CN113934264A

CN113934264A - Computing module and computing device comprising same

Info

Publication number: CN113934264A
Application number: CN202110790228.5A
Authority: CN
Inventors: 马甲坤; 张楠赓
Original assignee: Canaan Creative Co Ltd
Current assignee: Canaan Creative Co Ltd
Priority date: 2020-07-14
Filing date: 2021-07-13
Publication date: 2022-01-14
Also published as: CN215867687U

Abstract

The invention discloses a computing module and computing equipment comprising the computing module, wherein the computing module is connected with a power module and a control module of the computing equipment, the computing module comprises a substrate, and a computing chip and a conductive seat which are respectively connected on the substrate, the conductive seat comprises an electric conductive seat and a ground conductive seat, the electric conductive seat is connected with the power module, the ground conductive seat is grounded, the substrate is provided with an electric welding disc and a ground welding disc which respectively correspond to the electric conductive seat and the ground conductive seat, the control module comprises a control chip, the control module further comprises a first resistor, a second resistor and a third resistor, the ground welding disc comprises a ground welding disc and an isolated welding disc which are mutually separated, the control chip is connected with the isolated welding disc through a flat cable, the first resistor and the third resistor are connected with the flat cable and the ground, and the second resistor is connected with the flat cable and circuit voltage. The invention can achieve the purpose of detecting the falling of the conductive seat by only changing the encapsulation and adding three resistors, controls the power supply to be switched off when the ground conductive seat falls off so as to avoid burning the equipment, and has accurate result and low modification cost.

Description

Computing module and computing device comprising same

Technical Field

The present invention relates to a computing device, and more particularly, to a computing module for a computing device such as a virtual digital money handling device.

Background

The computing device is an electronic device for high-speed computing, such as an electronic device for running a specific algorithm, and communicating with a remote server to obtain corresponding virtual currency. The power supply connector of a computing board adopts a patch copper seat (an electric copper seat and a ground copper seat), and a signal wire is connected by a computing device with a flat cable with a ground wire, but the problem that the welding copper seat falls off easily occurs in the actual assembling and transporting process. If the electric copper seat falls off, the computing board does not work electrically, but if the ground copper seat falls off, large current returns through a ground wire in the signal flat cable, and the flat cable is overheated and burnt.

Disclosure of Invention

The invention aims to provide a computing module with a function of detecting falling of a ground conductive seat, so that a control board controls power supply to be turned off when the ground conductive seat falls, and burning is avoided.

The invention also provides a computing device comprising the computing module.

In order to achieve the above object, the computing module of the present invention is connected to a power module and a control module of a computing device, the computing module includes a substrate, and a computing chip and a conductive socket respectively connected to the substrate, the conductive socket includes an electrical conductive socket and an electrical ground conductive socket, the electrical conductive socket is connected to the power module, the electrical ground conductive socket is grounded, the substrate has an electrical pad and an electrical ground pad respectively corresponding to the electrical conductive socket and the electrical ground conductive socket, the control module includes a control chip, and further includes a first resistor, a second resistor and a third resistor, the electrical ground pad includes an electrical ground pad and an isolated pad which are separated from each other, the control chip is connected to the isolated pad through a flat cable, the first resistor and the third resistor are respectively connected to the flat cable and the ground, and the second resistor is connected to the flat cable and a circuit voltage.

In an embodiment of the foregoing calculation module, a resistance of the second resistor is greater than a resistance of the first resistor.

In an embodiment of the foregoing calculation module, a resistance of the second resistor is greater than a resistance of the third resistor.

In an embodiment of the foregoing computing module, the substrate is an aluminum substrate.

In an embodiment of the foregoing calculation module, the first resistor is disposed on the control module, and the second resistor and the third resistor are disposed on the substrate.

In an embodiment of the foregoing computing module, the computing module further includes two heat sinks, and the two heat sinks are respectively connected to two sides of the substrate.

In an embodiment of the foregoing computing module, the ground pad is larger than the island pad.

In an embodiment of the foregoing computing module, the isolated pad is disposed at an edge of the ground pad.

In an embodiment of the foregoing computing module, the ground pad is a rectangle having a blank area at an edge thereof, and the isolated pad is disposed in the blank area.

In an embodiment of the foregoing computing module, the conductive seat is a copper seat, the conductive seat is an electric copper seat, and the ground conductive seat is a ground copper seat.

The computing equipment comprises a computing module, a power supply module and a control module, wherein the computing module is electrically connected with the power supply module and is in signal connection with the control module, and the computing module is the computing module.

The invention has the advantages that the purpose of detecting the falling of the conductive seat can be achieved by only changing the encapsulation and adding three resistors, the result is accurate, and the change cost is low.

The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.

Drawings

FIG. 1 is a block diagram of one embodiment of a computing device of the present invention;

FIG. 2 is a perspective view of a computing module according to an embodiment of the present invention;

FIG. 3 is a three-dimensional exploded view of an embodiment of a computing module of the present invention;

FIG. 4 is a schematic structural diagram of a ground pad of the computing module of the present invention;

FIG. 5 is a schematic diagram of a ground conductive seat falling detection circuit of the computing module of the present invention.

Wherein the reference numerals

1: computing device

10: computing module

20: power supply module

30: control module

31: control chip

100: substrate

110: ground pad

111: ground pad

112: isolated pad

160: connecting through hole

200: computing chip

300: conductive seat

310: electric conducting seat

320: ground conductive seat

400: connecting piece

410: screw nail

420: elastic sealing gasket

430: spring

700: flat cable

810: the first heat sink

811: connecting through hole

820: second heat sink

821: threaded blind hole

R1: a first resistor

R2: second resistance

R3: third resistance

Detailed Description

The following detailed description of the embodiments of the present invention with reference to the drawings and specific examples is provided for further understanding the objects, aspects and effects of the present invention, but not for limiting the scope of the appended claims.

References in the specification to "an embodiment," "another embodiment," "the present embodiment," etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not intended to refer to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.

Where certain terms are used in the specification and following claims to refer to particular components or features, those skilled in the art will understand that various terms or numbers may be used by a skilled user or manufacturer to refer to the same component or feature. This specification and the claims that follow do not intend to distinguish between components or features that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. In addition, the term "coupled" is intended to include any direct or indirect coupling.

It should be noted that in the description of the present invention, the orientation or positional relationship indicated by the terms "lateral", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. appears on the basis of the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplicity of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. For the sake of clarity, the terms "first," "second," "third," "fourth," and the like, as used herein, are used to distinguish one element, region, or section from another, the same or similar element, region, or section, and are not intended to limit the particular element, region, or section.

Fig. 1 is a block diagram of a computing device according to an embodiment of the present invention. The computing device 1 of the present invention comprises a computing module 10, a power module 20 and a control module 30, wherein the computing module 10 is electrically connected to the power module 20, and the computing module 10 is in signal connection with the control module 30. The computing module 10 has a plurality of computing chips for running a specific algorithm, the computing chips on the computing module 10 consume a large amount of power and communicate with a remote server when operating, the power module 20 is used for providing a power source for the computing module 10, and the control module 30 is used for providing a control signal to the computing module 10.

As shown in fig. 2 and 3, fig. 2 and 3 are a perspective structural view and a perspective exploded structural view of an embodiment of a computing module of the present invention, respectively. The computing module 10 of the present invention includes a substrate 100, a computing chip 200, and a conductive socket 300.

The substrate 100 is, for example, an aluminum substrate with excellent heat dissipation performance, but the invention is not limited thereto, and other materials that can achieve the same function, such as a copper substrate, can be used, and all of them are within the protection scope of the invention. The substrate 100 includes a chip side and a substrate side, the chip side is connected with a plurality of computing chips 200 and conductive pads 300, and the computing chips 200 are used for performing operations by using a certain algorithm. The conductive socket 300 is disposed at an end of one side of the substrate 100 so as to be connected to the power module 20, and the conductive socket 300 is connected to the power module 20 through a conductive metal bar, for example, which has a large connection area and a large conduction area, so that the conductive socket is not only high in conductivity, but also low in conduction resistance, and is very suitable for computing devices with many computing chips 200 arranged in an automated and intelligent trend. Of course, in other embodiments, the conductive socket 300 and the power module 20 may be connected by a conductive wire, and the invention is not limited thereto. The conductive pad 300 is electrically connected to each computing chip 200 through a conductive bus embedded in the chip side of the substrate 100. The computing chips 200 are disposed on the chip side of the substrate 100, for example, in a matrix arrangement, wherein the distance between adjacent computing chips 200 in each row or each column may be the same or different according to the heat dissipation requirement. The substrate side can be, for example, an aluminum substrate or a copper substrate with excellent heat dissipation performance, which can quickly dissipate the working heat generated by the computing chips 200 during operation as much as possible, so as to avoid the influence of the heat accumulation on the substrate 100 on the normal operation of each computing chip 200 on the substrate 100 due to the high temperature of the substrate 100. The conductive socket 300 includes a conductive socket 310 and a ground conductive socket 320, the conductive socket 310 is connected to the power module 20 to transmit operating power to the computing module 10, and the ground conductive socket 320 is used for grounding.

The conductive pad 300 is, for example, a copper pad, and accordingly, the conductive pad 310 and the ground conductive pad 320 are, respectively, an electrical copper pad and a ground copper pad, but in other embodiments, the conductive pad 300 may also be made of other materials with excellent conductive performance, and the invention is not limited thereto.

Referring to fig. 4 and 5, fig. 4 is a schematic structural diagram of a ground pad of the computing module of the present invention, and fig. 5 is a schematic diagram of a ground conductive socket falling detection circuit of the computing module of the present invention. The computing module 10 of the present invention further includes a first resistor R1, a second resistor R2, and a third resistor R3, the ground pad 110 includes a ground pad 111 and an isolated pad 112 separated from each other, the control chip 31 and the isolated pad 112 are connected by a flat cable 700, the first resistor R1 and the third resistor R3 are respectively connected to the flat cable 700 and the ground, and the second resistor R2 is connected to the flat cable 700 and the circuit voltage VCC.

In the invention, an isolated pad 112 for detection is newly added corresponding to the ground pad 110 of the ground conductive seat 320, and the GND _ SENSE signal is pulled up to the circuit voltage VCC by the second resistor R2 and pulled down to GND by the third resistor R3 on the computing module 10; and is connected to a control IO of the control chip 31 on the control module 30 through the flat cable 700 for detection and is pulled down to GND on the control module 30 by the first resistor R1.

The working principle is that when the ground conductive seat 320 is normally welded and does not fall off, the GND _ SENSE signal is connected with GND through the ground conductive seat 320, and the control IO of the communication flat cable 700 of the control chip 31 detects that the signal is low. When the ground conductive seat 320 is welded poorly or falls off, the GND _ SENSE signal is influenced by the partial voltage of the first resistor R1, the second resistor R2 and the third resistor R3, and the voltage is VCC [ (R1// R3)/(R1// R3+ R2) ]; the R1, R2, R3 can make the signal satisfy the criterion of high level of the control chip 31 by proper resistance values, so that the control chip 31 is detected as high. When the control chip 31 detects that the signal is high, it can determine that the ground conductive seat 320 falls off, send an alarm and power off the computing module 10, thereby protecting the computing device and avoiding the phenomena of overheating and burnout of the flat cable caused by the return of a large current through the ground wire in the signal flat cable due to the falling of the ground copper seat.

Taking the existing device as an example, the signal power domain VDD of the control chip 31 is 3.3V, the low voltage discrimination voltage Vil is 0.3 × VDD is 0.99V, and the high voltage discrimination voltage Vih is 0.7 × VDD is 2.31V; the voltage range of the circuit voltage VCC is 11.5V-14.5V.

Taking R1 ═ 12.4K, R2 ═ 20K, and R3 ═ 10K, when the ground pad 320 is poorly welded or detached, the voltage of the GND _ SENSE signal is: VCC/(R2+ R1// R3) (R1// R3); when VCC is 11.5V, the voltage of the GND _ SENSE signal is 2.49V; when VCC is 14.5V, the signal voltage is 3.14V. Therefore, when the voltage of the circuit voltage VCC fluctuates between 11.5V and 14.5V, the voltage of the GND _ SENSE signal is 2.49V to 3.14V, which are all greater than the high voltage criterion 2.31V of the control chip 31, so that the control chip 31 can detect that the signal is high.

When the ground conductive seat 320 is welded well and does not fall off, the GND _ SENSE signal is connected to GND through the ground conductive seat 320, the voltage of the GND is obtained, that is, the control chip 31 detects that the signal is low level, and the system operates normally. When the ground socket 320 is welded poorly or falls off, the GND _ SENSE signal passes through the arrangement of the first resistor R1, the second resistor R2 and the third resistor R3, so that the control chip 31 detects that the signal is at a high level, thereby alarming and powering off.

Therefore, the detection method for the falling of the ground conductive seat does not change the device, only changes the bonding pad and adds a detection point, so that the effect of detecting the falling of the conductive seat is achieved, and the cost is low.

In the invention, the resistance value of the second resistor R2 is larger than that of the first resistor R1. The resistance of the second resistor R2 is greater than the resistance of the third resistor R3. The first resistor R1 and the third resistor R3 are respectively connected between the flat cable 700 and GND, the second resistor R2 is connected between the flat cable 700 and the circuit voltage VCC, and the resistance of the second resistor R2 is set to be larger than the resistances of the first resistor R1 and the third resistor R3, so that when the ground conductive seat 320 is welded poorly or falls off, the GND _ SENSE signal can easily meet the high-level judgment standard of the control chip 31, and an alarm can be given out and the power is cut off.

In the present invention, the first resistor R1 is disposed on the control module 30, and the second resistor R2 and the third resistor R3 are disposed on the substrate 100 of the calculation module 10. The first resistor R1, the second resistor R2, and the third resistor R3 are respectively disposed on the control module 30 and the substrate 100 for easier layout and inspection.

In the present invention, the ground pad 111 is larger than the isolated pad 112, and more specifically, the isolated pad 112 is disposed at an edge of the ground pad 111, for example, the ground pad 111 is a rectangular pad having a blank area at the edge, and the isolated pad 112 is disposed in the blank area.

In the present embodiment, the insular pad 112 is a circular pad, the edge of the ground pad 111 has an arc-shaped region larger than the insular pad 112, the insular pad 112 is disposed in the arc-shaped region, and a non-conductive region is disposed between the insular pad 112 and the ground pad 111, as shown in fig. 4, the insular pad 112 is preferably disposed at the center of the arc-shaped region of the ground pad 111.

In other embodiments, the insular pad 112 is, for example, a square pad, and the edge of the ground pad 111 may have a rectangular area larger than the insular pad 112, and the insular pad 112 is disposed in the rectangular area, and likewise, the insular pad 112 is preferably disposed at the center of the rectangular area of the ground pad 111 so as to have a non-conductive region between the insular pad 112 and the ground pad 111.

In the present invention, the shape of the isolated pad 112 is not limited, and may be set to an appropriate shape and size as needed.

In another embodiment of the present invention, the GND _ SENSE may be connected to the supply voltage VDD of the control chip 31 through the pull-up resistor R and connected to a detection IO of the control chip 31. The working principle is as follows: when the ground copper seat is welded well, the GND _ SENSE is connected to the ground through the ground copper seat, and the detection IO of the control chip 31 detects that the voltage is low, so that the welding is judged to be normal; when the ground copper seat falls off or is welded badly, GND _ SENSE is suspended, and the signal level of GND _ SENSE is pulled up to VDD through a resistor R; the control chip 31 detects the IO and checks that the voltage is high, determines that the welding is abnormal, gives an alarm, and interrupts the operation.

In still another embodiment of the present invention, when there are multiple bonding pads for the same copper sheet, each partial bonding pad may be reserved with a GND SENSE (GND SENSE0, GND SENSE1 … …); and the same detection signal or two different detection signals may be connected.

The computing module 10 of the present invention further includes heat sinks, as shown in fig. 2 and 3, the heat sinks include a first heat sink 810 and a second heat sink 820, and the first heat sink 810 and the second heat sink 820 are respectively disposed on two sides of the substrate 100 to carry away the working heat. In the present embodiment, the first heat sink 810 is provided on the chip side of the substrate 100 on which the plurality of computing chips 200 are mounted, and the second heat sink 820 is provided on the substrate side with respect to the chip side.

The first heat sink 810 and the second heat sink 820 are, for example, an integral fin heat sink, or a distributed fin heat sink, or a liquid cooling heat sink, and the invention is not limited thereto. The integrated fin heat sink is, for example, a fin heat sink covering all the computing chips 200 on the substrate 100, and has a simple structure, and is integrally disposed on both sides of the substrate 100, so that the integrated fin heat sink is easy to implement and has low cost. The distributed fin heat sinks are, for example, independent fin heat sinks, each of which may correspond to one computing chip 200, or each of which may correspond to a row or a column of computing chips 200, or each of which may correspond to one matrix or a certain number of computing chips 200, so that all the computing chips 200 of the substrate 100 need to be covered with a plurality of independent fin heat sinks, which operate together to dissipate heat from the substrate 100. The individual fin fins may have the same or different structures, for example, the fins of the individual fin fins having a larger heat generation amount corresponding to the chip or a lower heat dissipation efficiency corresponding to the chip may be arranged more densely, so as to balance the heat dissipation efficiency of the computing chips 200. The liquid-cooled heat dissipating structure may be, for example, a heat conducting plate having a heat conducting liquid-cooled tube.

In this embodiment, the first heat sink 810 and the second heat sink 820 are respectively an integral fin heat sink, and the first heat sink 810 and the second heat sink 820 on the two sides conduct out the working heat of the plurality of computing chips 200 on the substrate 100 sandwiched therebetween, so as to prevent the computing chips 200 from exceeding the working temperature and ensure the normal operation of the substrate 100.

The first and

second heat sinks

810 and 820 are coupled to both sides of the substrate 100, for example, by the coupling member 400. In detail, in the present embodiment, the first heat sink 810 is fixed on the second heat sink 820 by the connector 400, so as to sandwich the substrate 100 between the first heat sink 810 and the second heat sink 820. As shown in fig. 3, the first heat sink 810 has a connection through hole 811, the substrate 100 is provided with a connection through hole 160 corresponding to the connection through hole 811 of the first heat sink 810, the second heat sink 820 is provided with a threaded blind hole 821 corresponding to the connection through hole 811 of the first heat sink 810 and the connection through hole 160 of the substrate 100, and the connector 400 is connected to the threaded blind hole 821 of the second heat sink 820 through the connection through hole 811 of the first heat sink 810 and the connection through hole 160 of the substrate 100, thereby fixing the first heat sink 810, the substrate 100, and the second heat sink 820. After the first heat sink 810, the substrate 100 and the second heat sink 820 are fixedly connected together, not only the movement is facilitated, but also the influence on the performance of the computing chip 200 caused by the mutual displacement is avoided.

The connector 400 includes a screw 410 and an elastic gasket 420, the elastic gasket 420 has a certain elastic deformation when being pressed, so as to seal the connection through hole 811 on the first heat sink 810, and the elastic gasket 420 is, for example, a plastic gasket. Furthermore, a sealant can be coated at the connection position of the screw 410 to improve the sealing effect. In addition, the connector 400 further includes a spring 430, and the spring 430 has a function of preventing the screw 410 from being released.

The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. The utility model provides a calculation module is connected with a power module and the control module of computing equipment, calculation module includes the base plate and connects respectively calculation chip and electrically conductive seat on the base plate, electrically conductive seat includes electrically conductive seat and ground electrically conductive seat, electrically conductive seat connects power module, ground electrically conductive seat ground connection, it corresponds respectively to have on the base plate electrically welded disc and the ground pad of electrically conductive seat and ground electrically conductive seat, control module includes control chip, its characterized in that still includes first resistance, second resistance and third resistance, the ground pad includes mutual separation's ground pad and isolated pad, control chip with isolated pad passes through the winding displacement and links to each other, and winding displacement and ground connection are connected respectively to first resistance and third resistance, winding displacement and circuit voltage are connected to the second resistance.

2. The computing module of claim 1, wherein the second resistor has a resistance value greater than the first resistor.

3. The computing module of claim 1, wherein the second resistor has a resistance value greater than a resistance value of the third resistor.

4. The computing module of claim 1, wherein the substrate is an aluminum substrate.

5. The computing module of claim 1, wherein the first resistor is disposed on the control module, and the second and third resistors are disposed on the substrate.

6. The computing module of claim 1, further comprising two heat sinks, each of the two heat sinks attached to either side of the base plate.

7. The computing module of any of claims 1 to 6, wherein the ground pads are larger than the island pads.

8. The computing module of claim 7, wherein the orphan pad is disposed at an edge of the ground pad.

9. The computing module of claim 8, wherein the ground pads are rectangular pads having blank regions at edges thereof, the orphan pads being disposed in the blank regions.

10. The computing module of claim 1, wherein the conductive pad is a copper pad, the conductive pad is an electro-copper pad, and the ground conductive pad is a ground copper pad.

11. A computing device comprising a computing module, a power module and a control module, the computing module being electrically connected to the power module, the computing module being in signal connection with the control module, wherein the computing module is according to any one of claims 1 to 10.