CN113948413A - Single-chip rotary cleaning equipment real-time self-checking method, periodic self-checking method and single-chip rotary cleaning equipment - Google Patents

Single-chip rotary cleaning equipment real-time self-checking method, periodic self-checking method and single-chip rotary cleaning equipment Download PDF

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CN113948413A
CN113948413A CN202111178794.7A CN202111178794A CN113948413A CN 113948413 A CN113948413 A CN 113948413A CN 202111178794 A CN202111178794 A CN 202111178794A CN 113948413 A CN113948413 A CN 113948413A
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substrate
rotating
calibration substrate
cleaning
rotary
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史蒂文·贺·汪
刘立安
王亦天
吴仪
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Xinyang Guimi Shanghai Semiconductor Technology Co ltd
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Xinyang Guimi Shanghai Semiconductor Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
    • G01P3/36—Devices characterised by the use of optical means, e.g. using infrared, visible, or ultraviolet light
    • G01P3/38—Devices characterised by the use of optical means, e.g. using infrared, visible, or ultraviolet light using photographic means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

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Abstract

The invention discloses a single-chip rotary cleaning device, a real-time self-checking method and a periodic self-checking method thereof, wherein the single-chip rotary cleaning device is used for cleaning a substrate and can perform real-time self-checking and periodic self-checking and comprises a mechanical clamp, a rotating mechanism and an optical image sensor, wherein the rotating mechanism is provided with a rotary carrying platform, the single-chip rotary cleaning device also comprises an analysis mechanism, the optical image sensor can observe the edge jumping condition of the substrate in the rotating process, and the analysis mechanism can determine whether the device has faults or not by analyzing jumping values. The optical image light sensor can observe the image condition in the rotation process of the calibration substrate, and the analysis mechanism can determine whether the equipment has faults or not by analyzing the image. The single-chip rotary cleaning equipment real-time self-checking method and the periodic self-checking method can avoid the occurrence of accidents, find out mechanical deviation generated by the rotating mechanism in time and are beneficial to improving the safety and stability of the single-chip rotary cleaning process flow.

Description

Single-chip rotary cleaning equipment real-time self-checking method, periodic self-checking method and single-chip rotary cleaning equipment
Technical Field
The invention relates to the field of semiconductor wafer cleaning, in particular to a real-time self-inspection method and a periodic self-inspection method of single-wafer rotary cleaning equipment and the single-wafer rotary cleaning equipment.
Background
In the process of single wafer spin cleaning of a semiconductor wafer, due to the problem of mechanical precision, a certain deviation may exist between the central line of a substrate and the central line of rotation of a rotating mechanism, and particularly, the rotating mechanism may generate offset due to equipment looseness and other reasons in the long-term working process. This deviation is allowed within a certain range and does not cause any product defects. However, when the deviation exceeds the controllable range, a large imbalance is caused, and the imbalance is easy to cause flying chips and fragments due to the process requirement of high-speed rotation. In the prior art, the position of a single chip on a rotating mechanism is mostly detected and calibrated, but the detection and calibration cannot ensure the precision and the stability of the rotating mechanism.
In addition, the semiconductor wafer to be cleaned may have a certain deformation such as warpage, and when the deformation exceeds a controllable range, the cleaning and subsequent processing of the wafer may be affected.
Disclosure of Invention
In view of this, the invention discloses a single-chip rotary cleaning device real-time self-checking method, a periodic self-checking method and a single-chip rotary cleaning device, which can realize real-time detection and periodic detection of a rotary mechanism. The detection method does not need human intervention after various preset parameters, and is controlled by a computer to be carried out fully automatically.
The invention solves the technical problems by the following technical schemeTitle: a real-time self-checking method of a single-chip rotary cleaning device comprises the following steps: s10: presetting and calibrating the motion track of a mechanical clamp, so that the mechanical clamp can place the substrate on a rotating carrier in cleaning equipment, and ensuring that the central line of the substrate is superposed with the rotating central line of the rotating carrier; s20: placing a substrate to be cleaned on a rotating carrying platform through the mechanical clamp, and rotating the rotating carrying platform at a detection rate; s30: observing the image of the edge of the substrate during rotation by an optical image sensor, and recording the jitter value D of the edge of the substratei(ii) a S40: the run-out value D of the substrate edgeiWith a predetermined value D0Comparing to obtain a jitter value DiGreater than a predetermined value D0When the rotary carrying platform stops running, the cleaning equipment sends out a fault signal and a jitter value DiLess than a predetermined value D0At this time, the rotary stage rotates at a preset cleaning rate and normally starts cleaning, and the substrate is replaced with a new one after cleaning is completed and the steps S20 to S40 are repeated.
In the technical scheme, by adopting the method, the concentricity of the substrate and the rotary carrying platform can be observed in real time, the occurrence of accidents in the single-chip rotary cleaning process can be avoided, and the safety of the cleaning process flow is improved.
Preferably, an alignment substrate is additionally provided, and a specific reference line or reference point is etched on the alignment substrate, and further comprising the steps of: after the cleaning apparatus is operated for a certain period of time, or after a certain number of substrates are cleaned, step S50 is performed: placing the calibration substrate on a rotary stage via the mechanical fixture, rotating the rotary stage at a detection rate, and observing an image P presented on the calibration substrate during rotation via an optical image sensori。
In the technical scheme, by adopting the method, the precision of the rotating mechanism can be periodically detected, the stability of the cleaning process flow is favorably improved, after initial parameters are set, the follow-up periodic detection does not need manual participation, only needs manual maintenance when a fault occurs, and is favorable for improving the working efficiency.
Preferably, the method further comprises the following steps: s61:analyzing the image P by an analyzing mechanismiFrom the picture PiTo determine whether the operation of the rotary stage needs to be stopped and a fault signal is sent, and if the deviation is within the acceptable range, the calibration substrate is removed and step S20 is executed again.
In the technical scheme, by adopting the method, whether the rotating carrier deviates or not can be judged by analyzing the image generated in the rotation process of the calibration substrate, so that the detection precision can be further improved.
Preferably, the method further comprises the following steps: between S10 and S20 there is a step S11: placing the calibration substrate on a rotary stage via the mechanical fixture, rotating the rotary stage at a detection rate, and observing and recording an image P presented on the calibration substrate during an initial rotation process via an optical image sensor0(ii) a Step S62 is also included after S50: image PiAnd P0Comparison is made according to PiAnd P0And (4) judging whether the operation of the rotary carrier needs to be stopped and sending a fault signal, and if the deviation is within an acceptable range, removing the calibration substrate and executing the step S20 again.
In the technical scheme, by adopting the method, whether the rotating carrier deviates or not can be judged by comparing the rotating image of the calibration substrate in the initial stage with the rotating image of the calibration substrate in the detection process, so that the detection precision can be further improved.
Preferably, the preset value is D00.2-0.5 mm.
In the technical scheme, by adopting the method, different detection precisions can be set according to different requirements, the fault tolerance rate in the detection process can be controlled, and the detection efficiency can be improved.
Preferably, the detection rate ranges from 20 rpm to 200 rpm.
In the technical scheme, by adopting the method, the rotating speed in the detection process can be controlled in a proper range, and the detection efficiency and the detection precision are favorably balanced.
Preferably, the step S50 is performed after the operation time of the cleaning apparatus exceeds 200 hours.
Preferably, step S50 is performed after the cleaning apparatus has cleaned more than 500 substrates.
In the technical scheme, by adopting the method, different detection periods can be set according to different working conditions, and the safety and the working efficiency of the cleaning equipment are favorably balanced.
A periodic self-checking method of a single-chip rotary cleaning device comprises the following steps: presetting and calibrating the motion track of a mechanical clamp, so that the mechanical clamp can place the substrate on a rotating carrier in cleaning equipment, and ensuring that the central line of the substrate is superposed with the rotating central line of the rotating carrier; placing the substrate to be cleaned on a rotary carrying platform through the mechanical clamp to clean the substrate; setting a calibration substrate, and etching a specific reference line or a specific reference point on the calibration substrate; after the cleaning equipment runs for a period of time or a certain number of substrates are cleaned, the calibration substrate is placed on the rotating platform deck through the mechanical clamp, the rotating platform deck rotates at a detection rate, and an optical image sensor is used for observing an image P presented on the calibration substrate in the rotating processi(ii) a Analyzing the image P by an analyzing mechanismiFrom the picture PiAnd judging whether the operation of the rotary carrying platform needs to be stopped and sending a fault signal, and if the deviation is within an acceptable range, removing the calibration substrate and continuing to normally execute the cleaning work.
In the technical scheme, by adopting the method, the precision of the rotating mechanism can be periodically detected, the stability of the cleaning process flow is favorably improved, after initial parameters are set, the follow-up periodic detection does not need manual participation, only needs manual maintenance when a fault occurs, and is favorable for improving the working efficiency. Whether the rotating carrier deviates or not is judged by analyzing the image generated in the rotation process of the calibration substrate, and the detection precision is further improved.
A periodic self-checking method of a single-chip rotary cleaning device comprises the following steps: presetting and calibrating the motion track of the mechanical clamp, enabling the mechanical clamp to place the substrate on a rotary carrying platform in the cleaning equipment, and ensuring the central line of the substrateThe center line of the rotation carrier is superposed; setting a calibration substrate, and etching a specific reference line or a specific reference point on the calibration substrate; placing the calibration substrate on a rotary stage via the mechanical fixture, rotating the rotary stage at a detection rate, and observing and recording an image P presented on the calibration substrate during an initial rotation process via an optical image sensor0(ii) a Placing the substrate to be cleaned on a rotary carrying platform through the mechanical clamp to clean the substrate; after the cleaning equipment runs for a period of time or a certain number of substrates are cleaned, the calibration substrate is placed on the rotating platform deck through the mechanical clamp, the rotating platform deck rotates at a detection rate, and an optical image sensor is used for observing an image P presented on the calibration substrate in the rotating processi(ii) a Image P is analyzed by an analyzing mechanismiAnd P0Comparison is made according to PiAnd P0And comparing to judge whether the rotating carrier needs to stop running and send out a fault signal, and if the deviation is within an acceptable range, removing the calibration substrate and continuing to normally execute the cleaning work.
In the technical scheme, by adopting the method, the precision of the rotating mechanism can be periodically detected, the stability of the cleaning process flow is favorably improved, after initial parameters are set, the follow-up periodic detection does not need manual participation, only needs manual maintenance when a fault occurs, and is favorable for improving the working efficiency. Whether the rotating carrier deviates or not is judged by comparing the rotating image of the calibration substrate in the initial stage with the rotating image of the calibration substrate in the detection process, and the detection precision is further improved.
A single-chip rotary cleaning device comprises a cleaning device, a mechanical clamp, a rotating mechanism and an optical image sensor, wherein the rotating mechanism is provided with a rotating carrier, and the single-chip rotary cleaning device also comprises an analysis mechanism, so that the single-chip rotary cleaning device can implement the self-checking method.
Preferably, the single-chip spin cleaning equipment further comprises a calibration substrate with a specific reference line or reference point etched in advance, so that the single-chip spin cleaning equipment can implement the self-checking method.
On the basis of the common knowledge in the field, the above preferred conditions can be combined randomly to obtain the preferred embodiments of the invention.
The beneficial effects of the invention include: the single-chip rotary cleaning equipment, the real-time self-detection method and the periodic self-detection method can realize real-time detection and periodic detection of the rotary mechanism. The real-time self-checking can avoid the occurrence of accidents and is beneficial to improving the safety of the single-chip rotary cleaning process flow. And by adjusting the detection precision, whether the substrate has deformation conditions such as warping and the like can be judged, so that the substrate is screened to a certain extent. The mechanical deviation generated by the rotating mechanism can be found in time through periodic self-checking, and the stability of the single-chip rotary cleaning process flow is improved. The detection method does not need human intervention, is controlled by a computer to be carried out fully automatically, and is favorable for improving the detection efficiency.
Description of the drawings:
the accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, illustrate the invention, and do not constitute a limitation on the invention. In the drawings:
FIG. 1 is a schematic diagram of a real-time self-inspection method of a single-wafer spin cleaning apparatus according to the present invention;
FIG. 2 is another schematic diagram of the real-time self-inspection method of the single-wafer spin cleaning apparatus according to the present invention;
FIG. 3 is a schematic diagram of a periodic self-test method of a single-wafer spin cleaning apparatus according to the present invention;
FIG. 4 is another schematic diagram of a periodic self-test method for a single wafer spin cleaning apparatus according to the present invention;
FIG. 5 is a schematic view of a partial structure of the single-wafer spin cleaning apparatus according to the present invention;
FIG. 6A is a top view of a partial structure of a substrate and a rotating carrier when the substrate and the rotating carrier are coaxial in a single wafer spin cleaning apparatus of the present invention;
FIG. 6B is a top view of a portion of the structure of the substrate and the rotating stage of the single wafer spin cleaning apparatus of the present invention when the substrate and the rotating stage are not coaxial;
FIG. 7A is a first schematic view of a calibration substrate;
FIG. 7B is a second schematic view of the calibration substrate;
fig. 7C is a third schematic view of the calibration substrate.
The figures show that:
1-an optical image sensor;
2-a substrate;
3-rotating the carrier;
4-a rotating mechanism;
5-calibrating the substrate;
6, etching the pattern;
a-rotating the center line of the stage;
-observation range of the optical image sensor;
Di-a jitter value.
Detailed Description
The present invention will be more clearly and completely described below by way of examples, but the present invention is not limited thereto but is only limited to the scope of the examples. Based on the embodiments of the present invention, those skilled in the art can make various changes or modifications to the embodiments without departing from the principle and spirit of the present invention, and such changes and modifications all fall into the protection scope of the present invention.
Example 1
As shown in fig. 1, this embodiment is a real-time self-inspection method for a single-chip spin cleaning apparatus, and for convenience of description, the reference numerals in fig. 5 and fig. 6 are used in this embodiment. The real-time self-checking method comprises the following steps: s10: presetting and calibrating the motion track of a mechanical clamp, so that the mechanical clamp can place the substrate 2 on a rotating carrier 3 in cleaning equipment, and ensuring that the central line of the substrate 2 is superposed with the rotating central line of the rotating carrier 3; s20: placing the substrate 2 to be cleaned on the rotating carrier 3 through the mechanical fixture, and rotating the rotating carrier 3 at a detection rate, wherein the detection rate is less than a preset cleaning rate; s30: the image of the edge of the substrate 2 during rotation is observed by means of the optical image sensor 1 and the jitter value D of the edge of the substrate 2 is recordedi(ii) a S40: the run-out value D of the edge of the substrate 2iWith a predetermined value D0Comparing to obtain a jitter value DiGreater than a predetermined value D0When the rotating carrier 3 stops running, the cleaning equipment sends out a fault signal and a jitter value DiLess than a predetermined value D0In this case, the normal cleaning operation is started, and the substrate 2 is replaced with a new substrate 2 after the cleaning of the substrate 2 is completed, and the steps S20 to S40 are repeated.
As shown in fig. 6A, when the center line of the substrate 2 coincides with the rotation stage rotation center line a, the edge of the substrate 2 does not jump during the rotation of the rotation stage 3. As shown in fig. 6B, when the center line of the substrate 2 is not coincident with the rotation center line a of the rotation stage, the position of the substrate 2 may be significantly different during the rotation of the rotation stage 3, and when the substrate 2 is respectively located at the leftmost side and the rightmost side of the rotation stage 3, the maximum distance value between the edges of the substrate 2 is the jitter value DiWill beat value DiWith a predetermined value D0Comparing to obtain a jitter value DiGreater than a predetermined value D0This indicates that a large deviation has occurred between the substrate 2 and the rotary stage 3, at which point the rotary stage 3 stops operating and the cleaning apparatus sends out a fault signal.
Example 2
As shown in fig. 2, this embodiment is a real-time self-inspection method for a single-chip spin cleaning apparatus, and for convenience of description, the reference numerals in fig. 5, fig. 6, and fig. 7 are used in this embodiment. The real-time self-checking method comprises the following steps: s10: presetting and calibrating the motion track of a mechanical clamp, so that the mechanical clamp can place the substrate 2 on a rotating carrier 3 in cleaning equipment, and ensuring that the central line of the substrate 2 is superposed with the rotating central line of the rotating carrier 3; s20: placing the substrate 2 to be cleaned on the rotating carrier 3 through the mechanical fixture, and rotating the rotating carrier 3 at a detection rate, wherein the detection rate is less than a preset cleaning rate; s30: the image of the edge of the substrate 2 during rotation is observed by means of the optical image sensor 1 and the jitter value D of the edge of the substrate 2 is recordedi(ii) a S40: the run-out value D of the edge of the substrate 2iWith a predetermined value D0Comparing to obtain a jitter value DiGreater than a predetermined value D0When the rotating carrier 3 stops running, the cleaning equipment sends out a fault signal and a jitter value DiLess than presetValue D0In this case, the normal cleaning operation is started, and the substrate 2 is replaced with a new substrate 2 after the cleaning of the substrate 2 is completed, and the steps S20 to S40 are repeated.
As a preferred embodiment, a calibration substrate 5 is provided, and a reference line or a reference point as shown in fig. 7A or fig. 7B or fig. 7C is etched on the calibration substrate 5 to form an etched pattern 6, and further comprising the steps of: after the cleaning apparatus is operated for a certain period of time, or after a certain number of substrates 2 are cleaned, step S50 is performed: placing the calibration substrate 5 on the rotary stage 3 by the mechanical fixture, rotating the rotary stage 3 at a detection rate which is less than a preset cleaning rate, and observing an image P presented on the calibration substrate during rotation by the optical image sensor 1i。
As a preferred embodiment, the method includes step S61: analyzing the image P by an analyzing mechanismiFrom the picture PiTo determine whether the operation of the rotary stage 3 needs to be stopped and a failure signal is issued. As shown in FIG. 7A, the calibration substrate 5 is provided with the etching pattern 6 as a cross reference line, and the image P generated when the calibration substrate 5 is rotated is normally providediShould be a small circle, but when the center line of the calibration substrate 5 does not coincide with the rotation center line a of the rotation stage, the image P generated when the calibration substrate 5 rotatesiIt becomes a large circle or even a ring. Thus by observing PiThe shape of the calibration substrate 5 can be determined whether the calibration substrate 5 and the rotation stage 3 are concentric, and further, whether the rotation stage 3 needs to be stopped and a failure signal is generated is determined, and if the deviation is within an acceptable range, the calibration substrate 5 is removed and then step S20 is executed again.
As another preferred embodiment, the method comprises the following steps: between S10 and S20 there is a step S11: placing the calibration substrate 5 on the rotation stage 3 by means of said mechanical clamp, the rotation stage 3 rotating at a detection rate which is lower than the preset cleaning rate, observing and recording the image P presented on the calibration substrate 5 in the most initial rotation process by means of the optical image sensor 10(ii) a Step S62 is also included after S50: image PiAnd P0Comparison is made according to PiAnd P0To determine whether the operation of the rotary stage 3 needs to be stopped and a fault signal is sent. As shown in the calibration base 5 of FIG. 7B, the etched pattern 6 is three reference points, and the image P obtained in the step S110Should be a circular pattern with three different radii, ideally PiShould be in contact with P0Substantially consistent. However, when the center line of the calibration substrate 5 does not coincide with the rotation center line a of the rotation stage, the image PiWill be larger than the image P0The radius of the middle three circles. Thus by comparison of PiAnd P0The radius difference of the middle three circles, when the radius difference exceeds a certain critical value, the operation of the rotary carrier 3 is stopped and a fault signal is sent out. If the deviation is within the acceptable range, the calibration substrate 5 is removed and the step S20 is executed again.
As a preferred embodiment, the preset value is D00.2-0.5 mm.
As a preferred embodiment, the detection rate is in a range of 20-200 rpm.
As a preferred embodiment, step S50 is performed after the operation time of the cleaning apparatus exceeds 200 hours.
As a preferred embodiment, step S50 is performed after the cleaning apparatus has cleaned more than 500 substrates.
Example 3
As shown in fig. 3, this embodiment is a periodic self-checking method for a single-chip spin cleaning apparatus, and for convenience of description, the reference numerals in fig. 5, fig. 6, and fig. 7 are used in this embodiment. The periodic self-checking method comprises the following steps:
presetting and calibrating the motion trail of a mechanical clamp, so that the mechanical clamp can place the substrate 2 on a rotating carrier 3 in cleaning equipment, and ensuring that the central line of the substrate 2 is superposed with the rotating carrier rotating central line a; the substrate 2 to be cleaned is placed on the rotary carrying platform 3 through the mechanical clamp for cleaning the substrate; setting a calibration substrate 5, and etching a specific reference line or a specific reference point on the calibration substrate 5; after a certain period of operation of the cleaning apparatus, or after a certain number of substrates 2 have been cleaned, passed through the machineThe calibration substrate 5 is placed on the rotating carrier 3 by the mechanical fixture, the rotating carrier 3 rotates at a detection rate, the detection rate is less than a preset cleaning rate, and an image P presented on the calibration substrate 5 in the rotating process is observed by the optical image sensor 1i(ii) a Analyzing the image P by an analyzing mechanismiFrom the picture PiTo determine whether the operation of the rotary stage 3 needs to be stopped and a failure signal is issued. As shown in FIG. 7A, the calibration substrate 5 is provided with the etching pattern 6 as a cross reference line, and the image P generated when the calibration substrate 5 is rotated is normally providediShould be a small circle, but when the center line of the calibration substrate 5 does not coincide with the rotation center line a of the rotation stage, the image P generated when the calibration substrate 5 rotatesiIt becomes a large circle or even a ring. Thus by observing PiThe shape of the calibration substrate 5 can be used for judging whether the calibration substrate 5 and the rotary carrier 3 are concentric or not, further judging whether the rotary carrier 3 needs to stop running and send a fault signal or not, and if the deviation is within an acceptable range, removing the calibration substrate 5 and continuing to normally execute the cleaning work.
Example 4
As shown in fig. 4, this embodiment is a periodic self-checking method for a single-chip spin cleaning apparatus, and for convenience of description, the reference numerals in fig. 5, fig. 6, and fig. 7 are used in this embodiment. The periodic self-checking method comprises the following steps:
presetting and calibrating the motion trail of a mechanical clamp, so that the mechanical clamp can place the substrate 2 on a rotating carrier 3 in cleaning equipment, and ensuring that the central line of the substrate 2 is superposed with the rotating carrier rotating central line a; setting a calibration substrate 5, and etching a specific reference line or a specific reference point on the calibration substrate 5; placing the calibration substrate 5 on the rotation stage 3 by means of said mechanical clamp, the rotation stage 3 rotating at a detection rate which is lower than the preset cleaning rate, observing and recording the image P presented on the calibration substrate 5 in the most initial rotation process by means of the optical image sensor 10(ii) a The substrate 2 to be cleaned is placed on the rotary carrying platform 3 through the mechanical clamp to clean the substrate 2; after a certain period of operation of the cleaning apparatus, or after a certain number of substrates 2 have been cleaned, by means of said mechanical gripperThe calibration substrate 5 is placed on the rotating carrier 3, the rotating carrier 3 rotates at a detection rate, the detection rate is less than a preset cleaning rate, and an image P presented on the calibration substrate 5 in the rotating process is observed through the optical image sensor 1i(ii) a Image P is analyzed by an analyzing mechanismiAnd P0Comparison is made according to PiAnd P0To determine whether the operation of the rotary stage 3 needs to be stopped and a fault signal is sent. As shown in the calibration base 5 of FIG. 7B, the etched pattern 6 is three reference points, and the image P obtained in the step S110Should be a circular pattern with three different radii, ideally PiShould be in contact with P0Substantially consistent. However, when the center line of the calibration substrate 5 does not coincide with the rotation center line a of the rotation stage, the image PiWill be larger than the image P0The radius of the middle three circles. Thus by comparison of PiAnd P0The radius difference of the middle three circles, when the radius difference exceeds a certain critical value, the operation of the rotary carrier 3 is stopped and a fault signal is sent out. If the deviation is within the acceptable range, the calibration substrate 5 is removed and the cleaning operation is continued normally.
Example 5
As shown in fig. 5, 6 and 7, the present embodiment is a single-chip rotary cleaning apparatus, which can perform real-time or periodic self-inspection, and includes a cleaning device, a mechanical fixture, a rotating mechanism 4, and an optical image sensor 1, where β is an observation range of the optical image sensor, the rotating mechanism 4 is provided with a rotary stage 3, and further includes an analysis mechanism. When the equipment is used, the motion trail of the mechanical clamp is preset and calibrated, so that the mechanical clamp can place the substrate 2 on the rotating carrier 3 in the cleaning equipment, and the center line of the substrate 2 is ensured to be coincident with the rotating center line a of the rotating carrier; the rotating carrier 3 rotates at a detection rate, wherein the detection rate is less than a preset cleaning rate; the image of the edge of the substrate 2 during rotation is observed by means of the optical image sensor 1 and the jitter value D of the edge of the substrate 2 is recordedi(ii) a The run-out value D of the substrate edgeiWith a predetermined value D0Comparing to obtain a jitter value DiGreater than a predetermined value D0At the same time, rotateThe rotating platform 3 stops running, the cleaning equipment sends out a fault signal and a bounce value DiLess than a predetermined value D0And starting normal cleaning work, replacing the substrate 2 with a new one after the substrate 2 is cleaned, and continuously executing a new round of detection and cleaning steps.
As a preferred embodiment, it further comprises a calibration substrate 5 pre-etched with specific reference lines or points as shown in fig. 7A or fig. 7B or fig. 7C. After the cleaning equipment is operated for a period of time or after a certain number of substrates 2 are cleaned, the calibration substrate 5 is placed on the rotating carrier 3 through the mechanical clamp, the rotating carrier 3 rotates at a detection rate, the detection rate is less than the preset cleaning rate, and an image P presented on the calibration substrate in the rotating process is observed through the optical image sensor 1i。
In a preferred embodiment, the image P is analyzed by an analysis unitiFrom the picture PiTo determine whether the operation of the rotary stage 3 needs to be stopped and a failure signal is issued. The calibration substrate 5 shown in FIG. 7A is etched to form a cross reference line, and the image P generated when the calibration substrate 5 is rotated is normally calibratediShould be a small circle, but when the center line of the calibration substrate 5 does not coincide with the rotation center line a of the rotation stage, the image P generated when the calibration substrate 5 rotatesiIt becomes a large circle or even a ring. Thus by observing PiThe shape of the calibration substrate 51 can be used to determine whether the calibration substrate and the rotation carrier 3 are concentric, further determine whether the rotation carrier 3 needs to be stopped and a fault signal is sent, and if the deviation is within an acceptable range, remove the calibration substrate 5 and restart the normal cleaning operation.
As another preferred embodiment, after the movement locus of the mechanical jig is preset and calibrated in the initial stage, the calibration substrate 5 is placed on the rotary stage 3 by the mechanical jig, the rotary stage 3 is rotated at a detection rate which is less than the preset cleaning rate, and the image P appearing on the calibration substrate in the most initial rotation process is observed and recorded by the optical image sensor 10(ii) a Image PiAnd P0Comparison is made according to PiAnd P0To determine whether the operation of the rotary stage 3 needs to be stopped and a fault signal is sent. As shown in FIG. 7B, the calibration base 5 is a calibration substrate 5 on which three reference points are etched, image P0Should be a circular pattern with three different radii, ideally PiShould be in contact with P0Substantially consistent. However, when the center line of the calibration substrate 5 does not coincide with the rotation center line a of the rotation stage, the image PiWill be larger than the image P0The radius of the middle three circles. Thus by comparison of PiAnd P0The radius difference of the middle three circles, when the radius difference exceeds a certain critical value, the operation of the rotary carrier 3 is stopped and a fault signal is sent out. If the deviation is within the acceptable range, the calibration substrate 5 is removed and normal cleaning is restarted.
As a preferred embodiment, the preset value is D00.2-0.5 mm.
As a preferred embodiment, the detection rate is in a range of 20-200 rpm.
As a preferred embodiment, after the running time of the cleaning apparatus exceeds 200 hours, the calibration substrate 5 is placed on the rotary stage 3 by the mechanical jig for periodic inspection.
As a preferred embodiment, after the cleaning apparatus has cleaned more than 500 substrates, the calibration substrate 5 is placed on the rotary stage 3 by the mechanical clamp for periodic inspection.

Claims (12)

1. A real-time self-checking method of a single-chip rotary cleaning device is characterized by comprising the following steps:
s10: presetting and calibrating the motion track of a mechanical clamp, so that the mechanical clamp can place the substrate on a rotating carrier in cleaning equipment, and ensuring that the central line of the substrate is superposed with the rotating central line of the rotating carrier;
s20: placing a substrate to be cleaned on a rotating carrying platform through the mechanical clamp, and rotating the rotating carrying platform at a detection rate;
s30: by means of optical image sensorsObserving the image of the edge of the substrate during rotation and recording the run-out value D of the edge of the substratei；
S40: the run-out value D of the substrate edgeiWith a predetermined value D0Comparing to obtain a jitter value DiGreater than a predetermined value D0When the rotary carrying platform stops running, the cleaning equipment sends out a fault signal and a jitter value DiLess than a predetermined value D0At this time, the rotary stage rotates at a preset cleaning rate and normally starts cleaning, and the substrate is replaced with a new one after cleaning is completed and the steps S20 to S40 are repeated.
2. The single wafer spin cleaning apparatus real-time self-test method as recited in claim 1, wherein a calibration substrate is provided and a specific reference line or datum is etched on the calibration substrate, and further comprising the steps of:
after the cleaning apparatus is operated for a certain period of time, or after a certain number of substrates are cleaned, step S50 is performed: placing the calibration substrate on a rotary stage via the mechanical fixture, rotating the rotary stage at a detection rate, and observing an image P presented on the calibration substrate during rotation via an optical image sensori。
3. The single wafer spin cleaning apparatus real-time self-test method of claim 2, further comprising the steps of:
s61: analyzing the image P by an analyzing mechanismiFrom the picture PiTo determine whether the operation of the rotation stage needs to be stopped and to issue a fault signal, and if the operation of the rotation stage does not need to be stopped, the calibration substrate is removed and step S20 is executed again.
4. The single wafer spin cleaning apparatus real-time self-test method of claim 2, further comprising the steps of:
between S10 and S20 there is a step S11: placing the calibration substrate on a rotating stage via the mechanical fixture, the rotating stage rotating at a detection rate, and observing and recording the initial calibration substrate via an optical image sensorScaling an image P presented on a substrate during a rotation process0；
Step S62 is also included after S50: image PiAnd P0Comparison is made according to PiAnd P0The comparison is performed to determine whether the operation of the rotation stage needs to be stopped and a fault signal is sent, and if the operation of the rotation stage does not need to be stopped, the calibration substrate is removed and step S20 is executed again.
5. The single wafer spin cleaning apparatus real-time self-test method of any one of claims 1 to 4, wherein the predetermined value is D00.2-0.5 mm.
6. The real-time self-inspection method of the single-chip rotary cleaning equipment according to any one of claims 1 to 4, wherein the detection rate is in a range of 20 to 200 rpm.
7. The single wafer spin cleaning apparatus real-time self-test method of any one of claims 2 to 4, wherein step S50 is performed after the operation time of the cleaning apparatus exceeds 200 hours.
8. The single wafer spin cleaning apparatus real-time self-test method according to any one of claims 2 to 4, wherein the step S50 is performed after the cleaning apparatus has cleaned more than 500 substrates.
9. A periodic self-checking method of a single-chip rotary cleaning device is characterized by comprising the following steps:
presetting and calibrating the motion track of a mechanical clamp, so that the mechanical clamp can place the substrate on a rotating carrier in cleaning equipment, and ensuring that the central line of the substrate is superposed with the rotating central line of the rotating carrier;
placing the substrate to be cleaned on a rotary carrying platform through the mechanical clamp to clean the substrate;
setting a calibration substrate, and etching a specific reference line or a specific reference point on the calibration substrate;
after the cleaning equipment runs for a period of time or a certain number of substrates are cleaned, the calibration substrate is placed on the rotating platform deck through the mechanical clamp, the rotating platform deck rotates at a detection rate, and an optical image sensor is used for observing an image P presented on the calibration substrate in the rotating processi；
Analyzing the image P by an analyzing mechanismiFrom the picture PiAnd judging whether the operation of the rotary carrying platform needs to be stopped and sending a fault signal, and if the operation of the rotary carrying platform does not need to be stopped, removing the calibration substrate and continuing to normally execute the cleaning work.
10. A periodic self-checking method of a single-chip rotary cleaning device is characterized by comprising the following steps:
presetting and calibrating the motion track of a mechanical clamp, so that the mechanical clamp can place the substrate on a rotating carrier in cleaning equipment, and ensuring that the central line of the substrate is superposed with the rotating central line of the rotating carrier;
setting a calibration substrate, and etching a specific reference line or a specific reference point on the calibration substrate;
placing the calibration substrate on a rotary stage via the mechanical fixture, rotating the rotary stage at a detection rate, and observing and recording an image P presented on the calibration substrate during an initial rotation process via an optical image sensor0；
Placing the substrate to be cleaned on a rotary carrying platform through the mechanical clamp to clean the substrate;
after the cleaning equipment runs for a period of time or a certain number of substrates are cleaned, the calibration substrate is placed on the rotating platform deck through the mechanical clamp, the rotating platform deck rotates at a detection rate, and an optical image sensor is used for observing an image P presented on the calibration substrate in the rotating processi；
Image P is analyzed by an analyzing mechanismiAnd P0Comparison is made according to PiAnd P0The comparison of the data to determine whether the rotating carrier needs to be stopped and sends out a fault signal, if the rotating carrier does not need to be stopped, the mark is removedAnd (5) determining the substrate and continuing to normally perform cleaning work.
11. A single wafer spin cleaning apparatus comprising a cleaning device, a mechanical fixture, a spin mechanism having a spin stage, an optical image sensor, and an analysis mechanism, such that the single wafer spin cleaning apparatus can perform the method of claim 1.
12. The single-wafer spin cleaning apparatus of claim 11, further comprising a calibration substrate pre-etched with specific reference lines or fiducials, such that the single-wafer spin cleaning apparatus can perform the method of any of claims 2-4, 9, 10.
CN202111178794.7A 2021-10-11 2021-10-11 Single-chip rotary cleaning equipment real-time self-checking method, periodic self-checking method and single-chip rotary cleaning equipment Pending CN113948413A (en)

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