture and oxygen discharge from outlet duct 63 in the packing, form balance.
The working principle of the embodiment of the application is as follows: when packing photoelectronic device, at first drive telescopic cylinder 42 for mount 2 lifts up to the top, takes place laser through line shape laser generator 41 and forms the processing region on panel 11, places the basement membrane in the processing region, makes two through-holes on the basement membrane align with inlet port 13 and venthole 14 respectively, places photoelectronic device and top membrane in proper order again, places the back, and drive telescopic cylinder 42 contracts, drives mount 2 and resumes the normal position.
By starting the electric push rod 72, the first moving rod 73 and the second moving rod 74 drive the corresponding driving strips 71 to approach the center of the frame 1, and further the driving strips 71 drive the adjusting plate 5121 located at the outermost side to descend, so as to seal the edges of the bottom film and the top film. After the banding, through starting air pump 64, extraction nitrogen gas gets into between basement membrane and the epiphragma, moisture and oxygen between discharge basement membrane and the epiphragma, resume drive electric putter 72 again and stretch out, drive a plurality of regulating plates 5121 in proper order and descend, once per banding, all exhaust once, set up a plurality of outer banding subassembly 51, can repeatedly exhaust to take a breath in the packing, reduce inside oxygen and moisture content, continue to drive electric putter 72 at last and stretch out, make drive strip 71 contradict with interior heat layering 522's regulating plate 5121, make this regulating plate 5121 descend and carry out final banding to basement membrane and epiphragma, in addition, in the banding, cutter 53 excises the basement membrane and the epiphragma clout in the banding outside, form complete encapsulation.
The above description is only for the preferred embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can substitute or change the technical solution and its concept of the present application within the technical scope disclosed in the present application, and shall be covered by the scope of the present application.
Claims (10)
1. A packaging structure for an optoelectronic device comprises a rack (1), and is characterized in that a bottom film and a top film are sequentially paved on the rack (1) from bottom to top; the frame (1) is provided with air inlet holes (13) and air outlet holes (14) which are arranged at intervals; the air inlet hole (13) and the air outlet hole (14) are communicated with the bottom film;
the rack (1) is provided with a fixed frame (2); the fixed frame (2) is provided with a packaging device (3);
the packaging device (3) comprises a sealing edge mechanism (5) arranged on the fixing frame (2) and an air exchange mechanism (6) arranged on the rack (1);
the edge sealing mechanism (5) comprises an outer edge sealing component (51) positioned on the outer side of the air inlet hole (13) and the air outlet hole (14), an inner edge sealing component (52) positioned on the inner side of the air inlet hole (13) and the air outlet hole (14), and a driving component (7) for driving the outer edge sealing component (51) and the inner edge sealing component (52) to perform edge sealing;
the air exchange mechanism (6) comprises an air inlet pipe (62) communicated with the lower end of the air inlet hole (13), an air outlet pipe (63) communicated with the lower end of the air outlet hole (14), and an air inlet box (61) arranged at the other end of the air inlet pipe (62);
the other end of the air inlet pipe (62) is communicated with the air inlet box (61); an air pump (64) is arranged on the air inlet pipe (62).
2. An encapsulating structure for an optoelectronic device according to claim 1, characterized in that one side of the air intake box (61) is provided with an opening; a plurality of water-absorbing and air-permeable plates (65) arranged at intervals are arranged in the air inlet box (61).
3. An encapsulating structure for an optoelectronic device according to claim 1, characterized in that said holder (2) comprises a top plate (21) arranged above the frame (1);
a rectangular mounting hole (211) is formed in the center of the top plate (21); a transverse plate (22) is vertically arranged at the center of each hole wall of the mounting hole (211); the four transverse plates (22) are spliced into a cross shape;
connecting blocks (23) are arranged at four corners of the top plate (21); the four connecting blocks (23) are connected with the rack (1) through connecting rods (24).
4. An encapsulating structure for optoelectronic devices according to claim 3, wherein the outer edge sealing component (51) comprises an outer vertical rod (511) inserted into the transverse plate (22), and an outer heat pressing strip (512) arranged at the lower end of the outer vertical rod (511); a first connecting spring (513) is sleeved on the outer vertical rod (511); two ends of the first connecting spring (513) are respectively and fixedly connected with the lower end surface of the transverse plate (22) and the upper end surface of the outer heat pressing strip (512);
the outer vertical rod (511) is in sliding fit with the transverse plate (22); the four external hot pressing strips (512) are surrounded into a rectangular frame shape.
5. The encapsulating structure for the optoelectronic device according to claim 4, wherein the inner edge sealing component (52) comprises an inner vertical rod (521) inserted on the transverse plate (22), and an inner hot pressing strip (522) arranged at the lower end of the inner vertical rod (521); a second connecting spring (523) is sleeved on the inner vertical rod (521); two ends of the second connecting spring (523) are respectively and fixedly connected with the lower end surface of the transverse plate (22) and the upper end surface of the internal heat pressing strip (522);
the inner vertical rod (521) is in sliding fit with the transverse plate (22); the four internal heat pressing strips (522) are enclosed into a rectangular frame shape.
6. An encapsulating structure for optoelectronic devices according to claim 1, wherein a plurality of the outer edge sealing assemblies (51) are arranged at intervals along the horizontal direction of the frame (1).
7. The encapsulating structure for the optoelectronic device according to claim 5, wherein each of the inner thermal compression bar (522) and the outer thermal compression bar (512) comprises a regulating plate (5121) connected with the lower end of the outer vertical rod (511) or the inner vertical rod (521), and a compression rod (5122) arranged below the regulating plate (5121); an adjusting opening (5123) is formed in the upper end face of the adjusting plate (5121); a first inclined surface is formed at the bottom of the adjusting opening (5123); the first inclined plane inclines to a position close to the center of the rack (1) from bottom to top;
the driving assembly (7) comprises a driving strip (71) which is arranged on the lower end face of the transverse plate (22) in a sliding mode, and a driving part which is arranged below the fixing frame (2) and used for driving the driving strip (71) to slide along the length direction of the transverse plate (22);
one end of the driving strip (71) is provided with a second inclined surface matched with the corresponding adjusting opening (5123).
8. The packaging structure for the optoelectronic device according to claim 7, wherein the driving portion comprises an electric push rod (72) disposed at one side of the fixing frame (2), a first moving rod (73) slidably disposed below the fixing frame (2), and a second moving rod (74) slidably disposed below the fixing frame (2);
a piston rod of the electric push rod (72) is fixedly connected with the middle part of one corresponding first moving rod (73);
two first moving rods (73) are arranged along one side of the fixed frame (2) at intervals; two second moving rods (74) are arranged at intervals along the other side of the fixed frame (2); the adjacent first moving rod (73) and the second moving rod (74) are vertical in pairs;
two ends of the first moving rod (73) are provided with first helical racks (75); two ends of the second moving rod (74) are provided with second helical racks (76); the two first helical racks (75) positioned on the same side of the fixed frame (2) have opposite tooth trace directions; the first helical rack (75) is meshed with the corresponding second helical rack (76);
the four driving bars (71) are respectively and fixedly connected with the corresponding first moving rod (73) or the corresponding second moving rod (74); the length direction of the driving strip (71) is perpendicular to the length direction of the first moving rod (73) or the second moving rod (74) connected with the driving strip.
9. An encapsulating structure for optoelectronic devices according to claim 3, characterized in that the frame (1) is provided with positioning means (4); the positioning device (4) comprises a linear laser generator (41) arranged on the upper end surface of the rack (1);
each side of the rack (1) is provided with a linear laser generator (41);
the frame (1) is provided with a lifting mechanism for driving the fixing frame (2) to lift.
10. An encapsulating structure for optoelectronic devices according to claim 9, wherein said lifting mechanism comprises four telescopic cylinders (42); the four telescopic cylinders (42) are respectively positioned at four corners of the rack (1); piston rods of the four telescopic cylinders (42) penetrate through the rack (1) and are fixedly connected with the corresponding connecting rods (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111206697.4A CN113964060A (en) | 2021-10-15 | 2021-10-15 | Packaging structure for photoelectronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111206697.4A CN113964060A (en) | 2021-10-15 | 2021-10-15 | Packaging structure for photoelectronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113964060A true CN113964060A (en) | 2022-01-21 |
Family
ID=79464721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111206697.4A Withdrawn CN113964060A (en) | 2021-10-15 | 2021-10-15 | Packaging structure for photoelectronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113964060A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114346540A (en) * | 2022-01-26 | 2022-04-15 | 江苏红人实业股份有限公司 | Automatic welding mechanism for clothing rack panel |
-
2021
- 2021-10-15 CN CN202111206697.4A patent/CN113964060A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114346540A (en) * | 2022-01-26 | 2022-04-15 | 江苏红人实业股份有限公司 | Automatic welding mechanism for clothing rack panel |
| CN114346540B (en) * | 2022-01-26 | 2023-12-26 | 江苏红人实业股份有限公司 | Automatic welding mechanism for clothing rack panel |
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Application publication date: 20220121 |