CN113954168A - Integrated processing equipment for tinning through holes of circuit boards - Google Patents
Integrated processing equipment for tinning through holes of circuit boards Download PDFInfo
- Publication number
- CN113954168A CN113954168A CN202111048487.7A CN202111048487A CN113954168A CN 113954168 A CN113954168 A CN 113954168A CN 202111048487 A CN202111048487 A CN 202111048487A CN 113954168 A CN113954168 A CN 113954168A
- Authority
- CN
- China
- Prior art keywords
- tinning
- tin
- column
- circuit board
- fixedly connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000007747 plating Methods 0.000 claims abstract description 23
- 238000006243 chemical reaction Methods 0.000 claims abstract description 15
- 238000005553 drilling Methods 0.000 claims abstract description 15
- 230000005540 biological transmission Effects 0.000 claims description 34
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 238000004804 winding Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 5
- 238000000429 assembly Methods 0.000 claims description 4
- 230000000712 assembly Effects 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 3
- 238000005201 scrubbing Methods 0.000 claims description 2
- 230000010354 integration Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 238000004140 cleaning Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000005028 tinplate Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 235000000396 iron Nutrition 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000004304 visual acuity Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/02—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area using chambers or hoods covering the area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/015—Means for holding or positioning work for sheet material or piles of sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/01—Means for holding or positioning work
- B26D7/02—Means for holding or positioning work with clamping means
- B26D7/025—Means for holding or positioning work with clamping means acting upon planar surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
- C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Forests & Forestry (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses integrated processing equipment for tinning a through hole of a circuit board, which comprises a processing table, wherein two opposite supporting seats are arranged on the processing table, one side of the processing table is provided with a conversion table connected through a horizontal cylinder, the bottom of the conversion table is provided with a drilling device and a tinning chamber, a central control cavity is formed in the tinning chamber, a vertical cylinder is arranged on the conversion table, the vertical cylinder is connected with an abutting inner plate positioned in the central control cavity through an up-and-down moving assembly, the abutting inner plate is connected with a tinning column through a rotating assembly, a hollow channel is formed in the tinning column, a guide column is arranged in the hollow channel, the outer side wall of the guide column is provided with a plurality of guide rings for guiding tin bars, and the top of the guide column is provided with a tin feeding device for conveying the tin bars. The invention integrates drilling, cleaning and tinning of the circuit boards, can quickly and effectively tin-plate the through holes on a plurality of circuit boards, can ensure consistent tin-plating effect of the through holes, reduces the working procedures and can obviously improve the production efficiency.
Description
Technical Field
The invention relates to the technical field of circuit board through hole processing, in particular to integrated processing equipment for tinning a circuit board through hole.
Background
At present, printed circuit boards are widely applied in various fields in the industry, and all kinds of electronic products with the visual acuity, such as small electronic calculators, mobile phones, fax machines, printers and various medium and large-sized devices, relate to the use of the printed circuit boards;
the through hole tinning is used for metallizing holes of a circuit board, and the hole metallizing refers to a process of drilling required through holes on two or more layers of printed boards, and plating a layer of conductive metal on the insulated hole walls of the printed wires in the holes by using a chemical plating and electroplating method so as to ensure that the printed wires are mutually and reliably communicated.
The existing mode is mainly used for pre-punching the circuit board, the position of the hole is tinned one by one, through hole metallization is realized, the mode is slow in processing, waste materials in the process of drilling the through hole are required to be cleaned before tinning, firmness in the process of soldering tin is ensured, the processing is undoubtedly slower, the integrated processing equipment for tinning the through hole of the circuit board is provided, the integrated processing equipment can realize synchronous drilling, cleaning and tinning of the circuit board, and the processing speed is effectively improved.
Disclosure of Invention
The invention aims to solve the problems in the prior art, and provides integrated processing equipment for tinning a through hole of a circuit board.
In order to achieve the purpose, the invention adopts the following technical scheme:
an integrated processing device for tinning a through hole of a circuit board comprises a processing table, wherein two supporting seats which are oppositely arranged are arranged on the processing table, positioning devices are arranged on the two supporting seats, a conversion table connected with one side of the processing table through a horizontal cylinder, a drilling device and a tinning chamber are arranged at the bottom of the conversion table, a central control cavity is arranged in the tinning chamber, a vertical cylinder is arranged on the conversion table and is connected with a collision inner plate positioned in the central control cavity through an up-down moving assembly, the inner collision plate is connected with a tinned column through a rotating assembly, a hollow channel is arranged in the tinned column, a guide post is arranged in the hollow channel, a plurality of guide rings for conducting the tin bars are arranged on the outer side wall of the guide post, the top of the conduction column is provided with a tin feeding device for conveying tin bars, and the tin plating column is uniformly provided with a plurality of tin plating assemblies and a brushing assembly.
Preferably, positioner includes a plurality of support pads of fixed connection on the relative lateral wall of supporting seat, seted up the rectangular cavity in the supporting seat, be located and set up the grip slipper mouth with the rectangular cavity intercommunication on the supporting seat lateral wall between the adjacent support pad, the rectangular cavity is provided with triangle and supports touch panel and triangle movable plate, triangle supports touch panel lateral wall fixedly connected with and runs through the grip slipper of grip slipper mouth.
Preferably, it includes the connection pad of fixed connection at vertical cylinder output end tip to reciprocate the subassembly, the connection pad bottom is connected with the conflict inner panel through running through to the vertical post of well accuse intracavity, the connection pad is connected with tin-plating room upper surface through establishing the conflict spring and the tin-plating room on the vertical post lateral wall at the cover.
Preferably, the runner assembly is including setting up the rotatory spur gear through electric motor control in the tinning chamber, tinning top of the post end runs through to the central control intracavity to transmission gear under the fixedly connected with, the top rotates in the hollow channel and is connected with the transmission post, transmission gear on the transmission post top fixedly connected with, it is connected with the interior board rotation of contradicting through the swivel ring to go up transmission gear top.
Preferably, the tinning subassembly includes the flexible silica gel ring of fixed connection on the tinning post lateral wall, flexible silica gel ring bottom is provided with and holds the tin dish with the tinning post connection, flexible silica gel ring top fixedly connected with electricity irons the ring, it runs through to the defeated tin hole in the hollow channel to set up on the electricity irons the ring.
Preferably, the brushing assembly comprises a rubber ring arranged on the outer side wall of the tinned column, a brush layer is densely distributed on the outer wall of the rubber ring, an air outlet hole is formed in the tinned column above the rubber ring, a gas collecting hood is installed on the top of the tinned chamber in a threaded mode, and a gas collecting fan is arranged on the gas collecting hood.
Preferably, the tin feeding device comprises a lead screw column fixedly connected with the bottom of a transmission column, the bottom of the lead screw column is rotatably connected with the top of the transmission column, the outer side wall of the lead screw column is in threaded connection with a nut barrel, the bottom of the nut barrel is provided with a guide column, and the outer side wall of the nut barrel is fixedly connected with an arc inner contact block;
the hollow channel is characterized in that a plurality of vertical grooves are formed in the inner wall of the hollow channel, vertical guide pillars are fixedly connected to the inner wall of each vertical groove, arc-shaped outer abutting blocks are sleeved on the vertical guide pillars, and the arc-shaped outer abutting blocks are connected with the inner walls of the vertical grooves through return springs sleeved on the outer side walls of the vertical guide pillars.
Preferably, a plurality of mounting openings are formed in the top of the tin plating chamber, and a plurality of winding drums for winding tin bars are arranged in the mounting openings.
Compared with the prior art, the invention has the beneficial effects that:
this equipment collection is as an organic whole to circuit board drilling, clearance, tin-plating, can quick effectual realization to the through-hole tin-plating on a plurality of circuit boards to can guarantee that the through-hole tin-plating effect is unanimous, in the time of reducing the process, can show improvement production efficiency, be applicable to full automatic processing circuit board.
Drawings
FIG. 1 is a schematic structural diagram of an integrated processing device for tinning a through hole of a circuit board, which is provided by the invention;
FIG. 2 is an enlarged schematic view of the structure at A in FIG. 1;
FIG. 3 is an enlarged view of the structure at B in FIG. 1;
FIG. 4 is an enlarged view of the structure at C in FIG. 1;
FIG. 5 is a schematic structural view of a front view of an integrated processing device for tinning a through hole of a circuit board, which is provided by the invention;
fig. 6 is a schematic structural diagram of a positioning device in the integrated processing equipment for tinning the through hole of the circuit board, which is provided by the invention.
In the figure: 1 processing table, 2 supporting seats, 3 conversion tables, 4 drilling devices, 5 tinning chambers, 6 central control cavities, 7 vertical cylinders, 8 abutting inner plates, 9 tinning columns, 10 transmission guide columns, 11 hollow channels, 12 guide rings, 13 supporting gaskets, 14 triangular abutting plates, 15 triangular moving plates, 16 clamping blocks, 17 connecting discs, 18 vertical columns, 19 rotating straight gears, 20 lower transmission gears, 21 transmission columns, 22 upper transmission gears, 23 rotating rings, 24 flexible silica gel rings, 25 tin storage discs, 26 electric cauterizing rings, 27 tin conveying holes, 28 rubber rings, 29 air outlet holes, 30 gas collecting hoods, 31 lead screw columns, 32 nut barrels, 33 arc inner abutting blocks, 34 vertical guide columns, 35 arc outer abutting blocks and 36 winding drums.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-6, an integrated processing device for tinning a through hole of a circuit board comprises a processing table 1, wherein two opposite supporting seats 2 are arranged on the processing table 1, a positioning device is arranged on the two supporting seats 2, further, the positioning device comprises a plurality of supporting gaskets 13 fixedly connected to opposite side walls of the supporting seats 2, rectangular cavities are formed in the supporting seats 2, clamping openings communicated with the rectangular cavities are formed in the side walls of the supporting seats 2 positioned between the adjacent supporting gaskets 13, triangular contact plates 14 and triangular moving plates 15 are arranged in the rectangular cavities, the triangular contact plates 14 and the triangular moving plates 15 are obliquely arranged relative to the inner side walls, so that when the triangular moving plates 15 move, the triangular contact plates 14 are driven to horizontally move, the side walls of the triangular contact plates 14 are fixedly connected with clamping blocks 16 penetrating through the clamping openings, and the clamping blocks 16 realize effective clamping of the circuit board positioned at the supporting gaskets 13, the positioning effect is realized.
Conflict inner panel 8 is connected with tin-plated post 9 through runner assembly, furtherly, runner assembly is including setting up the rotatory straight-teeth gear 19 through electric motor control in tin-plating chamber 5, electric motor independent control is rotatory for rotatory straight-teeth gear 19 alone, tin-plated post 9 top is run through to well accuse intracavity 6 in, and transmission gear 20 under the fixedly connected with, the top rotates in hollow channel 11 and is connected with transmission post 21, transmission gear 22 on the fixedly connected with in transmission post 21 top, it is connected with conflict inner panel 8 rotation through swivel ring 23 to go up transmission gear 22 top, conflict inner panel 8 is when moving downwards, can drive tin-plated post 9 and remove, under the effect of conflict inner panel 8 not stress, lower transmission gear 20 of being connected with tin-plated post 9 just meshes with rotatory straight-teeth gear 19.
A hollow channel 11 is formed in the tin-plated column 9, a conducting column 10 is arranged in the hollow channel 11, a plurality of guide rings 12 for conducting tin bars are arranged on the outer side wall of the conducting column 10, a tin feeding device for conveying the tin bars is arranged on the top of the conducting column 10, the tin feeding device can drive the tin bars downwards to move downwards to be continuously supplemented, furthermore, the tin feeding device comprises a lead screw column 31 fixedly connected with the bottom of the conducting column 21, the bottom of the lead screw column 31 is rotatably connected with the top of the conducting column 21, a nut barrel 32 is connected to the outer side wall of the lead screw column 31 in a threaded manner, a guide column is arranged at the bottom of the nut barrel 32, and an arc-shaped inner collision block 33 is fixedly connected to the outer side wall of the nut barrel 32;
a plurality of vertical grooves have been seted up to 11 inner walls of cavity passageway, vertical inslot wall fixedly connected with vertical guide pillar 34, the cover is equipped with the outer conflict piece 35 of arc on the vertical guide pillar 34, the outer conflict piece 35 of arc is established through the cover and is established the answer spring on the 34 lateral walls of vertical guide pillar and be connected with vertical inslot wall, a plurality of installing ports have been seted up at 5 tops of tinning chamber, be provided with a plurality of winding barrels 36 that are used for twining the tin bar in the installing port, wherein 36 can realize changing winding barrels, its mode of connecting the accessible joint is realized connecting.
A plurality of tin plating assemblies and scrubbing assemblies are uniformly arranged on the tin plating column 9; further, the tin plating assembly comprises a flexible silica gel ring 24 fixedly connected to the outer side wall of the tin plating column 9, a tin storage disc 25 connected with the tin plating column 9 is arranged at the bottom of the flexible silica gel ring 24, an electrocautery ring 26 is fixedly connected to the top of the flexible silica gel ring 24, and a tin conveying hole 27 penetrating into the hollow channel 11 is formed in the electrocautery ring 26; flexible silica gel ring 24 all adopts heat-resisting silica gel material with hold tin dish 25, great deformation volume has, can also realize breaking away from after soldering tin is crossed, furtherly, scrub the subassembly including setting up the rubber ring 28 on tinned column 9 lateral wall, the rubber ring 28 outer wall is densely covered and is provided with the brush layer, venthole 29 has been seted up on the tinned column 9 that is located rubber ring 28 top, gas collecting channel 30 is installed to 5 top screw threads in tinned chamber, be provided with the gas collection fan on the gas collecting channel 30, wherein gas collecting channel 30 can realize producing wind-force and carry and discharge from venthole 29 through hollow channel 11, the realization is to the washing of circuit board through-hole.
When the circuit board clamping device is used, the circuit boards are placed on the supporting gaskets 13 on the two sides of the supporting seat 2 layer by layer, so that multiple layers of circuit boards are stacked together, at the moment, the triangular moving plate 15 is pressed, the side wall of the triangular moving plate 15 is abutted against the triangular contact plate 14 to move, the clamping block 16 arranged on the triangular contact plate 14 moves outwards, and the side wall of the circuit board on the supporting gasket 13 is effectively clamped, so that the circuit board is positioned, clamped and fixed;
the conversion table 3 is connected through the horizontal air cylinder, the drilling device 4 arranged on the conversion table 3 is enabled to move right above the circuit board, drilling processing of the circuit board is achieved through the drilling device 4, unified drilling of a plurality of circuit boards is achieved, after drilling is completed, the horizontal air cylinder is used for controlling the tinning chamber 5 to move right above the circuit board, the vertical air cylinder 7 arranged at the top of the tinning chamber 5 is enabled to move downwards, the tinning chamber 5 connected with the vertical air cylinder 7 through the connecting disc 17 can move downwards, a plurality of tinning columns 9 arranged on the tinning chamber 5 can be inserted into through holes in the circuit board, flexible silica gel rings 24 made of silica gel flexible materials and arranged on the tinning columns 9 can deform when passing through the through holes, and accordingly the flexible silica gel rings can enter the circuit board one by one;
when the tinning chamber 5 cannot move downwards due to the blocking of the positioning guide posts on the two sides, the rubber ring 28 arranged on the tinning post 9 is just positioned at the through hole of the circuit board, at the moment, the lower transmission gear 20 connected with the tinning post 9 is just meshed with the rotating straight gear 19, so that the tinning post 9 is driven to rotate through the rotating straight gear 19, the brush layer on the rubber ring 28 can clean the through hole, and the gas collection fan arranged on the gas collection hood 30 in the tinning chamber 5 can act during cleaning to generate wind power which is discharged from the gas outlet 29 through the hollow channel 11 through the channel arranged on the tinning post 9, thereby cleaning the through hole of the circuit board;
after the cleaning is finished, the vertical cylinder 7 can be controlled to continue acting, the tinning chamber 5 cannot move downwards under the action of the positioning guide pillar, so that the abutting spring is pressed to compress downwards, the abutting inner plate 8 moves downwards, and when the abutting inner plate 8 moves downwards, the tinning column 9 connected with the abutting inner plate through the rotating ring 23 moves downwards, so that the tinning column 9 moves downwards relative to the circuit board, the flexible silica gel ring 24 is positioned at the through hole, and the tin storage disc 25 is positioned below; at the same time, the upper transmission gear 22 arranged on the top of the tinned column 9 moves downwards to replace the original position of the lower transmission gear 20, is meshed with the rotating straight gear 19, at this time, the rotating straight gear 19 is controlled to drive the upper transmission gear 22 to rotate, so that the screw rod column 31 connected with the upper transmission gear through the transmission column 10 rotates, the nut barrel 32 drives the arc inner contact blocks 33 around to move downwards, the arc inner contact blocks 33 are mutually contacted with the arc outer contact blocks 35 when moving downwards, so that the solder bar between the two is driven to be conveyed downwards, and when the solder bar is conveyed downwards, the solder bar is conveyed to the electrocautery ring 26 under the guiding action of the guide ring 12 on the transmission column 10 and is discharged outwards through the solder conveying hole 27, when the circuit board is discharged, the circuit board is melted into molten tin by the electrocautery ring 26, and the molten tin is solidified at the hole of the circuit board under the left and right sides of the tin storage disc 25, so that the hole of the circuit board is metallized finally; the one-time processing of the circuit board hole metallization is realized.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The utility model provides an integration processing equipment for tinning of circuit board through-hole, includes processing platform (1), its characterized in that, be provided with two supporting seats (2) of relative setting on processing platform (1), two be provided with positioner on supporting seat (2), processing platform (1) one side is connected with conversion platform (3) through horizontal cylinder, conversion platform (3) bottom is provided with drilling equipment (4) and tin-plating room (5), well accuse chamber (6) have been seted up in tin-plating room (5), be provided with vertical cylinder (7) on conversion platform (3), vertical cylinder (7) are connected with conflict inner panel (8) that are located well accuse chamber (6) through the subassembly that reciprocates, conflict inner panel (8) are connected with tin-plating post (9) through rotating assembly, hollow passageway (11) have been seted up in tin-plating post (9), the tin bar conveying device is characterized in that a guide transmission column (10) is arranged in the hollow channel (11), a plurality of guide rings (12) used for conducting tin bars are arranged on the outer side wall of the guide transmission column (10), a tin feeding device used for conveying the tin bars is arranged at the top of the guide transmission column (10), and a plurality of tin plating assemblies and a scrubbing assembly are uniformly arranged on the tin plating column (9).
2. The integrated processing equipment for tinning of circuit board through holes of claim 1, characterized in that, the positioning device comprises a plurality of support gaskets (13) fixedly connected to opposite side walls of the support seat (2), a rectangular cavity is formed in the support seat (2), a clamping opening communicated with the rectangular cavity is formed on the side wall of the support seat (2) between the adjacent support gaskets (13), a triangular contact plate (14) and a triangular moving plate (15) are arranged in the rectangular cavity, and a clamping block (16) penetrating through the clamping opening is fixedly connected to the side wall of the triangular contact plate (14).
3. The integrated processing equipment for tinning of circuit board through holes of claim 1, characterized in that, the up-and-down moving assembly comprises a connecting disc (17) fixedly connected with the end part of the output end of the vertical cylinder (7), the bottom of the connecting disc (17) is connected with the inner abutting plate (8) through a vertical column (18) penetrating into the central control cavity (6), and the connecting disc (17) is connected with the upper surface of the tinning chamber (5) through an abutting spring sleeved on the outer side wall of the vertical column (18).
4. The integrated processing equipment for tinning of circuit board through-holes of claim 1, characterized in that, the rotating assembly includes a rotary spur gear (19) which is arranged in the tinning chamber (5) and is controlled by an electric motor, the top end of the tinning column (9) penetrates into the central control cavity (6) and is fixedly connected with a lower transmission gear (20), the top of the hollow channel (11) is rotatably connected with a transmission column (21), the top of the transmission column (21) is fixedly connected with an upper transmission gear (22), and the top of the upper transmission gear (22) is rotatably connected with an inner collision plate (8) through a rotating ring (23).
5. The integrated processing equipment for tinning of circuit board through holes according to claim 1, characterized in that the tinning component comprises a flexible silica gel ring (24) fixedly connected to the outer side wall of the tinning column (9), a tin storage disc (25) connected with the tinning column (9) is arranged at the bottom of the flexible silica gel ring (24), an electrocautery ring (26) is fixedly connected to the top of the flexible silica gel ring (24), and a tin conveying hole (27) penetrating into the hollow channel (11) is formed in the electrocautery ring (26).
6. The integrated processing equipment for tinning of circuit board through holes of claim 1, wherein the brushing assembly comprises a rubber ring (28) arranged on the outer side wall of the tinned column (9), a brush layer is densely distributed on the outer wall of the rubber ring (28), an air outlet (29) is formed in the tinned column (9) above the rubber ring (28), a gas collecting hood (30) is screwed on the top of the tinned chamber (5), and a gas collecting fan is arranged on the gas collecting hood (30).
7. The integrated processing equipment for tinning of circuit board through holes according to claim 4, characterized in that the tin feeding device comprises a lead screw column (31) fixedly connected with the bottom of a transmission column (21), the bottom of the lead screw column (31) is rotatably connected with the top of the transmission column (21), the outer side wall of the lead screw column (31) is in threaded connection with a nut barrel (32), the bottom of the nut barrel (32) is provided with a guide post, and the outer side wall of the nut barrel (32) is fixedly connected with an arc-shaped inner contact block (33);
the hollow channel (11) is characterized in that a plurality of vertical grooves are formed in the inner wall of the hollow channel (11), vertical guide pillars (34) are fixedly connected to the inner wall of each vertical groove, arc-shaped outer contact blocks (35) are sleeved on the vertical guide pillars (34), and the arc-shaped outer contact blocks (35) are connected with the inner walls of the vertical grooves through return springs sleeved on the outer side walls of the vertical guide pillars (34).
8. The integrated processing equipment for tinning of circuit board through holes as claimed in claim 1, characterized in that a plurality of mounting openings are opened at the top of the tinning chamber (5), and a plurality of winding drums (36) for winding tin bars are arranged in the mounting openings.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111048487.7A CN113954168B (en) | 2021-09-08 | 2021-09-08 | Integrated processing equipment for tinning of circuit board through hole |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111048487.7A CN113954168B (en) | 2021-09-08 | 2021-09-08 | Integrated processing equipment for tinning of circuit board through hole |
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| CN113954168A true CN113954168A (en) | 2022-01-21 |
| CN113954168B CN113954168B (en) | 2023-11-03 |
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| CN113038728A (en) * | 2021-05-27 | 2021-06-25 | 四川英创力电子科技股份有限公司 | Printed circuit board via hole half-windowing processing device and processing method |
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2021
- 2021-09-08 CN CN202111048487.7A patent/CN113954168B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| FR2663807A1 (en) * | 1990-06-26 | 1991-12-27 | Philips Composants | APPARATUS AND SYSTEM FOR PUNCHING PRINTED CIRCUITS. |
| CN207491350U (en) * | 2017-12-08 | 2018-06-12 | 江西安天高新材料有限公司 | The micropore copper plating device of HDI wiring boards |
| CN208649443U (en) * | 2018-09-10 | 2019-03-26 | 江西正导精密线材有限公司 | A kind of copper wire tinning machine |
| CN212211529U (en) * | 2020-05-18 | 2020-12-22 | 先进电子（珠海）有限公司 | Circuit board heavy copper plate plates post-processing device |
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| CN113038728A (en) * | 2021-05-27 | 2021-06-25 | 四川英创力电子科技股份有限公司 | Printed circuit board via hole half-windowing processing device and processing method |
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| CN113954168B (en) | 2023-11-03 |
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