CN110402014B - Circuit board of electronic equipment and electronic equipment - Google Patents

Circuit board of electronic equipment and electronic equipment Download PDF

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Publication number
CN110402014B
CN110402014B CN201910661194.2A CN201910661194A CN110402014B CN 110402014 B CN110402014 B CN 110402014B CN 201910661194 A CN201910661194 A CN 201910661194A CN 110402014 B CN110402014 B CN 110402014B
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Prior art keywords
circuit board
test pad
test
metal layer
pad
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CN201910661194.2A
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CN110402014A (en
Inventor
江超
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Oppo Chongqing Intelligent Technology Co Ltd
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Oppo Chongqing Intelligent Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

The application discloses electronic equipment's circuit board and electronic equipment. The circuit board comprises a main body part, a first testing pad and a second testing pad, wherein the first testing pad is arranged on the main body part, the second testing pad is spaced apart from the first testing pad, and at least one of the first testing pad and the second testing pad is provided with an anti-skid part. According to the circuit board of the electronic equipment, the test pads are arranged on the circuit board, the probes can be directly contacted with the corresponding test pads to test the circuit board, so that the test pads can be used for replacing a test seat structure, the number of electrical elements on the circuit board is reduced, the overall height of the circuit board is reduced, the production cost can be saved, and the light and thin design of the electronic equipment is easy to realize. In addition, the anti-skidding parts are arranged on the corresponding test pads, so that the contact stability of the probes and the corresponding test pads can be improved, and the test efficiency of a test experiment can be improved.

Description

Circuit board of electronic equipment and electronic equipment
Technical Field
The present application relates to the field of communications devices, and in particular, to a circuit board for an electronic device and an electronic device.
Background
In the related art, an electronic device has a wireless communication function, and an antenna module is required to be disposed in the electronic device to implement the wireless communication function. When the electronic device is tested, the performance of the antenna needs to be tested. When testing the antenna performance of the electronic equipment, an antenna test seat is arranged IN the circuit board, the probe is propped against the test seat to separate an Input (IN) end from an Output (OUT) end, and the input section is directly connected with the probe to test the antenna performance.
On one hand, the cost of the antenna test socket has a certain cost, which leads to the increase of the production cost of the circuit board; on the other hand, the area that an antenna test socket needs to occupy in the circuit board 2.5mm, need place a plurality of antenna test sockets in a circuit board (especially cell-phone circuit board mainboard), cause the promotion of circuit board area under the situation that circuit board layout density is more and more intensive, also can make whole PCBA's high increase simultaneously, cell-phone is more and more frivolous nowadays, and the component is the antenna test socket (reaching about 2.0mm) usually the highest in the whole cell-phone mainboard, influence the whole thickness of cell-phone, satisfy the frivolous design requirement of cell-phone.
Content of application
The application provides a circuit board of electronic equipment and electronic equipment, circuit board and electronic equipment of electronic equipment have simple structure, with low costs, the convenient advantage of test.
According to the circuit board of the electronic equipment of this application embodiment, include: a main body portion; a first test pad provided on the main body portion; a second test pad disposed on the body portion, the second test pad being spaced apart from the first test pad; at least one of the first test pad and the second test pad has a non-slip portion.
According to the circuit board of the electronic equipment, the test pads are arranged on the circuit board, when the circuit board is tested, the probes can be directly contacted with the corresponding test pads to test the circuit board, so that the test pads can be used for replacing a test seat structure, the number of electrical elements on the circuit board is reduced, the overall height of the circuit board is reduced, the production cost can be saved, and the light and thin design of the electronic equipment is easy to realize. In addition, the anti-skidding parts are arranged on the corresponding test pads, so that the contact stability of the probes and the corresponding test pads can be improved, and the test efficiency of a test experiment can be improved.
In some embodiments, the non-slip portion is a rough surface.
In some embodiments, the anti-slip portion is a blind hole, and the circuit board includes a first metal layer disposed on an inner wall of the blind hole.
In some embodiments, the blind hole has a first opening, and the circuit board includes a first flanged metal layer connected to the first metal layer, and the first flanged metal layer wraps an edge of the first opening.
In some embodiments, the anti-slip portion is a through hole, and the circuit board includes a second metal layer disposed on an inner wall of the through hole.
In some embodiments, the through hole has a second opening, wherein the second opening is located at one end of the through hole, the circuit board further includes a second flanged metal layer, the second flanged metal layer is connected to the second metal layer, and the second flanged metal layer wraps the edge of the second opening.
In some embodiments, the through hole has a third opening, where the third opening is located at the other end of the through hole, and the circuit board further includes a third flanged metal layer, where the third flanged metal layer is connected to the second metal layer, and the third flanged metal layer wraps an edge of the third opening.
In some embodiments, the first test pad is circular.
In some embodiments, the first test pad has a diameter of 0.4-1.6 mm.
In some embodiments, the first test pad has a diameter of 0.9-1.0 mm.
In some embodiments, the second testing pad has a long bar shape, and a minimum width of the second testing pad is greater than or equal to 0.3 mm.
In some embodiments, the first test pad and the second test pad are adapted to be electrically connected through the conductive member of the body portion.
In some embodiments, at least one of the first test pad and the second test pad is square.
In some embodiments, an area of at least one of the first test pad and the second test pad is 0.0625mm or more2。
In some embodiments, the first test pad and the second test pad are both square, and a minimum distance between the first test pad and the second test pad is equal to or greater than 0.15 mm.
In some embodiments, the non-slip portion is plural.
In some embodiments, the first test pad and the second test pad are both multiple, and the multiple first test pads and the multiple second test pads are in one-to-one correspondence and electrically connected.
In some embodiments, each of the first test pads and the second test pads is a plurality of first test pads and each of the first test pads is electrically connected to a corresponding one of the second test pads.
According to the electronic equipment of this application embodiment, include: a housing; the circuit board, the circuit board is located in the shell, the circuit board includes main part, first test pad and second test pad, first test pad with the second test pad is located the main part, the second test pad with first test pad is spaced apart, first test pad with at least one in the second test pad has antiskid portion.
According to the electronic equipment provided by the embodiment of the application, the test pads are arranged on the circuit board, when the electronic equipment is tested, the probes can be directly contacted with the corresponding test pads to test the circuit board, so that the test pads can be used for replacing a test seat structure, the number of electrical elements on the circuit board is reduced, the overall height of the circuit board is reduced, the production cost can be saved, and the light and thin design of the electronic equipment is easy to realize. In addition, the anti-skidding parts are arranged on the corresponding test pads, so that the contact stability of the probes and the corresponding test pads can be improved, and the test efficiency of a test experiment can be improved.
In some embodiments, the non-slip portion is a rough surface, a blind hole, or a through hole.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a circuit board of an electronic device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a circuit board of an electronic device according to an embodiment of the present application;
FIG. 3 is a schematic cross-sectional view of a circuit board of an electronic device according to an embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of a circuit board of an electronic device according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Reference numerals:
the electronic device 1000, the housing 200,
circuit board 100, output terminal 101, input terminal 102, probe 103,
a main body part 110, a cover part,
the first test pad 120, the first sub-test pad 1201, the second sub-test pad 1202,
the second test pad 130, the third sub-test pad 1301, the fourth sub-test pad 1302,
the anti-slip portion 140 is formed of a plastic material,
the rough surface 141 is a rough surface with a rough surface,
the length of the blind hole 142, the first opening 1421,
a first metal layer 1422, a first collar metal layer 1423,
a through hole 143, a second opening 1431, a third opening 1432,
a second metal layer 1433, a second flange metal layer 1434, and a third flange metal layer 1435.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
The circuit board 100 and the electronic apparatus 1000 of the electronic apparatus according to the embodiment of the present application are described below with reference to fig. 1 to 5.
The circuit board 100 of the electronic device according to the embodiment of the present application includes a body portion 110, a first test pad 120, and a second test pad 130.
Specifically, the first test pad 120 and the second test pad 130 are both disposed on the body portion 110, that is, the body portion 110 may carry the first test pad 120 and the second test pad 130. Here, the first and second test pads 120 and 130 may be antenna test pads or circuit test pads, etc., whereby antenna performance or circuit continuity of the electronic device 1000 may be tested using the first and second test pads 120 and 130.
It should be noted that, by providing the test pads (for example, the first test pad 120 and the second test pad 130) on the circuit board 100, during testing, the probe 103 can be directly contacted with the corresponding test pads to test the circuit board 100, so that the test pads can be used to replace the test socket structure, thereby reducing the number of electrical components on the circuit board 100, and reducing the overall height of the circuit board 100, thereby not only saving the production cost, but also facilitating the implementation of the light and thin design of the electronic device 1000.
As shown in fig. 1 and 2, the second test pad 130 is disposed apart from the first test pad 120, and at least one of the first test pad 120 and the second test pad 130 has a non-slip portion 140. It is understood that the anti-slip part 140 may be disposed on the first test pad 120 and also on the second test pad 130; of course, the anti-slip part 140 may be provided on both the first test pad 120 and the second test pad 130.
In the related art, when the probe is brought into contact with the corresponding test pad at the time of testing, the probe is easily slipped off from the corresponding test pad. In the embodiment of the present application, the anti-slip portion 140 is disposed on the corresponding test pad, so that the contact stability of the probe 103 and the corresponding test pad can be improved, and the test efficiency of the test experiment can be improved.
According to the circuit board 100 of the electronic device in the embodiment of the application, the test pads (for example, the first test pad 120 and the second test pad 130) are arranged on the circuit board 100, and the probes 103 can be directly contacted with the corresponding test pads during testing to test the circuit board 100, so that the test pads can be used to replace a test socket structure, the number of electrical components on the circuit board 100 is reduced, and the overall height of the circuit board 100 is reduced, thereby not only saving the production cost, but also easily realizing the light and thin design of the electronic device 1000. In addition, by providing the anti-slip part 140 on the corresponding test pad, the contact stability of the probe 103 with the corresponding test pad can be improved, thereby improving the test efficiency of the test experiment.
As shown in fig. 1, the anti-slip part 140 may be plural, and the plurality of anti-slip parts 140 are spaced apart on the corresponding test pad. The plurality of anti-slip portions 140 on each test pad may be the same anti-slip portion 140 or different anti-slip portions 140. As shown in fig. 3 and 4, the anti-slip part 140 may be a rough surface 141, a blind hole 142, or a through hole 143.
When the anti-slip part 140 is the rough surface 141, the rough surface 141 may increase a friction force between the probe 103 and the anti-slip part 140, so that the probe 103 may be prevented from slipping off the anti-slip part 140.
When the anti-slip part 140 is the blind hole 142, the position of the blind hole 142 is a recessed structure, the end of the probe 103 can be clamped into the recessed structure, the tip of the probe 103 is in contact with the inner bottom wall of the blind hole 142, and the peripheral wall of the blind hole 142 can limit the probe 103 inside the blind hole 142, so that the probe 103 can be prevented from slipping. It is understood that the opening edge of the recess structure may serve to position the probe 103 stably, so that the probe 103 may be stably brought into contact with the corresponding test pad. The circuit board 100 may include a first metal layer 1422, and the first metal layer 1422 is disposed on an inner wall of the blind via 142. It should be noted that, by providing the first metal layer 1422, the stability of the electrical connection between the probe 103 and the corresponding test pad can be improved.
Further, the blind via 142 has a first opening 1421, and the circuit board 100 may further include a first flanging metal layer 1423, the first flanging metal layer 1423 is connected to the first metal layer 1422, and the first flanging metal layer 1423 wraps the edge of the first opening 1421. It is understood that the edge of the first opening 1421 may be wrapped by the first flanging metal layer 1423, and when the probe 103 is located at the blind hole 142, the first flanging metal layer 1423 may be in real-time contact with the probe 103, so as to improve the stability of the electrical connection between the probe 103 and the pad. To facilitate the arrangement of the first metal layer 1422 and the first flanging metal layer 1423, the first metal layer 1422 and the first flanging metal layer 1423 may be integrally formed, for example, the first metal layer 1422 and the first flanging metal layer 1423 may be formed by a plating process.
When the anti-slip part 140 is the through hole 143, the through hole 143 is in a recessed structure, the end of the probe 103 can be snapped into the recessed structure, and the edge of the opening of the recessed structure can be used for stabilizing the probe 103, so that the probe 103 can be stably contacted with the corresponding test pad. The circuit board 100 may further include a second metal layer 1433, and the second metal layer 1433 is disposed on an inner wall of the through hole 143. It should be noted that by providing the second metal layer 1433, the stability of the electrical connection between the probe 103 and the corresponding test pad can be improved.
Further, the through hole 143 has a second opening 1431, wherein the second opening 1431 is located at one end of the through hole 143, the circuit board 100 may further include a second flanged metal layer 1434, the second flanged metal layer 1434 is connected to the second metal layer 1433, and the second flanged metal layer 1434 wraps an edge of the second opening 1431. It is understood that the edge of the second opening 1431 may be wrapped with the second collar metal layer 1434, and when the probe 103 is located at the second opening 1431 of the through hole 143, the second collar metal layer 1434 may be in real-time contact with the probe 103, so that the stability of the electrical connection of the probe 103 with the corresponding test pad may be improved. To facilitate the provision of the second metal layer 1433 and the second flange metal layer 1434, the second metal layer 1433 and the second flange metal layer 1434 may be integrally formed, for example, the second metal layer 1433 and the second flange metal layer 1434 may be formed by a plating process.
Furthermore, the through hole 143 further has a third opening 1432, wherein the third opening 1432 is located at the other end of the through hole 143, and the circuit board 100 further includes a third flanged metal layer 1435, the third flanged metal layer 1435 is connected to the second metal layer 1433, and the third flanged metal layer 1435 is wrapped around an edge of the third opening 1432. It is understood that the third flanging metal layer 1435 may be used to wrap the edge of the third opening 1432, and when the probe 103 is located at the third opening 1432 of the through hole 143, the third flanging metal layer 1435 may be in real-time contact with the probe 103, so that the stability of the electrical connection of the probe 103 with the corresponding test pad may be improved. To facilitate the provision of the second metal layer 1433 and the third collar metal layer 1435, the second metal layer 1433 and the third collar metal layer 1435 may be integrally formed, for example, the second metal layer 1433 and the third collar metal layer 1435 may be formed by a plating process.
As shown in fig. 1 and 2, the main body 110 may be provided with a plurality of first test pads 120 and a plurality of second test pads 130, and the plurality of first test pads 120 and the plurality of second test pads 130 may be in one-to-one correspondence and electrically connected. It should be noted that the correspondence relationship between the number of the first test pads 120 and the number of the second test pads 130 is not limited to this, for example, the first test pads 120 are electrically connected to the plurality of second test pads 130 correspondingly.
The plurality of first test pads 120 may or may not have the same shape. The first test pad 120 may include a first sub test pad 1201 and a second sub test pad 1202, and the second test pad 130 may include a third sub test pad 1301 and a fourth sub test pad 1302.
For example, as shown in fig. 1, in the main body 110, there are one first sub-test pad 1201 and one second sub-test pad 1202, one third sub-test pad 1301, two fourth sub-test pads 1302, one first sub-test pad 1201 corresponding to one third sub-test pad 1301, and one second sub-test pad 1202 corresponding to two fourth sub-test pads 1302. The first sub-test pad 1201 and the third sub-test pad 1301 may be crescent-shaped, the second sub-test pad 1202 is circular, the fourth sub-test pad 1302 is elongated, and the elongated fourth sub-test pad 1302 may extend along an arc or a linear.
As another example, as shown in fig. 2, in the main body 110, there are one first sub-test pad 1201 and one second sub-test pad 1202, one third sub-test pad 1301 and two fourth sub-test pads 1302, where one first sub-test pad 1201 corresponds to one third sub-test pad 1301 and one second sub-test pad 1202 corresponds to two fourth sub-test pads 1302. The first sub-test pad 1201 and the third sub-test pad 1301 may be square, the second sub-test pad 1202 may be circular, and the fourth sub-test pad 1302 may be elongated, where the elongated fourth sub-test pad 1302 may extend along an arc line or a linear line.
When the first test pad 120 has a circular shape, the diameter of the first test pad 120 may be 0.4-1.6 mm. Further, when the diameter of the first test pad 120 is 0.9-1.0mm, the first test pad 120 has better communication effect, and is more beneficial to the probe 103 to perform the test of the antenna performance.
When the second test pad 130 is in a strip shape, the minimum width of the second test pad 130 is greater than or equal to 0.3 mm. It should be noted that the "width" herein may refer to: the length direction of the second test pad 130 is the left-right direction as shown in fig. 1, the vertical direction (the vertical direction as shown in fig. 1) perpendicular to the direction is the width direction of the second test pad 130, the width of the second test pad 130 in the width direction is the width of the second test pad 130, and the minimum value of the width is 0.3mm or more.
Here, the shapes of the first and second test pads 120 and 130 are not particularly limited, and for example, at least one of the first and second test pads 120 and 130 is square. That is, the first test pad 120 may be square, and the second test pad 130 may be square, and of course, both the first test pad 120 and the second test pad 130 may be square. When the first and second test pads 120 and 130 are both square, the minimum distance between the first and second test pads 120 and 130 is 0.15mm or more. Further, in order to facilitate the contact of the probe pins 103 with the corresponding pads, at least one of the first and second test pads 120 and 130 has an area of 0.0625mm or more2。
In addition, in order to increase the versatility of the test pad, in the test stage, the first test pad 120 and the second test pad 130 may be conducted through a test device for testing; after the test is finished, the first test pad 120 and the second test pad 130 may be electrically connected through the conductive member of the main body 110, so that the first test pad 120 and the second test pad 130 may be used as a functional element of the electronic device 1000, for example, after the test is finished, the first test pad 120 and the second test pad 130 are conductively connected by using a soldering process, and the conductively connected first test pad 120 and the second test pad 130 are used as an antenna element.
It should be noted that, a conductive member may be disposed on the main body portion 110 to be electrically connected, one end of the conductive member electrically connected is an output end 101, and the other end is an input end 102, the output end 101 may be electrically connected to the first test pad 120, and the input end 102 may be electrically connected to the second test pad 130. After the test is finished, the output terminal 101 and the input terminal 102 are electrically connected by soldering, so that the first test pad 120 and the second test pad 130 can perform other functions (e.g., an antenna function, a conductive function, etc.) on the electronic device 1000.
In addition, in order to electrically connect the first testing pad 120 and the second testing pad 130 during welding, the first testing pad 120 and the second testing pad 130 can be both crescent-shaped, and the two crescent-shaped testing pads are oppositely arranged, so that during welding, the first testing pad 120 and the second testing pad 130 are electrically connected together, and meanwhile, the reliability and the stability of the electrical connection of the first testing pad 120 and the second testing pad 130 can also be improved.
As shown in fig. 5, an electronic device 1000 according to an embodiment of the present application includes a housing 200 and a circuit board 100.
Wherein the circuit board 100 is disposed in the housing 200. As shown in fig. 1 to 4, the circuit board 100 includes a body portion 110, a first test pad 120 and a second test pad 130, the first test pad 120 and the second test pad 130 are provided at the body portion 110, the second test pad 130 is spaced apart from the first test pad 120, and at least one of the first test pad 120 and the second test pad 130 has a non-slip portion 140. Further, the anti-slip part 140 is a rough surface 141, a blind hole 142 or a through hole 143.
When the probe is brought into contact with the corresponding test pad at the time of testing, the probe is liable to slip off the corresponding test pad. In the embodiment of the present application, the anti-slip portion 140 is disposed on the corresponding test pad, so that the contact stability of the probe 103 and the corresponding test pad can be improved, and the test efficiency of the test experiment can be improved.
According to the circuit board 100 of the electronic device 1000 in the embodiment of the application, the test pads (for example, the first test pad 120 and the second test pad 130) are arranged on the circuit board 100, and during testing, the probes 103 can be directly contacted with the corresponding test pads to test the circuit board 100, so that the test pads can be used to replace a test socket structure, the number of electrical components on the circuit board 100 is reduced, and the overall height of the circuit board 100 is reduced, thereby not only saving the production cost, but also easily realizing the light and thin design of the electronic device 1000. In addition, by providing the anti-slip part 140 on the corresponding test pad, the contact stability of the probe 103 with the corresponding test pad can be improved, thereby improving the test efficiency of the test experiment.
In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "left," "right," etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application. In the description of the present application, "a plurality" means two or more.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (19)

1. A circuit board of an electronic device, comprising:
a main body portion;
a first test pad provided on the main body portion;
the second testing pad is arranged on the main body part and is spaced from the first testing pad so as to be directly contacted with the testing pad by using a probe during testing, so that the circuit board is tested by using the testing pad to replace a testing seat structure, and the first testing pad and the second testing pad are suitable for being electrically connected through the conductive piece of the main body part after the testing is finished;
at least one of the first test pad and the second test pad has a non-slip portion.
2. The circuit board of electronic equipment according to claim 1, wherein the non-slip portion is a rough surface.
3. The circuit board of electronic equipment according to claim 1, wherein the non-slip portion is a blind hole,
the circuit board comprises a first metal layer, and the first metal layer is arranged on the inner wall of the blind hole.
4. The circuit board of an electronic device according to claim 3, wherein the blind hole has a first opening,
the circuit board comprises a first flanging metal layer, the first flanging metal layer is connected with the first metal layer, and the first flanging metal layer wraps the edge of the first opening.
5. The circuit board of electronic equipment according to claim 1, wherein the non-slip portion is a through hole,
the circuit board comprises a second metal layer, and the second metal layer is arranged on the inner wall of the through hole.
6. The circuit board of an electronic device according to claim 5, wherein the through hole has a second opening, wherein the second opening is located at one end of the through hole,
the circuit board further comprises a second flanging metal layer, the second flanging metal layer is connected with the second metal layer, and the second flanging metal layer wraps the edge of the second opening.
7. The circuit board of an electronic device according to claim 5, wherein the through-hole has a third opening, wherein the third opening is located at the other end of the through-hole,
the circuit board further comprises a third flanging metal layer, the third flanging metal layer is connected with the second metal layer, and the third flanging metal layer wraps the edge of the third opening.
8. The circuit board of electronic equipment of claim 1, wherein the first test pad is circular.
9. The circuit board of electronic equipment according to claim 8, wherein the diameter of the first test pad is 0.4-1.6 mm.
10. The circuit board of electronic equipment according to claim 9, wherein the diameter of the first test pad is 0.9-1.0 mm.
11. The circuit board of the electronic device according to claim 8, wherein the second test pad has a strip shape, and a minimum width of the second test pad is 0.3mm or more.
12. The circuit board of electronic equipment of claim 1, wherein at least one of the first test pad and the second test pad is square.
13. The circuit board of the electronic device according to claim 1, wherein at least one of the first test pad and the second test pad has an area of 0.0625mm or more2。
14. The circuit board of electronic equipment according to claim 1, wherein said first test pad and said second test pad are each square,
the minimum distance between the first test pad and the second test pad is greater than or equal to 0.15 mm.
15. The circuit board of electronic equipment according to claim 1, wherein the non-slip portion is plural.
16. The circuit board of claim 1, wherein the first test pad and the second test pad are both plural, and the plural first test pads and the plural second test pads are in one-to-one correspondence and electrically connected.
17. The circuit board of claim 1, wherein the first test pad and the second test pad are each a plurality of pads, and each of the first test pads is electrically connected to a corresponding one of the second test pads.
18. An electronic device, comprising:
a housing;
the circuit board, the circuit board is located in the shell, the circuit board includes main part, first test pad and second test pad, first test pad with the second test pad is located the main part, the second test pad with first test pad is spaced apart in order to utilize the probe directly to contact with the test pad when testing, in order to right the circuit board tests in order to utilize the test pad to replace the test seat structure, and at the end of the test first test pad with the second test pad is suitable for to pass through the electrically conductive piece electricity of main part is connected, first test pad with at least one in the second test pad has anti-skidding portion.
19. The electronic device of claim 18, wherein the anti-slip portion is a rough surface, a blind hole, or a through hole.
CN201910661194.2A 2019-07-22 2019-07-22 Circuit board of electronic equipment and electronic equipment Active CN110402014B (en)

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CN2920648Y (en) * 2006-05-30 2007-07-11 华为技术有限公司 Circuit board printing device and steel net thereof
CN201839519U (en) * 2010-09-24 2011-05-18 比亚迪股份有限公司 Radio-frequency circuit board and terminal equipment
CN102480852B (en) * 2010-11-22 2014-02-05 富葵精密组件(深圳)有限公司 Method for manufacturing circuit boards
TWI416233B (en) * 2010-12-24 2013-11-21 Au Optronics Corp Display panel
CN104093269B (en) * 2014-06-11 2017-09-19 深圳市磊科实业有限公司 The application method for the shared pad structure that compatible antennas is welded and thimble is tested
CN105703847B (en) * 2016-03-07 2018-03-23 广东欧珀移动通信有限公司 A kind of printed circuit board (PCB) and electric terminal
CN206728360U (en) * 2017-04-05 2017-12-08 捷开通讯(深圳)有限公司 A kind of radio frequency circuit board and mobile terminal
CN107276689A (en) * 2017-06-20 2017-10-20 北京小米移动软件有限公司 The method of testing and test fixture of WiFi module performances

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