CN113937614B - Low thermal resistance BAR strip packaging technology - Google Patents
Low thermal resistance BAR strip packaging technology Download PDFInfo
- Publication number
- CN113937614B CN113937614B CN202111169029.9A CN202111169029A CN113937614B CN 113937614 B CN113937614 B CN 113937614B CN 202111169029 A CN202111169029 A CN 202111169029A CN 113937614 B CN113937614 B CN 113937614B
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- CN
- China
- Prior art keywords
- heat sink
- electroplating
- metal plate
- low thermal
- thermal resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02315—Support members, e.g. bases or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
Abstract
The invention discloses a low thermal resistance BAR strip packaging process, which comprises the following steps: a water inlet and outlet channel is formed on the side surface of the heat sink, a cooling water tank is obtained on the heat sink through laser processing, and two ends of the cooling water tank are deepened and communicated with the water inlet and outlet channel; welding a metal plate on the cooling water tank in a welding mode, wherein the metal plate completely covers the cooling water tank; installing a heat sink and an electroplating tool, wherein an electroplating cavity is arranged on the electroplating tool, and the metal plate is accommodated in the electroplating cavity; electroplating the surface of the metal plate and the joint of the metal plate and the water channel through an electroplating tool to form an electroplated layer; carrying out surface flatness treatment on the electroplated layer; stacking a resistance layer between the heat sink and the chip to form a package; the packaging body is heated and welded, the thickness of the inner wall of the cooling water tank is greatly reduced in a laser processing mode, so that the cooling area is increased, and a plating layer can form a good sealing environment in an electroplating mode after a metal plate is welded.
Description
Technical Field
The invention relates to the technical field of laser chip packaging, in particular to a low thermal resistance BAR strip packaging technology.
Background
The performance, long-term reliability, and lifetime of high-power semiconductor lasers are largely determined by the packaging of the chip, and its main task is to provide current and heat dissipation to the laser chip, where heat dissipation is particularly important.
The existing laser chip realizes the cooling of the laser chip by arranging a macro channel heat sink during packaging, but the macro channel is arranged in such a way that the heat sink is generally thicker, so that the heat dissipation effect is poor, and meanwhile, an O-shaped ring is required to be adopted for isolation between a laser light emitting surface and a cooling water channel due to the macro channel, and meanwhile, inert gas is required to be input for preventing the humidity in a laser cavity from increasing, so that the cost is increased, the O-shaped ring is easy to be permeated by water molecules in the long-term use process, the chip is damaged, and therefore, the low thermal resistance BAR strip packaging technology capable of obtaining the excellent heat dissipation effect and avoiding the permeation of the water molecules is required.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide a low thermal resistance BAR strip packaging process capable of obtaining excellent heat dissipation effect and avoiding permeation of water molecules.
In order to achieve the above purpose, the present invention provides the following technical solutions: a low thermal resistance BAR packaging process comprising the steps of:
step 1, arranging a water inlet and outlet channel on the side surface of a heat sink, obtaining a cooling water tank on the heat sink through laser processing, and simultaneously deepening two ends of the cooling water tank and communicating with the water inlet and outlet channel;
step 2, welding a metal plate on the cooling water tank in a welding mode, wherein the metal plate completely covers the cooling water tank;
step 3, installing a heat sink and an electroplating tool, wherein an electroplating cavity is arranged on the electroplating tool, and the metal plate is accommodated in the electroplating cavity;
step 4, electroplating the surface of the metal plate and the joint of the metal plate and the water channel through an electroplating tool to form an electroplated layer;
step 5, carrying out surface flatness treatment on the electroplated layer;
step 6, stacking a resistance layer between the heat sink and the chip to form a package body;
and 7, performing heating welding on the packaging body.
As a further improvement of the present invention, the laser processing in step 1 is laser scribing, and the cooling water tank includes a plurality of cooling tanks arranged in sequence.
As a further improvement of the invention, the ratio of the width of the laser score line to the width of the rib is 1:1, and the depth of the score line is 2-4 times of the width of the groove.
As a further development of the invention, the soldering in step 2 is gold soldering.
As a further improvement of the invention, the electroplating tool in the step 3 is made of insulating materials, and an inlet and an outlet communicated with the electroplating cavity are arranged on the electroplating tool.
As a further improvement of the invention, the electroplating cavity is circumferentially provided with a sealing ring.
As a further improvement of the present invention, the surface flatness treatment in step 5 includes mechanical cutting, and the flatness is less than 0.003um.
As a further improvement of the present invention, the heat sink in step 6 includes a positive heat sink and a negative heat sink, and the positive heat sink and the negative heat sink are symmetrically disposed at two sides of the laser chip.
As a further improvement of the present invention, the resistive layer in step 6 includes an indium layer, a silicon carbide layer and a tungsten copper layer, and the indium layer, the silicon carbide layer and the tungsten copper layer are sequentially laminated from the heat sink toward the laser chip.
As a further improvement of the present invention, the heat welding in step 7 is heat welding in a vacuum furnace placed at 300 degrees.
The invention has the beneficial effects that: the inner wall thickness of the cooling water tank is greatly reduced in a laser processing mode, so that the cooling effect of a laser chip is improved, an electroplated layer is formed in an electroplating mode after a metal plate is welded, the defect of air tightness of the single welded metal plate can be effectively overcome, a good sealing environment is formed, meanwhile, the long service life of the single welded metal plate is obtained together with the metal plate, the surface flatness of the electroplated layer is processed, the surface fluctuation of the electroplated layer can be reduced, the higher installation precision is obtained in subsequent installation, the installation stress of the chip can be reduced, the influence of the laser chip on other parts can be reduced due to the arrangement of a resistance layer, and the influence on other parts in the electroplating process can be avoided due to the insulation arrangement of an electroplating tool.
Drawings
FIG. 1 is a cross-sectional view of an installation of a laser chip, thermal layer and resistive layer of the present invention;
FIG. 2 is a schematic view of a cooling water tank according to the present invention;
FIG. 3 is a sheet metal mounting diagram of the present invention;
FIG. 4 is a cross-sectional view of the thermal layer and plating tool of the present invention.
Reference numerals: 1. a heat sink; 2. a water inlet and outlet channel; 3. a cooling water tank; 4. a metal plate; 5. electroplating tooling; 6. an electroplating cavity; 7. plating layers; 8. a cooling tank; 9. a seal ring; 10. a negative heat sink; 11. a positive electrode thermal layer; 12. a laser chip; 13. a resistive layer; 14. an indium layer; 15. a silicon carbide layer; 16. tungsten copper layer.
Detailed Description
The invention will now be described in further detail with reference to the drawings and examples. Wherein like parts are designated by like reference numerals.
As shown in fig. 1-4, a low thermal resistance BAR packaging process comprises the steps of:
step 1, arranging a water inlet and outlet channel 2 on the side surface of a heat sink 1, obtaining a cooling water tank 3 on the heat sink 1 through laser processing, and simultaneously deepening two ends of the cooling water tank 3 to be communicated with the water inlet and outlet channel 2, wherein the deepening of the two ends of the cooling water tank 3 can be finished through a laser processing or milling mode, and the arranging mode of the water inlet and outlet channel 2 comprises milling, electric spark, laser processing and water processing;
step 2, welding a metal plate 4 on the cooling water tank 3 in a welding mode, wherein the metal plate 4 completely covers the cooling water tank 3;
step 3, installing the heat sink 1 and the electroplating tool 5, wherein an electroplating cavity 6 is arranged on the electroplating tool 5, and the metal plate 4 is accommodated in the electroplating cavity 6;
step 4, electroplating the surface of the metal plate 4 and the joint of the metal plate 4 and the cooling water tank 3 through an electroplating tool 5 to form an electroplated layer 7;
step 5, carrying out surface flatness treatment on the electroplated layer 7, wherein the surface flatness treatment comprises milling and grinding; step 6, stacking a resistance layer 13 between the heat sink 1 and the laser chip 12 to form a package;
step 7, heating and welding the packaging body;
the thickness of the inner wall of the cooling water tank 3 is greatly reduced in a laser processing mode, so that the cooling area is increased, the electroplated layer 7 is formed in an electroplating mode after the metal plates 4 are welded, the defect of air tightness of the single welded metal plate 4 can be effectively overcome, a good sealing environment is formed, meanwhile, the cooling water tank is long in service life together with the welded metal plate 4, and the possibility of water molecule permeation in the using process is reduced.
Preferably, in this embodiment, the metal plate 4 in step 2 is a copper plate, and the copper plate is disposed to ensure excellent heat conductivity and reduce cost.
Preferably, in step 1, the laser processing is a laser scribing, the cooling water tank 3 includes a plurality of cooling tanks 8 that are arranged in turn, a plurality of the cooling tanks 8 are arranged along the length direction of the water inlet and outlet channel 2, and the arrangement of the plurality of cooling tanks 8 can increase the cooling area and accelerate the liquid flow velocity in the cooling tanks, so as to obtain better cooling effect.
Preferably, the ratio of the width of the laser score line to the width of the rib is 1:1, the depth of the score line is 2-4 times of the width of the groove, and the best cooling effect can be obtained by setting the ratio of the depth of the score line to the width of the groove.
Preferably, the welding in the step 2 is gold soldering, and the welding spot can have high corrosion resistance, high creep resistance and good heat conduction performance by a gold soldering welding mode.
Preferably, in the step 3, the plating tool 5 is made of an insulating material, and an inlet and an outlet which are communicated to the plating cavity 6 are formed in the plating tool 5, and the plating tool 5 is arranged in an insulating manner so as to avoid affecting other parts in the plating process.
Preferably, the circumference of the electroplating cavity 6 is provided with a sealing ring 9, and the sealing ring 9 can ensure that electroplating liquid leakage is reduced in the electroplating process, thereby ensuring the electroplating effect.
Preferably, the surface planarization treatment in step 5 includes mechanical cutting, the flatness is less than 0.003um, the surface relief of the plating layer 7 can be reduced by the surface planarization treatment of the plating layer 7, thereby obtaining higher mounting accuracy in the subsequent mounting,
preferably, in step 6, the heat sink 1 includes an anode heat sink 11 and a cathode heat sink 10, where the anode heat sink 11 and the cathode heat sink 10 are symmetrically disposed on two sides of the laser chip 12, so as to implement double-sided cooling of the laser chip 12, so that the heat dissipation effect is increased.
Preferably, in the step 6, the resistive layer 13 includes an indium layer 14, a silicon carbide layer 15 and a tungsten copper layer 16, where the indium layer 14, the silicon carbide layer 15 and the tungsten copper layer 16 are sequentially stacked from the heat sink 1 toward the laser chip 12, and the stacked arrangement of the indium layer 14, the silicon carbide layer 15 and the tungsten copper layer 16 can achieve the resistance and simultaneously obtain the excellent heat conductivity.
Preferably, in the step 7, the heating welding is performed in a vacuum furnace at 300 ℃, and the harmful effect of air on the workpiece can be effectively eliminated by means of vacuum welding, so that the welding spot has good mechanical property and corrosion resistance.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and all technical solutions belonging to the concept of the present invention belong to the protection scope of the present invention. It should be noted that modifications and adaptations to the present invention may occur to one skilled in the art without departing from the principles of the present invention and are intended to be within the scope of the present invention.
Claims (10)
1. A low thermal resistance BAR packaging process, comprising the steps of:
step 1, arranging a water inlet and outlet channel (2) on the side surface of a heat sink (1), obtaining a cooling water tank (3) on the heat sink (1) through laser processing, and simultaneously deepening two ends of the cooling water tank (3) and communicating with the water inlet and outlet channel (2);
step 2, welding a metal plate (4) on the cooling water tank (3) in a welding mode, wherein the metal plate (4) completely covers the cooling water tank (3);
step 3, mounting the heat sink (1) and the electroplating tool (5), wherein an electroplating cavity (6) is arranged on the electroplating tool (5), and the metal plate (4) is accommodated in the electroplating cavity (6);
step 4, electroplating the surface of the metal plate (4) and the joint of the metal plate (4) and the cooling water tank (3) through an electroplating tool (5) to form an electroplated layer (7);
step 5, carrying out surface flatness treatment on the electroplated layer (7);
step 6, stacking a resistance layer (13) between the heat sink (1) and the laser chip (12) to form a package;
and 7, performing heating welding on the packaging body.
2. The low thermal resistance BAR packaging process of claim 1, wherein: in the step 1, laser processing is performed to form a laser scribing line, and the cooling water tank (3) comprises a plurality of cooling tanks (8) which are sequentially arranged.
3. The low thermal resistance BAR packaging process of claim 2, wherein: the ratio of the width of the laser score line to the width of the rib is 1:1, and the depth of the score line is 2-4 times of the width of the groove.
4. The low thermal resistance BAR packaging process of claim 2, wherein: and 2, welding in the step of welding is gold soldering.
5. The low thermal resistance BAR packaging process of claim 2, wherein: in the step 3, the electroplating tool (5) is made of insulating materials, and an inlet and an outlet which are communicated to the electroplating cavity (6) are formed in the electroplating tool (5).
6. The low thermal resistance BAR packaging process of claim 1, wherein: and a sealing ring (9) is arranged in the circumferential direction of the electroplating cavity (6).
7. The low thermal resistance BAR packaging process of claim 5, wherein: the surface flatness treatment in step 5 includes mechanical cutting, the flatness being less than 0.003um.
8. The low thermal resistance BAR packaging process of any of claims 1-7, wherein: in the step 6, the heat sink (1) comprises an anode heat sink (11) and a cathode heat sink (10), and the anode heat sink (11) and the cathode heat sink (10) are symmetrically arranged on two sides of the laser chip (12).
9. The low thermal resistance BAR packaging process of claim 1, wherein: in the step 6, the resistor layer (13) comprises an indium layer (14), a silicon carbide layer (15) and a tungsten copper layer (16), and the indium layer (14), the silicon carbide layer (15) and the tungsten copper layer (16) are sequentially laminated from the heat sink (1) to the laser chip (12).
10. The low thermal resistance BAR packaging process of claim 1, wherein: the heating welding in the step 7 is heating welding in a vacuum furnace at 300 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111169029.9A CN113937614B (en) | 2021-09-30 | 2021-09-30 | Low thermal resistance BAR strip packaging technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111169029.9A CN113937614B (en) | 2021-09-30 | 2021-09-30 | Low thermal resistance BAR strip packaging technology |
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| Publication Number | Publication Date |
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| CN113937614A CN113937614A (en) | 2022-01-14 |
| CN113937614B true CN113937614B (en) | 2023-08-18 |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011022923A1 (en) * | 2009-08-31 | 2011-03-03 | 西安炬光科技有限公司 | Cooling module for laser, manufacture method thereof and semiconductor laser including the same |
| CN106654820A (en) * | 2016-11-16 | 2017-05-10 | 中国电子科技集团公司第十研究所 | Double-sided packaging method of slab laser crystal |
| CN207646317U (en) * | 2017-12-27 | 2018-07-24 | 东莞市易恒金属制品有限公司 | A kind of energy-efficient electroplating bath |
| CN208461199U (en) * | 2018-08-23 | 2019-02-01 | 潍坊华光光电子有限公司 | A kind of side emitting laser encapsulating structure |
| CN111933784A (en) * | 2020-09-09 | 2020-11-13 | 山东元旭光电股份有限公司 | Ceramic packaging method of laser chip and ceramic packaging chip structure |
| CN213093555U (en) * | 2020-09-17 | 2021-04-30 | 温州泛波激光有限公司 | Laser semiconductor cooling structure |
| CN112802812A (en) * | 2021-03-31 | 2021-05-14 | 度亘激光技术（苏州）有限公司 | Heat sink and semiconductor device |
| CN112821187A (en) * | 2020-12-30 | 2021-05-18 | 西安立芯光电科技有限公司 | Single-bar packaging method for semiconductor laser |
| CN113300211A (en) * | 2021-06-24 | 2021-08-24 | 西安嘉合超亿光电科技有限公司 | Semiconductor laser packaging structure and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6917637B2 (en) * | 2001-10-12 | 2005-07-12 | Fuji Photo Film Co., Ltd. | Cooling device for laser diodes |
-
2021
- 2021-09-30 CN CN202111169029.9A patent/CN113937614B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011022923A1 (en) * | 2009-08-31 | 2011-03-03 | 西安炬光科技有限公司 | Cooling module for laser, manufacture method thereof and semiconductor laser including the same |
| CN106654820A (en) * | 2016-11-16 | 2017-05-10 | 中国电子科技集团公司第十研究所 | Double-sided packaging method of slab laser crystal |
| CN207646317U (en) * | 2017-12-27 | 2018-07-24 | 东莞市易恒金属制品有限公司 | A kind of energy-efficient electroplating bath |
| CN208461199U (en) * | 2018-08-23 | 2019-02-01 | 潍坊华光光电子有限公司 | A kind of side emitting laser encapsulating structure |
| CN111933784A (en) * | 2020-09-09 | 2020-11-13 | 山东元旭光电股份有限公司 | Ceramic packaging method of laser chip and ceramic packaging chip structure |
| CN213093555U (en) * | 2020-09-17 | 2021-04-30 | 温州泛波激光有限公司 | Laser semiconductor cooling structure |
| CN112821187A (en) * | 2020-12-30 | 2021-05-18 | 西安立芯光电科技有限公司 | Single-bar packaging method for semiconductor laser |
| CN112802812A (en) * | 2021-03-31 | 2021-05-14 | 度亘激光技术（苏州）有限公司 | Heat sink and semiconductor device |
| CN113300211A (en) * | 2021-06-24 | 2021-08-24 | 西安嘉合超亿光电科技有限公司 | Semiconductor laser packaging structure and preparation method thereof |
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| CN113937614A (en) | 2022-01-14 |
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