CN113954168B - Integrated processing equipment for tinning of circuit board through hole - Google Patents
Integrated processing equipment for tinning of circuit board through hole Download PDFInfo
- Publication number
- CN113954168B CN113954168B CN202111048487.7A CN202111048487A CN113954168B CN 113954168 B CN113954168 B CN 113954168B CN 202111048487 A CN202111048487 A CN 202111048487A CN 113954168 B CN113954168 B CN 113954168B
- Authority
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- China
- Prior art keywords
- tinning
- column
- tin
- fixedly connected
- vertical
- Prior art date
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 56
- 238000006243 chemical reaction Methods 0.000 claims abstract description 16
- 238000005553 drilling Methods 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 32
- 238000007747 plating Methods 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 238000005476 soldering Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 6
- 230000001680 brushing effect Effects 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000001465 metallisation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/02—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area using chambers or hoods covering the area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/02—Means for holding or positioning work with clamping means
- B26D7/025—Means for holding or positioning work with clamping means acting upon planar surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Forests & Forestry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses integrated processing equipment for tinning of a circuit board through hole, which comprises a processing table, wherein two supporting seats are arranged on the processing table in an opposite mode, a conversion table is connected with one side of the processing table through a horizontal air cylinder, a drilling device and a tinning chamber are arranged at the bottom of the conversion table, a central control cavity is formed in the tinning chamber, a vertical air cylinder is arranged on the conversion table, the vertical air cylinder is connected with an abutting inner plate positioned in the central control cavity through an up-down moving component, the abutting inner plate is connected with a tinning column through a rotating component, a hollow channel is formed in the tinning column, a guide post is arranged in the hollow channel, a plurality of guide rings for conducting tin bars are arranged on the outer side wall of the guide post, and a tin feeding device for conveying the tin bars is arranged at the top of the guide post. The invention integrates the functions of drilling, cleaning and tinning the circuit boards, can rapidly and effectively realize the tinning of the through holes on a plurality of circuit boards, can ensure the consistency of the tinning effect of the through holes, reduces the working procedures and can obviously improve the production efficiency.
Description
Technical Field
The invention relates to the technical field of circuit board through hole processing, in particular to integrated processing equipment for circuit board through hole tinning.
Background
At present, the printed circuit board is widely applied to various fields in the industry, and the printed circuit board is used in various electronic products which can be seen at home, such as small electronic calculators, mobile phones, fax machines, printers and various medium-sized and large-sized devices;
via tin plating is used to metallize circuit board holes, which means a process of drilling through holes on two or more layers of printed boards, plating a layer of conductive metal on the wall of an insulating hole in the holes by using chemical plating and electroplating methods to ensure that the conductive metal is communicated with each other.
The existing mode is mainly in order to pre-punch the circuit board, and tin plating is carried out one by one in the position with the trompil to realize to the through-hole metallization, this kind of mode processing is slow, and need clear up the waste material when the through-hole is bored before carrying out the tin plating, ensures the firm when soldering tin, this certainly makes the processing slower, and this now proposes an integrated processing equipment for circuit board through-hole tin plating, and it can realize going on in step to circuit board drilling, clearance, tin plating, effectively improves the process rate.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides integrated processing equipment for tinning a through hole of a circuit board.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the utility model provides an integration processing equipment for circuit board through-hole tinning, includes the processing platform, be provided with two supporting seats that set up relatively on the processing platform, two be provided with positioner on the supporting seat, the conversion platform that processing platform one side is connected through horizontal cylinder, the conversion platform bottom is provided with drilling equipment and tinning room, the cavity has been seted up in the tinning room, be provided with vertical cylinder on the conversion platform, vertical cylinder is connected with the conflict inner panel that is located the cavity through reciprocate the subassembly, the conflict inner panel is connected with the tinning post through rotating the subassembly, the cavity passageway has been seted up in the tinning post, be provided with the guide pillar in the cavity passageway, the guide pillar lateral wall is provided with a plurality of guide rings that are used for conducting the tinning strip, the conduction post top is provided with the continuous tin device of carrying the tinning strip, evenly be provided with a plurality of tinning subassemblies and scrubbing subassembly on the tinning post.
Preferably, the positioning device comprises a plurality of support gaskets fixedly connected to opposite side walls of the support seat, a rectangular cavity is formed in the support seat, a clamping opening communicated with the rectangular cavity is formed in the side wall of the support seat between the adjacent support gaskets, a triangular abutting plate and a triangular moving plate are arranged in the rectangular cavity, and a clamping block penetrating through the clamping opening is fixedly connected to the side wall of the triangular abutting plate.
Preferably, the up-and-down moving assembly comprises a connecting disc fixedly connected to the end part of the output end of the vertical cylinder, the bottom of the connecting disc is connected with the abutting inner plate through a vertical column penetrating into the hollow cavity, and the connecting disc is connected with the upper surface of the tinning chamber through an abutting spring sleeved on the outer side wall of the vertical column.
Preferably, the rotating assembly comprises a rotating spur gear which is arranged in the tin plating chamber and controlled by an electric motor, the top end of the tin plating column penetrates into the hollow cavity, and is fixedly connected with a lower transmission gear, the top in the hollow channel is rotationally connected with a transmission column, the top of the transmission column is fixedly connected with an upper transmission gear, and the top of the upper transmission gear is rotationally connected with an abutting inner plate through a rotating ring.
Preferably, the tinning assembly comprises a flexible silica gel ring fixedly connected to the outer side wall of the tinning column, a tin storage tray connected with the tinning column is arranged at the bottom of the flexible silica gel ring, an electric soldering ring is fixedly connected to the top of the flexible silica gel ring, and a tin conveying hole penetrating into the hollow channel is formed in the electric soldering ring.
Preferably, the brushing assembly comprises a rubber ring arranged on the outer side wall of the tinning column, a brush layer is densely arranged on the outer wall of the rubber ring, air outlet holes are formed in the tinning column above the rubber ring, a gas collecting cover is mounted on the top of the tinning chamber through threads, and a gas collecting fan is arranged on the gas collecting cover.
Preferably, the tin-feeding device comprises a screw rod column fixedly connected with the bottom of the transmission column, the bottom of the screw rod column is rotationally connected with the top of the transmission column, a nut cylinder is in threaded connection with the outer side wall of the screw rod column, a guide pillar is arranged at the bottom of the nut cylinder, and an arc-shaped inner collision block is fixedly connected with the outer side wall of the nut cylinder;
a plurality of vertical grooves are formed in the inner wall of the hollow channel, the inner wall of the vertical groove is fixedly connected with a vertical guide pillar, an arc-shaped outer abutting block is sleeved on the vertical guide pillar, and the arc-shaped outer abutting block is connected with the inner wall of the vertical groove through a return spring sleeved on the outer side wall of the vertical guide pillar.
Preferably, a plurality of mounting openings are formed in the top of the tin plating chamber, and a plurality of winding cylinders used for winding tin bars are arranged in the mounting openings.
Compared with the prior art, the invention has the beneficial effects that:
the device integrates drilling, cleaning and tinning of the circuit boards, can be used for fast and effectively realizing the tinning of the through holes on a plurality of circuit boards, can ensure the consistency of the tinning effect of the through holes, can obviously improve the production efficiency while reducing the working procedures, and is suitable for fully-automatic processing of the circuit boards.
Drawings
Fig. 1 is a schematic structural view of an integrated processing device for tin plating of a through hole of a circuit board according to the present invention;
FIG. 2 is an enlarged schematic view of the structure shown at A in FIG. 1;
FIG. 3 is an enlarged schematic view of the structure at B in FIG. 1;
FIG. 4 is an enlarged schematic view of FIG. 1 at C;
fig. 5 is a schematic diagram of a front view structure of an integrated processing device for tin plating of a through hole of a circuit board according to the present invention;
fig. 6 is a schematic structural view of a positioning device in an integrated processing device for tinning a through hole of a circuit board according to the present invention.
In the figure: 1 processing table, 2 supporting seats, 3 conversion table, 4 drilling equipment, 5 tin plating room, 6 cavity, 7 vertical cylinder, 8 conflict inner panel, 9 tin plating post, 10 pass guide pillar, 11 cavity passageway, 12 guide ring, 13 supporting pad, 14 triangle conflict board, 15 triangle movable plate, 16 grip block, 17 connection pad, 18 vertical post, 19 rotatory straight gear, 20 lower drive gear, 21 drive post, 22 upper drive gear, 23 rotation ring, 24 flexible silica gel ring, 25 hold tin dish, 26 electric cautery ring, 27 tin delivery hole, 28 rubber ring, 29 venthole, 30 gas collecting hood, 31 lead screw post, 32 nut section of thick bamboo, 33 arc internal conflict piece, 34 vertical guide pillar, 35 arc external conflict piece, 36 receipts reel.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present invention are included in the protection scope of the present invention.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Referring to fig. 1-6, an integrated processing device for tinning of a circuit board through hole comprises a processing table 1, two supporting seats 2 which are oppositely arranged are arranged on the processing table 1, positioning devices are arranged on the two supporting seats 2, further, the positioning devices comprise a plurality of supporting gaskets 13 which are fixedly connected to opposite side walls of the supporting seats 2, rectangular cavities are formed in the supporting seats 2, clamping openings which are communicated with the rectangular cavities are formed in the side walls of the supporting seats 2 and are positioned between the adjacent supporting gaskets 13, triangular abutting plates 14 and triangular moving plates 15 are arranged in the rectangular cavities, the triangular abutting plates 14 and the triangular moving plates 15 are obliquely arranged relative to the inner side walls, so that when the triangular moving plates 15 move, the triangular abutting plates 14 can be driven to horizontally move, the side walls of the triangular abutting plates 14 are fixedly connected with clamping blocks 16 which penetrate through the clamping openings, and the clamping blocks 16 realize effective clamping of the circuit board positioned at the supporting gaskets 13, and realize the positioning effect.
The conversion platform 3 that processing platform 1 one side was connected through horizontal cylinder, conversion platform 3 bottom is provided with drilling equipment 4 and tinning room 5, wherein tinning room 5 both sides all are provided with the location guide pillar that is used for carrying out the location, cavity 6 has been seted up in the tinning room 5, be provided with vertical cylinder 7 on the conversion platform 3, vertical cylinder 7 is connected with the conflict inner panel 8 that is located cavity 6 through the component that reciprocates, further, the component that reciprocates includes fixed connection at the connection pad 17 of vertical cylinder 7 output tip, the connection pad 17 bottom is connected with conflict inner panel 8 through running through to the vertical post 18 in the cavity 6, the connection pad 17 is established the conflict spring on the lateral wall of vertical post 18 through the cover and is connected with tinning room 5 upper surface.
The tin plating column 9 is connected to the inner abutting plate 8 through a rotating component, further, the rotating component comprises a rotary spur gear 19 which is arranged in the tin plating chamber 5 and controlled by an electric motor, the electric motor independently controls the rotary spur gear 19 to rotate, the top end of the tin plating column 9 penetrates into the hollow cavity 6 and is fixedly connected with a lower transmission gear 20, the top of the hollow channel 11 is rotationally connected with a transmission column 21, the top of the transmission column 21 is fixedly connected with an upper transmission gear 22, the top of the upper transmission gear 22 is rotationally connected with the inner abutting plate 8 through a rotating ring 23, and when the inner abutting plate 8 moves downwards, the tin plating column 9 can be driven to move, and the lower transmission gear 20 connected with the tin plating column 9 is just meshed with the rotary spur gear 19 under the action of the non-stress of the inner abutting plate 8.
The tin plating column 9 is internally provided with a hollow channel 11, a transmission column 10 is arranged in the hollow channel 11, the outer side wall of the transmission column 10 is provided with a plurality of guide rings 12 for transmitting tin bars, the top of the transmission column 10 is provided with a tin feeding device for conveying the tin bars, the tin feeding device can downwards drive the tin bars to move downwards for continuous supplement, and further, the tin feeding device comprises a screw rod column 31 fixedly connected with the bottom of the transmission column 21, the bottom of the screw rod column 31 is rotationally connected with the top of the transmission column 21, the outer side wall of the screw rod column 31 is in threaded connection with a nut cylinder 32, the bottom of the nut cylinder 32 is provided with a guide column, and the outer side wall of the nut cylinder 32 is fixedly connected with an arc inner collision block 33;
a plurality of vertical grooves are formed in the inner wall of the hollow channel 11, a vertical guide pillar 34 is fixedly connected to the inner wall of the vertical groove, an arc-shaped outer abutting block 35 is sleeved on the vertical guide pillar 34, the arc-shaped outer abutting block 35 is connected with the inner wall of the vertical groove through a return spring sleeved on the outer side wall of the vertical guide pillar 34, a plurality of mounting openings are formed in the top of the tinning chamber 5, a plurality of winding drums 36 used for winding tin bars are arranged in the mounting openings, replacement of the winding drums 36 can be achieved, and connection can be achieved through clamping connection.
A plurality of tinning components and brushing components are uniformly arranged on the tinning column 9; further, the tinning component comprises a flexible silica gel ring 24 fixedly connected to the outer side wall of the tinning column 9, a tin storage tray 25 connected with the tinning column 9 is arranged at the bottom of the flexible silica gel ring 24, an electric soldering ring 26 is fixedly connected to the top of the flexible silica gel ring 24, and a tin conveying hole 27 penetrating into the hollow channel 11 is formed in the electric soldering ring 26; the flexible silica gel ring 24 and the tin storage disk 25 are made of heat-resistant silica gel materials, have larger deformation, can be separated after soldering tin, further, the brushing assembly comprises a rubber ring 28 arranged on the outer side wall of the tin plating column 9, brush layers are densely distributed on the outer wall of the rubber ring 28, air outlet holes 29 are formed in the tin plating column 9 above the rubber ring 28, a gas collecting cover 30 is arranged on the top thread of the tin plating chamber 5, a gas collecting fan is arranged on the gas collecting cover 30, wind power can be generated by the gas collecting cover 30 to be conveyed through the hollow channel 11 and discharged from the air outlet holes 29, and cleaning of a through hole of a circuit board is achieved.
When the circuit board clamping device is used, the circuit boards are placed on the support gaskets 13 on the two sides of the support seat 2 layer by layer, so that the circuit boards are stacked together, at the moment, the side walls of the triangular moving plate 15 are pressed against the triangular abutting plate 14 to move by pressing the triangular moving plate 15, the clamping blocks 16 arranged on the triangular abutting plate 14 can move outwards, and the side walls of the circuit boards on the support gaskets 13 are effectively clamped to realize positioning, clamping and fixing of the circuit boards;
through setting up the conversion platform 3 that the horizontal cylinder is connected, make the drilling equipment 4 that sets up on conversion platform 3 move to the circuit board directly over, realize the drilling to the circuit board through drilling equipment 4, realize unifying the drilling to a plurality of circuit boards through the drilling equipment, after finishing drilling, control tinning room 5 to move to the circuit board directly over through the horizontal cylinder, make the vertical cylinder 7 that sets up in tinning room 5 top move down, the tinning room 5 that is connected through the connection pad 17 with vertical cylinder 7 will move down, a plurality of tinning posts 9 that set up on tinning room 5 will insert in the through-hole on the circuit board, the flexible silica gel ring 24 of the flexible material of silica gel on tinning post 9 will produce the deformation when passing through the through-hole, thus get into the circuit board one by one;
when the tinning chamber 5 cannot move downwards due to the blocking of positioning guide posts on two sides, the rubber ring 28 arranged on the tinning column 9 is just positioned at a through hole of a circuit board, and at the moment, the lower transmission gear 20 connected with the tinning column 9 is just meshed with the rotary spur gear 19, so that the tinning column 9 is driven to rotate through the rotary spur gear 19, a brush layer on the rubber ring 28 can clean the through hole, and a gas collecting fan arranged on a gas collecting cover 30 in the tinning chamber 5 can act while cleaning, so that wind power is generated and discharged from a gas outlet hole 29 through a hollow channel 11 through a channel formed on the tinning column 9, and the cleaning of the through hole of the circuit board is realized;
after the cleaning is finished, the vertical cylinder 7 can be controlled to continue to act, the tinning chamber 5 cannot move downwards under the action of the positioning guide post, so that the abutting spring is pressed to compress downwards, the abutting inner plate 8 moves downwards, when the abutting inner plate 8 moves downwards, the tinning column 9 connected with the inner plate through the rotating ring 23 moves downwards, the tinning column 9 moves downwards relative to the circuit board, the flexible silica gel ring 24 is positioned at the through hole, and the tin storage disc 25 is positioned below; meanwhile, the upper transmission gear 22 arranged at the top of the tin plating column 9 moves downwards to replace the original lower transmission gear 20, is meshed with the rotary spur gear 19, at the moment, the rotary spur gear 19 is controlled to drive the upper transmission gear 22 to rotate, so that a screw rod column 31 connected with the upper transmission gear through the transmission column 10 rotates, a nut cylinder 32 drives arc-shaped inner abutting blocks 33 around to move downwards, the arc-shaped inner abutting blocks 33 abut against arc-shaped outer abutting blocks 35 when moving downwards, so that soldering bars between the arc-shaped inner abutting blocks and the arc-shaped outer abutting blocks are driven to be conveyed downwards, the soldering bars are conveyed to an electric soldering ring 26 under the guiding action of a guide ring 12 on the transmission column 10 when being conveyed downwards, and are discharged outwards through a tin conveying hole 27, molten tin liquid is melted by the electric soldering ring 26 when being discharged, solidification is realized at a circuit board hole of a tin storage disc 25, and finally metallization of a circuit board hole is realized; the one-time processing of circuit board hole metallization is realized.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (1)
1. The integrated processing equipment for the through hole tinning of the circuit board comprises a processing table (1), and is characterized in that two supporting seats (2) which are oppositely arranged are arranged on the processing table (1), two supporting seats (2) are provided with positioning devices, one side of the processing table (1) is connected with a conversion table (3) through a horizontal cylinder, the bottom of the conversion table (3) is provided with a drilling device (4) and a tinning chamber (5), a hollow cavity (6) is formed in the tinning chamber (5), a vertical cylinder (7) is arranged on the conversion table (3), the vertical cylinder (7) is connected with an abutting inner plate (8) which is positioned in the hollow cavity (6) through a vertical moving component, the abutting inner plate (8) is connected with a tinning column (9) through a rotating component, a hollow channel (11) is formed in the tinning column (9), a guide post (10) is arranged in the hollow channel (11), a plurality of guide rings (12) used for conducting tin bars are arranged on the outer side wall of the conversion table (3), and a plurality of tin brushing and conveying devices are arranged on the top of the guide post (10) and the tinning column component;
the positioning device comprises a plurality of support gaskets (13) fixedly connected to opposite side walls of a support seat (2), a rectangular cavity is formed in the support seat (2), clamping ports communicated with the rectangular cavity are formed in the side walls of the support seat (2) between adjacent support gaskets (13), a triangular abutting plate (14) and a triangular moving plate (15) are arranged in the rectangular cavity, and clamping blocks (16) penetrating through the clamping ports are fixedly connected to the side walls of the triangular abutting plate (14);
the up-and-down moving assembly comprises a connecting disc (17) fixedly connected to the end part of the output end of the vertical cylinder (7), the bottom of the connecting disc (17) is connected with the abutting inner plate (8) through a vertical column (18) penetrating into the hollow cavity (6), and the connecting disc (17) is connected with the upper surface of the tinning chamber (5) through an abutting spring sleeved on the outer side wall of the vertical column (18);
the rotary assembly comprises a rotary straight gear (19) which is arranged in a tinning chamber (5) and controlled by an electric motor, the top end of a tinning column (9) penetrates into a hollow cavity (6) and is fixedly connected with a lower transmission gear (20), the top part in a hollow channel (11) is rotationally connected with a transmission column (21), the top part of the transmission column (21) is fixedly connected with an upper transmission gear (22), and the top part of the upper transmission gear (22) is rotationally connected with an abutting inner plate (8) through a rotary ring (23);
the tin plating assembly comprises a flexible silica gel ring (24) fixedly connected to the outer side wall of a tin plating column (9), a tin storage disc (25) connected with the tin plating column (9) is arranged at the bottom of the flexible silica gel ring (24), an electric soldering ring (26) is fixedly connected to the top of the flexible silica gel ring (24), and a tin conveying hole (27) penetrating into the hollow channel (11) is formed in the electric soldering ring (26);
the brushing assembly comprises a rubber ring (28) arranged on the outer side wall of a tinning column (9), a brush layer is densely arranged on the outer wall of the rubber ring (28), air outlet holes (29) are formed in the tinning column (9) above the rubber ring (28), a gas collecting cover (30) is arranged on the top thread of the tinning chamber (5), and a gas collecting fan is arranged on the gas collecting cover (30);
the tin feeding device comprises a screw rod column (31) fixedly connected with the bottom of a transmission column (21), the bottom of the screw rod column (31) is rotationally connected with the top of the transmission column (21), a nut cylinder (32) is connected with the outer side wall of the screw rod column (31) in a threaded manner, a guide pillar is arranged at the bottom of the nut cylinder (32), and an arc-shaped inner abutting block (33) is fixedly connected with the outer side wall of the nut cylinder (32);
a plurality of vertical grooves are formed in the inner wall of the hollow channel (11), a vertical guide post (34) is fixedly connected to the inner wall of the vertical groove, an arc-shaped outer abutting block (35) is sleeved on the vertical guide post (34), and the arc-shaped outer abutting block (35) is connected with the inner wall of the vertical groove through a return spring sleeved on the outer side wall of the vertical guide post (34);
a plurality of mounting openings are formed in the top of the tinning chamber (5), and a plurality of winding cylinders (36) used for winding tin bars are arranged in the mounting openings.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111048487.7A CN113954168B (en) | 2021-09-08 | 2021-09-08 | Integrated processing equipment for tinning of circuit board through hole |
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| CN202111048487.7A CN113954168B (en) | 2021-09-08 | 2021-09-08 | Integrated processing equipment for tinning of circuit board through hole |
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| CN113954168A CN113954168A (en) | 2022-01-21 |
| CN113954168B true CN113954168B (en) | 2023-11-03 |
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|---|---|---|---|---|
| FR2663807A1 (en) * | 1990-06-26 | 1991-12-27 | Philips Composants | APPARATUS AND SYSTEM FOR PUNCHING PRINTED CIRCUITS. |
| CN207491350U (en) * | 2017-12-08 | 2018-06-12 | 江西安天高新材料有限公司 | The micropore copper plating device of HDI wiring boards |
| CN208649443U (en) * | 2018-09-10 | 2019-03-26 | 江西正导精密线材有限公司 | A kind of copper wire tinning machine |
| CN212211529U (en) * | 2020-05-18 | 2020-12-22 | 先进电子（珠海）有限公司 | Circuit board heavy copper plate plates post-processing device |
| CN212713823U (en) * | 2020-06-11 | 2021-03-16 | 深圳市松柏实业发展有限公司 | Horizontal high-aspect-ratio circuit board micropore copper-plating and tin-plating equipment |
| CN113038728A (en) * | 2021-05-27 | 2021-06-25 | 四川英创力电子科技股份有限公司 | Printed circuit board via hole half-windowing processing device and processing method |
-
2021
- 2021-09-08 CN CN202111048487.7A patent/CN113954168B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2663807A1 (en) * | 1990-06-26 | 1991-12-27 | Philips Composants | APPARATUS AND SYSTEM FOR PUNCHING PRINTED CIRCUITS. |
| CN207491350U (en) * | 2017-12-08 | 2018-06-12 | 江西安天高新材料有限公司 | The micropore copper plating device of HDI wiring boards |
| CN208649443U (en) * | 2018-09-10 | 2019-03-26 | 江西正导精密线材有限公司 | A kind of copper wire tinning machine |
| CN212211529U (en) * | 2020-05-18 | 2020-12-22 | 先进电子（珠海）有限公司 | Circuit board heavy copper plate plates post-processing device |
| CN212713823U (en) * | 2020-06-11 | 2021-03-16 | 深圳市松柏实业发展有限公司 | Horizontal high-aspect-ratio circuit board micropore copper-plating and tin-plating equipment |
| CN113038728A (en) * | 2021-05-27 | 2021-06-25 | 四川英创力电子科技股份有限公司 | Printed circuit board via hole half-windowing processing device and processing method |
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| CN113954168A (en) | 2022-01-21 |
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Effective date of registration: 20231010 Address after: 518000, Building 8, 101, Hengmingzhu Science and Technology Industrial Park, Xinqiao Tongfu Industrial Zone, Gonghe Community, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN SAIFU TECHNOLOGY CO.,LTD. Address before: Guangdong Institute of science and technology, 99 Xihu Road, Nancheng District, Dongguan City, Guangdong Province, 523000 Applicant before: Zhang Qingtao |
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