CN113906630A - Plane glass antenna and manufacturing method thereof - Google Patents

Plane glass antenna and manufacturing method thereof Download PDF

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Publication number
CN113906630A
CN113906630A CN202080040767.0A CN202080040767A CN113906630A CN 113906630 A CN113906630 A CN 113906630A CN 202080040767 A CN202080040767 A CN 202080040767A CN 113906630 A CN113906630 A CN 113906630A
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China
Prior art keywords
glass
antenna
glass substrate
etching
substrate
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Pending
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CN202080040767.0A
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Chinese (zh)
Inventor
西山荣
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NSC Co Ltd
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NSC Co Ltd
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Publication of CN113906630A publication Critical patent/CN113906630A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Waveguide Aerials (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)

Abstract

A planar glass antenna having a plurality of antenna elements and a method for manufacturing the same are provided. The planar glass antenna (10) uses a glass substrate (12) as a dielectric substrate and is configured to receive radio waves. The planar glass antenna (10) is provided with at least a glass substrate (12), a ground conductive part (14), and a plurality of antenna elements (16). The glass substrate (12) has a plurality of power supply through-holes (20) arranged in a matrix. The grounded conductive part (14) is provided on the first main surface of the glass substrate (12). The plurality of antenna elements (16) are provided at positions corresponding to the plurality of power feeding through holes (20) on the second main surface of the glass substrate (12).

Description

Plane glass antenna and manufacturing method thereof
Technical Field
The present invention relates to a planar glass antenna configured to receive radio waves using a glass substrate as a dielectric substrate, and a method for manufacturing the same.
Background
Conventionally, antennas of various configurations have been developed for receiving various radio waves. Among radio waves, there are many names from long waves having long wavelengths (small frequencies) to millimeter waves having short wavelengths (large frequencies) and submillimeter waves, and there are many kinds of characteristics and applications thereof.
However, if the number of antennas to be installed increases as the types of radio waves to be received increase, the following inconvenience may occur: it is difficult to find the setting space or the setting of the antenna destroys the landscape.
For this purpose, the following flat glass antennas are used in the prior art: the present invention is applicable to a window opening, and is provided with a lighting property by using not only a glass substrate excellent in transparency as a dielectric substrate but also at least a ground conductor made of a transparent conductor (see, for example, patent document 1).
Prior art documents
Patent document
Patent document 1: JP-A61-150402
Disclosure of Invention
(problems to be solved by the invention)
However, since it is difficult to perform a punching process or the like on the glass substrate, it is difficult to form a power feeding through hole in the flat glass antenna. Therefore, it is sometimes difficult to form a multi-element planar glass antenna having a plurality of antenna elements.
The reason for this is that, when the feed through hole is not formed, a coplanar feed method using a microstrip line is employed. That is, in the coplanar feeding method using microstrip lines, antenna elements need to be arranged in series in an array for the purpose of impedance equalization, and it is often not appropriate to arrange a plurality of antenna elements.
The invention aims to provide a plane glass antenna with a plurality of antenna elements and a manufacturing method thereof.
(means for solving the problems)
The flat glass antenna according to the present invention uses a glass substrate as a dielectric substrate and is configured to receive radio waves. The planar glass antenna includes at least a glass substrate, a ground conductive portion, and a plurality of antenna elements.
Examples of the conductor used for the ground conductor portion or the antenna element include metal foils such as copper foil, silver foil, and gold foil, and transparent conductors (organic conductive films such as ITO and PEDOT). Since the dielectric substrate is a transparent glass substrate, the planar glass antenna itself can be made transparent by using a transparent material for the antenna element and the ground conductor.
As a result, even when a plurality of flat glass antennas are arranged, the landscape is not easily damaged. For example, the Massive multiple input multiple output (Massive MIMO) technology of 5G wireless communication requires an extremely large number of antennas, and if the antennas are transparent, they can be arranged in various places (windows and the like) without concern for light shielding and landscapes.
The glass substrate has a plurality of power supply through holes arranged in a matrix. The grounding conductive part is arranged on the first main surface of the glass substrate. The plurality of antenna elements are provided at positions corresponding to the plurality of power feeding through holes on the second main surface of the glass substrate.
In this configuration, by forming the plurality of power feeding through holes arranged in a matrix on the glass substrate, it is easy to arrange the plurality of antenna elements in a matrix without arranging the plurality of antenna elements in series in an array. As a result, the planar glass antenna can be easily multi-element.
In addition to the above configuration, it is preferable that the glass substrate has a plurality of regions having different thicknesses so as to form a plurality of regions having different intervals between the ground conductive part and the antenna element.
In this configuration, by providing a plurality of regions having different intervals between the ground conductive portion and the antenna element, it is possible to cope with radio waves of a plurality of wavelengths in the planar glass antenna formed of a single glass substrate with respect to radio waves.
The method for manufacturing a flat glass antenna according to the present invention is a method for manufacturing a flat glass antenna that uses a glass substrate as a dielectric substrate and is configured to receive radio waves. The manufacturing method of the plane glass antenna at least comprises a first laser processing step and an etching processing step.
In the first laser processing step, a laser beam is irradiated to a position where a power feeding through hole is to be formed, thereby forming a modified portion having a property of being easily etched at the position.
In the etching step, the modified portion is etched to form a power supply through hole.
In the above method for manufacturing a flat glass antenna, it is preferable that the method further includes a second laser processing step of irradiating the glass substrate with a laser beam while adjusting a laser focus so that a thickness of the substrate becomes at least two levels or more with respect to a region to be thinned of the glass substrate.
(effect of the invention)
According to the present invention, a planar glass antenna including a plurality of antenna elements and a method for manufacturing the same can be realized.
Drawings
Fig. 1 is a schematic view of a planar glass antenna according to a first embodiment of the present invention.
Fig. 2 is a diagram showing an example of laser processing in the method for manufacturing a flat glass antenna.
Fig. 3 is a diagram showing an example of etching treatment in the method for manufacturing a flat glass antenna.
Fig. 4 is a diagram showing an example of etching treatment in the method for manufacturing a flat glass antenna.
Fig. 5 is a diagram showing a state of the power supply through hole after the etching treatment.
Fig. 6 is a diagram illustrating an example of a method of forming the ground conductor portion and the antenna element.
Fig. 7 is a schematic view of a flat glass antenna according to a second embodiment of the present invention.
Fig. 8 is a diagram illustrating an example of a method for manufacturing a flat glass antenna according to a second embodiment.
Detailed Description
Hereinafter, a first embodiment of a flat glass antenna according to the present invention will be described with reference to the drawings. As shown in fig. 1 (a) and 1 (B), the planar glass antenna 10 is used as a multi-element glass antenna for 5G communication, for example.
Here, the planar glass antenna 10 is described as an example of a square patch antenna in which the width of a strip conductor is increased in order to make a microstrip antenna a wide band, but the configuration and application of the planar glass antenna are not limited to this.
The planar glass antenna 10 includes at least: a glass substrate 12 as a dielectric substrate, a ground conductor portion 14 (ground electrode) and an antenna element 16 (radiation electrode) formed on both principal surfaces of the glass substrate 12.
The glass substrate 12 has a plurality of power feeding through holes 20 formed at positions corresponding to the power feeding points of the antenna element 16. As described later, a power feed line for feeding power to the antenna element 16 passes through the power feed through hole 20.
The glass substrate 12 is, for example, a glass substrate having a thickness of about 0.3mm to 0.5 mm. As the glass substrate 12, glass (e.g., quartz glass, alkali-free glass, etc.) having a relative dielectric constant of about 3 to 7 is used.
The ground conductor portion 14 is formed on a first main surface (a lower main surface in the drawing) of the glass substrate 12. The ground conductor portion 14 surrounds the power supply through hole 20 and has an opening portion having a diameter slightly larger than that of the power supply through hole 20, thereby ensuring insulation between the power supply line passing through the power supply through hole 20 and the ground conductor portion 14.
On the other hand, the antenna element 16 is formed on the second main surface (upper main surface in the drawing) of the glass substrate 12. The antenna elements 16 are arranged in a matrix. The antenna elements 16 are each formed in a square shape (square patch), but may be formed in other shapes such as a circular shape.
In this embodiment, an example of a matrix arrangement of 4 rows and 4 columns will be described to simplify the drawing. However, in practice, for example, 40 rows and 40 columns (1600 in total) of the antenna elements 16 may be arranged on a 40mm × 40mm glass substrate 12, and the arrangement and number of the antenna elements 16 are not particularly limited.
The planar glass antenna 10 is connected to a transmitter or a receiver via a power feed line 18. The feeder line 18 is preferably a coaxial line or a waveguide, but other feeder lines such as a parallel two-wire line may be used.
Next, a manufacturing process of the flat glass antenna 10 will be described with reference to fig. 2 to 6. First, in the manufacture of the planar glass antenna 10, as shown in fig. 2 (a) and 2 (B), a laser beam is irradiated to a position of the glass substrate 12 where the power feeding through-hole 20 is to be formed, thereby forming a modified portion having a property of being easily etched at the position.
The type and irradiation conditions of the laser beam are not particularly limited as long as the laser beam can modify the intended formation position of the power feeding through hole 20 in the glass substrate 12 so as to be easily etched. In the present embodiment, a laser beam oscillated from a short pulse laser (for example, picosecond laser or femtosecond laser) is irradiated from a laser head, but for example, CO may be used2Laser, nanosecond laser, etc.
In the present embodiment, the output is controlled so that the average laser energy of the laser beam is about 30 μ J to 300 μ J, but the present invention is not limited thereto.
The condensing area of the laser beam is preferably adjusted as appropriate. Here, the laser beam condensing region is adjusted to extend over the entire thickness direction of the glass substrate 12, and the power feeding through-hole 20 is easily formed.
The laser processing is then shifted to etching for forming the power supply through-hole 20 in the glass substrate 12 by etching the modified portion. The efficiency of etching the glass base material 24 including a plurality of regions to be the glass substrates 12 is higher than the efficiency of etching a single glass substrate 12.
Therefore, as shown in fig. 3 (a) and 3 (B), the following method is generally adopted: the glass base material 24 from which the plurality of glass substrates 12 are cut is subjected to laser processing, etching, film forming, and the like, and thereafter, the glass base material 24 is divided into a plurality of glass substrates 12.
For example, the glass base material 24 in which the glass substrates 12 shown in fig. 3 (a) are arranged in a matrix of 5 rows × 5 columns can be divided into 25 glass substrates 12 by laser modification + etching (laser-assisted etching), photolithography, and scribe and break methods.
In the case of performing the cutting by the photo etching, after the first main surface and the second main surface of the glass base material 24 are covered with the protective film, the portion of the protective film corresponding to the cutting portion is removed to perform the etching (if necessary, the laser assisted etching) to perform the cutting.
In the etching process, as shown in fig. 4 (a), the glass base material 24 is introduced into an etching apparatus 50, and an etching process using an etching solution containing hydrofluoric acid, hydrochloric acid, or the like is applied thereto. Usually, an etching solution containing about 1 to 10 wt% of hydrofluoric acid and about 5 to 20 wt% of hydrochloric acid is used, and if necessary, a surfactant or the like is used in combination.
In the etching apparatus 50, while the glass base material 24 is conveyed by the conveying rollers, the etching solution is brought into contact with the main surface of the glass base material 24 in the etching chamber 52, thereby performing the etching treatment on the glass base material 24. Further, since the cleaning chamber 53 for washing the etching liquid adhering to the glass base material 24 is provided at the rear stage of the etching chamber 52 in the etching apparatus 50, the glass base material 24 is discharged from the etching apparatus 50 in a state where the etching liquid is removed.
As an example of a method of bringing the etching liquid into contact with the glass base material 24, spray etching in which the etching liquid is sprayed to the glass base material 24 in each etching chamber 52 of the etching apparatus 50 is exemplified as shown in fig. 4 (a).
Instead of the spray etching, as shown in fig. 4 (B), the glass preform 24 may be conveyed while being in contact with the overflowing etching liquid in the overflow etching chamber 54.
Further, as shown in fig. 4 (C), immersion etching may be employed in which a single or a plurality of glass base materials 24 accommodated in a carrier are immersed in an etching bath 56 accommodating an etching solution.
As a result of the etching treatment, as shown in fig. 5 (a) and 5 (B), the modified portion of the glass substrate 12 in the glass preform 24 penetrates and the power supply through hole 20 is formed. As described above, the etching treatment time can be minimized to the limit by the method of assisting the etching by the laser processing.
As a result, the surface of the glass substrate 12 is less likely to be roughened during formation of the power supply through-hole 20, and the shape of the power supply through-hole 20 is less likely to be deformed. The diameter of the power feeding through-hole 20 can be appropriately adjusted to a range of about 5 μm to 500 μm.
In principle, the smaller the thickness of the glass substrate 12, the easier the diameter of the power supply through hole 20 is to be reduced. The reason for this is that the diameter of the power feeding through hole 20 is slightly increased in the etching process than the laser beam diameter.
As a countermeasure against this increase, the following is clarified based on the experiments by the applicant: in the etching treatment, the fluorine complexing agent such as titanium oxide is added, whereby the increase in the groove width of the power feeding through hole 20 in the etching treatment is suppressed. Therefore, the diameter and shape of the power supply through-hole 20 can be adjusted by adding an appropriate amount of fluorine complexing agent to the etching solution as necessary.
Next, as shown in fig. 6 (a) and 6 (B), the antenna element 16 and the ground conductor 14 are formed. Examples of a method for forming the antenna element 16 include vacuum deposition, sputtering, electroless plating, and metal foil bonding.
In the above embodiment, the power supply through-hole 20 can be formed appropriately in the glass substrate 12. As a result, the back feed system is easily adopted in the flat glass antenna 10 using the glass substrate 12, and the multi-element structure of the flat glass antenna 10 can be easily realized. That is, even when the glass substrate 12 is used, it is not necessary to use the coplanar feeding method using the microstrip line.
Since a high frequency in gigahertz units (short wavelength in millimeter units) for 5G mobile communication is susceptible to irregularities of the dielectric substrate, it is possible to form the through-hole 20 for passing the feed line 18 therethrough or to form the outer shape of the glass substrate 12 without disturbing the flatness thereof, and thus it is possible to easily realize a high-performance glass antenna for 5G mobile communication.
Next, a second embodiment of the flat glass antenna according to the present invention will be described with reference to fig. 7 and 8. The basic configuration of the flat glass antenna 100 according to the present embodiment is the same as that of the flat glass antenna 10 described in the first embodiment. But differs from the first embodiment in that: the flat glass antenna 120 uses glass 120, and the glass 120 is configured such that the thickness of the glass changes in a stepwise manner.
Here, as shown in fig. 7 (a) and 7 (B), the glass substrate 120 of the planar glass antenna 100 has 4 regions having different thicknesses. Therefore, since there are 4 kinds of gaps between the antenna element 16 and the grounded conductive part 14, the flat glass antenna 100 can cope with radio waves of 4 kinds of wavelengths.
The types of the thicknesses of the glass substrate 120 are not limited to 4, and may be 2, 3, or 5 or more. The more the kind of the thickness is increased, the more the electric wave with more wavelength can be handled.
That is, the planar glass antenna 100 formed of a single substrate has a plurality of thicknesses, so that a plurality of spaces are provided between the antenna element 16 and the grounded conductive part 14, and it is possible to cope with radio waves of a plurality of wavelengths.
In order to manufacture such a planar glass antenna 100, for example, as shown in fig. 8 (a) and 8 (B), a laser beam may be irradiated onto a region to be thinned in a glass substrate while adjusting a laser focus.
The laser focus is adjusted so that the condensed regions of the laser beam are staggered in layers in the thickness direction of the glass substrate 120, whereby the glass substrate 120 is subjected to a removal process in the etching process so as to have different thicknesses from each other.
The above description of the embodiments is to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is shown not by the above embodiments but by the claims. The scope of the present invention is intended to include all modifications within the scope and meaning equivalent to the scope of the claims.
(description of reference numerals)
10. 100 plane glass antenna
12. 120 glass substrate
14 ground conductor part
16 antenna element unit
18 supply line
20 through hole for power supply
24 glass parent material.

Claims (4)

1. A flat glass antenna using a glass substrate as a dielectric substrate and configured to receive a radio wave,
the planar glass antenna is provided with at least:
a glass substrate having a plurality of power supply through-holes arranged in a matrix;
a ground conductive portion provided on the first main surface of the glass substrate; and
and a plurality of antenna elements provided at positions corresponding to the plurality of power feeding through holes on the second main surface of the glass substrate.
2. The planar glass antenna according to claim 1,
the glass substrate has a plurality of regions having different thicknesses to form a plurality of regions having different intervals between the ground conductive part and the antenna element.
3. A method for manufacturing a flat glass antenna which uses a glass substrate as a dielectric substrate and is configured to receive a radio wave,
the manufacturing method of the plane glass antenna at least comprises the following steps:
a first laser processing step of forming a modified portion having a property of being easily etched at a position where a power feeding through hole is to be formed by irradiating the position with a laser beam; and
and an etching step of forming a power supply through hole by etching the modified portion.
4. The manufacturing method of a planar glass antenna according to claim 3,
the method for manufacturing a planar glass antenna further includes a second laser processing step of irradiating a laser beam to a region to be thinned of the glass substrate while adjusting a laser focus so that a thickness of the substrate is at least two levels or more.
CN202080040767.0A 2019-05-24 2020-05-19 Plane glass antenna and manufacturing method thereof Pending CN113906630A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-097903 2019-05-24
JP2019097903A JP6840403B2 (en) 2019-05-24 2019-05-24 Flat glass antenna and its manufacturing method
PCT/JP2020/019735 WO2020241371A1 (en) 2019-05-24 2020-05-19 Planar glass antenna and method for producing same

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CN113906630A true CN113906630A (en) 2022-01-07

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WO (1) WO2020241371A1 (en)

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KR20220021939A (en) * 2020-08-13 2022-02-23 삼성디스플레이 주식회사 Manufacturing method of a cover window for a flexible display device and manufacturing method of the flexible display device
KR20230021899A (en) * 2021-08-06 2023-02-14 삼성전자주식회사 Electronic apparatus comprising pattern structure for beam forming and opeartion method of the same

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CN107074633A (en) * 2014-10-22 2017-08-18 日本板硝子株式会社 The manufacture method of glass substrate and the glass of tabular
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JP6840403B2 (en) 2021-03-10
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