CN113937542A

CN113937542A - Non-metal conducting connector

Info

Publication number: CN113937542A
Application number: CN202111051295.1A
Authority: CN
Inventors: 黄明达
Original assignee: Shenzhen Frd Science & Technology Co ltd
Current assignee: Shenzhen Frd Science & Technology Co ltd
Priority date: 2021-09-08
Filing date: 2021-09-08
Publication date: 2022-01-14

Abstract

The invention discloses a nonmetal conductive connector, which comprises a conductive base and a compressible conductive lining; the conductive lining comprises a compressible lining colloid and first conductive layers respectively arranged on the end faces of two opposite ends of the lining colloid; the end face of the first end of the conductive base is provided with at least one first convex column; one end of the lining colloid is provided with a positioning hole matched with the first convex column; the conductive bush is matched with the first convex column through the positioning hole and is inserted into the first end of the conductive base, and the first conductive layer on one end face of the conductive bush is attached to the first end face of the conductive base to realize conductive connection. The nonmetal conductive connector of the invention is formed by matching the compressible conductive lining on the conductive base, and two electronic devices (circuits) are conducted in a stable surface contact mode without welding, so that the nonmetal conductive connector has the advantages of more stable conduction signals and the like compared with POGOPIN in the prior art.

Description

Non-metal conducting connector

Technical Field

The invention relates to the technical field of connectors, in particular to a nonmetal conduction connector.

Background

POGOPIN is a precision connector applied to electronic products such as mobile phones and the like, is widely applied to semiconductor equipment and plays a role in connection. Current POGOPIN is structural including hollow copper post, interior needle and spring, and the spring mounting is inside the copper post, and the top that goes the ejecting copper post of interior needle through the inside spring of copper post during the use removes the contact line, realizes switching on.

However, the inner needle needs to be capable of moving up and down along the copper column to achieve ejection or retraction of the copper column, so that clearance fit is needed between the inner needle and the inner wall of the copper column, after the inner needle is ejected by the spring, the inner needle only contacts with the copper column through the outer surface with a small area to achieve conduction between the inner needle and the copper column, the contact between the inner needle and the copper column is basically only point-to-point contact, the contact area is small, the contact position is not fixed, signals conducted between two parts or lines through POGOPIN are unstable, and performance and use of an electronic product are affected.

Disclosure of Invention

The technical problem to be solved by the invention is to provide a nonmetal conduction connector which can improve the stability of conduction signals.

The technical scheme adopted by the invention for solving the technical problems is as follows: providing a non-metallic conductive connector comprising a conductive base having opposing first and second ends, a compressible conductive liner; the conductive lining comprises a compressible lining colloid and first conductive layers respectively arranged on the end faces of two opposite ends of the lining colloid;

the end face of the first end of the conductive base is provided with at least one first convex column; one end of the lining colloid is provided with a positioning hole matched with the first convex column; the conductive bush is matched with the first convex column through the positioning hole and is inserted into the first end of the conductive base, and the first conductive layer on one end face of the conductive bush is attached to the first end face of the conductive base to realize conductive connection.

Preferably, the first conductive layer is a silver layer, a gold layer or a tin layer.

Preferably, the conductive bushing further comprises a second conductive layer disposed on an outer circumferential surface of the bushing colloid and/or an inner wall surface of the positioning hole.

Preferably, the second conductive layer is a silver layer, a gold layer or a tin layer.

Preferably, the first convex column is in interference fit with the positioning hole.

Preferably, the positioning holes penetrate through two opposite end faces of the lining colloid.

Preferably, the conductive base is a metal base, and the first protruding column is a metal column.

Preferably, the conductive base comprises a hard insulating base and a conductive metal layer coated on the outer surface of the insulating base.

Preferably, the first protruding pillar is integrally formed on one end of the insulating base, and the conductive metal layer extends and wraps the outer surface of the first protruding pillar.

Preferably, the end face of the second end of the conductive base is provided with at least one second convex column.

The nonmetal conductive connector is formed by matching the compressible conductive bush on the conductive base to form the connector, two electronic devices (circuits) are conducted in a stable surface contact mode, welding is not needed between the connector and the electronic devices, the requirement that the electronic device base materials need high temperature resistance is avoided, the nonmetal conductive connector is different from POGOPIN in the prior art which is formed by matching copper columns, inner pins and the like, and has the advantages of more stable conduction signals and the like compared with the POGOPIN.

The nonmetal conductive connector is suitable for connection and conduction between the antenna oscillator and the PCB, and avoids the problems that the oscillator and the PCB need to be welded in a conventional connection mode, the oscillator base material needs to have high temperature resistance and the like; compared with a POGOPIN connection mode, the radio frequency signal has better and stable radio frequency signal.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

fig. 1 is a schematic structural diagram of a non-metallic conductive connector according to an embodiment of the invention;

FIG. 2 is an exploded view of a non-metallic conductive connector according to an embodiment of the present invention;

fig. 3 is a schematic longitudinal sectional view of a conductive bush in a non-metallic conductive connector according to an embodiment of the invention;

fig. 4 and 5 are standing wave ratio test waveforms of two ports of an antenna element conducted by applying the present invention, respectively;

fig. 6 and 7 are standing wave ratio test waveform diagrams of two ports of an antenna element conducted by applying prior art POGOPIN, respectively.

Detailed Description

For a more clear understanding of the technical features, objects and effects of the present invention, embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

As shown in fig. 1 and 2, the non-metallic conductive connector according to an embodiment of the present invention includes a conductive base 10 and a compressible conductive sleeve 20. The conductive bush 20 is disposed on the conductive base 10 and is conductively connected with the conductive base 10 in a surface-fitting manner, and the connection area is large and stable. The conductive base 10 is used for being mounted on an electronic device (such as a PCB board, etc.), and the conductive bushing 20 is used for being in contact connection with another electronic device (such as an antenna element, etc.) and being capable of being pressed and deformed to realize stable contact, so as to realize conduction between the lines of the two electronic devices and transmission of signals.

The conductive base 10 has a first end and a second end opposite to each other, and the end surface of the first end of the conductive base 10 is in contact with and electrically connected to the conductive bushing 20. In order to position the conductive bush 20 on the conductive base 10, the end face of the first end of the conductive base 10 is provided with at least one first protruding column 11, the conductive bush 20 is correspondingly provided with a positioning hole 21 matched with the first protruding column 11, and the conductive bush 20 is inserted on the conductive base 10 through the matching of the positioning hole 21 and the first protruding column 11, so that the conductive bush is limited on the conductive base 10 and cannot easily fall off or move, and the stable contact between the conductive base 10 and the conductive bush 20 is ensured.

In the present embodiment, the conductive base 10 is a cylindrical structure, and may be, but not limited to, a cylinder or a polygonal cylinder. The first protruding pillar 11 protrudes from the first end surface of the conductive base 10, and may be integrally formed on the conductive base 10. The end of the first protruding pillar 11 away from the conductive base 10 can be chamfered to form a guiding portion for aligning and embedding into the positioning hole 21 of the conductive bushing 20.

The first protruding column 11 and the positioning hole 21 are preferably in interference fit, so that the conductive bushing 20 is inserted and fixed on the conductive base 10.

Alternatively, the conductive base 10 may be made of a conductive metal, such as copper, so that the entirety may be a copper pillar structure. Or, the conductive base 10 is made of a hard insulating material and covered with a conductive metal layer, so that the conductive base 10 may structurally include a hard insulating base and a conductive metal layer covered on the outer surface of the insulating base; the conductive metal layer may be a silver layer, a copper layer, a gold layer, or a tin layer, among others. The hard insulating material comprises hard rubber or the like.

The second end of the conductive base 10 is used for mounting on an electronic device (such as a PCB board, etc.), and the mounting method may be soldering, plugging, etc. In this embodiment, as shown in fig. 1, an end surface of the second end of the conductive base 10 is provided with at least one second protrusion 12, so that the conductive base 10 can be mounted on the electronic device through the second protrusion 12 matching with the hole and electrically connected to the circuit on the electronic device.

The second protrusion 12 may be configured in the same manner as the first protrusion 11, so that the conductive base 10 does not need to be oriented when being mounted with the conductive bushing 20 and on the electronic device, and only one end of the conductive base needs to be used as the first end and the other end of the conductive base needs to be used as the second end.

The first and second protruding

pillars

11 and 12 may be integrally formed on the conductive base 10. When the conductive base 10 is entirely made of a conductive metal, the first and

second bosses

11 and 12 are metal posts integrally formed on opposite ends of the conductive base 10 from the same conductive metal. When the conductive base 10 is made of a hard insulating material and covered with a conductive metal layer, the bodies of the first and

second pillars

11 and 12 are integrally formed on opposite ends of the insulating base, and the conductive metal layer covers the outer surface of the insulating base and extends to cover the outer surfaces of the bodies of the first and

second pillars

11 and 12.

In the present invention, the conductive bush 20 is not a structural body made of a conductive metal.

As shown in fig. 2 and 3, the conductive bushing 20 includes a compressible bushing colloid 22, and first conductive layers 23 respectively disposed on end surfaces of opposite ends of the bushing colloid 22. The bushing colloid 22 is formed by extrusion or molding using a soft material such as rubber or silicone, has elasticity, and can be deformed and restored. The positioning hole 21 is disposed on the bushing colloid 22, the positioning hole 21 connects the conductive bushing 20 to the conductive base 10 by interference fit with the first boss 11, and the conductive bushing 20 is detachable. When the conductive lining 20 has the performance loss or the aging problem, the operation is convenient and fast because the conductive lining 20 is replaced with a new one.

In an embodiment, the positioning hole 21 may be disposed at one end of the bushing colloid 22, and extend towards the inside of the bushing colloid 22 on the end surface of the end where the positioning hole 21 is located to form a hole having a certain depth and capable of being matched with the first protruding pillar 11, so that the first conductive layer 23 on the end surface where the positioning hole 21 is located is annular, and the whole end surface covers the first conductive layer 23 due to no hole on the end surface at the other end of the bushing colloid 22.

In another embodiment, the positioning holes 21 may further penetrate through two opposite end surfaces of the bushing colloid 22 to form through holes of the bushing colloid 22, so that the two opposite end surfaces of the bushing colloid 22 are both annular, and the first conductive layer 23 on the end surfaces is also annular. For the arrangement mode that the positioning hole 21 penetrates through the two opposite end faces of the bushing colloid 22, the length of the first convex column 11 is smaller than the depth of the positioning hole 21 (i.e. smaller than the length of the conductive bushing 20), so that after the first convex column 11 is matched in the positioning hole 21, the conductive bushing 20 is not supported by the first convex column 11 inside the upper end far away from the conductive base 10, and can be compressed and deformed.

After the conductive bushing 20 is inserted into the conductive base 10 through the positioning hole 21 and the first protrusion 11, the first conductive layer 23 on the end surface of the conductive bushing 20 facing the conductive base 10 is attached to the first end surface of the conductive base 10, so that the conductive connection between the conductive bushing 20 and the conductive base 10 is realized. The first conductive layer 23 on the other end face of the conductive bush 20 is used for contact electrical connection with an electronic device. Because the lining colloid 22 is made of soft material, when it is pressed and contacted with the electronic device, it will not have indentation or scratch to the electronic device.

The first conductive layer 23 is formed of a conductive metallic material, preferably a silver layer, a gold layer, or a tin layer. An oxide formed by oxidation of silver or the like also has good conductivity, and therefore the first conductive layer 23 is further preferably a silver layer; the silver layer may be formed by silver paste coating.

In order to increase the conductive layer area and the conductive stability of the conductive bushing 20, the conductive bushing 20 further includes a second conductive layer 24, and the second conductive layer 24 is disposed on the outer circumferential surface of the bushing colloid 22 or the inner wall surface of the positioning hole 21, or both of the outer circumferential surface and the inner wall surface of the positioning hole 21 are disposed with the second conductive layer 24.

The second conductive layer 24 on the outer peripheral surface of the bushing colloid 22 is in contact with the first conductive layer 23 to form an integral outer conductive layer. The second conductive layer 24 on the inner wall surface of the positioning hole 21 may be integrally formed in contact with the first conductive layer 23.

Similarly to the first conductive layer 23, the second conductive layer 24 can be a silver layer, a gold layer, or a tin layer.

The nonmetal conduction connector is suitable for the connection of line conduction between two electronic devices on equipment or products such as electronic appliances and the like, and realizes the conduction between the lines of the two electronic devices and the transmission of signals. For example in standing wave ratio testing of antenna elements.

When the nonmetal conductive connector is applied to the standing-wave ratio test of the antenna oscillator, the conductive base 10 of the nonmetal conductive connector is firstly installed on the PCB in a welding or inserting mode, and then the antenna oscillator is pressed on the conductive lining 20, so that the conduction between the PCB and the antenna oscillator is realized.

The invention is further explained below in terms of a standing wave ratio test applied to an antenna element.

Taking 60 antenna elements and two ports connected as an example, the test frequency band is 3300 MHz-3790 MHz.

Example 1

The nonmetal conduction connector is adopted to connect and conduct the antenna oscillator and the PCB of the standing-wave ratio tester to carry out standing-wave ratio test. Standing wave ratio waveforms obtained by two port connection tests of 60 antenna elements are respectively shown in fig. 4 and 5.

Comparative example 1

And connecting and conducting the antenna oscillator and a PCB of a standing-wave ratio tester by using POGOPIN to test the standing-wave ratio. Standing wave ratio waveforms obtained by two port connection tests of 60 antenna elements are respectively shown in fig. 6 and 7.

In FIGS. 4-7, the abscissa represents the frequency band (3300 MHz-3790 MHz in FIGS. 4, 5, and 7; 3300 MHz-3800 MHz in FIG. 6), and the ordinate represents the standing wave value.

As can be seen from comparison between fig. 4 and 5 and fig. 6 and 7, 60 sets of waveforms (each set of waveforms corresponds to one antenna element) obtained by the connection conduction test of the non-metallic conduction connector of the present invention are overlapped, and the waveforms are relatively concentrated and have good consistency. 60 groups of waveforms obtained by adopting a POGOPIN connection conduction test are partially overlapped, partial waveforms are discrete, and the consistency is poor. Therefore, the nonmetal conduction connector is used for standing wave ratio test of the antenna oscillator, and the transmission radio frequency signal ratio POGOPIN is stable.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly used in other related technical fields, are included in the scope of the present invention.

Claims

1. A non-metallic conductive connector comprising a conductive base having opposite first and second ends, a compressible conductive liner; the conductive lining comprises a compressible lining colloid and first conductive layers respectively arranged on the end faces of two opposite ends of the lining colloid;

2. The non-metallic via connector of claim 1, wherein the first conductive layer is a silver layer, a gold layer, or a tin layer.

3. The non-metallic conductive connector according to claim 1, wherein the conductive bushing further includes a second conductive layer disposed on an outer circumferential surface of the bushing colloid and/or an inner wall surface of the positioning hole.

4. The non-metallic via connector of claim 3, wherein the second conductive layer is a silver layer, a gold layer, or a tin layer.

5. The non-metallic conductive connector of claim 1, wherein the first post is in interference fit with the positioning hole.

6. The non-metallic conductive connector of claim 1, wherein the positioning holes penetrate through two opposite end faces of the bushing colloid.

7. The non-metallic conductive connector of claim 1, wherein the conductive base is a metal base and the first post is a metal post.

8. The non-metallic conductive connector of claim 1, wherein the conductive base comprises a rigid insulating base and a conductive metal layer coated on an outer surface of the insulating base.

9. The non-metallic conductive connector of claim 8, wherein the first protrusion is integrally formed on one end of the insulating base, and the conductive metal layer is extended to cover an outer surface of the first protrusion.

10. The non-metallic conductive connector of any one of claims 1-9, wherein the end surface of the second end of the conductive base is provided with at least one second post.