CN113926615A - Substrate processing apparatus and substrate processing method - Google Patents
Substrate processing apparatus and substrate processing method Download PDFInfo
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- CN113926615A CN113926615A CN202110691128.7A CN202110691128A CN113926615A CN 113926615 A CN113926615 A CN 113926615A CN 202110691128 A CN202110691128 A CN 202110691128A CN 113926615 A CN113926615 A CN 113926615A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a substrate processing apparatus and a substrate processing method capable of reducing errors in substrate transfer. A substrate processing apparatus according to an embodiment of the present invention includes a guide unit, a transport unit, and a processing unit. The guide portion extends along a conveying direction of the substrate. The conveying device is used for conveying the substrate along the conveying direction. The processing unit is configured to perform processing on a substrate conveyed in a conveying direction. The conveying device includes a holding section, a moving section, and an adjusting section. The holding portion is used for holding the substrate. The moving section can support the holding section and move along the guide section. The adjusting part is used for adjusting the position of the moving part in the direction orthogonal to the conveying direction, and at least part of the adjusting part and the moving part are arranged on the same horizontal plane.
Description
Technical Field
The present invention relates to a substrate processing apparatus and a substrate processing method.
Background
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2018-126718
Disclosure of Invention
Technical problem to be solved by the invention
The invention provides a technique capable of reducing errors in substrate conveyance.
Means for solving the problems
A substrate processing apparatus according to an embodiment of the present invention includes a guide unit, a transport unit, and a processing unit. The guide portion extends along a conveying direction of the substrate. The conveying device is used for conveying the substrate along the conveying direction. The processing unit is configured to perform processing on a substrate conveyed in a conveying direction. The conveying device includes a holding section, a moving section, and an adjusting section. The holding portion is used for holding the substrate. The moving section can support the holding section and move along the guide section. The adjusting part is used for adjusting the position of the moving part in the direction orthogonal to the conveying direction, and at least part of the adjusting part and the moving part are arranged on the same horizontal plane.
Effects of the invention
By adopting the invention, the error of substrate conveying can be reduced.
Drawings
Fig. 1 is a schematic plan view showing a part of a substrate processing apparatus according to an embodiment.
FIG. 2 is a diagrammatic sectional view of section II-II of FIG. 1.
Fig. 3 is a flowchart illustrating substrate processing according to an embodiment.
Fig. 4 is a diagram illustrating an adjustment method of the conveying device according to the embodiment.
Fig. 5 is a schematic cross-sectional view showing a part of a transport apparatus of a substrate processing apparatus according to a modification.
Description of the reference numerals
A substrate processing apparatus 1, a floating table 2, a guide rail 3, a side surface 3a, 3b, a conveying apparatus 4, a coating section 5, a maintenance section 6, a control section 7, a moving section 10, an adjusting section 11a, 11b, a driving section 12, an arm 12a, floating pads 13a to 13c, a holding section 14, a suction pad 14a, a rotating section 15, side wall sections 10a, 10b, and an upper wall section 10 c.
Detailed Description
Embodiments of the substrate processing apparatus and the substrate processing method disclosed in the present application will be described in detail below with reference to the drawings. The substrate processing apparatus and the substrate processing method of the present invention are not limited to the embodiments described below.
In the drawings referred to below, in order to facilitate understanding of the description, a rectangular coordinate system is shown in which the positive Z-axis direction is the vertical upward direction, in which the X-axis direction, the Y-axis direction, and the Z-axis direction are defined to be orthogonal to each other.
Here, a front-rear direction is defined in which the positive Y-axis direction is the front, and the negative Y-axis direction is the rear, and a left-right direction is defined in which the negative X-axis direction is the right and the positive X-axis direction is the left. The vertical direction is defined with the positive Z-axis direction as the upper side and the negative Z-axis direction as the lower side. The substrate processing apparatus 1 can process the substrate S while conveying the substrate S from the rear to the front in the front-rear direction. That is, the substrate processing apparatus 1 can process the substrate S while conveying the substrate S along the conveying direction which is a direction from the rear to the front.
< integral construction >
A substrate processing apparatus 1 according to an embodiment will be described with reference to fig. 1. Fig. 1 is a schematic plan view showing a part of a substrate processing apparatus 1 according to an embodiment. The substrate processing apparatus 1 can draw the substrate S as a workpiece by an ink jet method while conveying the substrate S in a horizontal direction. The substrate S is, for example, a substrate used for a flat panel display.
The substrate processing apparatus 1 includes a floating table 2 (an example of a table portion), a pair of guide rails 3 (an example of a guide portion), a plurality of conveying devices 4, a plurality of coating portions 5, a maintenance portion 6, and a control device 7.
The floating platform 2 has a plurality of discharge ports. The floating table 2 can blow compressed gas (for example, air) from the discharge port toward the lower surface of the substrate S, and apply a force (hereinafter referred to as a floating force) acting upward to the substrate S. The floating table 2 adjusts the floating height of the substrate S held by the holding portion 14 of the transport device 4 by applying a floating force. That is, the floating platform 2 can adjust the floating height of the substrate S by blowing gas from below onto the substrate S held by the holding portion 14 of the transport device 4.
The floating table 2 includes a carry-in table for carrying in the substrate S and a carry-out table for carrying out the substrate S. The carry-in table is provided on the rear side of the substrate processing apparatus 1. The delivery table is provided on the front side of the substrate processing apparatus 1.
The floating platform 2 may be provided in plurality along the conveying direction. The range of the floating height of the substrate S on the floating platform 2 positioned below the coating part 5 is narrower than the range of the floating height of the substrate S on the other floating platforms 2. For example, the floating height of the substrate S on the floating platform 2 located below the coating part 5 is in the range of 30 to 60 μm. The floating height of the substrate S on the other floating platforms 2 is in the range of 200 to 2000 μm.
For example, the floating height of the substrate S may be adjusted by the floating table 2 located below the coating section 5 by discharging compressed air to the lower surface of the substrate S and sucking air between the substrate S and the floating table 2.
The guide rail 3 is provided so as to extend in the conveying direction. The pair of guide rails 3 are arranged side by side in the left-right direction. Specifically, the pair of guide rails 3 are disposed so as to sandwich the floating platform 2 in the left-right direction. The pair of guide rails 3 is made of, for example, granite. The cross section of the guide rail 3 orthogonal to the conveying direction is rectangular.
The transport device 4 is used to transport the substrate S in the transport direction. The conveying device 4 is provided with, for example, 4 so that it can support the four corners of the substrate S and convey the substrate S. 2 conveying devices 4 are provided for 1 guide rail 3. The transport device 4 can support the substrate S and transport the substrate S in the transport direction along the guide rail 3. The conveyance device 4 can move the substrate S whose floating height is adjusted by the floating table 2 (an example of a table portion) in the conveyance direction. The number of the conveying devices 4 is not limited thereto. The details of the conveyance device 4 will be described later.
The coating section 5 (an example of a processing section) performs processing on the substrate S conveyed in the conveying direction. Specifically, the coating section 5 applies the functional liquid to the substrate S. The functional liquid is ink. The coating section 5 can coat the functional liquid on the substrate S whose floating height is adjusted by the floating table 2 (an example of a table section). Specifically, the coating section 5 releases the functional liquid to the substrate S to coat the substrate S with the functional liquid. The plurality of coating units 5 are arranged in the left-right direction. Although fig. 1 shows a state in which 7 coating units 5 are arranged along the left-right direction, the number of coating units 5 is not limited to this. The coating section 5 has a plurality of discharge heads for discharging the functional liquid, and the functional liquid can be discharged from each discharge head to the substrate S.
The coating section 5 is movable along a pair of rails 8 arranged side by side in the front-rear direction. The pair of guide rails 8 are provided so as to extend in the left-right direction. The pair of guide rails 8 are provided to extend rightward with respect to the floating platform 2, for example. A maintenance unit 6 is provided between a pair of guide rails 8 on the right side of the floating platform 2. The coating section 5 is movable between a position above the maintenance section 6 and a position for discharging the functional liquid onto the substrate S. The coating section 5 is movable in the left-right direction along a pair of guide rails 8 by a driving device, for example, a linear motor. The plurality of coating units 5 may be independently moved in the left-right direction, or may be integrally moved in the left-right direction.
The maintenance unit 6 is used to perform maintenance of the release head of the application unit 5 and to eliminate or prevent release failure of the release head of the application unit 5. The maintenance unit 6 may be provided above the floating platform 2.
The control device 7 is, for example, a computer, and includes a control unit 7A and a storage unit 7B. The storage unit 7B stores a program for controlling various processes executed in the substrate processing apparatus 1. The control unit 7A reads and executes the program stored in the storage unit 7B to control the operation of the substrate processing apparatus 1.
The program may be stored in a computer-readable storage medium and installed from the storage medium to the storage unit 7B of the control device 7. Examples of the computer-readable storage medium include a Hard Disk (HD), a Flexible Disk (FD), an optical disk (CD), a magneto-optical disk (MO), and a memory card.
Although detailed description is omitted, the substrate processing apparatus 1 includes a detection mechanism for detecting a release state of the functional liquid from the coating section 5. The detection means detects the release state of the functional liquid from the application section 5 by capturing an image of the functional liquid released from the application section 5 to the thin film section with an image pickup device such as a camera.
< conveying device >
Next, the conveying device 4 will be described with reference to fig. 1 and 2. FIG. 2 is a diagrammatic sectional view of section II-II of FIG. 1.
The conveying device 4 includes: a moving part 10; a plurality of adjustment units 11a and 11 b; a drive section 12; a plurality of floating pads 13a to 13 c; a holding portion 14; and a rotating portion 15.
The moving part 10 is of a gate type and includes a pair of side wall parts 10a, 10b and an upper wall part 10 c. The pair of side walls 10a and 10b are provided to sandwich the guide rail 3 in the left-right direction. That is, the pair of side wall portions 10a and 10b are provided so as to face the pair of side surfaces 3a and 3b of the guide rail 3 (an example of a guide portion) in the left-right direction (an example of a direction orthogonal to the conveying direction). Specifically, the side wall portion 10a faces the side surface 3a of the guide rail 3. The side wall portion 10b is opposed to the side surface 3b of the guide rail 3. The upper wall portion 10c connects the upper ends of the pair of side wall portions 10a, 10 b. The moving unit 10 can support the holding unit 14 and move along the guide rail 3 (an example of a guide unit)
The adjustment portions 11a and 11b are respectively provided between the pair of side surfaces 3a and 3b and the pair of side wall portions 10a and 10 b. Specifically, the adjusting portion 11a is provided between the side surface 3a of the guide rail 3 and the side wall portion 10a of the moving portion 10. The adjusting portion 11b is provided between the side surface 3b of the guide rail 3 and the side wall portion 10b of the moving portion 10. That is, the adjusting portions 11a and 11b are provided on both sides of the guide rail 3 in the left-right direction.
The adjusting portions 11a and 11b are actuators for moving the moving portion 10 in the left-right direction. The adjustment portions 11a and 11b are, for example, piezoelectric elements, and can be displaced in the left-right direction in accordance with the supplied voltage. The adjusting units 11a and 11b may be linear motors, for example. The adjusting portions 11a and 11b are used to adjust the position of the moving portion 10 in the left-right direction (an example of a direction orthogonal to the conveying direction). At least a part of the adjusting parts 11a and 11b is disposed on the same horizontal plane as the moving part 10. Specifically, the adjusting portions 11a and 11b are disposed on the same horizontal plane as the pair of side walls 10a and 10b of the moving portion 10.
The driving unit 12 moves the moving unit 10 in the front-rear direction. The driving unit 12 is, for example, a linear motor. The driving part 12 includes an arm 12a connectable with the moving part 10. The driving unit 12 moves the moving unit 10 in the front-rear direction by moving the arm 12a in the front-rear direction. The arm 12a extends in the vertical direction, and the upper end side of the arm 12a is connected to the adjustment portion 11 a. That is, the driving unit 12 is connected to the moving unit 10 via the adjusting unit 11 a. The arm 12a overlaps the moving portion 10 in the vertical direction (an example of the height direction). The arm 12a is sandwiched by the adjustment portion 11a and the floating pad 13 a. As described above, the driving unit 12 has the arm 12a connectable to the moving unit 10, and the moving unit 10 can be moved along the guide rail 3 (an example of a guide unit) via the arm 12 a.
The floating pad 13a is provided between the side surface 3a of the rail 3 and the arm 12a of the driving portion 12. The floating pad 13a is mounted on the arm 12 a. The floating pads 13a can blow compressed gas (e.g., air) toward the side surfaces 3a of the guide rail 3, thereby supporting the moving part 10 on the guide rail 3 in a non-contact state in the left-right direction. The floating pad 13a can support the moving part 10 on the guide rail 3 in the left-right direction in a non-contact state while keeping a distance between the side surface 3a of the guide rail 3 and the floating pad 13a at a predetermined distance.
The floating pad 13b is provided between the side surface 3b of the guide rail 3 and the adjusting portion 11 b. The floating pad 13b is mounted on the adjusting portion 11 b. The floating pads 13b can blow compressed gas (for example, air) toward the side surfaces 3b of the guide rail 3, thereby supporting the moving part 10 on the guide rail 3 in a non-contact state in the left-right direction. The floating pad 13b can support the moving part 10 on the guide rail 3 in the left-right direction in a non-contact state while keeping a distance between the side surface 3b of the guide rail 3 and the floating pad 13b at a predetermined distance.
The floating pad 13c is provided between the upper surface 3c of the guide rail 3 and the upper wall portion 10c of the moving portion 10. The floating pad 13c is mounted on the upper wall portion 10c of the moving portion 10. The floating pads 13c can blow compressed gas (for example, air) toward the upper surface 3c of the guide rail 3, thereby supporting the moving portion 10 on the guide rail 3 in a non-contact state in the vertical direction. The floating pad 13c can support the moving portion 10 on the guide rail 3 in the vertical direction in a non-contact state while keeping a distance between the upper surface 3c of the guide rail 3 and the floating pad 13c at a predetermined distance.
The holding portion 14 is for holding the substrate S. The holding portion 14 includes a plurality of suction pads 14 a. The plurality of suction pads 14a are arranged side by side in the front-rear direction. For example, 3 suction pads 14a are provided in parallel in the front-rear direction on the holding portion 14. The number of the suction pads 14a is not limited to this, and 1 suction pad 14a may be provided in the holding portion 14. The holding portion 14 can hold the substrate S by attracting the lower surface of the substrate S by the plurality of suction pads 14 a. The holding portion 14 is supported by the moving portion 10 via the rotating portion 15.
The rotating portion 15 is provided on the upper wall portion 10c of the moving portion 10. The rotating portion 15 is, for example, a bearing, and includes a shaft portion 15a and a receiving portion 15 b. The shaft portion 15a is attached to the holding portion 14. The receiving portion 15b is attached to the upper wall portion 10c of the moving portion 10, and rotatably supports the shaft portion 15 a. That is, the rotating portion 15 can rotatably support the holding portion 14 with respect to the moving portion 10.
In the plurality of transport devices 4, the position of the moving section 10 can be adjusted in the front-rear direction and the left-right direction, respectively. The position of the moving portion 10 in the front-rear direction can be adjusted by the driving portion 12. The position of the moving unit 10 in the left-right direction can be adjusted by the adjusting units 11a and 11 b. For example, when the moving unit 10 is to be moved leftward, the amount of displacement by the adjusting unit 11a may be decreased, and the amount of displacement by the adjusting unit 11b may be increased. This allows the moving unit 10 to move leftward with respect to the guide rail 3.
In the transport device 4, the holding portion 14 is supported by the moving portion 10 via the rotating portion 15 so as to be rotatable with respect to the moving portion 10. Therefore, the orientation of the substrate S sucked by the suction pads 14a of the holding portion 14 with respect to the conveying direction can be adjusted by adjusting the position of the moving portion 10 in the front-rear direction and the left-right direction. That is, the conveying device 4 can adjust the orientation of the substrate S with respect to the conveying direction by the driving section 12, the adjusting sections 11a, 11b, and the rotating section 15.
The substrate processing apparatus 1 can adjust the orientation of the substrate S with respect to the transport direction by adjusting the positions of the moving portions 10 of the plurality of transport devices 4 in the front-rear direction and the left-right direction, respectively.
< substrate treatment >
Next, a substrate processing will be explained with reference to fig. 3. Fig. 3 is a flowchart illustrating substrate processing according to an embodiment.
The substrate processing apparatus 1 performs the holding step (S100). The substrate processing apparatus 1 holds the substrate S conveyed to the floating table 2 by the plurality of conveying apparatuses 4. Specifically, the substrate processing apparatus 1 holds the substrate S by attracting the four corners of the substrate S by the attraction pads 14a of the holding portion 14.
The substrate processing apparatus 1 performs the adjustment step (S101). The substrate processing apparatus 1 adjusts the orientation of the substrate S with respect to the transport direction. The substrate processing apparatus 1 adjusts the orientation of the substrate S so that the shape of the substrate S held by the holding portion 14 does not change. The adjusting step may be performed before the holding step.
Specifically, the substrate processing apparatus 1 aligns the positions in the front-rear direction of the 2 transport devices 4 provided on the front side. The substrate processing apparatus 1 measures the distances in the front-rear direction of 2 transport devices 4 provided on the front side, for example, by using laser interferometers provided on the front end sides of the respective guide rails 3. Then, the substrate processing apparatus 1 adjusts the positions in the front-rear direction of the 2 transport devices 4 disposed on the front side so that the positions in the front-rear direction of the 2 transport devices 4 disposed on the front side coincide.
In addition, the substrate processing apparatus 1 adjusts the positions of the 2 transport devices 4 in the left-right direction by the adjusting portions 11a and 11b of the 2 transport devices 4 disposed on the front side so that the distance in the left-right direction of the 2 transport devices 4 becomes a predetermined distance.
In addition, the substrate processing apparatus 1 adjusts the positions in the left-right direction of the 2 transport apparatuses 4 provided on the rear side. As shown in fig. 4, the substrate processing apparatus 1 adjusts the positions of the 2 transport devices 4 provided on the rear side so that the virtual line a1 connecting the 2 transport devices 4 provided on the front side and the virtual line a2 connecting the 2 transport devices 4 provided on the 1 guide rail 3 are orthogonal to each other. The virtual line a1 is a line connecting the axial centers of the shaft portions 15a of the rotating portions 15 of the 2 transport devices 4 provided on the front side. The virtual line a2 is a line connecting the axial centers of the shaft portions 15a of the rotating portions 15 of the 2 transport devices 4 provided on the 1 guide rail 3. Fig. 4 is a diagram illustrating an adjustment method of the conveyance device 4 according to the embodiment.
In addition, the substrate processing apparatus 1 adjusts the positions in the front-rear direction of the 2 transport devices 4 provided on the one guide rail 3 so that the distances in the front-rear direction of the 2 transport devices 4 become the preset distances.
Returning to fig. 3, the substrate processing apparatus 1 performs the transport step (S102). The substrate processing apparatus 1 conveys the substrate S held by the holding portions 14 of the 4 conveying apparatuses 4 in the conveying direction. The substrate processing apparatus 1 may perform the adjustment step during the conveyance of the substrate S.
The substrate processing apparatus 1 performs the coating step (S103). The substrate processing apparatus 1 discharges the functional liquid from the coating section 5 to the substrate S conveyed in the conveying direction, and coats the functional liquid on the substrate S. The substrate S coated with the functional liquid is sent out from the floating table 2.
< Effect >
In the substrate processing apparatus of the comparative example which does not include the transport apparatus 4 of the embodiment, for example, an adjustment mechanism for adjusting the position of the holding portion in the left-right direction is provided above the moving portion. Therefore, the substrate processing apparatus of the comparative example increases the distance from the moving portion to the substrate in the vertical direction, and the positional deviation of the substrate due to the error generated by the mechanism for adjusting the position of the moving portion in the front-rear direction increases. That is, the substrate processing apparatus of the comparative example has a large error in substrate conveyance.
The substrate processing apparatus 1 includes a guide rail 3 (an example of a guide), a transport device 4, and a coating section 5 (an example of a processing section). The guide rail 3 extends along the conveying direction of the substrate S. The transport device 4 is used to transport the substrate S in the transport direction. The coating section 5 is used for processing the substrate S conveyed in the conveying direction. Specifically, the coating section 5 is used to coat the substrate S with the functional liquid. The conveying device 4 includes a holding portion 14, a moving portion 10, and adjusting portions 11a and 11 b. The holding portion 14 is for holding the substrate S. The moving portion 10 can support the holding portion 14 and move along the guide rail 3. The adjusting portions 11a and 11b are used to adjust the position of the moving portion 10 in the left-right direction (an example of a direction orthogonal to the conveying direction), and at least a part of the adjusting portions 11a and 11b is provided on the same horizontal plane as the moving portion 10.
Thus, the substrate processing apparatus 1 can shorten the distance from the moving unit 10 to the substrate S in the vertical direction, and can shorten the distance from the driving unit 12 to the substrate S. Therefore, the substrate processing apparatus 1 can suppress the positional deviation of the substrate S caused by the error of the driving section 12. That is, the substrate processing apparatus 1 can reduce errors in substrate conveyance. In addition, the substrate processing apparatus 1 can reduce the height of the entire apparatus.
In addition, the substrate processing apparatus 1 can prevent the adjusting parts 11a and 11b from being disposed in the vicinity of the substrate S, for example, directly below the substrate S, and can suppress the influence of the heat generated by the adjusting parts 11a and 11b on the substrate S. Therefore, the substrate processing apparatus 1 can suppress the state of the substrate S from changing due to the heat generation of the adjusting portions 11a and 11b, and reduce the error in the substrate conveyance.
The conveying device 4 includes a driving section 12. The driving unit 12 has an arm 12a connected to the moving unit 10, and can move the moving unit 10 along the guide rail 3 (an example of a guide unit) via the arm 12 a. The arm 12a overlaps the moving portion 10 in the vertical direction (an example of the height direction).
Thus, the substrate processing apparatus 1 can connect the arm 12a and the moving unit 10 at a position where the arm 12a overlaps the moving unit 10 in the vertical direction. Therefore, the substrate processing apparatus 1 can; the height from the driving unit 12 to the moving unit 10 is suppressed from increasing by the connection of the arm 12a to the moving unit 10. That is, the substrate processing apparatus 1 can shorten the distance from the moving section 10 to the substrate S, and can suppress the positional deviation of the substrate S. Therefore, the substrate processing apparatus 1 can reduce errors in substrate conveyance.
The moving part 10 includes a pair of side wall parts 10a, 10 b. The pair of side wall portions 10a and 10b face a pair of side surfaces 3a and 3b of the guide rail 3 (an example of a guide portion) in the left-right direction (an example of a direction orthogonal to the conveying direction). The adjustment portions 11a and 11b are respectively provided between the pair of side surfaces 3a and 3b and the pair of side wall portions 10a and 10 b.
Thus, the substrate processing apparatus 1 can adjust the position of the moving unit 10 in the left-right direction by the respective adjusting units 11a and 11b, and can adjust the position of the moving unit 10 in the left-right direction, that is, the position of the substrate S in the left-right direction with high accuracy.
The conveyor 4 comprises a turning section 15. The rotating portion 15 can support the holding portion 14 to be rotatable with respect to the moving portion 10. The conveying device 4 adjusts the orientation of the substrate S with respect to the conveying direction by the moving section 10, the adjusting sections 11a, 11b, and the rotating section 15.
Thus, the substrate processing apparatus 1 can adjust the position of the moving section 10 in the front-rear direction by the driving section 12, and adjust the position of the moving section 10 in the left-right direction by the adjusting sections 11a and 11b, thereby adjusting the orientation of the substrate S with respect to the conveying direction.
The substrate processing apparatus 1 includes a floating table 2 (an example of a table portion). The floating table 2 can blow gas from below onto the substrate S held by the holding portion 14 to adjust the floating height of the substrate S. The transport device 4 can move the substrate S whose floating height is adjusted by the floating table 2 in the transport direction. The coating section 5 can coat the functional liquid on the substrate S whose floating height is adjusted by the floating table 2.
Thus, the substrate processing apparatus 1 can improve the coating accuracy of the functional liquid on the substrate S when the floating height of the substrate S is adjusted by the floating platform 2 and the functional liquid is coated on the substrate S by the coating section 5.
In addition, the substrate processing apparatus 1 can transport the substrate S without supporting the entire lower surface of the substrate S with granite, for example, by adjusting the floating height of the substrate S using the floating table 2 and transporting the substrate S using the transport device 4. Therefore, the substrate processing apparatus 1 can transport the substrate S without using large granite, and can reduce the cost.
The coating section 5 releases the functional liquid to the substrate S to coat the functional liquid on the substrate S.
Thus, the substrate processing apparatus 1 can improve the accuracy of applying ink to the substrate S when applying ink to the substrate S by the ink jet method.
< modification example >
As shown in fig. 5, the substrate processing apparatus 1 according to the modified example may be configured such that the holding portion 14 is provided with a step portion 14b, and the step portion 14b is provided with the suction pad 14 a. Fig. 5 is a schematic cross-sectional view showing a part of the transfer device 4 of the substrate processing apparatus 1 according to a modification. The step portion 14b is formed to be lower in height than a portion where the shaft portion 15a of the rotating portion 15 is attached. Thus, the substrate processing apparatus 1 of the modified example can secure the mounting height of the shaft portion 15a and shorten the distance from the driving portion 12 to the substrate S. Therefore, the substrate processing apparatus 1 according to the modified example can suppress the positional deviation of the substrate S due to the error of the driving unit 12, and can reduce the error of the substrate conveyance.
In the above embodiment, the substrate processing apparatus 1 has been described as an example in which the coating section 5 is provided and the coating section 5 draws the substrate S by the ink jet method, but the processing of the substrate S is not limited to this. For example, the technique of the present invention can be applied to various processing treatments such as modification of the surface of the substrate S or removal of a film on the surface layer by performing a treatment of irradiating the substrate S with light or a treatment of releasing a removing liquid from the substrate S.
The presently disclosed embodiments are to be considered in all respects as illustrative and not restrictive. Indeed, the above-described embodiments may be embodied in many ways. Further, the above-described embodiments may be omitted, replaced, or changed in various ways without departing from the spirit and scope of the appended claims.
Claims (8)
1. A substrate processing apparatus, comprising:
a guide portion extending along a conveying direction of the substrate;
a conveying device for conveying the substrate along the conveying direction; and
a processing unit configured to perform a processing process on the substrate conveyed in the conveying direction,
the conveying device comprises:
a holding portion for holding the substrate;
a moving section that can support the holding section and move along the guide section; and
and an adjusting unit for adjusting a position of the moving unit in a direction orthogonal to the conveying direction, wherein at least a part of the adjusting unit is disposed on the same horizontal plane as the moving unit.
2. The substrate processing apparatus according to claim 1, wherein:
the moving portion includes a pair of side wall portions that oppose a pair of side surfaces of the guide portion in a direction orthogonal to the conveying direction,
the adjusting portions are respectively provided between one of the pair of side surfaces and one of the pair of side wall portions and between the other of the pair of side surfaces and the other of the pair of side wall portions.
3. The substrate processing apparatus according to claim 1 or 2, wherein:
the conveying device includes a driving unit having an arm connected to the moving unit and capable of moving the moving unit along the guide unit via the arm,
the arm overlaps the moving portion in the height direction.
4. The substrate processing apparatus according to claim 3, wherein:
the conveying device includes a rotating portion for rotatably supporting the holding portion with respect to the moving portion,
the conveying device can adjust the orientation of the substrate with respect to the conveying direction by the driving portion, the adjusting portion, and the rotating portion.
5. The substrate processing apparatus according to any one of claims 1 to 4, wherein:
the processing unit includes a coating unit for coating the substrate with a functional liquid.
6. The substrate processing apparatus according to claim 5, wherein:
comprising a stage for blowing a gas from below onto the substrate held by the holding section to adjust a floating height of the substrate,
the conveying device is capable of moving the substrate whose floating height is adjusted by the stage in the conveying direction,
the coating section may coat the functional liquid on the substrate whose floating height is adjusted by the stage section.
7. The substrate processing apparatus according to claim 5 or 6, wherein:
the coating section can coat the functional liquid on the substrate by releasing the functional liquid to the substrate.
8. A method of processing a substrate, comprising:
a holding step of holding the substrate by the holding section;
an adjustment step of adjusting a position of a moving section, which is movable along a guide section extending in a conveying direction and supports the holding section, in a direction orthogonal to the conveying direction of the substrate by an adjustment section, at least a part of the adjustment section being provided on the same horizontal plane as the moving section; and
and a processing step of performing processing on the substrate conveyed in the conveying direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020111972A JP2022011083A (en) | 2020-06-29 | 2020-06-29 | Substrate processing device and substrate processing method |
| JP2020-111972 | 2020-06-29 |
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| Publication Number | Publication Date |
|---|---|
| CN113926615A true CN113926615A (en) | 2022-01-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110691128.7A Pending CN113926615A (en) | 2020-06-29 | 2021-06-22 | Substrate processing apparatus and substrate processing method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2022011083A (en) |
| KR (1) | KR20220001471A (en) |
| CN (1) | CN113926615A (en) |
| TW (1) | TW202220090A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118268208A (en) * | 2024-05-30 | 2024-07-02 | 季华实验室 | Panel gluing device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023156645A (en) * | 2022-04-13 | 2023-10-25 | 東京エレクトロン株式会社 | Droplet discharge device, droplet discharge method, and storage medium |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6846943B2 (en) | 2017-02-10 | 2021-03-24 | 東京エレクトロン株式会社 | Coating device and coating method |
-
2020
- 2020-06-29 JP JP2020111972A patent/JP2022011083A/en active Pending
-
2021
- 2021-06-16 TW TW110121889A patent/TW202220090A/en unknown
- 2021-06-17 KR KR1020210078603A patent/KR20220001471A/en unknown
- 2021-06-22 CN CN202110691128.7A patent/CN113926615A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118268208A (en) * | 2024-05-30 | 2024-07-02 | 季华实验室 | Panel gluing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022011083A (en) | 2022-01-17 |
| KR20220001471A (en) | 2022-01-05 |
| TW202220090A (en) | 2022-05-16 |
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