CN113933180A - Apparatus and method for testing interconnect bonds - Google Patents

Apparatus and method for testing interconnect bonds Download PDF

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Publication number
CN113933180A
CN113933180A CN202010656412.6A CN202010656412A CN113933180A CN 113933180 A CN113933180 A CN 113933180A CN 202010656412 A CN202010656412 A CN 202010656412A CN 113933180 A CN113933180 A CN 113933180A
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CN
China
Prior art keywords
bond
force
test tool
test
testing apparatus
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Pending
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CN202010656412.6A
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Chinese (zh)
Inventor
宋景耀
李锐丰
陈建敏
吴茂发
陈健佳
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ASMPT Singapore Pte Ltd
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ASM Technology Singapore Pte Ltd
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Publication date
Application filed by ASM Technology Singapore Pte Ltd filed Critical ASM Technology Singapore Pte Ltd
Priority to CN202010656412.6A priority Critical patent/CN113933180A/en
Priority to TW110123574A priority patent/TWI783556B/en
Priority to KR1020210088373A priority patent/KR102603357B1/en
Publication of CN113933180A publication Critical patent/CN113933180A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G01N3/04—Chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/24—Investigating strength properties of solid materials by application of mechanical stress by applying steady shearing forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/0028—Force sensors associated with force applying means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/161—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance
    • G01L5/1627—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in ohmic resistance of strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
    • G01L5/167—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using piezoelectric means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M13/00—Testing of machine parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0041—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress
    • G01M5/005—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining deflection or stress by means of external apparatus, e.g. test benches or portable test systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0016—Tensile or compressive
    • G01N2203/0017—Tensile
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0014—Type of force applied
    • G01N2203/0025—Shearing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/04—Chucks, fixtures, jaws, holders or anvils
    • G01N2203/0405—Features allowing alignment between specimen and chucks

Abstract

An interconnect bond testing apparatus for testing the bond strength of an electronic device that includes at least one interconnect bond attached to the electronic device. The interconnect bond testing apparatus has a positioning mechanism and a test tool assembly mounted to the positioning mechanism. The test tool assembly is configured to push a first portion of the interconnected bonds and pull a second portion of the interconnected bonds, the positioning mechanism operates to align the test tool assembly with the interconnected bonds during testing, and apply a pushing force to the first portion of the interconnected bonds and a pulling force to the second portion of the interconnected bonds. The interconnect bond testing apparatus has a fixture including at least one force sensing element mounted thereon. The at least one force sensing element is configured to apply a resistive force to the test tool assembly when engaged with the test tool assembly.

Description

Apparatus and method for testing interconnect bonds
Technical Field
The present invention relates to an apparatus and method for testing the strength of interconnect bonds, such as wire bonds, on an electronic device, and more particularly to an apparatus that can perform both shear and pull tests.
Background
During assembly and packaging of semiconductors, wire bonders are used to electrically interconnect a semiconductor die to a substrate. Wire is supplied to the capillary from a coil containing bonding wire to perform wire bonding. Typically, each bond includes a length of gold or copper wire bonded to the surface of the substrate.
The strength of the test bond is important to the user to confirm that the particular wire or interconnect bond formed is acceptable. The test tool used to test the bond strength of these bonds must be able to accurately measure very small forces and deflections, subject to the size of the bond.
There are many known types of bonding tests, such as shear tests and pull tests. Shear testing the shear strength of the bond was tested by applying a shear force to the sides of the bond to shear the bond away from the substrate. The pull test tests the pull strength of the wire bond by pulling the wire away from the wire bond.
Machines that perform these tests typically have a test tool that can be placed against the bond to perform the test. The test tool may then be moved to perform a test, which typically involves measuring the force required to break the bond. This is time consuming since the user must perform such tests manually and also use different machines to perform different types of tests.
Furthermore, the force generated by the motor or sensed by the sensor may fluctuate over time as the machine performance may change over time. If this occurs in an in-line production, test accuracy can be compromised. Thus, in order to perform preventative maintenance on the testing machine, the user needs to perform the force test manually on a regular basis (sometimes weekly or even daily). This is both cumbersome and time consuming, which in turn reduces the overall equipment efficiency of the machine.
Therefore, it would be beneficial to design an interconnect bond testing apparatus that avoids and overcomes these disadvantages.
Disclosure of Invention
Accordingly, it is an object of the present invention to seek to provide an interconnection bond testing apparatus adapted to perform a shear test and a pull test on an interconnection bond formed on an electronic device.
It is another object of the present invention to seek to provide an interconnect bond testing apparatus adapted to perform self-monitoring machine force testing.
Accordingly, a first aspect of the present invention provides an interconnect bond testing apparatus for testing the bond strength of an electronic device, the electronic device including at least one interconnect bond attached to the electronic device, the interconnect bond testing apparatus comprising: a positioning mechanism; a test tool assembly mounted on the positioning mechanism and configured to push a first portion of the interconnected bonds and pull a second portion of the interconnected bonds during testing; a fixture including at least one force sensing element mounted on the fixture and configured to apply a resistive force to a test tool assembly when engaged with the test tool assembly, wherein the positioning mechanism operates to align the test tool assembly with the interconnected bond during testing and to apply a pushing force to a first portion of the interconnected bond and a pulling force to a second portion of the interconnected bond.
In one embodiment, the test tool assembly includes a first test tool configured to apply a pushing force to push a first portion of an interconnected bond and a second test tool configured to apply a pulling force to pull a second portion of the interconnected bond.
In one embodiment, the direction of the pushing force is perpendicular to the direction of the pulling force.
In one embodiment, the interconnect bond testing apparatus further comprises at least one sensor connected to the first and second test tools, the at least one sensor operative to determine a reaction force applied to the first and second test tools when the pushing and pulling forces are applied.
In one embodiment, the at least one sensor is a first force sensor.
In one embodiment, a bottom end of the first test tool distal from the positioning mechanism has a tip portion configured to engage a first portion of the interconnected bonds upon application of a pushing force.
In one embodiment, the second test tool has a pull hook at its distal end distal to the positioning mechanism, the pull hook configured to engage to the second portion of the interconnected bonds upon application of a pulling force.
In one embodiment, the at least one force sensing element comprises at least one flexure.
In one embodiment, the fixture further comprises a constant weight portion mounted to the fixture, and the test tool assembly is configured to engage and lift the constant weight portion.
In one embodiment, the constant weight portion is a self-weight.
In one embodiment, the at least one force sensing element further comprises a second force sensor.
In one embodiment, the second force sensor is a strain gauge.
In one embodiment, the fixture further includes a lever block mounted on the fixture, and the test tool assembly is configured to engage and lift the lever block.
In one embodiment, the second force sensor is a piezoelectric sensor.
In one embodiment, the second force sensor is a flexure-type sensor.
According to a second aspect of the present invention, there is provided a method of testing the bond strength of an electronic device comprising at least one interconnect bond attached to the electronic device, the method comprising the steps of: providing a test tool assembly mounted on the positioning mechanism; moving the test tool assembly with the positioning mechanism to align the test tool assembly with the interconnect bond; applying a pushing force to a first portion of the interconnected bonds and a pulling force to a second portion of the interconnected bonds with the test tool assembly; engaging the test tool assembly with a force sensing element mounted on the fixture; and determining a reaction force applied to the test tool assembly by the force sensing element.
In one embodiment, the test tool assembly includes a first test tool configured to apply a pushing force to a first portion of the interconnected bonds and a second test tool configured to apply a pulling force to a second portion of the interconnected bonds.
In one embodiment, the step of applying a pushing force and a pulling force further comprises the steps of: determining a reaction force applied to the first and second test tools with at least one sensor connected to the first and second test tools.
The above described and other features, aspects, and advantages will become better understood with regard to the following description, appended claims, and accompanying drawings.
Drawings
Embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings.
Fig. 1 is an isometric view of an interconnect bond testing apparatus according to a first preferred embodiment of the present invention.
FIG. 2 is an elevation view of the positioning mechanism with the test tool assembly mounted thereon.
FIG. 3 is an isometric view of a clamp with a force sensing element and a self-weight mounted thereon.
FIG. 4A is a front view of the positioning mechanism with the test tool engaged with the fixture during the self-monitoring machine shear test.
FIG. 4B is a close-up view of the force sensing element labeled with a reference numeral.
FIG. 5A is an isometric view of a fixture with a force sensing element engaged with a first test tool.
Fig. 5B is a graph of machine learned reaction force at the tip of a shear tool versus distance traveled by the shear tool.
FIG. 6A is an isometric view of a pulling tool engaging and lifting a deadweight block.
FIG. 6B is a side view of the pulling tool shown in FIG. 6A with a sensor attached thereto.
Fig. 6C is a graph of the force required to lift the tool from the weight over a period of time.
Fig. 7A is an isometric view of an interconnect bond testing apparatus according to a second preferred embodiment of the present invention.
Fig. 7B is a side view of the interconnect bond testing apparatus shown in fig. 7A.
Fig. 8A is a cross-sectional side view of an interconnect bond testing apparatus according to a second preferred embodiment of the present invention.
Fig. 8B is a plan view of a wire bonding portion testing apparatus according to a second preferred embodiment of the present invention.
Fig. 8C is a cross-sectional view taken along line a-a shown in fig. 8B.
FIG. 9A is a cross-sectional side view of a third preferred embodiment of the present invention with a flexure tab mounted to the clamp.
FIG. 9B is a plan view of FIG. 9A with a plurality of flex tabs mounted to the clip.
FIG. 10 is a side view of a shear tool pushing on a pressure sensor.
Detailed Description
Fig. 1 is an isometric view of an interconnect bond testing apparatus 10 according to a first preferred embodiment of the present invention. For example, a wire bonder may be utilized to create the tested interconnect bonds. In general, the interconnect bond testing apparatus 10 includes a positioning mechanism 20 having a test tool assembly 22 mounted thereon, a pair of front and rear rails 12, 14, and a fixture 30.
The clip 30 is mounted to the frame 18, which in turn mounts the frame 18 to the front rail 12. The fixture 30 may have a plurality of through holes 38. The clamp 30 may be mounted to the frame 18 by any suitable fastening means, such as screws or fasteners secured with through holes 38. Alternatively, the clamp 30 may be mounted to the frame 18 by a suitable adhesive. The frame 18 may be mounted to the front rail 12 by any suitable fastening means, such as screws or fasteners. Alternatively, the frame 18 may be mounted to the front rail 12 by a suitable adhesive. Thus, the position of the clip 30 relative to the front rail 12 is fixed.
The front rail 12 and the rear rail 14 are laterally spaced from each other such that the front rail 12 is located between the clip 30 and the rear rail 14. The front rail 12 is substantially parallel to the rear rail 14. Disposed between the front rail 12 and the rear rail 14 is a stage 16 adapted to receive an electronic device supported by a substrate, such as a lead frame 19, for testing. The present embodiment will be explained with reference to a lead frame. However, it will be understood by those skilled in the art that the bond strength test disclosed in the present invention is equally applicable to substrates other than lead frames.
The lead frame 19 may be held on the stage 16 by a clamping device. For example, the lead frame 19 may be mechanically clamped to the stage by a clamper (not shown), and then further held on the stage 16 by a vacuum suction device provided on the stage 16. The lead frame 19 is adapted to engage with the test tool assembly 22 during a shear test or a pull test.
The positioning mechanism 20 may be connected to an XY drive mechanism (not shown) that drives the positioning mechanism 20 through the XY axes in a horizontal plane. Alternatively, the XY drive mechanism may be connected to the stage 16 holding the lead frame 19 so as to drive the stage 16 across the XY axis in the horizontal plane. A separate Z-drive mechanism (not shown) may be coupled to the positioning mechanism 20 to drive the positioning mechanism 20 to move vertically in the Z-direction. X, Y and the Z-drive mechanism may operate together or separately to move positioning mechanism 20 according to programmed instructions from the processor. For example, the positioning mechanism 20 may be programmed to move so that the test tool assembly 22 is positioned over the interconnect bond and engaged to the interconnect bond on the lead frame 19.
The interconnect bond testing apparatus 10 may, for example, be configured to perform a shear ball test and a pull test on interconnect bonds of an electronic device. While the present disclosure relates to interconnecting bonds, those of skill in the art will appreciate from this disclosure that the present invention is not so limited. For example, the interconnection bonds may be, but are not limited to, wire bonds, ball bumps, bond post ball (BSOB), bond post ball (BBOS), Ball Vertical Array (BVA), stacked wafer wire bonds, die attach bonds, and wedge bonds. How the shear push ball test and the pull wire test are performed according to the embodiment of the present invention will be described below.
Referring to fig. 1, the test tool assembly 22 is configured to perform shear ball and/or pull wire tests on electronic devices supported on the lead frame 19. The stacked lead frames to be tested may be loaded onto a magazine (not shown) disposed spaced from the stage 16. The user determines the lead frame to be tested. During testing, a feeder (not shown) pushes the selected lead frame onto the stage 16. The lead frame 19 may be mechanically clamped to the stage by a clamp (not shown) and then further held to the stage 16 by vacuum suction created on the stage 16.
During shear ball test, the XY drive mechanism drives the positioning mechanism 20 to move so that the shear tool of the test tool assembly 22 is positioned over the interconnected bond to be tested. Next, the Z-drive mechanism drives the positioning mechanism 20 vertically downward toward the interconnected bonds to be tested. Once the shear tool contacts the top surface of the electronic device or lead frame 19 adjacent the interconnection bond to be tested, the positioning mechanism 20 is raised vertically upward to a predetermined height to raise the shear tool 24 to the same height. The predetermined height may be determined by user programming and depends on the size of the interconnection bond to be tested. Thereafter, the XY drive mechanism drives the positioning mechanism 20 to move so that it pushes the interconnection bonds until the interconnection bonds are completely sheared off. When the shear tool pushes the interconnection bonds, the interconnection bonds exert a reaction force on the tip portion of the shear tool. A sensor connected to the shear tool can then measure the reaction force required to push the interconnect bond completely off the leadframe, which in turn yields the ball shear force.
In an alternative arrangement where the XY drive mechanism is connected to the stage 16, the XY drive mechanism drives the stage 16 holding the lead frame 19 so that the shear tool of the test tool assembly 22 is positioned over the interconnected bond to be tested. Next, the Z-drive mechanism drives the positioning mechanism 20 vertically downward toward the interconnected bonding portions to be tested. Once the shear tool contacts the top surface of the electronic device or lead frame 19 adjacent the interconnect bond to be tested, the positioning mechanism 20 is raised vertically upward to a predetermined height to raise the shear tool 24 the same height. The predetermined height may be determined by user programming and depends on the size of the interconnection bond to be tested. Thereafter, the XY drive mechanism drives the stage to push the tip end of the shearing tool 24 until the interconnected bonds are completely sheared off.
During the pull wire test, the XY drive mechanism drives the positioning mechanism 20 to move so that the pull tool of the test tool assembly 22 is positioned over the interconnected bond to be tested. Next, the Z-drive mechanism drives the positioning mechanism 20 vertically downward toward the interconnected bonds to be tested. The pull hooks on the pulling tool engage the wires of the interconnect bond to be tested. Next, the Z drive mechanism drives the pulling tool to pull the wire interconnecting the bonds upward toward the positioning mechanism until the wire breaks or the bonds break and are lifted off the lead frame 19 (to the extent that earlier occurs). A sensor connected to the pulling tool then measures the pull force required to pull the wire until the wire breaks or the bond breaks, and thus derives the wire tension.
In an alternative arrangement where the XY drive mechanism is connected to the stage 16, the XY drive mechanism may drive the stage 16 holding the lead frame 19 so that the pull tool of the test tool assembly 22 is positioned over the interconnected bond to be tested. Next, the Z-drive mechanism drives the positioning mechanism 20 vertically downward toward the interconnected bonds to be tested. The pull hooks on the pulling tool engage the wires of the interconnect bond to be tested. Next, the Z drive mechanism drives the pulling tool to pull the wire interconnecting the bonds upward toward the positioning mechanism until the wire breaks or the bonds break and are lifted off the lead frame 19 (to the extent that earlier occurs). Thus, the interconnection bond testing apparatus of the present invention allows both shear and tensile testing to be performed on the same machine. Thus, different types of tests can be performed without using multiple machines or manually changing the test tools of the machines. This has the advantage that little manual intervention is required, since the shear push ball test and pull wire test can be performed automatically and the results sent to the processor.
And the user can also select which test (shear push ball test or pull wire test) to perform by himself, and can program according to the user's requirements. For example, a user may prefer to perform a pull test before performing a shear push test for cost savings. In this example, the pull test is performed until after the wire is broken, and the remaining ball bonding portion is still available for the shear ball test, so that waste of resources can be minimized. However, if the shear push ball test is performed first, the pull wire test cannot be performed on the same ball bond portion because the ball bond has been sheared at that time.
After the shear ball test and the pull test are performed on the lead frame, a pushing device (not shown) pushes the lead frame to be detached from the stage 16. The stage 16 is then ready to receive the next lead frame for testing. This allows for fully automated testing of the entire interconnect bond without manual intervention.
When the interconnect bond testing apparatus 10 described above is operated, the performance of the drive mechanism and the sensors may change over time, resulting in erratic drive and sensed forces over time, causing the test results to become increasingly inaccurate. Therefore, it is desirable to periodically test the interconnect bond testing apparatus 10 to ensure that it continues to operate as intended, particularly without human intervention.
Fig. 2 is an elevation view of the positioning mechanism 20 with the test tool assembly 22 mounted thereon. Test tool assembly 22 includes a shear tool 24 and a pull tool 26. The shearing tool 24 has a tip portion 25 at a bottom end remote from the positioning mechanism 20. Preferably, the tip portion 25 is tapered in shape (as shown more clearly in FIG. 5A). The shear tool 24 is connected to a sensor (not shown). The pulling tool 26 has a pull hook 27 at its bottom end remote from the positioning means 20. The pulling tool 26 is connected to the sensor 38 (as shown in fig. 6B).
Also mounted on the positioning mechanism 20 is an image sensor 28, which is spaced apart from the test tool assembly 22. Thus, the image sensor 28 may move with the positioning mechanism 20. The image sensor 28 may be in the form of a camera and positioned so that the fixture 30 can be viewed through the image sensor 28. The image sensor 28 is operable to align the test tool assembly 22 with the fixture 30 to perform a self-monitoring machine force test.
Fig. 3 is an isometric view of a clamp 30 that may be used with the preferred embodiment of the present invention. The clamp 30 has mounted thereon a force sensing element 32 and a deadweight 34. Preferably, the force sensing element 32 is mounted on the top surface of the fixture 30 and is pushed by the shear tool 24 during the self-monitoring machine shear test. Preferably, the area around the force sensing element 32 should remain empty to avoid any interference during the self-monitoring machine shear test of the test tool assembly 22. Force sensing element 32 may be made of any flexible material or suitable material that will elastically deflect, deform or shear when a force is applied thereto. The force sensing element 32 may be, but is not limited to, a flexure, a sheet, machined metal, a component resiliently held by a spring, a strain gauge, a piezoelectric sensor, a flexure-type sensor, or a force sensor. Preferably, the shape of the force sensing element 32 is a regular shape with a plurality of side walls, for example, four side walls. This is beneficial because it allows the force sensing element 32 to have multiple points of contact during self-monitoring machine shear testing. Shear tool 24 may be configured to apply a force to any of the four sidewalls of force sensing element 32 to urge force sensing element 32.
The clamp 30 may have a plurality of through holes 38 for mounting the clamp 30 to the frame 18 by suitable fastening means such as screws and fasteners. The embodiment shown in fig. 3 shows two holes. However, any number of holes may be used to operatively connect the clip 30 to the front rail 12.
The constant weight portion (e.g., self-weight 34) is located on a clamp support 35 mounted on a side wall of the clamp 30. Alternatively, the clamp support 35 may be integrally formed with the clamp 30. Preferably, the clip support 35 extends from the clip 30 in a direction parallel to the front rail 12. Self-weight 34 is configured to rest on the top surface of clamp support 35. Self-weight 34 may be made of any material of known mass (e.g., free weight). Wires 36 are attached to the top surface of self-weight 34. The wire 36 is adapted to engage the pulling tool 26 during a self-monitoring machine pull test. The wire 36 may be made of a metal that is at least malleable so that the wire 36 does not break when the pulling tool 26 is lifted from the weight 34. Preferably, the wire 36 is made of a hard material such as metal.
Fig. 4A is a front view of positioning mechanism 20 with shear tool 24 engaged with force sensing element 32 during a self-monitoring machine shear test. During the self-monitoring machine shear test, an XY drive mechanism coupled to the positioning mechanism 20 drives the positioning mechanism 20 to a position such that the test tool assembly 22 is vertically above the fixture 30.
Reference marks 39 (see fig. 4B) may be marked on the jig 30 so as to be observable by the image sensor 28. Reference marks 39 may be marked on the force sensing element 32 so that when an image of the reference mark 39 is captured by the image sensor 28, the shear tool 24 aligns the force sensing element 32 above to perform a self-monitoring machine shear test. Reference mark 39 may also be marked on self-weight block 34 so that when image sensor 28 captures an image of reference mark 39, pulling tool 26 may be aligned above self-weight block 34 to perform a self-monitoring machine pull test. Alternatively, reference marks 39 may be marked on both the force sensing element 32 and the self-weight 34 so that when the image sensor 28 captures an image of either of the two reference marks 39, the shear tool 24 and the pull tool 26 may align the force sensing element 32 or the self-weight block 34, respectively, above to perform a self-monitoring machine force test. The reference mark 39 may have any form or shape, or it may be located anywhere along the clamp, force sensing element, or deadweight, as long as it is viewable through the image sensor 28. Preferably, the reference mark 39 is located on the top surface of the fixture, force sensing element or self-weight so that an unobstructed image of the reference mark 39 can be obtained by the image sensor 28.
When the image sensor 28 captures an image of the reference mark 39 marked on the fixture 30, the image sensor 28 can confirm that the test tool assembly 22 is aligned with the fixture 30. Any deviations and deviations from alignment captured by the image sensor 28 can be corrected by signals sent to the XY drive mechanism.
Once the alignment of the test tool assembly 22 with the fixture 30 is confirmed, the Z-drive mechanism may drive the positioning mechanism 20 to move the shear tool 24 in a vertical direction toward the force sensing element 32. In the embodiment shown in FIG. 4A, the shear tool 24 is in contact with the force sensing element 32. At this stage the pulling tool 26 is now in a "rest" position during which the pulling tool 26 is not engaged with the wire 36 of the weight block 34.
Fig. 5A is an isometric view of the clamp 30 with the force sensing element 32 engaged with the shear tool 24. The tip portion 25 of the shearing tool 24 is configured to urge the side wall of the sensing element 32. The Z-drive mechanism drives the positioning mechanism 20 to move vertically downward until the tip portion 25 contacts the top plate 31 on the top surface of the jig 30. When the top plate 31 is contacted, the positioning mechanism 20 is lifted vertically upward to a predetermined height to lift the shearing tool 24 to the same height. The predetermined height may be determined programmatically by a user and depends on the characteristics of the force sensing element 32 used. The top plate 31 may be made of a hard material such as sapphire.
After that, the positioning mechanism 20 can be driven by the XY driving mechanism to move in the S direction as shown in fig. 5A and to urge the side wall of the sensing element 32. The force sensing element 32 will elastically deform and generate a reaction force R on the tip portion 25. A sensor coupled to the cutting tool 24 may measure the reaction force R acting on the tip portion 25 and send the data to the processor. The processor records the value of the reaction force R and the distance moved by the shear tool 24.
The machine can learn the relationship between the reaction force R acting on the tip portion 25 and the distance moved by the cutting tool 24, the result of which is shown in fig. 5B. In the embodiment shown in FIG. 5A, cutting tool 24 pushes against sensing element 32 in the S direction. It should be noted that the shear tool 24 may also be configured to apply a force to any of the four side walls of the force sensing element 32 to urge the force sensing element 32, thereby deriving a reaction force R on the tip portion 25 of the shear tool 24.
In fig. 5B, the relationship between the reaction force R generated at the tip end portion 25 of the shear tool 24 and the distance over which the shear tool 24 moves is learned, and the learned slope is obtained. The self-monitoring machine shear test may be programmed to be performed periodically according to the user's preferences and needs. For example, the self-monitoring machine shear test may be set to be performed once a week or once a month. The results obtained from each shear test can be tabulated and compared to the learned slope. Ideally, any differences or deviations from the learned slope should be within a minimum. The allowable tolerance may be determined by the user. Preferably, the suggested tolerance is +/-0.5%. If the test results fall outside of the allowable tolerance, the processor may alert the user to perform the necessary compensation and/or corrective action on the shear tool 24 and/or sensors.
Advantageously, the shearing tool 24 and the tip 25 are made of a hard material, such as metal. For example, the shear tool may be made of titanium or an aluminum-lithium alloy, and the tip portion may be made of tungsten carbide. The tip portion 25 is typically sized or shaped according to the interconnection bond to be tested. Thus, tip portion 25 is replaceable, and accordingly, larger or smaller tip portions may be used for larger or smaller bonding portions.
Fig. 6A is an isometric view of the pulling tool 26 engaging and lifting the deadweight block 34. Self-weight 34 rests on clamp support 35. The pulling tool 26 has a pull hook 27, which is located at the end of the pulling tool 26 remote from the positioning means 20. The wire 36 attached to the top surface of the self-weight is adapted to engage the hook 27 and be pulled upward in the direction of the positioning mechanism 20. During the self-monitoring machine pull test, when the pulling tool 26 is aligned with the wire 36 of the weight block 34, a Z-drive mechanism (not shown) drives the pulling tool 26 vertically downward, thereby engaging the wire 36 with the hook 27. Next, the Z-direction drive mechanism drives the lifting tool 26 to move upward toward the positioning mechanism 20. The lifting tool 26 lifts the self weight 34 upward in a direction L away from the clamp support 35. As shown in fig. 6B, the sensor 38 is connected to the pulling tool 26. The sensor 38 may be a load cell. Sensor 38 may be used to measure the force required to lift weight 34 off of clamp support 35. As shown in the graph of fig. 6C, the force required to lift weight 34 off clamp support 35 is constant and does not change over time.
Alternatively, a self-monitoring machine pull test may be performed on the force sensing element 32. In this case, the force sensing element 32 may be mounted on the fixture 30 such that a portion of the force sensing element 32 extends from the fixture 30 (not shown). A notch (not shown) may be formed near the edge of the force sensing element 32 and adapted to engage the pull hook 27 of the pulling tool 26. During the self-monitoring machine pull test, when the pulling tool 26 is aligned with the notch on the force sensing element 32, the Z-drive mechanism drives the pulling tool 26 vertically downward, thereby engaging the draw hook 27 with the notch on the force sensing element 32. Next, the Z-drive mechanism drives the pulling tool 26 to move upward in the direction of the positioning mechanism 20. The force-sensing element 32 will be elastically deformed and generate a reaction force on the hook 27. A sensor connected to the pulling tool 26 can measure the reaction force acting on the pulling hook 27 and send the data to the processor. The processor records the value of the reaction force and the distance the pulling tool 26 has moved. The machine can learn the relationship between the reaction force acting on the drag hook 27 and the distance traveled by the pulling tool 26, with the result being similar to the learned slope shown in fig. 5B.
The self-monitoring machine pull test can be programmed to be performed periodically according to the user's preferences and needs. For example, the self-monitoring machine pull test may be programmed to be performed weekly or monthly. The results obtained from each pull test can be compared to a constant force curve or learned slope. Ideally, any difference or deviation from the constant force curve or learned slope should be minimal. The allowable tolerance may be determined by the user. Preferably, the suggested tolerance is +/-0.5%. If the test results fall outside of the allowable tolerance, the processor may alert the user to perform the necessary compensation and/or corrective action on the pulling tool 26 and/or sensor 38. Thus, the performance of the machine may be self-monitored over time.
Advantageously, the draw hook 27 is made of a hard material, such as metal. The draw hooks 27 are typically sized according to the interconnect bonding to be tested. The draw hook 27 is therefore replaceable and larger or smaller draw hooks can be used accordingly. Thus, the performance of the machine can be self-monitored over time without human intervention to perform force tests using different test tools. This will reduce the possibility of equipment failure, reduce maintenance costs, reduce down time, and improve production quality.
Fig. 7A and 7B are isometric and side views of an interconnect bond testing apparatus according to a second preferred embodiment of the present invention. The clip 30 has an interior cavity 47 and the clip 30 is mounted on the frame 18 such that the front rail 12 is received within the interior cavity 47 of the clip (as shown in fig. 7B). The clip is housed within the housing 40. The top surface of the housing 40 has a pair of recesses located at one end of the housing 40 near the front rail 12. The recess is adapted to receive a shear tool 24 and a pull tool 26 during a self-monitoring machine force test. The force sensing element is mounted on the fixture such that the force sensing element is located above the front rail 12. As shown in fig. 7B, the tip portion 25 of the shearing tool 24 and the pulling tool 26 are located above the front rail 12. Thus, in this embodiment, the working area for the self-monitoring machine force test is above the front rail 12. This is particularly advantageous for machines that fail to properly reach the force sensing element for self-monitoring machine force testing due to the short travel of the positioning mechanism and space limitations.
Fig. 8A is a cross-sectional side view of an interconnect bond testing apparatus according to a second preferred embodiment of the present invention. The force sensing element in this embodiment may be a lever block 42. The lever block 42 is mounted on the clamp 30 by a U-shaped bracket 51 and secured with a suitable fastening means such as fastener 44. When a pulling force is applied to the opposite end of the lever block 42, the lever block 42 rotates about the pivot shaft 43. The opposite end of the lever block 42 is provided with a notch adapted to engage the draw hook 27 and be pulled upwardly in the direction of the positioning mechanism.
During the self-monitoring machine pull test, when the pulling tool 26 is aligned with the notch on the lever block 42, a Z-drive mechanism (not shown) drives the pulling tool 26 vertically downward, thereby engaging the pull hook 27 with the notch on the lever block 42. Next, the Z-drive mechanism drives the pulling tool 26 to move upward in the direction of the positioning mechanism 20. Thus, the lifting tool 26 lifts the opposite end of the lever block 42 in the direction L1, causing the lever block 42 to rotate about the pivot pin 43. As previously shown in fig. 6B, the sensor 38 is connected to the pulling tool 26. The sensor 38 may be a load cell. The sensor 38 can measure the reaction force acting on the retractor 27 and send information to the processor. The processor records the value of the reaction force and the distance the pulling tool 26 has moved. The machine can learn the relationship between the reaction force R acting on the drag hook 27 and the distance moved by the pulling tool 26, and the result is shown in fig. 5B.
Fig. 8B is a plan view of an interconnection bond testing apparatus according to a second preferred embodiment of the present invention, and fig. 8C is a sectional view taken along line a-a shown in fig. 8B. One end of the clamp 30 is mounted with a second force sensing element, which may be a strain gauge, for example it may be a load cell strain gauge 41 as shown in fig. 8B. The opposite end of the load cell strain gauge 41 from the clamp 30 is provided with a tab 45. The load cell strain gauge 41 is mounted to the clamp 30 by a protrusion 52 and secured by a C-shaped clip fastener 46. The C-shaped clip fastener 46 securely holds the load cell strain gauge 41 to the clamp 30.
During the self-monitoring machine shear force test, the tip portion 25 of the shear tool 24 is configured to push the tab 45 of the load cell 41. The Z-drive mechanism drives the positioning mechanism to move vertically downward until the tip portion 25 is aligned with the bump 45 of the load cell 41. Thereafter, the positioning mechanism may be driven by the XY driving mechanism to move and push the bump 45 in the S1 direction as shown in fig. 8C. The load cell type strain gauge 41 will be elastically deformed and generate a reaction force on the tip portion 25. Sensors coupled to the cutting tool 24 may measure the reaction force acting on the tip portion 25 and send information to the processor. The processor records the value of the reaction force and the distance moved by the shear tool 24. The machine can learn the relationship between the reaction force acting on the tip portion 25 and the distance moved by the cutting tool 24, the result of which is shown in figure 5B.
FIG. 9A is a cross-sectional side view of a clip with a flexure strip mounted thereon according to a third preferred embodiment of the present invention. A force sensing element such as a flexure tab 48 is mounted to the clamp 30 by fasteners 44. Self-monitoring machine pull tests may be performed in a similar manner as described in the embodiments above. During the self-monitoring machine pull test, the pulling tool 26 may be configured to lift the free end of the flexure tab 48 proximate the front rail 12. A sensor connected to the pulling tool 26 can measure the reaction force acting on the pulling hook 27 and send information to the processor. The processor records the value of the reaction force and the distance the pulling tool 26 has moved. The machine can learn the relationship between the reaction force acting on the drag hook 27 and the distance moved by the pulling tool 26, and the result is shown in fig. 5B.
Fig. 9B is a plan view of fig. 9A with a plurality of flex tabs mounted to the clip 30. A force sensing element, such as a plurality of flexure tabs 49, is mounted on the clamp 30. The plurality of flexing tabs 49 are configured to engage the tip portion 25 of the shear tool 24 during a self-monitoring machine shear test. The shear tool 24 pushes the plurality of flexure tabs 49 at a protrusion 53 located at an end of the plurality of flexure tabs 49 remote from the clamp 30. Sensors coupled to the cutting tool 24 may measure the reaction force acting on the tip portion 25 and send the information to the processor. The processor records the value of the reaction force and the distance moved by the shear tool 24. The machine can learn the relationship between the reaction force acting on the tip portion 25 and the distance moved by the cutting tool 24, the result of which is shown in figure 5B.
While various examples have been provided with respect to performing self-monitoring machine force tests using force sensing elements, those skilled in the art, in light of this disclosure, will appreciate that the examples provided herein are not limited in this regard. For example, a force sensor, piezoelectric sensor, or other sensor suitable for directly or indirectly measuring force may be used in place of the flexure and flexure mounted to the fixture 30, as schematically illustrated in FIG. 10.
Although the present invention has been described in considerable detail with reference to certain embodiments, other embodiments are possible.
Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

Claims (18)

1. An interconnect bond testing apparatus for testing the bond strength of an electronic device, the electronic device including at least one interconnect bond attached to the electronic device, the interconnect bond testing apparatus comprising:
a positioning mechanism;
a test tool assembly mounted on the positioning mechanism and configured to push a first portion of the interconnected bonds and pull a second portion of the interconnected bonds during testing; and
a fixture including at least one force sensing element mounted on the fixture and configured to apply a resistive force to the test tool assembly when engaged therewith,
wherein the positioning mechanism operates to align the test tool assembly with the interconnected bond during testing and to apply a pushing force to a first portion of the interconnected bond and a pulling force to a second portion of the interconnected bond.
2. The interconnection bond testing apparatus of claim 1, wherein the test tool assembly comprises a first test tool configured to apply a pushing force to push a first portion of the interconnection bond and a second test tool configured to apply a pulling force to pull a second portion of the interconnection bond.
3. The interconnection bond testing apparatus of claim 1 wherein the direction of the pushing force is perpendicular to the direction of the pulling force.
4. The interconnection bond testing apparatus of claim 2, further comprising at least one sensor connected to the first and second test tools, the at least one sensor operative to determine a reaction force applied to the first and second test tools when the pushing and pulling forces are applied.
5. The interconnection bond testing apparatus of claim 4 wherein the at least one sensor is a first force sensor.
6. The interconnection bond testing apparatus of claim 2, wherein a bottom end of the first test tool distal from the positioning mechanism has a tip portion configured to engage a first portion of the interconnection bond upon application of a pushing force.
7. The interconnected bond testing apparatus of claim 2, wherein the second testing tool has a pull hook at a distal end thereof distal from the positioning mechanism, the pull hook configured to engage to the second portion of the interconnected bond upon application of a pulling force.
8. The interconnection bond testing apparatus of claim 1, wherein the at least one force sensing element comprises at least one flexure.
9. The interconnection bond testing apparatus of claim 8 wherein the clamp further comprises a constant weight portion mounted to the clamp and the test tool assembly is configured to engage and lift the constant weight portion.
10. The interconnection bond testing apparatus of claim 9 wherein the constant weight portion is a self-weight.
11. The interconnected bond testing apparatus of claim 1 wherein the at least one force sensing element comprises a second force sensor.
12. The interconnection bond testing apparatus of claim 11 wherein the second force sensor is a strain gauge.
13. The interconnection bond testing apparatus of claim 12, wherein the fixture further comprises a lever block mounted to the fixture, and the test tool assembly is configured to engage and lift the lever block.
14. The interconnection bond testing apparatus of claim 11 wherein the second force sensor is a piezoelectric sensor.
15. The interconnection bond testing apparatus of claim 11 wherein the second force sensor is a flexure-type sensor.
16. A method for testing the bond strength of an electronic device comprising at least one interconnect bond attached to the electronic device, the method comprising the steps of:
providing a test tool assembly mounted on the positioning mechanism;
moving the test tool assembly with the positioning mechanism to align the test tool assembly with the interconnect bond;
applying a pushing force to a first portion of the interconnected bonds and a pulling force to a second portion of the interconnected bonds with the test tool assembly;
engaging the test tool assembly with a force sensing element mounted on a fixture; and
determining, by the force sensing element, a reaction force applied to the test tool assembly.
17. The method of claim 16, wherein the test tool assembly comprises a first test tool configured to apply a pushing force to a first portion of the interconnected bonds and a second test tool configured to apply a pulling force to a second portion of the interconnected bonds.
18. The method of claim 17, wherein in applying the pushing and pulling forces, further comprising the steps of: determining a reaction force applied to the first test tool and the second test tool with at least one sensor connected to the first test tool and the second test tool.
CN202010656412.6A 2020-07-09 2020-07-09 Apparatus and method for testing interconnect bonds Pending CN113933180A (en)

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US20040156539A1 (en) * 2003-02-10 2004-08-12 Asm Assembly Automation Ltd Inspecting an array of electronic components
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JP4438837B2 (en) 2007-08-01 2010-03-24 日立化成工業株式会社 Destructive testing equipment
EP2363701B1 (en) * 2010-03-05 2015-11-04 Nordson Corporation Improved clamping mechanism for shear testing apparatus
EP2386845B1 (en) 2010-05-14 2024-03-13 Nordson Corporation Apparatus and method for testing of bonds of a semiconductor assembly
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