CN113910473A - Mica plate laser positioning plate shearing process - Google Patents
Mica plate laser positioning plate shearing process Download PDFInfo
- Publication number
- CN113910473A CN113910473A CN202111217060.5A CN202111217060A CN113910473A CN 113910473 A CN113910473 A CN 113910473A CN 202111217060 A CN202111217060 A CN 202111217060A CN 113910473 A CN113910473 A CN 113910473A
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- Prior art keywords
- mica plate
- shearing
- mica
- plate
- laser
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- 239000010445 mica Substances 0.000 title claims abstract description 140
- 229910052618 mica group Inorganic materials 0.000 title claims abstract description 140
- 238000010008 shearing Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 43
- 230000008569 process Effects 0.000 title claims abstract description 34
- 239000000463 material Substances 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 239000002893 slag Substances 0.000 claims description 6
- 238000005299 abrasion Methods 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of mica plate shearing, and discloses a mica plate laser positioning plate shearing process, which comprises the following steps: feeding a mica plate; step two: positioning the mica plate, namely installing laser positioners on two sides of the shearing track, detecting whether the two sides of the mica plate are subjected to positioning standards by the laser positioners, and judging whether two side edges of the mica plate are parallel to two sides of the shearing track; step three: the mica plate is sheared, an upper shearing blade and a lower shearing blade are respectively installed on the upper side and the lower side of a shearing track, the upper shearing blade and the lower shearing blade are arranged in an up-down position in an aligned mode, and the mica plate is sheared by the aid of the mode that the upper shearing blade makes reciprocating linear motion with the lower shearing blade; step four: and (5) blanking the mica plate. The mica plate laser positioning plate shearing process adopts the laser positioning and double-blade up-and-down simultaneous cutting technology, ensures the product quality of the mica plate, has high automation degree and reduces the labor intensity.
Description
Technical Field
The invention relates to the technical field of mica plate shearing, in particular to a mica plate laser positioning and shearing process.
Background
The mica plate is a high-quality insulating material, has the advantages of no toxicity, no odor, high temperature resistance, high pressure resistance, aging resistance, corrosion resistance, stable electrical performance and the like, particularly has excellent high-temperature-resistant insulating performance, can resist the temperature up to 1000 ℃ at most, and has good cost performance in the high-temperature-resistant insulating material. Therefore, the method is widely applied to the fields of household appliances, metallurgy and chemical engineering and the like.
The prior art for shearing a mica plate generally comprises the following steps: the three steps of material loading, board shearing and unloading, wherein material loading and unloading are manual operation generally, and intensity of labour is great, has increased the input of manpower and material resources, and wherein adopt single cutter piece directly to cut off it when cutting the board in addition, and the phenomenon that deckle edge produced appears easily in single cutter piece does not have corresponding location structure to the mica plate moreover, appears the phenomenon of displacement deviation easily when cutting the board to influence the product quality of mica plate. Therefore, the invention provides a mica plate laser positioning plate shearing process.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a mica plate laser positioning plate shearing process, which adopts the technologies of laser positioning and simultaneous up-and-down cutting of double blades, ensures the product quality of mica plates, has high automation degree, reduces the labor intensity, and solves the problems that the loading and unloading of the prior mica plates are generally manually operated, the labor intensity is higher, the input of manpower and material resources is increased, in addition, a single blade is adopted to directly cut off the mica plates during plate shearing, burrs are easily generated by the single blade, and no corresponding positioning structure is adopted for the mica plates, and the phenomenon of displacement deviation is easily generated during plate shearing, so the product quality of the mica plates is influenced.
(II) technical scheme
In order to achieve the purpose, the invention provides the following technical scheme: a mica plate laser positioning plate shearing process comprises the following specific steps:
the method comprises the following steps: feeding the mica plates, wherein the mica plates finish the feeding action of the mica plates through automatic feeding equipment;
step two: the mica plate is positioned, laser positioners are installed on two sides of the shearing track, when the mica plate is conveyed to the lower parts of the laser positioners on the two sides, laser rays are emitted by the laser positioners at the moment, the laser rays of the laser positioners can be aligned with reference lines on the two sides of the mica plate, the laser positioners can detect whether the two sides of the mica plate are subjected to positioning standards, and whether the two side edges of the mica plate are parallel to the two sides of the shearing track is judged, so that the mica plate is always in the equal-width condition, the parallelism of the two side edges of the mica plate is ensured, and if the rays of the laser positioners are shielded by the mica plate or the laser ray parts of the laser positioners and the side edges of the mica plate are not on the same reference line, errors exist in the positioning of the mica plate at the moment;
step three: the mica plate is sheared, an upper shearing blade and a lower shearing blade are respectively installed on the upper side and the lower side of a shearing track, the upper shearing blade and the lower shearing blade are arranged in an up-down position in an aligned mode, the upper shearing blade is installed and connected with a reciprocating linear motion structure, the driving mode of the reciprocating linear motion can be electric or pneumatic, the mica plate is sheared by the mode that the upper shearing blade makes reciprocating linear motion towards the lower shearing blade, when the upper shearing blade is in butt joint with the lower shearing blade, the mica plate is sheared, the shearing surface is flat and smooth, no burr is generated, and the using performance of a product is improved;
step four: and (4) blanking the mica plates, and conveying the cut mica plates to a stacking platform by a suction device for unified storage.
Preferably, the automatic feeding device in the first step is a conveying track, the conveying track adopts a conveying mode of conveying rollers, and the conveying rollers adopt roller ways made of rubber materials, so that the abrasion phenomenon of the surface of the mica plate is avoided.
Preferably, in the second step, if the mica plate does not reach the parallelism standard, an alarm can be sent out through a warning lamp to inform a worker, at the moment, the worker manually adjusts the parallelism between the mica plate and the two sides of the shearing roller way, and if the mica plate and the two sides of the shearing rail are arranged in parallel, the operation in the third step is continued.
Preferably, the driving modes of the upper shearing blade and the lower shearing blade in the third step are both a cylinder driving mode.
Preferably, in the third step, when the mica plate is sheared, a slag receiving box is further arranged below the shearing track, so that crushed slag generated in the shearing process can be collected.
Preferably, the suction device in the fourth step completes suction and blanking actions on the mica plate by matching a vacuum chuck with a vacuum compressor.
Preferably, in the fourth step, the mica plates are pushed into a storage room after being stacked, and the internal temperature of the storage room is a normal temperature state.
(III) advantageous effects
Compared with the prior art, the invention provides a mica plate laser positioning plate shearing process, which has the following beneficial effects:
1. according to the mica plate laser positioning plate shearing process, the parallelism of the two side edges of the mica plate is ensured through laser positioning, so that the mica plate is always equal in width, the positioning accuracy of the mica plate is ensured, and the phenomenon that the mica plate has larger positioning error is not easy to occur, so that the product quality of the mica plate is improved.
2. According to the mica plate laser positioning plate shearing process, burrs are prevented from being generated in the shearing process through the arrangement of the upper shearing blade and the lower shearing blade, so that the shearing precision of a mica plate is improved, the product quality of the mica plate is improved, and the shearing efficiency of the mica plate is improved.
3. According to the mica plate laser positioning plate shearing process, the mica plates are fed and discharged in a mechanical mode with high automation degree, and the operation intensity of workers is reduced.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
A mica plate laser positioning plate shearing process comprises the following specific steps:
the method comprises the following steps: feeding the mica plates, wherein the mica plates finish the feeding action of the mica plates through automatic feeding equipment;
step two: the mica plate is positioned, laser positioners are installed on two sides of the shearing track, when the mica plate is conveyed to the lower parts of the laser positioners on the two sides, laser rays are emitted by the laser positioners at the moment, the laser rays of the laser positioners can be aligned with reference lines on the two sides of the mica plate, the laser positioners can detect whether the two sides of the mica plate are subjected to positioning standards, and whether the two side edges of the mica plate are parallel to the two sides of the shearing track is judged, so that the mica plate is always in the equal-width condition, the parallelism of the two side edges of the mica plate is ensured, and if the rays of the laser positioners are shielded by the mica plate or the laser ray parts of the laser positioners and the side edges of the mica plate are not on the same reference line, errors exist in the positioning of the mica plate at the moment;
step three: the mica plate is sheared, an upper shearing blade and a lower shearing blade are respectively installed on the upper side and the lower side of a shearing track, the upper shearing blade and the lower shearing blade are arranged in an up-down position in an aligned mode, the upper shearing blade is installed and connected with a reciprocating linear motion structure, the driving mode of the reciprocating linear motion can be electric or pneumatic, the mica plate is sheared by the mode that the upper shearing blade makes reciprocating linear motion towards the lower shearing blade, when the upper shearing blade is in butt joint with the lower shearing blade, the mica plate is sheared, the shearing surface is flat and smooth, no burr is generated, and the using performance of a product is improved;
step four: and (4) blanking the mica plates, and conveying the cut mica plates to a stacking platform by a suction device for unified storage.
The automatic feeding equipment in the mica plate laser positioning plate shearing process step I is a conveying track, the conveying track adopts a conveying mode of conveying rollers, and the conveying rollers adopt roller tables made of rubber materials, so that the phenomenon of abrasion on the surface of a mica plate is avoided.
And in the second mica plate laser positioning plate shearing process step, if the mica plates do not reach the parallelism standard, an alarm can be sent out through a warning lamp to inform a worker, at the moment, the worker manually adjusts the parallelism between the mica plates and the two sides of the shearing roller way, and if the mica plates and the two sides of the shearing rail are arranged in parallel, the operation in the third step is continued.
In the third step of the mica plate laser positioning plate shearing process, the upper shearing blade and the lower shearing blade are driven by cylinders.
In the third step of the mica plate laser positioning plate shearing process, when the mica plates are sheared, a slag receiving box is arranged below the shearing track, and crushed slag generated in the shearing process can be collected.
The suction device in the fourth step of the mica plate laser positioning plate shearing process completes the suction and blanking actions of the mica plate by adopting the cooperation of the vacuum suction disc and the vacuum compressor.
In the fourth step of the mica plate laser positioning plate shearing process, the mica plates are pushed into a storage room after being stacked, the internal temperature of the storage room is in a normal temperature state, and the sheared mica plates can be kept for a long time.
In the mica plate laser positioning plate shearing process, parallelism of two side edges of a mica plate is ensured through laser positioning, the mica plate is always equal in width, and burrs are prevented from being generated in the shearing process through the arrangement of the upper shearing blade and the lower shearing blade, so that the product quality of the mica plate is improved, and meanwhile, the mica plate is fed and discharged in a mechanical mode with high automation degree, and the operation intensity of workers is reduced.
The plate shearing process optimizes the positioning structure of the mica plate in the prior art, and adopts laser positioning to ensure the parallelism of two side edges of the mica plate, so that the mica plate is always equal in width, the positioning accuracy of the mica plate is ensured, and the phenomenon that the mica plate has larger positioning error is not easy to occur.
It is to be noted that the term "comprises," "comprising," or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A mica plate laser positioning plate shearing process is characterized by comprising the following specific steps:
the method comprises the following steps: feeding the mica plates, wherein the mica plates finish the feeding action of the mica plates through automatic feeding equipment;
step two: the mica plate is positioned, laser positioners are installed on two sides of the shearing track, when the mica plate is conveyed to the lower parts of the laser positioners on the two sides, laser rays are emitted by the laser positioners at the moment, the laser rays of the laser positioners can be aligned with reference lines on the two sides of the mica plate, the laser positioners can detect whether the two sides of the mica plate are subjected to positioning standards, and whether the two side edges of the mica plate are parallel to the two sides of the shearing track is judged, so that the mica plate is always in the equal-width condition, the parallelism of the two side edges of the mica plate is ensured, and if the rays of the laser positioners are shielded by the mica plate or the laser ray parts of the laser positioners and the side edges of the mica plate are not on the same reference line, errors exist in the positioning of the mica plate at the moment;
step three: the mica plate is sheared, an upper shearing blade and a lower shearing blade are respectively installed on the upper side and the lower side of a shearing track, the upper shearing blade and the lower shearing blade are arranged in an up-down position in an aligned mode, the upper shearing blade is installed and connected with a reciprocating linear motion structure, the driving mode of the reciprocating linear motion can be electric or pneumatic, the mica plate is sheared by the mode that the upper shearing blade makes reciprocating linear motion towards the lower shearing blade, when the upper shearing blade is in butt joint with the lower shearing blade, the mica plate is sheared, the shearing surface is flat and smooth, no burr is generated, and the using performance of a product is improved;
step four: and (4) blanking the mica plates, and conveying the cut mica plates to a stacking platform by a suction device for unified storage.
2. The mica plate laser positioning plate shearing process according to claim 1, characterized in that: the automatic feeding equipment in the first step is a conveying track, the conveying track adopts a conveying mode of conveying rollers, and the conveying rollers adopt roller ways made of rubber materials, so that the phenomenon of abrasion of the surface of the mica plate is avoided.
3. The mica plate laser positioning plate shearing process according to claim 1, characterized in that: and in the second step, if the mica plate does not reach the parallelism standard, an alarm can be sent out through a warning lamp to inform a worker, at the moment, the worker manually adjusts the parallelism between the mica plate and the two sides of the shearing roller way, and if the mica plate and the two sides of the shearing rail are arranged in parallel, the operation in the third step is continued.
4. The mica plate laser positioning plate shearing process according to claim 1, characterized in that: and in the third step, the upper shearing blade and the lower shearing blade are driven by cylinders.
5. The mica plate laser positioning plate shearing process according to claim 1, characterized in that: and in the third step, when the mica plate is sheared, a slag receiving box is also arranged below the shearing track, so that crushed slag generated in the shearing process can be collected.
6. The mica plate laser positioning plate shearing process according to claim 1, characterized in that: and the suction device in the fourth step adopts the matching of a vacuum sucker and a vacuum compressor to complete the suction and blanking actions of the mica plate.
7. The mica plate laser positioning plate shearing process according to claim 1, characterized in that: and in the fourth step, the mica plates are pushed into a storage room after being stacked, and the internal temperature of the storage room is in a normal temperature state.
Priority Applications (1)
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CN202111217060.5A CN113910473A (en) | 2021-10-19 | 2021-10-19 | Mica plate laser positioning plate shearing process |
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CN202111217060.5A CN113910473A (en) | 2021-10-19 | 2021-10-19 | Mica plate laser positioning plate shearing process |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101557902A (en) * | 2006-09-22 | 2009-10-14 | 西门子Vai金属科技有限公司 | Device for the weld joining of sheet metal strips |
CN102500627A (en) * | 2011-10-19 | 2012-06-20 | 北京金自天正智能控制股份有限公司 | Plate width, side shape and side defect measuring instrument and measuring method thereof |
CN210587382U (en) * | 2019-09-16 | 2020-05-22 | 安徽马钢重型机械制造有限公司 | Laser alignment plate shearing machine |
CN210731201U (en) * | 2019-10-21 | 2020-06-12 | 永安市洪锦工贸有限公司 | Automatic numerical control panel trimming machine |
CN111716565A (en) * | 2020-06-08 | 2020-09-29 | 安徽锐光电子科技有限公司 | Plate shearing machine for mica sheet production and using method thereof |
CN112284286A (en) * | 2020-08-31 | 2021-01-29 | 张家港扬子江冷轧板有限公司 | Plate shearing detection and release device and method |
-
2021
- 2021-10-19 CN CN202111217060.5A patent/CN113910473A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101557902A (en) * | 2006-09-22 | 2009-10-14 | 西门子Vai金属科技有限公司 | Device for the weld joining of sheet metal strips |
CN102500627A (en) * | 2011-10-19 | 2012-06-20 | 北京金自天正智能控制股份有限公司 | Plate width, side shape and side defect measuring instrument and measuring method thereof |
CN210587382U (en) * | 2019-09-16 | 2020-05-22 | 安徽马钢重型机械制造有限公司 | Laser alignment plate shearing machine |
CN210731201U (en) * | 2019-10-21 | 2020-06-12 | 永安市洪锦工贸有限公司 | Automatic numerical control panel trimming machine |
CN111716565A (en) * | 2020-06-08 | 2020-09-29 | 安徽锐光电子科技有限公司 | Plate shearing machine for mica sheet production and using method thereof |
CN112284286A (en) * | 2020-08-31 | 2021-01-29 | 张家港扬子江冷轧板有限公司 | Plate shearing detection and release device and method |
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