JPWO2021002009A1 - - Google Patents

Info

Publication number
JPWO2021002009A1
JPWO2021002009A1 JP2021529671A JP2021529671A JPWO2021002009A1 JP WO2021002009 A1 JPWO2021002009 A1 JP WO2021002009A1 JP 2021529671 A JP2021529671 A JP 2021529671A JP 2021529671 A JP2021529671 A JP 2021529671A JP WO2021002009 A1 JPWO2021002009 A1 JP WO2021002009A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021529671A
Other languages
Japanese (ja)
Other versions
JP7283544B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021002009A1 publication Critical patent/JPWO2021002009A1/ja
Priority to JP2023081481A priority Critical patent/JP7597147B2/ja
Application granted granted Critical
Publication of JP7283544B2 publication Critical patent/JP7283544B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2021529671A 2019-07-04 2019-07-04 プリント配線板及びその製造方法 Active JP7283544B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023081481A JP7597147B2 (ja) 2019-07-04 2023-05-17 プリント配線板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/026702 WO2021002009A1 (ja) 2019-07-04 2019-07-04 プリント配線板及びその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023081481A Division JP7597147B2 (ja) 2019-07-04 2023-05-17 プリント配線板及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021002009A1 true JPWO2021002009A1 (https=) 2021-01-07
JP7283544B2 JP7283544B2 (ja) 2023-05-30

Family

ID=74101213

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021529671A Active JP7283544B2 (ja) 2019-07-04 2019-07-04 プリント配線板及びその製造方法
JP2023081481A Active JP7597147B2 (ja) 2019-07-04 2023-05-17 プリント配線板及びその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023081481A Active JP7597147B2 (ja) 2019-07-04 2023-05-17 プリント配線板及びその製造方法

Country Status (4)

Country Link
US (1) US11979983B2 (https=)
JP (2) JP7283544B2 (https=)
CN (2) CN113950871B (https=)
WO (1) WO2021002009A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12016130B2 (en) * 2021-05-26 2024-06-18 Samsung Electro-Mechanics Co., Ltd. Method of manufacturing printed circuit board
TWI862200B (zh) * 2023-10-03 2024-11-11 瑞霸生技股份有限公司 多物質一次性電化學檢測方法
WO2025215836A1 (ja) * 2024-04-12 2025-10-16 住友電気工業株式会社 プリント配線板用基板およびプリント配線板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007182623A (ja) * 2005-12-08 2007-07-19 Mitsui Mining & Smelting Co Ltd 金属薄体の製造方法
JP2011171423A (ja) * 2010-02-17 2011-09-01 Sumitomo Electric Ind Ltd フレキシブルプリント配線板の製造方法
JP2012169597A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法
JP2013060660A (ja) * 2011-09-09 2013-04-04 Rohm & Haas Electronic Materials Llc 低内部応力銅電気めっき方法
JP2014125679A (ja) * 2012-12-27 2014-07-07 Ishihara Chemical Co Ltd 電気銅メッキ浴

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3563730B2 (ja) 2002-06-07 2004-09-08 松下電器産業株式会社 フレキシブルプリント回路基板
TW201037105A (en) * 2009-03-23 2010-10-16 Nippon Mining Co Double layered flexible board, and copper electrolytic liquid for making the same
JP5654416B2 (ja) * 2011-06-07 2015-01-14 Jx日鉱日石金属株式会社 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔
KR101344065B1 (ko) * 2012-02-08 2013-12-24 주식회사 호진플라텍 구리 도금용액
WO2014061983A1 (ko) * 2012-10-18 2014-04-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
JP6842229B2 (ja) * 2016-04-05 2021-03-17 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007182623A (ja) * 2005-12-08 2007-07-19 Mitsui Mining & Smelting Co Ltd 金属薄体の製造方法
JP2011171423A (ja) * 2010-02-17 2011-09-01 Sumitomo Electric Ind Ltd フレキシブルプリント配線板の製造方法
JP2012169597A (ja) * 2011-01-26 2012-09-06 Sumitomo Bakelite Co Ltd プリント配線板およびプリント配線板の製造方法
JP2013060660A (ja) * 2011-09-09 2013-04-04 Rohm & Haas Electronic Materials Llc 低内部応力銅電気めっき方法
JP2014125679A (ja) * 2012-12-27 2014-07-07 Ishihara Chemical Co Ltd 電気銅メッキ浴

Also Published As

Publication number Publication date
JP2023103401A (ja) 2023-07-26
CN119155893A (zh) 2024-12-17
US11979983B2 (en) 2024-05-07
US20220232699A1 (en) 2022-07-21
WO2021002009A1 (ja) 2021-01-07
JP7597147B2 (ja) 2024-12-10
CN113950871A (zh) 2022-01-18
JP7283544B2 (ja) 2023-05-30
CN113950871B (zh) 2024-10-11

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