CN113921488A

CN113921488A - Cooling structure for enhancing heat dissipation of packaging body

Info

Publication number: CN113921488A
Application number: CN202111153246.9A
Authority: CN
Inventors: 马晓建; 刘卫东; 高瑞锋; 杨欢; 张兵; 张红兵; 苏亚兰
Original assignee: Huatian Technology Nanjing Co Ltd
Current assignee: Huatian Technology Nanjing Co Ltd
Priority date: 2021-09-29
Filing date: 2021-09-29
Publication date: 2022-01-11

Abstract

The invention discloses a cooling structure for enhancing heat dissipation of a packaging body, which is characterized in that cavity pipelines are arranged at different positions according to the electrical connection relation between a chip and a carrier plate, and cooling liquid is introduced into the cavity pipelines, so that the cooling liquid can cool the chip, the heat dissipation performance of the packaging body is obviously improved, and the stability of the chip during operation is ensured.

Description

Cooling structure for enhancing heat dissipation of packaging body

Technical Field

The invention belongs to the technical field of semiconductor packaging, and particularly relates to a cooling structure and a cooling method for enhancing heat dissipation of a packaging body.

Background

With the rapid development of the semiconductor industry and the miniaturization of electronic products, electronic packaging products not only need to provide chip protection, but also need to meet the requirements of increasing performance, reliability, heat dissipation, electromagnetic shielding and the like at a certain cost. Particularly, in terms of meeting the heat dissipation requirement, a great challenge is formed on a new generation of high-speed and high-integration chips, and the stability of the chips in high-speed operation is directly influenced. Therefore, in the chip industry, the FC-BGA technology is adopted and mainly applied to display chip products and radio frequency chip products, based on the unique flip-chip packaging form, the back surface of the chip can be contacted with air and can directly dissipate heat, meanwhile, the substrate can also improve the heat dissipation efficiency through the metal layer, and compared with the prior packaging technology, the problem of low heat dissipation efficiency is solved to a certain extent.

However, the existing packaging structure is not provided with a heat dissipation structure, and is limited by the packaging structure and materials, so that the heat dissipation capability is very limited.

Disclosure of Invention

The present invention is directed to overcome the above-mentioned disadvantages of the prior art, and to provide a cooling structure for enhancing heat dissipation of a package, so as to solve the problems of the prior art that the package has no heat dissipation structure and the heat dissipation effect of the package is poor

In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:

a cooling structure for enhancing heat dissipation of a package body comprises a carrier plate, wherein a chip is arranged on the carrier plate, and the chip is arranged in a plastic package body; the plastic package body is internally provided with a cavity pipeline, and the cavity pipeline is attached to the upper surface of the carrier plate or the upper surface of the chip or is jointly arranged on the upper surface of the carrier plate and the upper surface of the chip; and cooling liquid flows through the cavity pipeline.

The invention is further improved in that:

preferably, the cooling liquid is cold water or liquid nitrogen.

Preferably, the inlet and the outlet of the cavity pipeline are respectively arranged on two side walls of the plastic package body.

Preferably, when the upper surface of the carrier plate and the upper surface of the chip are both provided with the cavity conduits, the upper surface of the carrier plate and the upper surface of the chip are two independent cavity conduits.

Preferably, each individual cavity conduit is provided with a separate inlet and outlet.

Preferably, when the chip and the carrier are electrically connected by a bonding wire, the cavity pipe is disposed on the carrier.

Preferably, when the chip and the carrier plate are electrically connected through the metal posts, the cavity pipe is arranged on the chip.

Preferably, the cavity pipeline is arranged on the chip through a medium, and the cavity pipeline is arranged on the carrier plate through a second colloid.

Preferably, the shape of the cavity pipeline is wave-shaped, U-shaped or linear.

Compared with the prior art, the invention has the following beneficial effects:

Furthermore, the cooling liquid is flowing cold water or liquid nitrogen, so that the packaging body achieves a better heat dissipation effect.

Furthermore, when the cavity pipeline is arranged on the carrier plate or the chip, the cavity pipeline is respectively provided with an inlet and an outlet which correspond to each other.

Furthermore, when the carrier plate and the chip are respectively provided with the cavity pipelines, the inlets and the outlets are respectively arranged, so that the cooling effect is ensured, and the number of open cavities in the whole packaging body is reduced.

Further, the shape of the cavity pipeline is wave-shaped, U-shaped or linear, so that the cavity pipeline can be arranged according to the actual chip or carrier structure.

Drawings

FIG. 1 is a front view of a schematic structure of embodiment 1;

FIG. 2 is a front view of a schematic structure of embodiment 2;

FIG. 3 is a sectional view showing a schematic structure of example 1;

FIG. 4 is a sectional view showing a schematic structure of example 2;

FIG. 5 is a top view of example 1;

FIG. 6 is a plan view of example 2.

In the figure, 1 is a cavity pipeline; 2 is a welding line; 3 is a medium; 4 is a chip; 5 is a metal column; 6 is a solder ball; 7 is a first colloid; 8-a second colloid; 9 is a carrier plate; 10-plastic package body.

Detailed Description

The invention is described in further detail below with reference to the accompanying drawings:

in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and encompass, for example, both fixed and removable connections; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The invention discloses a cooling structure for enhancing heat dissipation of a packaging body, which can be applied to most of the existing packaging structures. Specifically, referring to fig. 1, the package structure includes a carrier 9, a chip 4 is disposed on the carrier 9, the chip 4 is packaged in a plastic package 11, and a plurality of solder balls 6 are disposed on an upper end surface of the carrier 9.

A cavity pipeline 11 is arranged in the plastic package body 11, and the cavity pipeline 11 is attached to the upper surface of the carrier plate 9 and the upper surface of the chip 4, or the upper surface of the carrier plate 9 and the upper surface of the chip 4; the cavity pipeline (1) is internally circulated with cooling liquid, and the cooling liquid is flowing cold water or liquid nitrogen.

Example 1

Referring to fig. 1, 3 and 5, a metal pillar 5 is disposed between the lower end surface of the chip 4 and the carrier 9, and the metal pillar 5 can transmit an electrical signal between the chip 4 and the carrier 9, so that the effective area of the upper surface of the chip 4 is increased. Chip 4 is radiating essential element, and when the upper surface area of chip 4 was great, cavity pipeline 1 priority set up the upper surface at chip 4, and cavity pipeline 1 passes through medium 3 and laminates the upper surface at chip 1. In order to increase the cooling area, the cavity duct 1 is arranged in a U-shaped winding on the upper surface of the chip 4, the specific winding number is determined according to the actual surface area of the chip, and the medium 3 is a high-thermal-conductivity adhesive glue.

Referring to fig. 3, a cavity pipeline 1 is arranged on the chip 4, and an inlet and an outlet of the cavity pipeline are respectively arranged on two wall surfaces, so that the structure is convenient to arrange.

Example 2

Referring to fig. 2, 4 and 6, the chip 4 is attached to the carrier 9 through the first adhesive 7, and the upper surface of the chip 4 is electrically connected to the carrier 9 through a plurality of bonding wires 2. In this embodiment, the upper surface area of the chip 4 is not large, so that the cavity pipeline 11 is not suitable for being arranged on the upper surface of the chip 4, the cavity pipeline 11 is arranged around the chip 4 in a circle, the cavity pipeline 11 is attached to the upper surface of the carrier plate 9 through the second colloid 8, and the first colloid 7 and the second colloid 8 are high-thermal-conductivity adhesive glue.

Referring to fig. 6, the chip 4 is rectangular, the cavity pipes 11 are disposed around four sides of the chip 4, and the cavity pipes 11 beside each side of the chip 4 can be linear, wavy or U-shaped, and are disposed according to the vacant area of the carrier plate 9 to enhance the cooling strength.

The cavity pipeline 11 is provided with one, and the inlet and the outlet of the cavity pipeline are respectively arranged on two wall surfaces of the plastic package body 10.

Example 3

When the chip 4 and the carrier 9 are simultaneously provided with the cavity pipes 11, the cavity pipes 11 on the chip 4 and the carrier 9 are two independent cavity pipes 11.

The cavity channel 11 on the chip 4 is connected to the chip 4 via the medium 3, and the cavity channel 11 can be arranged on the chip 4 in a winding manner.

A cavity tube 11 on the carrier plate 9 is connected to the carrier plate 9 through the second glue 8, and the cavity tube 11 is disposed around the chip 4.

The inlet and outlet of the cavity tube 11 on the chip 4 are higher than the inlet and outlet of the cavity tube 11 on the carrier plate 9.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims

1. A cooling structure for enhancing heat dissipation of a package body is characterized by comprising a carrier plate (9), wherein a chip (4) is arranged on the carrier plate (9), and the chip (4) is arranged in a plastic package body (11); a cavity pipeline (11) is arranged in the plastic package body (11), and the cavity pipeline (11) is attached to the upper surface of the carrier plate (9) or the upper surface of the chip (4), or is arranged on the upper surface of the carrier plate (9) and the upper surface of the chip (4) together; the cavity pipeline (1) is internally circulated with cooling liquid.

2. A cooling structure for enhancing heat dissipation of a package body as recited in claim 1, wherein the cooling liquid is cold water or liquid nitrogen.

3. A cooling structure for enhancing heat dissipation of a package body as recited in claim 1, wherein the inlet and the outlet of the cavity duct (11) are respectively disposed on two side walls of the plastic package body (11).

4. A cooling structure for enhancing heat dissipation of a package according to claim 1, wherein when the upper surface of the carrier board (9) and the upper surface of the chip (4) are both provided with the cavity conduit (11), the upper surface of the carrier board (9) and the upper surface of the chip (4) are two independent cavity conduits (11).

5. A cooling structure for enhancing heat dissipation of packages according to claim 4, characterized in that each individual cavity duct (11) is provided with a separate inlet and outlet.

6. A cooling structure for enhancing heat dissipation of a package according to claim 1, wherein the cavity tube (11) is disposed on the carrier (9) when the chip (4) and the carrier (9) are electrically connected by the bonding wire (2).

7. A cooling structure for enhancing heat dissipation of a package according to claim 1, wherein the cavity conduit (11) is disposed on the chip (4) when the chip (4) and the carrier (9) are electrically connected through the metal posts (5).

8. A cooling structure for enhancing heat dissipation of a package according to any one of claims 1 to 7, wherein the cavity tube (11) is disposed on the chip (4) through the medium (3), and the cavity tube (11) is disposed on the carrier (9) through the second adhesive (8).

9. The cooling structure for enhancing the heat dissipation of the package body as recited in any one of claims 1 to 7, wherein the shape of the cavity duct (11) is a wave shape, a U shape or a straight line shape.