CN113950871B - 印刷布线板及其制造方法 - Google Patents

印刷布线板及其制造方法 Download PDF

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Publication number
CN113950871B
CN113950871B CN201980097406.7A CN201980097406A CN113950871B CN 113950871 B CN113950871 B CN 113950871B CN 201980097406 A CN201980097406 A CN 201980097406A CN 113950871 B CN113950871 B CN 113950871B
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CN
China
Prior art keywords
seed layer
plane
ray diffraction
less
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201980097406.7A
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English (en)
Chinese (zh)
Other versions
CN113950871A (zh
Inventor
池边茉纪
新田耕司
酒井将一郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to CN202411301881.0A priority Critical patent/CN119155893A/zh
Publication of CN113950871A publication Critical patent/CN113950871A/zh
Application granted granted Critical
Publication of CN113950871B publication Critical patent/CN113950871B/zh
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CN201980097406.7A 2019-07-04 2019-07-04 印刷布线板及其制造方法 Active CN113950871B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202411301881.0A CN119155893A (zh) 2019-07-04 2019-07-04 印刷布线板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/026702 WO2021002009A1 (ja) 2019-07-04 2019-07-04 プリント配線板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202411301881.0A Division CN119155893A (zh) 2019-07-04 2019-07-04 印刷布线板及其制造方法

Publications (2)

Publication Number Publication Date
CN113950871A CN113950871A (zh) 2022-01-18
CN113950871B true CN113950871B (zh) 2024-10-11

Family

ID=74101213

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201980097406.7A Active CN113950871B (zh) 2019-07-04 2019-07-04 印刷布线板及其制造方法
CN202411301881.0A Pending CN119155893A (zh) 2019-07-04 2019-07-04 印刷布线板及其制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202411301881.0A Pending CN119155893A (zh) 2019-07-04 2019-07-04 印刷布线板及其制造方法

Country Status (4)

Country Link
US (1) US11979983B2 (https=)
JP (2) JP7283544B2 (https=)
CN (2) CN113950871B (https=)
WO (1) WO2021002009A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12016130B2 (en) * 2021-05-26 2024-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
TWI862200B (zh) * 2023-10-03 2024-11-11 瑞霸生技股份有限公司 多物質一次性電化學檢測方法
WO2025215836A1 (ja) * 2024-04-12 2025-10-16 住友電気工業株式会社 プリント配線板用基板およびプリント配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171423A (ja) * 2010-02-17 2011-09-01 Sumitomo Electric Ind Ltd フレキシブルプリント配線板の製造方法
JP2012169597A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3563730B2 (ja) 2002-06-07 2004-09-08 松下電器産業株式会社 フレキシブルプリント回路基板
JP2007182623A (ja) * 2005-12-08 2007-07-19 Mitsui Mining & Smelting Co Ltd 金属薄体の製造方法
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
EP2568063A1 (en) * 2011-09-09 2013-03-13 Rohm and Haas Electronic Materials LLC Low internal stress copper electroplating method
KR101344065B1 (ko) * 2012-02-08 2013-12-24 주식회사 호진플라텍 구리 도금용액
WO2014061983A1 (ko) * 2012-10-18 2014-04-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
JP6178958B2 (ja) * 2012-12-27 2017-08-16 石原ケミカル株式会社 電気銅メッキ方法
JP6842229B2 (ja) * 2016-04-05 2021-03-17 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011171423A (ja) * 2010-02-17 2011-09-01 Sumitomo Electric Ind Ltd フレキシブルプリント配線板の製造方法
JP2012169597A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法

Also Published As

Publication number Publication date
JP2023103401A (ja) 2023-07-26
CN119155893A (zh) 2024-12-17
US11979983B2 (en) 2024-05-07
US20220232699A1 (en) 2022-07-21
WO2021002009A1 (ja) 2021-01-07
JP7597147B2 (ja) 2024-12-10
CN113950871A (zh) 2022-01-18
JP7283544B2 (ja) 2023-05-30
JPWO2021002009A1 (https=) 2021-01-07

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