CN212451695U - Circuit board pattern electroplating device - Google Patents

Circuit board pattern electroplating device Download PDF

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Publication number
CN212451695U
CN212451695U CN202021178958.7U CN202021178958U CN212451695U CN 212451695 U CN212451695 U CN 212451695U CN 202021178958 U CN202021178958 U CN 202021178958U CN 212451695 U CN212451695 U CN 212451695U
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CN
China
Prior art keywords
circuit board
rubber pad
sliding
box
cavity
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Active
Application number
CN202021178958.7U
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Chinese (zh)
Inventor
陈斌
卢耀普
卢振华
黄治国
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Yuehu Crystal Core Circuit Suzhou Co ltd
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Yuehu Crystal Core Circuit Suzhou Co ltd
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Priority to CN202021178958.7U priority Critical patent/CN212451695U/en
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Publication of CN212451695U publication Critical patent/CN212451695U/en
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Abstract

The utility model discloses a circuit board figure electroplating device, including the box, be equipped with the dead slot in the box, sliding connection has the limiting plate in the dead slot. The device can rotate the cover plate along the rotary ball through the circular groove by pulling the cover plate upwards, so that the U-shaped outer frame at the upper end enters the box body, and the U-shaped outer frame at the lower end after electroplating rotates to the upper end of the cover plate, so that the device can carry out electroplating operation and installation and disassembly of a circuit board at the same time, and the service time of the electroplating device is effectively saved; the device can be through the pulling sliding plate for the sliding block slides in the cavity and with the spring compression, places the circuit board between first rubber pad and second rubber pad, loosens the sliding plate, makes the spring reset drive the sliding block and slides in the cavity, and it is fixed with the circuit board to reach the first rubber pad of second rubber pad cooperation, and the surface of circuit board can carry out abundant contact with electrolyte this moment.

Description

Circuit board pattern electroplating device
Technical Field
The utility model belongs to the technical field of the circuit board, specifically be a circuit board figure electroplating device.
Background
The pattern electroplating of the circuit board is an important process in the production and manufacturing process of the circuit board, and is a process for depositing and forming a coating on a substrate by an electrolytic method, and the electroplating process can be completed by generally taking a coating metal as an anode and a PCB as a cathode and vertically immersing the coating metal and the PCB in an electroplating solution in parallel.
Current electroplating device, after the circuit board is electroplated and is accomplished, need take off the circuit board from electroplating device, place the circuit board that needs to electroplate again on electroplating device, it has longer interval time to make between the electroplating work of two circuit boards, it finishes with the installation to wait for the circuit board to dismantle, and then wasted operating time, and the production efficiency is reduced, and only fix the one end of circuit board, hardly carry out fully fixed with the circuit board, still shelter from the surface of circuit board easily, influence the normal clear of electroplating.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a circuit board figure electroplating device to solve the fixed improper problem of circuit board.
In order to achieve the above object, the utility model provides a following technical scheme: a circuit board graph electroplating device comprises a box body, wherein an empty groove is formed in the box body, the empty groove is formed in two sides of the box body, a limiting plate is connected in the empty groove in a sliding mode, the cross section area of the limiting plate is the same as that of the empty groove, the limiting plate is limited in the empty groove and can only slide up and down in the empty groove, a sliding rod is arranged at the upper end of the limiting plate and welded at the upper end of the limiting plate, the upper end of the sliding rod penetrates through the box body to be connected with a rotating ball, the rotating ball is welded at the upper end of the sliding rod, the rotating ball is rotatably connected with a cover plate through a circular groove, the cross section area of the circular groove is larger than that of the rotating ball, the sliding rod can only rotate 180 degrees in the cover plate and can only rotate through the front side of the cover plate, a water pump is arranged in the box body and, the utility model discloses a set up the box, including the box, the box is equipped with the apron, the inboard of U type frame, the inboard of U type frame that is equipped with of U type frame, the other end of pipeline is equipped with the shower nozzle, and the outside welding of shower nozzle is at the inner wall of box, the box inner wall is located in the outside of shower nozzle, be equipped with U type frame on the apron, U type frame is equipped with two, welds respectively at the upper and lower both ends of apron, the inboard of.
Preferably, be equipped with the cavity in the U type frame, the left and right sides of U type frame is located to the cavity, be equipped with the sliding block in the cavity, the sectional area of sliding block and the sectional area size of cavity are the same for the sliding block is spacing in the cavity, and the sliding block can only slide from top to bottom in the cavity.
Preferably, the one end of sliding block is equipped with the spring, and the one end welding of spring is on the sliding block, and the other end welding is at the cavity inner wall.
Preferably, the sliding plate is arranged on the outer side of the sliding block and welded between the sliding blocks on the two sides, so that the sliding plate can slide along with the sliding blocks.
Preferably, the outer side of the sliding plate is slidably connected to the inner wall of the U-shaped outer frame, and the outer side of the sliding plate is attached to the inside of the U-shaped outer frame, so that the sliding plate can slide on the inner wall of the U-shaped outer frame.
Preferably, the sliding plate is provided with a second rubber pad which is adhered to the sliding plate.
Preferably, be equipped with the circuit board between second rubber pad and the first rubber pad, the upper and lower both ends and second rubber pad and the first rubber pad of circuit board carry out the contact, and second rubber pad and first rubber pad have stronger flexibility, can take place certain deformation, can be fine protect the tip of circuit board.
Compared with the prior art, the beneficial effects of the utility model are that: 1. the device can be through upwards pulling the apron, rotate the apron through the circular slot along changeing the ball for in the U type frame of upper end entered into the box, the lower extreme U type frame after the electroplating rotated the apron upper end, made the device can carry out the electroplating operation on one side, carries out the installation and the dismantlement of circuit board on one side, the effectual live time who saves electroplating device.
2. The device can be through the pulling sliding plate for the sliding block slides in the cavity and with the spring compression, places the circuit board between first rubber pad and second rubber pad, loosens the sliding plate, makes the spring reset drive the sliding block and slides in the cavity, and it is fixed with the circuit board to reach the first rubber pad of second rubber pad cooperation, and the surface of circuit board can carry out abundant contact with electrolyte this moment.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the fixing structure of the circuit board of the present invention;
fig. 3 is a top view of the present invention.
In the figure: 1. a box body; 21. an empty groove; 22. a limiting plate; 23. a slide bar; 24. rotating the ball; 25. a circular groove; 26. a cover plate; 31. a water pump; 32. a pipeline; 33. a spray head; 41. a U-shaped outer frame; 42. a first rubber pad; 43. a cavity; 44. a slider; 45. a spring; 46. a sliding plate; 47. a second rubber pad; 5. a circuit board.
Detailed Description
Referring to fig. 1, 2 and 3, a circuit board pattern electroplating device includes a box 1, a hollow groove 21 is provided in the box 1, the hollow groove 21 is provided at two sides of the box 1, a limiting plate 22 is slidably connected in the hollow groove 21, a cross-sectional area of the limiting plate 22 is the same as that of the hollow groove 21, so that the limiting plate 22 is limited in the hollow groove 21, the limiting plate 22 can only slide up and down in the hollow groove 21, a sliding rod 23 is provided at an upper end of the limiting plate 22, the sliding rod 23 is welded at an upper end of the limiting plate 22, the upper end of the sliding rod 23 passes through the box 1 to be connected with a rotary ball 24, the rotary ball 24 is welded at the upper end of the sliding rod 23, the rotary ball 24 is rotatably connected with a cover plate 26 through a circular groove 25, the cross-sectional area of the circular groove 25 is larger than that of the rotary ball 24, and the sliding rod 23 can only rotate 180 degrees in the cover plate 26 and can only rotate through a, one end of water pump 31 is equipped with pipeline 32, pipeline 32 locates the left and right sides of water pump 31, pipeline 32 is connected with shower nozzle 33 respectively of both sides, shower nozzle 33 is to the inboard hydrojet, the other end of pipeline 32 is equipped with shower nozzle 33, the outside welding of shower nozzle 33 is at the inner wall of box 1, the inner wall of box 1 is located in the outside of shower nozzle 33, be equipped with U type frame 41 on the apron 26, U type frame 41 is equipped with two, weld respectively at the upper and lower both ends of apron 26, the inboard of U type frame 41 is equipped with first rubber pad 42, first rubber pad 42 fixed bonding is in the inboard of U type frame 41.
Referring to fig. 1 and 2, a cavity 43 is disposed in the U-shaped frame 41, the cavity 43 is disposed on the left and right sides of the U-shaped frame 41, a sliding block 44 is disposed in the cavity 43, a cross-sectional area of the sliding block 44 is the same as a cross-sectional area of the cavity 43, so that the sliding block 44 is limited in the cavity 43, and the sliding block 44 can only slide up and down in the cavity 43.
Referring to fig. 1 and 2, one end of the sliding block 44 is provided with a spring 45, one end of the spring 45 is welded on the sliding block 44, and the other end is welded on the inner wall of the cavity 43.
Referring to fig. 1 and 2, a sliding plate 46 is disposed outside the sliding block 44, and the sliding plate 46 is welded between the sliding blocks 44, so that the sliding plate 46 can slide along with the sliding blocks 44.
Referring to fig. 1 and 2, the outer side of the sliding plate 46 is slidably connected to the inner wall of the U-shaped frame 41, and the outer side of the sliding plate 46 is attached to the inside of the U-shaped frame 41, so that the sliding plate 46 can slide on the inner wall of the U-shaped frame 41.
Referring to fig. 1 and 2, a second rubber pad 47 is disposed on the sliding plate 46, and the second rubber pad 47 is adhered to the sliding plate 46.
Referring to fig. 1 and 2, a circuit board 5 is disposed between the second rubber pad 47 and the first rubber pad 42, the upper and lower ends of the circuit board 5 are in contact with the second rubber pad 47 and the first rubber pad 42, and the second rubber pad 47 and the first rubber pad 42 have high flexibility and can deform to a certain extent, so as to protect the end of the circuit board 5 well.
The working principle of the scheme is as follows: when the circuit board limiting device is used, firstly, the sliding plate 46 of the upper U-shaped outer frame 41 is pulled upwards, the sliding block 44 slides in the cavity 43 and simultaneously compresses the spring 45, the circuit board 5 is placed between the second rubber pad 47 and the first rubber pad 42, then the sliding plate 46 is loosened, the spring 45 is reset, the sliding block 44 slides in the cavity 43 and simultaneously drives the second rubber pad 47 on the sliding plate 46 to move downwards until the second rubber pad 47 is matched with the first rubber pad 42 to fix the position of the circuit board 5, so that the outer surfaces on two sides of the circuit board 5 are not shielded, the cover plate 26 is pulled upwards, the limiting plate 22 slides in the hollow groove 21 until the limiting plate 22 reaches the uppermost end of the hollow groove 21, at the moment, the cover plate 26 is rotated, the circular groove 25 in the cover plate 26 rotates 180 degrees along the rotating ball 24, then the cover plate 26 is pushed downwards, so that the limiting plate 22 slides downwards in the hollow, until the U-shaped frame 41 of upper end is put into the box 1, at this moment, turn on the water pump 31, the water pump 31 introduces the electrolyte in the box 1 through the pipeline 32, spout to the circuit board 5 from the shower nozzle 33, realize the electroplating operation, after the electroplating operation, pull the apron 26 upwards, make the limiting plate 22 slide in the dead slot 21, until the limiting plate 22 reaches the topmost end of dead slot 21, at this moment rotate the apron 26, make the circular slot 25 in the apron 26 rotate 180 degrees along the ball 24 reversal, push the apron 26 downwards again, make the limiting plate 22 slide in the dead slot 21, until the U-shaped frame 41 of upper end at this moment is put into the box 1, take out the circuit board 5 that is electroplated, repeat the above-mentioned operation and change over new circuit board 5.

Claims (7)

1. The utility model provides a circuit board figure electroplating device, includes box (1), its characterized in that: be equipped with dead slot (21) in box (1), sliding connection has limiting plate (22) in dead slot (21), the upper end of limiting plate (22) is equipped with slide bar (23), the upper end of slide bar (23) is passed box (1) and is connected with commentaries on classics ball (24), it is connected with apron (26) to change ball (24) through round slot (25) rotation, be equipped with water pump (31) in box (1), the one end of water pump (31) is equipped with pipeline (32), the other end of pipeline (32) is equipped with shower nozzle (33), box (1) inner wall is located in the outside of shower nozzle (33), be equipped with U type frame (41) on apron (26), the inboard of U type frame (41) is equipped with first rubber pad (42).
2. A circuit board pattern plating apparatus according to claim 1, wherein: a cavity (43) is arranged in the U-shaped outer frame (41), and a sliding block (44) is arranged in the cavity (43).
3. A circuit board pattern plating apparatus according to claim 2, characterized in that: and one end of the sliding block (44) is provided with a spring (45).
4. A circuit board pattern plating apparatus according to claim 2, characterized in that: and a sliding plate (46) is arranged on the outer side of the sliding block (44).
5. A circuit board pattern plating apparatus according to claim 4, wherein: the outer side of the sliding plate (46) is connected with the inner wall of the U-shaped outer frame (41) in a sliding mode.
6. A circuit board pattern plating apparatus according to claim 4, wherein: and a second rubber pad (47) is arranged on the sliding plate (46).
7. A circuit board pattern plating apparatus according to claim 6, wherein: a circuit board (5) is arranged between the second rubber pad (47) and the first rubber pad (42).
CN202021178958.7U 2020-06-23 2020-06-23 Circuit board pattern electroplating device Active CN212451695U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021178958.7U CN212451695U (en) 2020-06-23 2020-06-23 Circuit board pattern electroplating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021178958.7U CN212451695U (en) 2020-06-23 2020-06-23 Circuit board pattern electroplating device

Publications (1)

Publication Number Publication Date
CN212451695U true CN212451695U (en) 2021-02-02

Family

ID=74462266

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021178958.7U Active CN212451695U (en) 2020-06-23 2020-06-23 Circuit board pattern electroplating device

Country Status (1)

Country Link
CN (1) CN212451695U (en)

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