CN110402014A - The circuit board and electronic equipment of electronic equipment - Google Patents
The circuit board and electronic equipment of electronic equipment Download PDFInfo
- Publication number
- CN110402014A CN110402014A CN201910661194.2A CN201910661194A CN110402014A CN 110402014 A CN110402014 A CN 110402014A CN 201910661194 A CN201910661194 A CN 201910661194A CN 110402014 A CN110402014 A CN 110402014A
- Authority
- CN
- China
- Prior art keywords
- weld pad
- testing weld
- circuit board
- electronic equipment
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
Abstract
This application discloses the circuit board of a kind of electronic equipment and electronic equipments.Circuit board includes main part, the first testing weld pad and the second testing weld pad, first testing weld pad is set to main part, second testing weld pad is set to main part, and the second testing weld pad is spaced apart with the first testing weld pad, and at least one of the first testing weld pad and the second testing weld pad have anti-slip part.According to the circuit board of the electronic equipment of the application, by the way that testing weld pad is arranged on circuit boards, it can use probe directly to contact with corresponding testing weld pad, to test circuit board, so as to replace test holder structure using testing weld pad, the number of electric elements on circuit board is reduced, circuit board whole height is reduced, thus production cost can be not only saved, is also easy to realize the lightening design of electronic equipment.In addition, the contact stabilization of probe with corresponding testing weld pad can be promoted by the way that anti-slip part is arranged on corresponding testing weld pad, it is possible thereby to promote the testing efficiency of test experiments.
Description
Technical field
This application involves technical field of communication equipment, more particularly, to the circuit board and electronic equipment of a kind of electronic equipment.
Background technique
In the related technology, electronic equipment has wireless communication function, in order to realize wireless communication function, needs to set in electronics
Standby interior setting Anneta module.Electronic equipment when testing, needs to test antenna performance.Test the day of electronic equipment
It linearly when energy, arranges that an antenna measurement seat, probe are withstood on test bench in the circuit board, make to input (IN) and exports (OUT)
End separates, and input section directly tests antenna performance with probe connection.
On the one hand, antenna measurement seat cost has certain cost, this results in the production cost of circuit board to be promoted；Another party
Face, an antenna measurement seat need the area 2.5mm*2.5mm occupied, (the especially mobile phone in one piece of circuit board in the circuit board
Circuit board mainboard) mutiple antennas test bench need to be placed, circuit board is caused under the more and more intensive situation of circuit-board laying-out density
The promotion of plate suqare, while the height of entire PCBA can also be made to increase, nowadays mobile phone is more and more lightening, and whole mobile phone master
It is usually antenna measurement seat (reaching about 2.0mm) that element is highest in plate, influences the integral thickness of mobile phone, is unsatisfactory for the light of mobile phone
Thinning design requirement.
Apply for content
The application provides the circuit board and electronic equipment of a kind of electronic equipment, and the circuit board and electronics of the electronic equipment are set
It is standby to have the advantages that structure is simple, at low cost, convenient test.
According to the circuit board of the electronic equipment of the embodiment of the present application, comprising: main part；First testing weld pad, described first
Testing weld pad is set to the main part；Second testing weld pad, second testing weld pad are set to the main part, and described second surveys
Test weld disk is spaced apart with first testing weld pad；At least one of first testing weld pad and second testing weld pad
With anti-slip part.
According to the circuit board of the electronic equipment of the embodiment of the present application, by the way that testing weld pad is arranged on circuit boards, testing
When, it can use probe and directly contacted with corresponding testing weld pad, to test circuit board, so as to utilize test weldering
Disk replaces test holder structure, reduces the number of electric elements on circuit board, reduces the whole height of circuit board, thus not only can be with
Production cost is saved, is also easy to realize the lightening design of electronic equipment.In addition, anti-by being arranged on corresponding testing weld pad
Cunning portion, can promote the contact stabilization of probe with corresponding testing weld pad, it is possible thereby to promote the testing efficiency of test experiments.
In some embodiments, the anti-slip part is rough surface.
In some embodiments, the anti-slip part is blind hole, and the circuit board includes the first metal layer, first metal
Layer is set to the inner wall of the blind hole.
In some embodiments, the blind hole has the first opening, and the circuit board includes the first flange metal layer, described
First flange metal layer is connect with the first metal layer, and the first flange metal layer is wrapped in the side of first opening
Edge.
In some embodiments, the anti-slip part is through-hole, and the circuit board includes second metal layer, second metal
Layer is set to the inner wall of the through-hole.
In some embodiments, the through-hole has the second opening, wherein second opening is located at the one of the through-hole
End, the circuit board further includes the second flange metal layer, and the second flange metal layer is connect with the second metal layer, described
Second flange metal layer is wrapped in the edge of second opening.
In some embodiments, the through-hole is open with third, wherein third opening is located at the another of the through-hole
One end, the circuit board further include third flange metal layer, and the third flange metal layer is connect with the second metal layer, institute
State the edge that third flange metal layer is wrapped in the third opening.
In some embodiments, first testing weld pad is circle.
In some embodiments, the diameter of first testing weld pad is 0.4-1.6mm.
In some embodiments, the diameter of first testing weld pad is 0.9-1.0mm.
In some embodiments, second testing weld pad is elongated, and the minimum widith of second testing weld pad is big
In equal to 0.3mm.
In some embodiments, first testing weld pad and second testing weld pad are suitable for through the main part
Conduct piece electrical connection.
In some embodiments, at least one of first testing weld pad and second testing weld pad are pros
Shape.
In some embodiments, the area of at least one of first testing weld pad and described second testing weld pad is big
In equal to 0.0625mm2。
In some embodiments, first testing weld pad and second testing weld pad are square, and described first
Minimum range between testing weld pad and second testing weld pad is more than or equal to 0.15mm.
In some embodiments, the anti-slip part is multiple.
In some embodiments, first testing weld pad and second testing weld pad are multiple, and multiple described
One testing weld pad and multiple second testing weld pads are corresponded and are electrically connected.
In some embodiments, first testing weld pad and second testing weld pad are multiple, and each described
One testing weld pad is corresponding with multiple second testing weld pads to be electrically connected.
According to the electronic equipment of the embodiment of the present application, comprising: shell；Circuit board, the circuit board are set in the shell,
The circuit board includes main part, the first testing weld pad and the second testing weld pad, and first testing weld pad and described second are surveyed
Test weld disk is set to the main part, and second testing weld pad is spaced apart with first testing weld pad, the first test weldering
At least one of disk and second testing weld pad have anti-slip part.
According to the electronic equipment of the embodiment of the present application, by the way that testing weld pad is arranged on circuit boards, in test, Ke Yili
It is directly contacted with corresponding testing weld pad with probe, to test circuit board, is surveyed so as to be replaced using testing weld pad
Holder structure is tried, the number of the electric elements on circuit board is reduced, reduces the whole height of circuit board, thus can not only save life
Cost is produced, is also easy to realize the lightening design of electronic equipment.In addition, by the way that anti-slip part is arranged on corresponding testing weld pad,
The contact stabilization of probe with corresponding testing weld pad can be promoted, it is possible thereby to promote the testing efficiency of test experiments.
In some embodiments, the anti-slip part is rough surface, blind hole or through-hole.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram according to the circuit board of the electronic equipment of the embodiment of the present application；
Fig. 2 is the structural schematic diagram according to the circuit board of the electronic equipment of the embodiment of the present application；
Fig. 3 is the schematic cross-sectional view according to the circuit board of the electronic equipment of the embodiment of the present application；
Fig. 4 is the schematic cross-sectional view according to the circuit board of the electronic equipment of the embodiment of the present application；
Fig. 5 is the structural schematic diagram according to the electronic equipment of the embodiment of the present application.
Appended drawing reference:
Electronic equipment 1000, shell 200,
Circuit board 100, output end 101, input terminal 102, probe 103,
Main part 110,
First testing weld pad 120, the first sub- testing weld pad 1201, the second sub- testing weld pad 1202,
Second testing weld pad 130, the sub- testing weld pad 1301 of third, the 4th sub- testing weld pad 1302,
Anti-slip part 140,
Rough surface 141,
Blind hole 142, the first opening 1421,
The first metal layer 1422, the first flange metal layer 1423,
Through-hole 143, the second opening 1431, third opening 1432,
Second metal layer 1433, the second flange metal layer 1434, third flange metal layer 1435.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
Below with reference to Fig. 1-Fig. 5 description according to the circuit board 100 and electronic equipment of the electronic equipment of the embodiment of the present application
1000。
According to the circuit board 100 of the electronic equipment of the embodiment of the present application, including main part 110,120 and of the first testing weld pad
Second testing weld pad 130.
Specifically, the first testing weld pad 120 and the second testing weld pad 130 are set to main part 110 namely main part
110 can carry the first testing weld pad 120 and the second testing weld pad 130.Here, the first testing weld pad 120 and the second test weldering
Disk 130 can be antenna measurement pad or circuit test pad etc., it is possible thereby to utilize the first testing weld pad 120 and the second test
Pad 130 tests the antenna performance of electronic equipment 1000 or the conduction of circuit.
It should be noted that by the way that testing weld pad (such as the first testing weld pad 120 and second is arranged on circuit board 100
Testing weld pad 130), in test, it can use probe 103 and directly contact with corresponding testing weld pad so as to circuit board
100 are tested, and so as to replace test holder structure using testing weld pad, reduce the number of electric elements on circuit board 100,
The whole height for reducing circuit board 100, thus can not only save production cost, be also easy to realize the frivolous of electronic equipment 1000
Change design.
As shown in Figure 1 and Figure 2, the second testing weld pad 130 is spaced apart setting, the first testing weld pad with the first testing weld pad 120
120 and second at least one of testing weld pad 130 there is anti-slip part 140.It is understood that anti-slip part 140 can be set
On the first testing weld pad 120, also it can be set on the second testing weld pad 130；Certainly, anti-slip part 140 can be arranged simultaneously
On the first testing weld pad 120 and the second testing weld pad 130.
In the related technology, in test, when probe is contacted with corresponding testing weld pad, probe is easy from corresponding test weldering
It is slipped on disk.And probe can be promoted by the way that anti-slip part 140 is arranged on corresponding testing weld pad in embodiments herein
103 with the contact stabilization of corresponding testing weld pad, it is possible thereby to promote the testing efficiency of test experiments.
According to the circuit board 100 of the electronic equipment of the embodiment of the present application, by the way that testing weld pad is arranged on circuit board 100
(such as the first testing weld pad 120 and second testing weld pad 130) can use probe 103 and directly survey with corresponding in test
Contact pads are tried, to test circuit board 100, so as to replace test holder structure using testing weld pad, reduce circuit
The number of electric elements on plate 100 reduces the whole height of circuit board 100, thus can not only save production cost, be also easy to
Realize the lightening design of electronic equipment 1000.In addition, by the way that anti-slip part 140, Ke Yiti is arranged on corresponding testing weld pad
The contact stabilization for rising probe 103 and corresponding testing weld pad, it is possible thereby to promote the testing efficiency of test experiments.
As shown in Figure 1, anti-slip part 140 can be to be multiple, multiple anti-slip parts 140 are spaced apart on corresponding testing weld pad.
Multiple anti-slip parts 140 on each testing weld pad can be identical anti-slip part 140, or different anti-slip parts 140.Such as
Shown in Fig. 3, Fig. 4, anti-slip part 140 can be rough surface 141, blind hole 142 or through-hole 143.
When anti-slip part 140 is rough surface 141, rubbing between probe 103 and anti-slip part 140 is can be enhanced in rough surface 141
Power is wiped, so as to prevent probe 103 from slipping from anti-slip part 140.
It is sunk structure at 142 position of blind hole, the end of probe 103 can be caught in when anti-slip part 140 is blind hole 142
To sunk structure, contact the tip of probe 103 and the inner bottom wall of blind hole 142, the peripheral wall of blind hole 142 can be by probe
103 are limited to inside blind hole 142, so as to prevent probe 103 from slipping.It is understood that the open edge of sunk structure
It can be used for the stability of position probe 103, so as to so that probe 103 is steadily contacted with corresponding testing weld pad.Circuit
Plate 100 may include the first metal layer 1422, and the first metal layer 1422 is set to the inner wall of blind hole 142.It should be noted that passing through
The first metal layer 1422 is set, the stability that probe 103 is electrically connected with corresponding testing weld pad can be promoted.
Further, blind hole 142 has the first opening 1421, and circuit board 100 can also include the first flange metal layer
1423, the first flange metal layer 1423 is connect with the first metal layer 1422, and the first flange metal layer 1423 is wrapped in the first opening
1421 edge.It is understood that can use the edge of the first opening 1421 of the first flange metal layer 1423 package, work as spy
When needle 103 is located at the blind hole 142, the first flange metal layer 1423 can be visited with 103 real-time contact of probe so as to be promoted
The stability that needle 103 is electrically connected with pad.It, can be in order to facilitate setting the first metal layer 1422 and the first flange metal layer 1423
It is integrally formed the first metal layer 1422 and the first flange metal layer 1423, for example, the first metal layer 1422 and the first flange gold
Belonging to layer 1423 can be formed by plating process.
It is sunk structure at 143 position of through-hole, the end of probe 103 can be caught in when anti-slip part 140 is through-hole 143
To sunk structure, the open edge of sunk structure can be used for the stability of position probe 103, so as to so that probe
103 steadily contact with corresponding testing weld pad.Circuit board 100 can also include second metal layer 1433, second metal layer
1433 are set to the inner wall of through-hole 143.It should be noted that probe 103 and phase can be promoted by setting second metal layer 1433
The stability for the testing weld pad electrical connection answered.
Further, through-hole 143 has the second opening 1431, wherein the second opening 1431 is located at one end of through-hole 143, electricity
Road plate 100 can also include the second flange metal layer 1434, and the second flange metal layer 1434 is connect with second metal layer 1433, the
Two flange metal layers 1434 are wrapped in the edge of the second opening 1431.It is understood that can use the second flange metal layer
The edge of 1434 the second openings 1431 of package, when at the second opening 1431 that probe 103 is located at the through-hole 143, the second flange
Metal layer 1434 can be electrically connected with 103 real-time contact of probe so as to promoting probe 103 with corresponding testing weld pad steady
It is qualitative.In order to facilitate setting second metal layer 1433 and the second flange metal layer 1434, second metal layer 1433 and the can be made
Two flange metal layers 1434 are integrally formed, for example, second metal layer 1433 and the second flange metal layer 1434 can pass through coating
Technique is formed.
Further, through-hole 143 also has third opening 1432, and wherein third opening 1432 is located at the another of through-hole 143
One end, circuit board 100 can also include third flange metal layer 1435, third flange metal layer 1435 and second metal layer 1433
Connection, third flange metal layer 1435 are wrapped in the edge of third opening 1432.It is understood that can use third flange
Metal layer 1435 wraps up the edge of third opening 1432, when at the third opening 1432 that probe 103 is located at the through-hole 143, the
Three flange metal layers 1435 can be electrically connected with 103 real-time contact of probe so as to promote probe 103 with corresponding testing weld pad
The stability connect.In order to facilitate setting second metal layer 1433 and third flange metal layer 1435, second metal layer can be made
1433 and third flange metal layer 1435 be integrally formed, for example, second metal layer 1433 and third flange metal layer 1435 can be with
It is formed by plating process.
As shown in Figure 1 and Figure 2, multiple first testing weld pads 120 and multiple second test welderings can be equipped on main part 110
Disk 130, multiple first testing weld pads 120 and multiple second testing weld pads 130 are corresponded and are electrically connected.It should be noted that
First 130 several corresponding relationships of the number of testing weld pad 120 and the second testing weld pad are not limited to this, for example, the first test weldering
The electrical connection corresponding with multiple second testing weld pads 130 of disk 120.
The shape of multiple first testing weld pads 120 can be identical, can not also be identical.First testing weld pad 120 can wrap
The first sub- testing weld pad 1201 and the second sub- testing weld pad 1202 are included, the second testing weld pad 130 may include the test weldering of third
Disk 1301 and the 4th sub- testing weld pad 1302.
For example, as shown in Figure 1, first sub- testing weld pad 1201 and the second sub- testing weld pad 1202 are on main part 110
It is one, the sub- testing weld pad 1301 of third is one, and the 4th sub- testing weld pad 1302 is two, a first sub- testing weld pad
1201 is corresponding with the sub- testing weld pad 1301 of a third, a second sub- testing weld pad 1202 and two the 4th sub- testing weld pads
1302 is corresponding.Wherein, the first sub- testing weld pad 1201 and the sub- testing weld pad 1301 of third can be in crescent shape, the second son test
Pad 1202 is rounded, and the 4th sub- testing weld pad 1302 is elongated, and the sub- testing weld pad 1302 of the 4th of the strip can edge
Arc line shaped extends, and can also extend along linear type.
For another example, as shown in Fig. 2, on main part 110, the first sub- testing weld pad 1201 and the second sub- testing weld pad 1202 are
It is one, the sub- testing weld pad 1301 of third is one, and the 4th sub- testing weld pad 1302 is two, a first sub- testing weld pad
1201 is corresponding with the sub- testing weld pad 1301 of a third, a second sub- testing weld pad 1202 and two the 4th sub- testing weld pads
1302 is corresponding.Wherein, the first sub- testing weld pad 1201 and the sub- testing weld pad 1301 of third can be square, the second son test
Pad 1202 is rounded, and the 4th sub- testing weld pad 1302 is elongated, and the sub- testing weld pad 1302 of the 4th of the strip can edge
Arc line shaped extends, and can also extend along linear type.
When the first testing weld pad 120 is round, the diameter of the first testing weld pad 120 can be 0.4-1.6mm.Further
Ground, when the diameter of the first testing weld pad 120 be 0.9-1.0mm when, the connection effect of the first testing weld pad 120 is more preferable, more have with
The test of antenna performance is carried out conducive to probe 103.
When the second testing weld pad 130 is elongated, the minimum widith of the second testing weld pad 130 is more than or equal to 0.3mm.It needs
It is noted that " width " here can refer to: the length direction of the second testing weld pad 130 is left and right directions as shown in Figure 1,
The up and down direction (up and down direction as shown in Figure 1) being perpendicularly to the direction is the width direction of the second testing weld pad 130, and second surveys
Width of the test weld disk 130 in the width direction is the width of the second testing weld pad 130, and the minimum value of the width is more than or equal to
0.3mm。
Here, the shape of the first testing weld pad 120 and the second testing weld pad 130 is not specifically limited, for example, first surveys
At least one of test weld disk 120 and the second testing weld pad 130 are square.That is, the first testing weld pad 120 can be pros
Shape, the second testing weld pad 130 can be square, and certainly, the first testing weld pad 120 and the second testing weld pad 130 all can be
Square.When the first testing weld pad 120 and the second testing weld pad 130 are square, the first testing weld pad 120 and second is surveyed
Minimum range between test weld disk 130 is more than or equal to 0.15mm.Further, it is connect in order to facilitate probe 103 with corresponding pad
The area of at least one of touching, the first testing weld pad 120 and the second testing weld pad 130 is more than or equal to 0.0625mm2。
In addition, in order to increase the multifunctionality of testing weld pad, in test phase, the first testing weld pad 120 and the second test
Pad 130 can be connected by test equipment, to be tested；After test, the first testing weld pad 120 and the second test
Pad 130 can be electrically connected by the conduct piece of main part 110, so that the first testing weld pad 120 and second testing weld pad
130 can be used as the function element of electronic equipment 1000, such as after test, using welding procedure by the first testing weld pad
120 and second testing weld pad 130 be conductively connected, and by the first testing weld pad 120 and the second testing weld pad 130 after conductive connection
It is used as antenna element.
It should be noted that conduct piece electrical connection can be arranged on main part 110, one end of conduct piece electrical connection is defeated
Outlet 101, the other end are input terminal 102, and output end 101 can be electrically connected with the first testing weld pad 120, and input terminal 102 can be with
It is electrically connected with the second testing weld pad 130.After test, output end 101 and input terminal 102 are electrically connected by welding, from
And the first testing weld pad 120 and the second testing weld pad 130 can be made to realize (such as the antenna of the other function on electronic equipment 1000
Function, conducting function etc.).
In addition, being for convenience electrically connected the first testing weld pad 120 and the second testing weld pad 130 in welding, first is surveyed
Test weld disk 120 and the second testing weld pad 130 can be in crescent shape, and the testing weld pad of two crescent shapes is oppositely arranged, thus
In welding, be conducive to for the first testing weld pad 120 and the second testing weld pad 130 being electrically connected, while can also be promoted
The reliability and stability of first testing weld pad 120 and the electrical connection of the second testing weld pad 130.
As shown in figure 5, according to the electronic equipment 1000 of the embodiment of the present application, including shell 200 and circuit board 100.
Wherein, circuit board 100 is set in shell 200.As Figure 1-Figure 4, circuit board 100 includes main part 110, first
Testing weld pad 120 and the second testing weld pad 130, the first testing weld pad 120 and the second testing weld pad 130 are set to main part 110, the
Two testing weld pads 130 are spaced apart with the first testing weld pad 120, in the first testing weld pad 120 and the second testing weld pad 130 at least
One has anti-slip part 140.Further, anti-slip part 140 is rough surface 141, blind hole 142 or through-hole 143.
In test, when probe is contacted with corresponding testing weld pad, probe is easy to slip from corresponding testing weld pad.And
In embodiments herein, by the way that anti-slip part 140 is arranged on corresponding testing weld pad, probe 103 and corresponding can be promoted
Testing weld pad contact stabilization, it is possible thereby to promote the testing efficiency of test experiments.
According to the circuit board 100 of the electronic equipment 1000 of the embodiment of the present application, by the way that test weldering is arranged on circuit board 100
Disk (such as the first testing weld pad 120 and second testing weld pad 130), test when, can use probe 103 directly with it is corresponding
Testing weld pad contact, tests circuit board 100, so as to replace test holder structure using testing weld pad, reduces circuit
The number of electric elements on plate 100 reduces the whole height of circuit board 100, thus can not only save production cost, be also easy to
Realize the lightening design of electronic equipment 1000.In addition, by the way that anti-slip part 140, Ke Yiti is arranged on corresponding testing weld pad
The contact stabilization for rising probe 103 and corresponding testing weld pad, it is possible thereby to promote the testing efficiency of test experiments.
In the description of the present application, it is to be understood that term " length ", " width ", "upper", "lower", "left", "right",
The orientation or positional relationship of equal instructions is to be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the application and
Simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation construction
And operation, therefore should not be understood as the limitation to the application.In the description of the present application, the meaning of " plurality " is two or two
More than.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this
The range of application is defined by the claims and their equivalents.
Claims (20)
1. the circuit board of a kind of electronic equipment characterized by comprising
Main part；
First testing weld pad, first testing weld pad are set to the main part；
Second testing weld pad, second testing weld pad are set to the main part, and second testing weld pad and described first are surveyed
Test weld disk is spaced apart；
At least one of first testing weld pad and second testing weld pad have anti-slip part.
2. the circuit board of electronic equipment according to claim 1, which is characterized in that the anti-slip part is rough surface.
3. the circuit board of electronic equipment according to claim 1, which is characterized in that the anti-slip part is blind hole,
The circuit board includes the first metal layer, and the first metal layer is set to the inner wall of the blind hole.
4. the circuit board of electronic equipment according to claim 3, which is characterized in that the blind hole has the first opening,
The circuit board includes the first flange metal layer, and the first flange metal layer is connect with the first metal layer, described
First flange metal layer is wrapped in the edge of first opening.
5. the circuit board of electronic equipment according to claim 1, which is characterized in that the anti-slip part is through-hole,
The circuit board includes second metal layer, and the second metal layer is set to the inner wall of the through-hole.
6. the circuit board of electronic equipment according to claim 5, which is characterized in that the through-hole has the second opening,
Described in second opening be located at the through-hole one end,
The circuit board further includes the second flange metal layer, and the second flange metal layer is connect with the second metal layer, institute
State the edge that the second flange metal layer is wrapped in second opening.
7. the circuit board of electronic equipment according to claim 5, which is characterized in that the through-hole is open with third,
Described in third opening be located at the through-hole the other end,
The circuit board further includes third flange metal layer, and the third flange metal layer is connect with the second metal layer, institute
State the edge that third flange metal layer is wrapped in the third opening.
8. the circuit board of electronic equipment according to claim 1, which is characterized in that first testing weld pad is circle.
9. the circuit board of electronic equipment according to claim 8, which is characterized in that the diameter of first testing weld pad is
0.4-1.6mm。
10. the circuit board of electronic equipment according to claim 9, which is characterized in that the diameter of first testing weld pad
For 0.9-1.0mm.
11. the circuit board of electronic equipment according to claim 8, which is characterized in that second testing weld pad is in strip
The minimum widith of shape, second testing weld pad is more than or equal to 0.3mm.
12. the circuit board of electronic equipment according to claim 1, which is characterized in that first testing weld pad with it is described
Second testing weld pad is suitable for being electrically connected by the conduct piece of the main part.
13. the circuit board of electronic equipment according to claim 1, which is characterized in that first testing weld pad and described
At least one of second testing weld pad is square.
14. the circuit board of electronic equipment according to claim 1, which is characterized in that first testing weld pad and described
The area of at least one of second testing weld pad is more than or equal to 0.0625mm2。
15. the circuit board of electronic equipment according to claim 1, which is characterized in that first testing weld pad and described
Second testing weld pad is square,
Minimum range between first testing weld pad and second testing weld pad is more than or equal to 0.15mm.
16. the circuit board of electronic equipment according to claim 1, which is characterized in that the anti-slip part is multiple.
17. the circuit board of electronic equipment according to claim 1, which is characterized in that first testing weld pad and described
Second testing weld pad be it is multiple, multiple first testing weld pads and multiple second testing weld pads are corresponded and are electrically connected
It connects.
18. the circuit board of electronic equipment according to claim 1, which is characterized in that first testing weld pad and described
Second testing weld pad is multiple, each first testing weld pad electrical connection corresponding with multiple second testing weld pads.
19. a kind of electronic equipment characterized by comprising
Shell；
Circuit board, the circuit board are set in the shell, and the circuit board includes main part, the first testing weld pad and the second survey
Test weld disk, first testing weld pad and second testing weld pad are set to the main part, second testing weld pad and institute
It states the first testing weld pad to be spaced apart, at least one of first testing weld pad and second testing weld pad have anti-skidding
Portion.
20. electronic equipment according to claim 19, which is characterized in that the anti-slip part is rough surface, blind hole or through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910661194.2A CN110402014B (en) | 2019-07-22 | 2019-07-22 | Circuit board of electronic equipment and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910661194.2A CN110402014B (en) | 2019-07-22 | 2019-07-22 | Circuit board of electronic equipment and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110402014A true CN110402014A (en) | 2019-11-01 |
| CN110402014B CN110402014B (en) | 2021-03-16 |
Family
ID=68324924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910661194.2A Active CN110402014B (en) | 2019-07-22 | 2019-07-22 | Circuit board of electronic equipment and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110402014B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2920648Y (en) * | 2006-05-30 | 2007-07-11 | 华为技术有限公司 | Circuit board printing device and steel net thereof |
| CN201839519U (en) * | 2010-09-24 | 2011-05-18 | 比亚迪股份有限公司 | Radio-frequency circuit board and terminal equipment |
| CN102122092A (en) * | 2010-12-24 | 2011-07-13 | 友达光电股份有限公司 | Display panel |
| CN102480852A (en) * | 2010-11-22 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit boards |
| CN104093269A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | Common pad structure compatible with antenna welding and thimble testing, and application method thereof |
| CN105703847A (en) * | 2016-03-07 | 2016-06-22 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic terminal |
| CN107276689A (en) * | 2017-06-20 | 2017-10-20 | 北京小米移动软件有限公司 | The method of testing and test fixture of WiFi module performances |
| CN206728360U (en) * | 2017-04-05 | 2017-12-08 | 捷开通讯(深圳)有限公司 | A kind of radio frequency circuit board and mobile terminal |
-
2019
- 2019-07-22 CN CN201910661194.2A patent/CN110402014B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2920648Y (en) * | 2006-05-30 | 2007-07-11 | 华为技术有限公司 | Circuit board printing device and steel net thereof |
| CN201839519U (en) * | 2010-09-24 | 2011-05-18 | 比亚迪股份有限公司 | Radio-frequency circuit board and terminal equipment |
| CN102480852A (en) * | 2010-11-22 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | Method for manufacturing circuit boards |
| CN102122092A (en) * | 2010-12-24 | 2011-07-13 | 友达光电股份有限公司 | Display panel |
| CN104093269A (en) * | 2014-06-11 | 2014-10-08 | 深圳市磊科实业有限公司 | Common pad structure compatible with antenna welding and thimble testing, and application method thereof |
| CN105703847A (en) * | 2016-03-07 | 2016-06-22 | 广东欧珀移动通信有限公司 | Printed circuit board and electronic terminal |
| CN206728360U (en) * | 2017-04-05 | 2017-12-08 | 捷开通讯(深圳)有限公司 | A kind of radio frequency circuit board and mobile terminal |
| CN107276689A (en) * | 2017-06-20 | 2017-10-20 | 北京小米移动软件有限公司 | The method of testing and test fixture of WiFi module performances |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110402014B (en) | 2021-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104297534A (en) | Cantilever type high-frequency probe card | |
| WO2009154335A1 (en) | Printed circuit board electrically connected to the ground of electronic device | |
| US8333597B2 (en) | Connector and interposer using connector | |
| KR101133405B1 (en) | Cable connection pin and embeded antenna type electronic device including the same | |
| KR20150020138A (en) | Antenna circuit | |
| WO2005006003A1 (en) | Lsi test socket for bga | |
| CN107197595B (en) | Printed circuit board and welding design thereof | |
| CN105325064B (en) | Electronic device | |
| CN109983628A (en) | Conducting particles configures film, its manufacturing method, checks contact unit, conduction inspection method | |
| CN110402014A (en) | The circuit board and electronic equipment of electronic equipment | |
| CN101588675B (en) | Flexible printed circuit and manufacturing method thereof | |
| JP2011024022A (en) | Mobile walkie-talkie | |
| KR101311752B1 (en) | Contactor for testing semiconductor and manufacturing method thereof | |
| US8044877B2 (en) | Antenna | |
| JP4927901B2 (en) | Connection device | |
| CN208782077U (en) | A kind of chip test base | |
| US20050233620A1 (en) | Anisotropic conductive sheet and its manufacturing method | |
| JP2004333459A (en) | Contact probe, and semiconductor and electrical inspection device using the same | |
| CN113133188B (en) | Flexible circuit board, display module and display device | |
| TW200418239A (en) | Socket for electrical parts | |
| CN209748899U (en) | Circuit board | |
| JP3090329U (en) | Modular integrated circuit socket | |
| CN105977667A (en) | Electronic product and contact elastic piece thereof | |
| US8963568B2 (en) | Resistive probing tip system for logic analyzer probing system | |
| CN206728360U (en) | A kind of radio frequency circuit board and mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |