CN111129665A - Movable lead wire for flexibly interconnecting columnar lead wire of microwave device and substrate - Google Patents
Movable lead wire for flexibly interconnecting columnar lead wire of microwave device and substrate Download PDFInfo
- Publication number
- CN111129665A CN111129665A CN201911349552.2A CN201911349552A CN111129665A CN 111129665 A CN111129665 A CN 111129665A CN 201911349552 A CN201911349552 A CN 201911349552A CN 111129665 A CN111129665 A CN 111129665A
- Authority
- CN
- China
- Prior art keywords
- lead
- substrate
- microwave device
- movable
- jack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/06—Movable joints, e.g. rotating joints
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
A movable lead for flexibly interconnecting a columnar lead of a microwave device and a substrate comprises: a jack structure, a metal lead; one end of the metal lead is connected with the jack structure, and the other end of the metal lead is welded with the substrate; the jack structure and the columnar lead on the microwave device are electrically connected through the plug-in structure; the plug-in structure is a four-claw structure, and a mounting hole is formed in the center of the plug-in structure; the mounting hole is matched with the size of the columnar lead on the microwave device; the microwave device and the substrate are both mounted on an aluminum chassis. The invention can meet the requirement of interconnection of the movable lead and the device lead on stress release under the condition of environmental test, has the advantages of hard lap welding interconnection on signal transmission, can ensure the stability of signal transmission, reduces the rework rate of product repair, and obviously improves the production efficiency.
Description
Technical Field
The invention relates to a movable lead for flexibly interconnecting a columnar lead of a microwave device and a substrate, belonging to the technical field of electronic assembly.
Background
Microwave devices are an important component of microwave active electronic products. With the continuous expansion of user demands, the quantity of the satellite equipment requirements is continuously increased, the satellite functions are more and more complex, and the capacity is more and more large, so that the microwave active product has higher requirements, and the requirements on the quantity and the performance of microwave devices are further driven to be continuously improved.
The microwave device is interconnected with an adjacent substrate through a lead wire in a microwave active product to realize functions, the application environment is complex, and the assembly process of the microwave device, such as interconnection mode, interconnection materials, welding spot size and the like, can influence the transmission of microwave signals, thereby influencing the performance stability and consistency of the microwave device in a space environment. Meanwhile, the reliability of the interconnection point can influence the application reliability of the microwave device, thereby influencing the service life of the active complete machine.
At present, the interconnection mode of the microwave device leads can be divided into two modes, the first mode is that the device leads are directly welded with a substrate by adopting lead-tin solder, namely hard lap welding; the second is to use flexible materials (gold or copper) to interconnect the device leads. However, the problems of the above interconnection methods can be found in the application process, which mainly appear as follows:
1) the hard lap welding point consists of a device lead, a substrate and a welding flux, and the difference of the thermal expansion coefficients of different materials is large. In the process of the environmental test, the periodic change of the temperature leads the welding spot to be subjected to periodic tensile and compressive stress, and when the stress applied to the welding spot is greater than the fatigue strength of the tin-lead solder and the whole welding spot structure has no stress release room, the welding spot can crack, which is also the defect of hard lap welding.
2) The copper strip interconnection has a plurality of influences and limiting conditions on microwave signal transmission, and the copper strip is only suitable for a strip device lead structure, and simultaneously along with the miniaturization development of products, the operation space is gradually reduced, so that great limitation is caused to welding operation.
3) The gold ribbon interconnection reworking treatment is far more troublesome than the reworking treatment of tin-lead welding, can be implemented after the components such as the cover plate, the device and the like are dismantled, and has the disadvantages of complicated process and long time consumption. Meanwhile, the reliability of the pressure welding spot after reworking needs to be further verified, and a common processing method is to directly replace a device.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the defects of the prior art are overcome, the movable lead for flexibly interconnecting the columnar lead of the microwave device and the substrate is provided, the requirements of interconnection of the movable lead and the device lead on stress release under the environment test condition can be met, meanwhile, the advantages of hard lap welding interconnection on signal transmission are achieved, the signal transmission stability can be ensured, the product repair rework rate is reduced, and the production efficiency is remarkably improved.
The technical scheme of the invention is as follows:
a movable lead for flexibly interconnecting a columnar lead of a microwave device and a substrate comprises: a jack structure, a metal lead;
one end of the metal lead is connected with the jack structure, and the other end of the metal lead is welded with the substrate;
the jack structure and the columnar lead on the microwave device are electrically connected through the plug-in structure;
the plug-in structure is a four-claw structure, and a mounting hole is formed in the center of the plug-in structure; the mounting hole is matched with the size of the columnar lead on the microwave device;
the microwave device and the substrate are both mounted on an aluminum chassis.
The movable lead is made of beryllium bronze.
The surface coating of the movable lead is gold.
The thickness of the surface coating is more than or equal to 1.27 mu m.
One end of the jack structure is provided with a counter bore as a mounting hole, and the circumferential direction of the hole wall of the counter bore section of the jack structure is uniformly provided with a groove forming four-claw structure which is communicated along the radial direction.
The depth of the counter bore of the jack structure is 2 mm; the depth of the columnar lead wire inserted into the mounting hole on the microwave device is 1.2 mm; the hole wall of the jack structure counter bore section is 0.1 mm.
The metal lead is a variable-diameter stepped cylinder, and the diameter of one end of the metal lead, which is connected with the jack structure, is 0.75 mm; the diameter of the welding end of the metal lead and the substrate is 0.5 mm.
Compared with the prior art, the invention has the beneficial effects that:
1) the movable lead and the device lead are in jack type contact, so that the movable lead has sufficient stress release room under the environment test condition, and stress in the environment test and application process can be released, thereby reducing the probability of failure of interconnection points and ensuring the interconnection reliability of the device leads.
2) The movable lead and the substrate are soldered, so that coaxial-to-microstrip transmission can be directly realized in the aspect of signal transmission, the signal transmission loss is small, and the stability is high.
3) Beryllium bronze is selected as a processing material of the movable lead wire by combining microwave signal transmission, drawing force between the device lead wire and the jack structure and weldability of the movable lead wire, and the surface plating layer is gold.
4) In order to ensure the reliability of the interconnection structure and prevent the influence of the welding flux pollution jack on signal transmission, a stepped structure is adopted during design, and the diameter of a lead at one side of the interconnection with the substrate is smaller than that of a movable lead interconnected with a device lead.
Drawings
FIG. 1 is a schematic view of an integral weld configuration;
FIG. 2 is a view of a movable lead;
FIG. 3 is a schematic diagram of an electrical performance simulation analysis structure of an interconnection model of active leads according to the present invention;
FIG. 4 is a graph of insertion loss under the effect of the initial parameters of the present invention;
FIG. 5 is a graph of voltage standing wave ratio under the effect of initial parameters;
FIG. 6 is a test chart of the structure of a proof sample according to the present invention.
Detailed Description
The invention is based on the existing problems in the interconnection of microwave device leads and a substrate, designs a movable lead which is in jack contact with the device leads and is directly soldered with the substrate, can meet the requirements of the interconnection of the movable lead and the device leads on stress release under the condition of environmental test, has the advantages of hard lap welding interconnection on signal transmission, can ensure the stability of signal transmission, reduces the rework rate of products and obviously improves the production efficiency.
The interconnection of the microwave device lead and the substrate is widely applied to microwave active products, and aiming at the problems of the interconnection of the microwave device lead in the aspects of welding spot reliability, operability, reworkability and signal transmission, the movable lead structure for realizing the interconnection of the microwave device and the substrate is designed, and has the advantages of high interconnection point reliability, simple operation process, easiness in reworking and the like. Meanwhile, the highest application frequency band is found to be 20GHz by performing electrical performance test on the verification sample piece, and the microwave signal transmission requirement can be better met under the condition.
Therefore, the achievement can be completely popularized and applied to interconnection between the microwave device and the substrate in microwave active product production, and has important significance in the aspects of improving device lead interconnection efficiency, reducing production cost, improving product quality and the like.
As shown in fig. 1, the present invention relates to a movable lead for flexibly interconnecting a pillar lead of a microwave device and a substrate, comprising: jack structures, metal leads. One end of the metal lead is connected with the jack structure, and the other end of the metal lead is welded with the substrate; the jack structure and the columnar lead on the microwave device are electrically connected through the plug-in structure; the plug-in structure is a four-claw structure, and a mounting hole is formed in the center of the plug-in structure; the mounting hole is matched with the size of the columnar lead on the microwave device; the microwave device and the substrate are both mounted on an aluminum chassis. The movable lead is made of beryllium bronze.
In order to ensure the binding force between the jack and the device lead wire and simultaneously require that the jack is not easy to deform, the surface coating of the movable lead wire is provided with gold.
In order to ensure the signal transmission effect and facilitate the welding operation, the thickness of the surface coating is more than or equal to 1.27 mu m.
One end of the jack structure is provided with a counter bore as a mounting hole, and the circumferential direction of the hole wall of the counter bore section of the jack structure is uniformly provided with a groove forming four-claw structure which is communicated along the radial direction. The depth of the counter bore of the jack structure is 2 mm; the depth of the columnar lead wire inserted into the mounting hole on the microwave device is 1.2 mm; the hole wall of the jack structure counter bore section is 0.1 mm.
The metal lead is a variable-diameter stepped cylinder, and the diameter of one end of the metal lead, which is connected with the jack structure, is 0.75 mm; the diameter of the welding end of the metal lead and the substrate is 0.5 mm.
The design idea is as follows:
one, integral welding structure and movable lead structure design
1) Integral welding structure design
The overall solder structure has a significant impact on the reliability of the interconnection point and also on the transmission of microwave signals. Therefore, the overall soldering structure design diagram is shown in fig. 1 according to the structural relationship between the microwave device and the substrate.
As can be seen from fig. 1, the movable lead is formed by a jack and a lead junction. In the connection mode, the movable lead is connected with the device lead through the jack and connected with the substrate through the solder. The structure can effectively release the stress of the welding spot in the later-stage environment test process, and ensure the reliability of the welding spot.
2) Movable lead structure design
The key point of the design of the movable lead is two parts, namely, the reliability of the interconnection point is improved, and the signal transmission loss is reduced. In order to meet the above-mentioned objectives, both material selection and structural design need to be developed.
① choice of material
The movable lead and the device lead are in jack-type contact, so that the quality of the jack has important influence on the performance of the movable lead. In the application process, the following factors need to be considered, wherein firstly, the binding force between the jack and the device lead ensures that a certain drawing force is kept between the jack and the device lead; secondly, the jack structure can not cause serious damage to the surface coating of the microwave device lead; thirdly, the movable lead wire material has moderate hardness and is not easy to deform, thereby preventing the influence on the microwave signal transmission. Therefore, in terms of material selection, materials which have high advantages in elasticity, strength and plastic deformation and are nonmagnetic need to be used. Beryllium bronze has the title of "king of colored elastic material", and can meet the above requirements in terms of performance, so beryllium bronze is selected as a movable lead processing material.
The surface coating of the jack material can refer to the requirements of the central contact element of the radio frequency coaxial connector on the coating, namely the surface of the material is plated with gold, and the thickness of the gold layer is more than or equal to 1.27 mu m. Meanwhile, as the movable lead and the substrate are interconnected by using the solder, the surface of the movable lead is required to have good solderability, and the movable lead is convenient to solder. In summary, gold was chosen as the plating material.
② structural design
Firstly, from the structural design, the movable lead is in jack-type contact with the device lead, and is directly soldered with the substrate. In order to ensure the reliability of the interconnection structure and prevent the solder from polluting the jacks and influencing signal transmission, a stepped structure is adopted during design.
Secondly, in order to ensure the coaxial transmission of signals and easy processing, a straight slotting mode is adopted. The jack structure between the movable lead and the device lead is designed to be a 4-claw jack.
The active lead design is performed by taking a coaxial device lead with phi 0.3mm as an example, and the specific structure is shown in the following figure.
Fig. 2 shows a movable lead of a 4-claw jack structure, the thickness of each claw is 0.1mm, the diameter of the movable lead connected with a device lead is 0.75mm, the insertion depth of the device lead is 1.2mm, the depth of a groove is 2mm, the diameter of the lead connected with a substrate is 0.5mm, and the welding length is 1.5 mm.
The research shows that no lead interconnection method for the same type of devices exists at present in China, and research results have strong innovation, applicability and market competitiveness.
Third, verification test and result analysis
1) Interconnection point electrical property simulation analysis
In order to discuss the influence of the interconnection point form on microwave signal transmission, the interconnection point form is subjected to simulation analysis by combining the requirements of microwave amplifiers of different frequency bands on standing waves and insertion loss indexes, and the optimal interconnection parameters are determined. The electrical performance simulation analysis structure of the active lead interconnection model is shown in fig. 3.
The definitions of the variables and the initial value selections in FIG. 3 are detailed in Table 1. Taking the L-band as an example, the insertion loss obtained by performing electrical performance simulation analysis under the initial value parameter is shown in fig. 4, and the voltage standing wave ratio is shown in fig. 5. According to simulation analysis, the available frequency bands of the active lead interconnection mode are L, S, C, Ku and K frequency bands.
2) Sample design and electrical performance testing
According to the result of the electrical property simulation analysis, a verification sample structure as shown in fig. 6 is designed and manufactured, and the electrical property of the sample is tested.
After the electrical performance test of the test sample piece, the highest application frequency band of the interconnection structure of the movable lead is 20GHz, the requirement of signal transmission can be met under the condition, and VSWR is less than or equal to 1.8 dB.
Those skilled in the art will appreciate that the details of the invention not described in detail in the specification are within the skill of those skilled in the art.
Claims (7)
1. A movable lead for flexibly interconnecting a columnar lead of a microwave device and a substrate is characterized by comprising: a jack structure, a metal lead;
one end of the metal lead is connected with the jack structure, and the other end of the metal lead is welded with the substrate;
the jack structure and the columnar lead on the microwave device are electrically connected through the plug-in structure;
the plug-in structure is a four-claw structure, and a mounting hole is formed in the center of the plug-in structure; the mounting hole is matched with the size of the columnar lead on the microwave device;
the microwave device and the substrate are both mounted on an aluminum chassis.
2. The microwave device cylindrical lead and the flexible interconnected movable lead of the substrate as claimed in claim 1, wherein the material of the movable lead is beryllium bronze.
3. The microwave device cylindrical lead and the flexible interconnected movable lead of the substrate as claimed in any one of claims 1 to 2, wherein the surface coating of the movable lead is gold.
4. The flexible interconnection active lead wire for the pillar lead wire and the substrate of the microwave device as claimed in claim 3, wherein the thickness of the surface coating is greater than or equal to 1.27 μm.
5. The microwave device cylindrical lead and the flexible interconnected movable lead of the substrate as claimed in claim 3, wherein one end of the jack structure is provided with a counter bore as a mounting hole, and the peripheral direction of the hole wall of the counter bore section of the jack structure is uniformly provided with a groove which is communicated along the radial direction to form a four-claw structure.
6. The microwave device cylindrical lead and the flexible interconnected movable lead of the substrate as claimed in claim 5, wherein the depth of the counter bore of the jack structure is 2 mm; the depth of the columnar lead wire inserted into the mounting hole on the microwave device is 1.2 mm; the hole wall of the jack structure counter bore section is 0.1 mm.
7. The microwave device cylindrical lead and the flexible interconnected movable lead of the substrate as claimed in claim 4, wherein the metal lead is a variable diameter stepped cylinder, and the diameter of the end of the metal lead connected with the jack structure is 0.75 mm; the diameter of the welding end of the metal lead and the substrate is 0.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911349552.2A CN111129665A (en) | 2019-12-24 | 2019-12-24 | Movable lead wire for flexibly interconnecting columnar lead wire of microwave device and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911349552.2A CN111129665A (en) | 2019-12-24 | 2019-12-24 | Movable lead wire for flexibly interconnecting columnar lead wire of microwave device and substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111129665A true CN111129665A (en) | 2020-05-08 |
Family
ID=70501983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911349552.2A Pending CN111129665A (en) | 2019-12-24 | 2019-12-24 | Movable lead wire for flexibly interconnecting columnar lead wire of microwave device and substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111129665A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113972521A (en) * | 2021-12-27 | 2022-01-25 | 中国电子科技集团公司第二十九研究所 | Center contact, connector and connector center contact crimping end structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010125902A (en) * | 2008-11-26 | 2010-06-10 | Nissei Electric Co Ltd | Heater for grip |
| CN110427698A (en) * | 2019-08-01 | 2019-11-08 | 西安电子科技大学 | A kind of movable leadframe joint welding interconnection point regulation method towards electromagnetic transmission performance |
| CN110442960A (en) * | 2019-08-01 | 2019-11-12 | 西安电子科技大学 | The coupling prediction method of movable leadframe joint welding electromagnetic transmission performance and interconnection point form |
-
2019
- 2019-12-24 CN CN201911349552.2A patent/CN111129665A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010125902A (en) * | 2008-11-26 | 2010-06-10 | Nissei Electric Co Ltd | Heater for grip |
| CN110427698A (en) * | 2019-08-01 | 2019-11-08 | 西安电子科技大学 | A kind of movable leadframe joint welding interconnection point regulation method towards electromagnetic transmission performance |
| CN110442960A (en) * | 2019-08-01 | 2019-11-12 | 西安电子科技大学 | The coupling prediction method of movable leadframe joint welding electromagnetic transmission performance and interconnection point form |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113972521A (en) * | 2021-12-27 | 2022-01-25 | 中国电子科技集团公司第二十九研究所 | Center contact, connector and connector center contact crimping end structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6659784B1 (en) | Connector with switching device | |
| JP4405358B2 (en) | Inspection unit | |
| US20110121850A1 (en) | Spring structure and test socket using thereof | |
| US7656175B2 (en) | Inspection unit | |
| US6809265B1 (en) | Terminal assembly for a coaxial cable | |
| KR100638694B1 (en) | Inspection coaxial probe and inspection unit incorporating the same | |
| TWI482973B (en) | Wire material for spring, contact probe, and probe unit | |
| US20040212383A1 (en) | IC socket | |
| JP2010237133A (en) | Inspection socket and manufacturing method of the same | |
| CN110676551B (en) | Microstrip coaxial conversion structure with air cavity and interconnection method thereof | |
| US11251552B2 (en) | Method for the manufacture of a connecting element | |
| CN111129665A (en) | Movable lead wire for flexibly interconnecting columnar lead wire of microwave device and substrate | |
| CN207896297U (en) | A kind of elastomeric connector of soldering-free type test microstrip circuit | |
| CN104678230A (en) | Three-dimensional microwave assembly testing device | |
| CN215771495U (en) | Radio frequency microwave assembly | |
| KR101597109B1 (en) | TM mode dielectric resonator | |
| CN108695621A (en) | A kind of heterogeneous substrate high-frequency interconnection structure | |
| FI68134C (en) | METHOD FOER TILLVERKNING AV EN CONTACT CLAMP | |
| EP2282381A1 (en) | Contact probe device | |
| US20030019653A1 (en) | Intermetallic contact surface structure and connector | |
| CN111509346A (en) | Inverted structure circulator/isolator and processing method thereof | |
| US6354845B1 (en) | Apparatus and method for connecting a plurality of electrical circuits borne upon a plurality of substrates | |
| CN113937542B (en) | Non-metal conductive connector | |
| CN216015752U (en) | Conductive terminal | |
| CN219831805U (en) | Probe jig for software burning and software burning system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200508 |
|
| RJ01 | Rejection of invention patent application after publication |