CN113954563B - Nanometer micro-carving anti-counterfeiting gold stamping process - Google Patents

Nanometer micro-carving anti-counterfeiting gold stamping process Download PDF

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Publication number
CN113954563B
CN113954563B CN202111418411.9A CN202111418411A CN113954563B CN 113954563 B CN113954563 B CN 113954563B CN 202111418411 A CN202111418411 A CN 202111418411A CN 113954563 B CN113954563 B CN 113954563B
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gold stamping
oxide layer
micro
plate
copper plate
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CN113954563A (en
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谢明伟
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Shanghai May May Noble Printing Co ltd
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Shanghai May May Noble Printing Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
    • B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
    • B44C1/17—Dry transfer
    • B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
    • B44C1/1729—Hot stamping techniques
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/081—Oxides of aluminium, magnesium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Abstract

The invention relates to the technical field of gold stamping processes, and particularly discloses a nano micro-engraving anti-counterfeiting gold stamping process which comprises the following steps: designing a pattern according to a drawing, and engraving the pattern of a copper plate gold stamping plate by using a laser nanometer micro engraving machine; and secondly, sequentially plating a zinc oxide layer, a titanium oxide layer and a protective layer on the surface of the copper plate bronzing plate with the micro-engraved patterns, and thirdly, performing flat-ironing treatment on the copper plate bronzing plate and finally performing pressure-ironing treatment on the copper plate bronzing plate. Through the process treatment, the reflected light color on the surface of the copper plate gold stamping plate presents corresponding specific color at different incident angles, a special colorful effect is formed, and the stereoscopic impression of micro-engraved patterns can be effectively improved.

Description

Nanometer micro-carving anti-counterfeiting gold stamping process
Technical Field
The invention relates to the technical field of gold stamping processes, in particular to a nano micro-engraving anti-counterfeiting gold stamping process.
Background
The gold stamping is also called as alumite hot stamping, the gold stamping process is to transfer an aluminum layer in alumite to the surface of a bearing object by utilizing the principle of hot-pressing transfer to form a special metal effect, and the gold stamping is generally applied to the surfaces of paper surfaces, plastics and cloth.
The positioning holographic gold stamping is a special process application of holographic laser positioning electrochemical aluminum in design, wherein patterns on the positioning holographic gold stamping foil have both decoration and anti-counterfeiting effects, and the grade of a product can be greatly improved.
The positioning holographic gold stamping process needs to match the positioning holographic foil with special equipment, and the positioning holographic foil and the special equipment are extremely expensive and have high edition development cost, so the cost of the positioning holographic gold stamping process is generally higher.
In contrast, the price of the copper plate bronzing plate is lower, and the price of equipment used for the copper plate bronzing is also lower, but the decoration effect and the anti-counterfeiting effect of the copper plate bronzing plate are obviously poorer than those of the positioning holographic bronzing foil. Therefore, the inventor thinks that how to provide a gold stamping process which is low in cost and has decoration and anti-counterfeiting effects to replace a positioning holographic foil gold stamping process has important significance.
Disclosure of Invention
In order to obtain an anti-counterfeiting gold stamping process which is low in cost and has good decoration and anti-counterfeiting effects, the application provides a nano micro-engraving anti-counterfeiting gold stamping process.
A nanometer micro-carving anti-counterfeiting gold stamping process comprises the following steps:
step one, carving patterns on a copper plate gold stamping plate by adopting a laser nanometer micro-carving machine according to the patterns designed by a drawing;
secondly, sequentially plating a zinc oxide layer, a titanium oxide layer and a protective layer on the surface of the copper plate gold stamping plate with the micro-engraved patterns;
and step three, performing flat ironing treatment on the copper plate gold stamping plate, and finally performing pressing treatment on the copper plate gold stamping plate to transfer the copper plate gold stamping plate with the micro-engraved pattern to the surface of the base material.
This application carries out laser micro-carving to copper gilt version and handles in order to form the micro-carving pattern, on this basis, zinc oxide layer, titanium oxide layer and protective layer are plated in proper order on copper gilt version surface, handle the back through above-mentioned cladding material, the light color that reflects of copper gilt version surface is changed along with different incident angles and is shown corresponding specific color under the interference effect of light, not only form special various effect of dazzling, but also the third dimension of improving the micro-carving pattern effectively, consequently, the copper gilt version of this application is handled the anti-fake ability who combines the cladding material to handle the back to produce at the micro-carving and is obviously improved.
The nano micro-engraving anti-counterfeiting gold stamping process adopts a common copper plate gold stamping plate as a raw material, the equipment required by the production is low in price, the operation process is relatively simple, the existing positioning holographic foil needs to purchase special equipment for matching, the special equipment is extremely expensive and high in plate-making cost, so that the use cost of the positioning holographic foil is very high, the nano micro-engraving anti-counterfeiting gold stamping process has both decoration and anti-counterfeiting effects, and the use cost is obviously lower, the gold stamping process of the positioning holographic foil can be replaced, in addition, compared with the positioning holographic gold stamping foil with determined patterns, the graphic and text information on the copper plate gold stamping plate can be formed by nano micro-engraving according to the requirements of customers, the gold stamping process can be changed corresponding to different customer requirements, and can better meet the requirements of customers on decoration and anti-counterfeiting, so that the gold stamping process has better commercial prospect.
Preferably, the thickness of the zinc oxide layer is 0.2-0.4mm, the thickness of the titanium oxide layer is 0.1-0.2mm, and the thickness of the protective layer is 0.2-0.3 mm.
By controlling the thickness of the zinc oxide layer, the titanium oxide layer and the protective layer, the zinc oxide layer, the titanium oxide layer and the protective layer have better refraction and reflection effects after being superposed under specific thickness, and the anti-counterfeiting effect and the decorative effect of the micro-carving pattern are enhanced, so that the anti-counterfeiting effect of the copper plate bronzing plate after transfer printing is further improved.
Preferably, the protective layer is an aluminum oxide layer.
The aluminum oxide layer has better wear resistance and corrosion resistance, and not only plays a better protection effect on the zinc oxide and the titanium oxide layer as a protection layer, but also makes the interference effect on the surface of the copper plate gold stamping plate more obvious, so that the decoration effect and the anti-counterfeiting effect of the copper plate gold stamping plate are better.
Preferably, the copper plate bronzing plate is subjected to ultrasonic cleaning before the zinc oxide layer is plated.
Preferably, after the ultrasonic cleaning, argon gas is introduced until the air pressure reaches 0.1-0.3Pa under the condition that the vacuum degree is 0.005-0.01Pa, and the ion cleaning is carried out for 10-15 s.
The copper plate gold stamping plate can be subjected to ultrasonic cleaning by using deionized water, and after the cleaning is finished, the copper plate gold stamping plate is subjected to drying treatment and then subjected to ion cleaning, so that the bonding force of zinc oxide and the copper plate gold stamping plate is favorably improved, a good adhesion effect is provided for a subsequent plating layer, and the adhesion effect of the plating layer on the surface of the copper plate gold stamping plate is better.
Preferably, the zinc oxide layer, the titanium oxide layer and the protective layer are plated in sequence by a magnetron sputtering method.
Preferably, in the process of plating the zinc oxide layer, the plating temperature of the zinc oxide layer is kept at 410-420 ℃, oxygen is introduced, the air pressure is kept at 0.1-0.2Pa, the zinc target is opened, and deposition is carried out for 2-4min under the condition that the current of the zinc target is 8-10A.
Preferably, in the process of plating the titanium oxide layer, the plating temperature of the titanium oxide layer is kept at 260-280 ℃, oxygen is introduced, the air pressure is maintained at 0.1-0.3Pa, the titanium target is opened, and deposition is carried out for 5-10min under the condition that the current of the titanium target is 12-15A.
Preferably, in the process of plating the aluminum oxide layer, argon and oxygen are introduced, the air pressure is maintained to be 0.1-0.3Pa, the aluminum target is opened, the current of the aluminum target is controlled to be 15-18A, and the aluminum oxide layer is deposited for 15-20 min.
Through adopting above-mentioned plating zinc oxide layer, titanium oxide layer and aluminium oxide layer technology, the cohesion preferred between copper gilding edition surface and zinc oxide cladding material and each cladding material, above-mentioned cladding material is good and difficult for droing at copper gilding edition surperficial adhesion effect, and copper gilding edition surface presents the preferred and dazzles various effect to make the stereovision of micro-carving pattern further improve and can present specific various effect of dazzling under different incident angles, consequently the anti-fake effect of the gilding technology of this application is better.
In summary, the present application has the following beneficial effects:
1. according to the method, the copper plate bronzing version is carved through the nanometer micro-carving machine to form the specific pattern with the stereoscopic effect, then the zinc oxide layer is sequentially plated on the surface of the copper plate bronzing version, the titanium oxide layer and the protective layer enable the reflected light color on the surface of the copper plate bronzing version to be changed at different incident angles to present corresponding specific colors, a special dazzling color effect is formed, the pattern stereoscopic effect of the copper plate bronzing version is enabled to be better, the anti-counterfeiting and decoration effects of the copper plate bronzing version are better achieved, and the current positioning holographic bronzing process can be well replaced.
2. Through the thickness of control zinc oxide layer, titanium oxide layer and protective layer, the refraction and the reflection effect preferred that zinc oxide layer, titanium oxide layer and protective layer produced after the stack under specific thickness to form special various effect of dazzling, the anti-fake effect and the decorative effect reinforcing of micro-carving pattern, consequently behind the copper gilding press scalds the rendition, its decorative effect and anti-fake effect further improve.
3. The application uses the alumina layer as a protective layer, the alumina layer not only plays a better protection effect on the zinc oxide layer and the titanium oxide layer, but also makes the interference effect on the surface of the copper plate bronzing plate more obvious, so the decoration effect and the anti-counterfeiting capability of the copper plate bronzing plate are further improved.
Detailed Description
Example 1
A nanometer micro-carving anti-counterfeiting gold stamping process comprises the following steps:
step one, carving patterns on the copper plate gold stamping plate by using a laser nanometer micro-carving machine according to patterns designed by a drawing.
Step two, carrying out ultrasonic cleaning on the copper plate gold stamping plate, then introducing argon gas until the air pressure reaches 0.3Pa under the condition that the vacuum degree is 0.005Pa, carrying out ion cleaning for 15s, and then plating a zinc oxide layer, a titanium oxide layer and an aluminum oxide layer on the surface of the copper plate gold stamping plate with the micro-engraved patterns by adopting a magnetron sputtering method: introducing oxygen, maintaining the air pressure at 0.2Pa, raising the coating temperature to 410 ℃, starting a zinc target, depositing for 2min under the condition that the current of the zinc target is 8A, and closing the zinc target; then cooling to 260 ℃, introducing oxygen, maintaining the air pressure at 0.1Pa, starting the titanium target, depositing for 5min under the condition that the current of the titanium target is 15A, and closing the titanium target; introducing argon and oxygen, maintaining the air pressure at 0.1Pa, opening the aluminum target, controlling the current of the aluminum target at 15A, and depositing the aluminum oxide layer for 20 min. Wherein the thickness of the zinc oxide layer is 0.1mm, the thickness of the titanium oxide layer is 0.2mm, and the thickness of the aluminum oxide layer is 0.2 mm.
And thirdly, performing flat ironing treatment on the copper plate gold stamping plate, and finally performing pressing treatment on the copper plate gold stamping plate to transfer the copper plate gold stamping plate with the micro-engraved patterns to the surface of the base material.
Example 2
A nanometer micro-carving anti-counterfeiting gold stamping process comprises the following steps:
step one, carving patterns on the copper plate gold stamping plate by using a laser nanometer micro-carving machine according to patterns designed by a drawing.
Step two, carrying out ultrasonic cleaning on the copper plate gold stamping plate, introducing argon gas until the air pressure reaches 0.2Pa under the condition that the vacuum degree is 0.008Pa, carrying out ion cleaning for 12s, and plating a zinc oxide layer, a titanium oxide layer and an aluminum oxide layer on the surface of the copper plate gold stamping plate with the micro-engraved patterns by adopting a magnetron sputtering method: introducing oxygen, maintaining the air pressure at 0.1Pa, raising the coating temperature to 420 ℃, starting the zinc target, depositing for 4min under the condition that the zinc target current is 10A, and closing the zinc target; then cooling to 280 ℃, introducing oxygen, maintaining the air pressure at 0.3Pa, starting the titanium target, depositing for 10min under the condition that the current of the titanium target is 12A, and closing the titanium target; introducing argon and oxygen, maintaining the air pressure at 0.3Pa, opening the aluminum target, controlling the current of the aluminum target at 18A, and depositing an aluminum oxide layer for 15 min. Wherein the thickness of the zinc oxide layer is 0.2mm, the thickness of the titanium oxide layer is 0.4mm, and the thickness of the aluminum oxide layer is 0.4 mm.
And step three, performing flat ironing treatment on the copper plate gold stamping plate, and finally performing pressing treatment on the copper plate gold stamping plate to transfer the copper plate gold stamping plate with the micro-engraved pattern to the surface of the base material.
Example 3
A nanometer micro-carving anti-counterfeiting gold stamping process comprises the following steps:
step one, carving patterns on the copper plate gold stamping plate by using a laser nanometer micro-carving machine according to patterns designed by a drawing.
Step two, carrying out ultrasonic cleaning on the copper plate gold stamping plate, introducing argon gas until the air pressure reaches 0.2Pa under the condition that the vacuum degree is 0.01Pa, carrying out ion cleaning for 10s, and plating a zinc oxide layer, a titanium oxide layer and an aluminum oxide layer on the surface of the copper plate gold stamping plate with the micro-engraved patterns by adopting a magnetron sputtering method: introducing oxygen, maintaining the air pressure at 0.1Pa, raising the coating temperature to 420 ℃, starting the zinc target, depositing for 3min under the condition that the zinc target current is 10A, and closing the zinc target; then cooling to 280 ℃, introducing oxygen, maintaining the air pressure at 0.2Pa, starting the titanium target, depositing for 8min under the condition that the current of the titanium target is 13A, and closing the titanium target; introducing argon and oxygen, maintaining the air pressure at 0.2Pa, opening the aluminum target, controlling the current of the aluminum target at 16A, and depositing the aluminum oxide layer for 18 min. Wherein the thickness of the zinc oxide layer is 0.15mm, the thickness of the titanium oxide layer is 0.35mm, and the thickness of the aluminum oxide layer is 0.35 mm.
And thirdly, performing flat ironing treatment on the copper plate gold stamping plate, and finally performing pressing treatment on the copper plate gold stamping plate to transfer the copper plate gold stamping plate with the micro-engraved patterns to the surface of the base material.
Comparative example 1
The difference from example 1 is that: and (4) directly performing flat ironing and pressing in the third step after the nano micro-carving.
Comparative example 2
The difference from example 1 is that: and in the second step, only plating a zinc oxide layer and an aluminum oxide layer on the surface of the copper plate gold stamping plate with the micro-engraved patterns.
Comparative example 3
The difference from example 1 is that: and in the second step, only plating a titanium oxide layer and an aluminum oxide layer on the surface of the copper plate bronzing plate with the micro-carving patterns.
Comparative example 4
The difference from example 1 is that: and in the second step, only plating a zinc oxide layer and a titanium oxide layer on the surface of the copper plate gold stamping plate with the micro-engraved patterns.
Experiment 1
The nanometer micro-carving anti-counterfeiting gold stamping process is applied to cloth, and the bonding strength grade between coating layers of examples 1-3 and comparative examples 2-4 is tested according to GB/T28786-2012 tape pasting method for vacuum coating layer bonding strength measurement method in vacuum technology, wherein the higher the grade is, the worse the film layer bonding is.
The experimental results are as follows: the film layers of examples 1-3 had a cohesion rating of 0, comparative example 2 had a cohesion rating of 2, comparative example 3 had a cohesion rating of 4, and comparative example 4 had a cohesion rating of 0.
The above experiment results show that the zinc oxide layer, the titanium oxide layer and the aluminum oxide layer are sequentially plated on the copper plate gold stamping plate, the bonding force between the film layers is good, the film coating layer can be firmly attached to the surface of the copper plate gold stamping plate, and the good effects of improving the pattern stereo degree and the anti-counterfeiting degree are generated. Wherein comparative example 2 lacks a titanium oxide layer, comparative example 3 lacks a zinc oxide layer, and comparative examples 2 to 3 have a significantly lower bonding force grade than the respective examples, indicating that both the titanium oxide and the zinc oxide layers have a significant effect on improving the bonding force between the film layers.
Experiment 2
And observing whether the micro-carving pattern can correspondingly present different colors along with different light incidence angles.
The experimental results are as follows: the pattern effects of examples 1-3 were significant, comparative example 3 times less, comparative examples 2 and 4 were inferior, and comparative example 1 had no effect.
The above experiment results show that the pattern effect generated by sequentially plating the zinc oxide layer, the titanium oxide layer and the aluminum oxide layer on the copper plate bronzing plate in each embodiment of the invention is good, the titanium oxide layer is lacked in comparative example 2, the zinc oxide layer is lacked in comparative example 3, the aluminum oxide layer is lacked in comparative example 4, the dazzling color effect generated in comparative examples 2-4 is poorer than that generated in examples 1-3, and the effect generated by sequentially overlapping the zinc oxide, the titanium oxide and the aluminum oxide is very excellent.
The specific embodiments are only for explaining the present application and are not limiting to the present application, and those skilled in the art can make modifications to the embodiments without inventive contribution as required after reading the present specification, but all the embodiments are protected by patent law within the scope of the claims of the present application.

Claims (8)

1. A nanometer micro-carving anti-counterfeiting gold stamping process is characterized by comprising the following steps: the method comprises the following steps:
firstly, carving patterns on a copper plate gold stamping plate by using a laser nanometer micro-carving machine according to patterns designed by a drawing;
secondly, sequentially plating a zinc oxide layer, a titanium oxide layer and a protective layer on the surface of the copper plate bronzing plate with the micro-carving patterns,
performing flat ironing treatment on the copper plate gold stamping plate, and finally performing pressing treatment on the copper plate gold stamping plate;
the thickness of the zinc oxide layer is 0.2-0.4mm, the thickness of the titanium oxide layer is 0.1-0.2mm, and the thickness of the protective layer is 0.2-0.3 mm.
2. The nano micro-engraving anti-counterfeiting gold stamping process according to claim 1, characterized in that: the protective layer is an aluminum oxide layer.
3. The nano micro-engraving anti-counterfeiting gold stamping process according to claim 1, characterized in that: and the copper plate gold stamping plate is subjected to ultrasonic cleaning before the zinc oxide layer is plated.
4. The nano micro-engraving anti-counterfeiting gold stamping process according to claim 1, characterized in that: after ultrasonic cleaning, introducing argon gas under the vacuum degree of 0.005-0.01Pa until the air pressure reaches 0.1-0.3Pa, and ion cleaning for 10-15 s.
5. The nano-micro-engraving anti-counterfeiting gold stamping process according to claim 1, which is characterized in that: and sequentially plating the zinc oxide layer, the titanium oxide layer and the protective layer by adopting a magnetron sputtering method.
6. The nano-micro-engraving anti-counterfeiting gold stamping process according to claim 1, which is characterized in that: in the process of plating the zinc oxide layer, the plating temperature of the zinc oxide layer is kept at 410-420 ℃, oxygen is introduced, the air pressure is maintained at 0.1-0.2Pa, the zinc target is opened, and deposition is carried out for 2-4min under the condition that the current of the zinc target is 8-10A.
7. The nano-micro-engraving anti-counterfeiting gold stamping process according to claim 1, which is characterized in that: in the process of plating the titanium oxide layer, the plating temperature of the titanium oxide layer is kept at 260-280 ℃, oxygen is introduced, the air pressure is maintained at 0.1-0.3Pa, the titanium target is opened, and deposition is carried out for 5-10min under the condition that the current of the titanium target is 12-15A.
8. The nano micro-engraving anti-counterfeiting gold stamping process according to claim 1, characterized in that: in the process of aluminum oxide coating, argon and oxygen are introduced, the air pressure is maintained to be 0.1-0.3Pa, the aluminum target is opened, the current of the aluminum target is controlled to be 15-18A, and an aluminum oxide layer is deposited for 15-20 min.
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CN101200149B (en) * 2006-12-12 2010-05-19 比亚迪股份有限公司 Method for forming embossed hologram
CN102896927B (en) * 2012-10-19 2014-12-24 武汉虹之彩包装印刷有限公司 Novel alumite suitable for rotary gold stamping on ultraviolet (UV) glazing oil paper
CN107829067A (en) * 2017-10-27 2018-03-23 中山市汉庭照明科技有限公司 A kind of method for preparing multi-angle color-changing crystal lamp suspension member
CN207833042U (en) * 2018-02-11 2018-09-07 合肥路明反光材料有限公司 A kind of Novel light reflection film superficial layer and reflective membrane
CN113650446A (en) * 2021-07-30 2021-11-16 江苏大亚印务有限公司 Holographic effect imitating 3D micro-carving gold stamping process

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