CN103723927A - Method for manufacturing glass substrate with wavy surface - Google Patents
Method for manufacturing glass substrate with wavy surface Download PDFInfo
- Publication number
- CN103723927A CN103723927A CN201210497748.8A CN201210497748A CN103723927A CN 103723927 A CN103723927 A CN 103723927A CN 201210497748 A CN201210497748 A CN 201210497748A CN 103723927 A CN103723927 A CN 103723927A
- Authority
- CN
- China
- Prior art keywords
- glass substrate
- waviness
- protective layer
- tool
- etch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 123
- 239000000758 substrate Substances 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000011241 protective layer Substances 0.000 claims abstract description 34
- 238000005530 etching Methods 0.000 claims abstract description 30
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 7
- 239000002195 soluble material Substances 0.000 claims description 7
- 239000010410 layer Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 5
- 238000007772 electroless plating Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- 238000009826 distribution Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000004512 die casting Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 201000009310 astigmatism Diseases 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hcl hcl Chemical compound Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/06—Surface treatment of glass, not in the form of fibres or filaments, by coating with metals
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0095—Solution impregnating; Solution doping; Molecular stuffing, e.g. of porous glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Inorganic Chemistry (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
The invention provides a method for manufacturing a glass substrate with a wavy surface, which comprises the following steps: providing a glass substrate; manufacturing a protective layer on the surface of the glass substrate, wherein the protective layer comprises an area to be etched, and part of the surface of the glass substrate is exposed; performing a first etching process to etch the glass substrate to form a groove corresponding to the region to be etched; removing the protective layer; and carrying out a second etching process, and immersing the glass substrate with the groove into etching solution to form the glass substrate with the wavy surface. The invention can ensure that the internal stress of the glass substrate is not damaged, and can maintain quite high product yield for subsequent processing procedures.
Description
Technical field
The present invention relates to a kind of surperficial working method of glass substrate, relate in particular to the manufacture method of the glass substrate on a kind of tool waviness surface.
Background technology
Tradition will be produced waviness surface or bent type surface is to process in die casting mode at glass substrate, yet this kind of mode can increase the formation of glass substrate internal stress, the manufacturing procedure of carrying out for follow-up need, as operations such as cutting, skiving, polishing and making chamferings (R angle), the situation that easily causes breaking glass panel or fracture, product yield is declined, and whole manufacturing cost improves.Therefore, how to provide a kind of manufacture with the glass substrate on waviness surface, to solve the problem of the low yield that traditional casting die caused, real is the important topic of current industrial community.
Summary of the invention
An object of the present invention is to provide the manufacture method of the glass substrate on a kind of tool waviness surface, to solve traditional die casting mode, is formed the problem that bent type glass is unfavorable for following process.
For reaching above-mentioned purpose, the invention provides the manufacture method of the glass substrate on a kind of tool waviness surface, comprise step: (a) provide a glass substrate; (b) on the surface of described glass substrate, make a protective layer, described protective layer comprises a region to be etched, and it exposes the part surface of described glass substrate; (c) carry out one first etch process, described glass substrate etching is formed to a groove in corresponding described region to be etched; (d) described protective layer is removed; And (e) by being formed with in step (c) in the glass substrate immersion etching solution of described groove, carry out one second etch process, with by the wall curvature of described groove, form the glass substrate on tool waviness surface.
The present invention also provides the manufacture method of the glass substrate on a kind of tool waviness surface, comprises step: (a) provide a glass substrate; (b) on the surface of described glass substrate, make a protective layer, described protective layer comprises a region to be etched, and it exposes the part surface of described glass substrate; (c) with one first etch-rate, the glass substrate from step (b) is carried out to etching, to form a groove in corresponding described region to be etched on described glass substrate, the described groove forming on described glass substrate has a predetermined depth and a preset width; (d) described protective layer is removed from described glass substrate; And (e) with one second etch-rate, the glass substrate from step (d) is carried out to etching, with by the wall curvature of described groove, the glass substrate that forms tool waviness surface, wherein described the first etch-rate in step (c) is greater than described the second etch-rate in step (e).
Compared to tradition, by die casting mode, make bent type glass, the present invention uses twice etch process to form the mode on the waviness surface of glass substrate, can guarantee that glass substrate internal stress is not damaged, therefore for manufacturing procedures such as follow-up cutting, attenuate, formation chamferings (R angle), still can maintain quite high product yield.
Accompanying drawing explanation
Figure 1A to Fig. 1 F shows the schematic flow sheet of the manufacture method of the glass substrate on tool waviness surface in the present invention.
Figure 1A shows the schematic diagram that glass substrate is provided.
Figure 1B is presented at the schematic diagram that forms the protective layer that includes region to be etched on glass baseplate surface.
Fig. 1 C demonstration is carried out the first etch process glass substrate etching is formed to the schematic diagram of groove.
Fig. 1 D shows the schematic diagram that protective layer is removed.
Fig. 1 E shows the clean schematic diagram of glass substrate.
Fig. 1 F shows and to carry out the second etch process with by the schematic diagram of groove curved surface.
[primary clustering nomenclature]
10 glass substrate 12 grooves
20 protective layer 21 regions to be etched
Embodiment
Below the various embodiments of the present invention will be introduced in detail, and for the purpose of cheer and bright, in the description of the specific embodiment of the invention, particular terms can be used.Yet the particular terms that the present invention has no intent to select is limited, only for clear, describe.It will be understood by those skilled in the art that in the situation that not deviating from spirit of the present invention and scope, the present invention can be contained the use equipollent of equivalence technically, or reaches in a similar manner other assembly and the configuration of similar object.
Feature of the present invention and advantage can show and the embodiment of the present invention is described and clear presenting more specifically by rear accompanying drawing, wherein identical or functionally similar and or the assembly of similar with identical label, represent.Unless otherwise specified, otherwise appended diagram is according to equal proportion, not draw.
The present invention is the manufacture method of the glass substrate on relevant a kind of tool waviness surface, and it has used twice etch process to form the waviness surface of glass substrate.First etch process is to etch groove at glass baseplate surface, to set up roughly the general profile on waviness surface.Second etch process utilizes lateral erosion and etching effect, further, by the smooth and sharp keen part curvature of glass substrate, that is to say, by the further etching of the groove forming on glass substrate, make its wall present the form of cambered surface, so form the glass substrate on tool waviness surface.Utilize the made bent type glass of this mode, because its internal stress is not damaged, therefore (as cutting, skiving and polishing) can maintain quite high product yield in the operation of follow-up glass processing.
Figure 1A to Fig. 1 F shows the schematic flow sheet of the manufacture method of the glass substrate on tool waviness surface in the present invention.Should be noted, the side that Figure 1A to Fig. 1 F is only presented at glass substrate forms waviness surface.Yet according to the present invention, those skilled in the art can understand also can form at the two opposite sides of glass substrate waviness surface, the shown flow process of its processing procedure and Figure 1A to Fig. 1 F is similar, so omits its associated description.
Refer to Figure 1A, first a glass substrate 10 is provided, its material is silicon-dioxide (SiO
2).Glass substrate 10 also can be has the glass that other adds material, or through chemical, hot or stacking chilled glass (tempered glass), for example chemcor glass (ion-exchanged glass).
Refer to Figure 1B, form a protective layer 20 on the surface of glass substrate 10, protective layer 20 comprises region 21 to be etched, and region to be etched 21 exposes the part surface of glass substrate 10.In follow-up etch process, etching solution can carry out etching to glass substrate 10 according to the distribution in region 21 to be etched.
Refer to Fig. 1 C, then carry out the first etch process, the region etching that region 21 to be etched on glass substrate 10 is exposed forms groove 12, and the region that on glass substrate 10, protected seam 20 covers is because of the not etched removal of protected layer 20 protection.
As previously mentioned, the object of the first etch process is set up the general profile on waviness surface roughly, is to utilize the groove 12 forming on glass substrate 10 as basic profile on actual applying.Before carrying out etch process, can according to customer demand preset the size of the groove 12 that forms of wish, make the groove 12 that forms of wish there is a preset width W and a predetermined depth H.In making the process of protective layer 20, predetermine the size in region 21 to be etched, so can make the groove 12 forming there is preset width W, and predetermined depth of groove H can reach by etch-rate or the etching period adjusted in the first etch process.
Refer to Fig. 1 D, protective layer 20 is removed from glass substrate 10 surfaces.
Refer to Fig. 1 E, then glass substrate 10 is carried out to clean operation, to remove the residual etching solution of the first etch process.
Refer to Fig. 1 F, then carry out the second etch process, the glass substrate 10 that is formed with groove 12 is immersed in etching solution, so that the groove 12 forming on glass substrate 10 is done to further etching, under lateral erosion and etching effect, the wall of groove 12 can be presented by curvature the form of cambered surface, and the smooth and sharp keen part of glass substrate 10 also can reach curvature surface, so forms the glass substrate on tool waviness surface.
In a preferred embodiment, in the first etch process, use the first etch-rate to carry out etching to glass substrate, in the second etch process, use the second etch-rate to carry out etching to glass substrate, the first etch-rate is greater than the second etch-rate, and the etchant concentration that the etchant concentration that for example the first etch process is used is used than the second etch process is high.
Because higher etch-rate can etch more precipitous figure, be therefore suitable for being used in the groove that depicts glass substrate in the first etch process, to set up the substrate profile on the waviness surface of glass substrate.The further curved surface of figure that uses lower etch-rate the first etch process can be set up in the second etch process, effect by lateral erosion and etch, the second etch process can corrode figure periphery and acute angle portion lentamente and finally reach curvature surface, also because the second etch process is used lower etch-rate, therefore can not do significantly to destroy to configuration.
For instance, when wanting to produce at the thick glass substrate of 2 ~ 3cm the waviness surface that about 0.8mm is thick, now preferably, the first etch-rate that the first etch process is used can be 10 ~ 20 μ m/min, and the second etch-rate that the second etch process is used can be 5 μ m/min.
Compared to tradition, by die casting mode, make bent type glass, the present invention uses twice etch process to form the mode on the waviness surface of glass substrate, can guarantee that glass substrate internal stress is not damaged, therefore for manufacturing procedures such as follow-up cutting, attenuate, formation chamferings (R angle), still can maintain quite high product yield.The manufacture on the waviness surface of glass substrate proposed by the invention, can be applied to every field, such as the glass substrate on made tool waviness surface applicable to solar panels, astigmatism plate etc.
In addition,, in Figure 1B, on the surface of glass substrate 10, form the protective layer 20 that includes region 21 to be etched, practicable following several modes.
First kind of way: cook up wish and will carry out etched region to be etched 21 on glass substrate 10; then the glued membrane cutting is directly attached to glass substrate 10 surfaces above according to the distribution in pre-designed region to be etched 21, that is to say and utilize the glued membrane attaching to form the protective layer 20 that includes region 21 to be etched.
The second way: soluble material (or colloidal materials) is coated on the surface of glass substrate 10 completely; then according to the distribution in predetermined region to be etched 21, remove soluble material; make the distribution that removes region of soluble material consistent with the distribution in described predetermined region to be etched 21; finally operation is dried or toasted to the soluble material that completes distribution design, can form the protective layer 20 that includes region 21 to be etched.
The third mode: cover a shielding (mask) on the surface of glass substrate 10, this shielding is that the distribution in the predetermined region to be etched 21 of foundation designs, the pattern of shielding is consistent with the distribution in described predetermined region to be etched 21, then described shielding is positioned in an electroless plating board together with glass substrate 10, and plate an anticorrosion layer or acid-resistant layer thereon, again described shielding is removed afterwards, that is to say and utilize the mode of electroless plating to form patterned anticorrosion layer or acid-resistant layer, mode forms the protective layer 20 that includes region 21 to be etched according to this.
The 4th kind of mode: be coated with a photoresistance (photoresist) on the surface of glass substrate 10; then above the photoresistance being coated with, place a light shield (photo mask); the pattern of this light shield is consistent with the distribution in the region to be etched 21 of being scheduled to; then irradiate high light or UV-light; so that the photoresistance of the distribution in correspondence region 21 to be etched is removed, formed patterned photoresistance is the protective layer 20 that includes region 21 to be etched.
As above, the material of protective layer 20 can need to be chosen as glued membrane according to processing procedure and attach, or coating or the plated film such as organic materials, macromolecular material or metallic substance.The material of protective layer 20 itself needs to resist the erosion of the etching solution that successive process used; that is to say; the appropriate characteristic need with the suitable ability that opposing soda acid corrodes, just can prevent acid in etch process or alkali effect and phenomenon that the erosion that produces or protective layer are peeled off.
In addition, in one embodiment, the etching solution using in the first etch process and the second etch process at least comprises hydrofluoric acid (HF), also can use hydrofluoric acid and allocate appropriate sulfuric acid (H
2sO
4), hydrochloric acid (HCl) or nitric acid (HNO
3) as etching solution.
The above is only the preferred embodiments of the present invention; it should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. a manufacture method for the glass substrate on tool waviness surface, is characterized in that, comprises step:
(a) provide a glass substrate;
(b) on the surface of described glass substrate, make a protective layer, described protective layer comprises a region to be etched, and it exposes the part surface of described glass substrate;
(c) carry out one first etch process, described glass substrate etching is formed to a groove in corresponding described region to be etched;
(d) described protective layer is removed; And
(e) glass substrate that is formed with described groove in step (c) is immersed in etching solution, carry out one second etch process, with by the wall curvature of described groove, form the glass substrate on tool waviness surface.
2. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, it is characterized in that, in the first etch process of step (c), be, with one first etch-rate, described glass substrate is carried out to etching, and in the second etch process of step (e), be, with one second etch-rate, described glass substrate is carried out to etching, described the first etch-rate is greater than described the second etch-rate.
3. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, it is characterized in that, size in region to be etched described in step (b) predetermines, and the described groove forming on glass substrate described in step (c) has a predetermined depth and a preset width.
4. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, is characterized in that, in step (e) before, more comprises the clean step of described glass substrate.
5. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, is characterized in that, step (b) comprises:
One glued membrane is provided; And
Described glued membrane is attached on the surface of described glass substrate, to form described protective layer.
6. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, is characterized in that, step (b) comprises:
One soluble material is provided;
Described soluble material is coated on the surface of described glass substrate; And
Soluble material to described coating is dried operation, to form described protective layer.
7. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, is characterized in that, step (b) comprises:
Described glass substrate is placed in to an electroless plating board; And
With electroless plating mode anticorrosion layer on the plated surface of described glass substrate, using as described protective layer.
8. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, is characterized in that, the material of described protective layer comprise organic materials and metallic substance at least one.
9. the manufacture method of the glass substrate on tool waviness as claimed in claim 1 surface, is characterized in that, carries out the etching solution that etching program uses and at least comprise hydrofluoric acid in step (c) and step (e).
10. a manufacture method for the glass substrate on tool waviness surface, is characterized in that, comprises step:
(a) provide a glass substrate;
(b) on the surface of described glass substrate, make a protective layer, described protective layer comprises a region to be etched, and it exposes the part surface of described glass substrate;
(c) with one first etch-rate, the glass substrate from step (b) is carried out to etching, to form a groove in corresponding described region to be etched on described glass substrate, the described groove forming on described glass substrate has a predetermined depth and a preset width;
(d) described protective layer is removed from described glass substrate; And
(e) with one second etch-rate, the glass substrate from step (d) is carried out to etching, with by the wall curvature of described groove, the glass substrate that forms tool waviness surface, wherein described the first etch-rate in step (c) is greater than described the second etch-rate in step (e).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101137708 | 2012-10-12 | ||
| TW101137708A TWI461378B (en) | 2012-10-12 | 2012-10-12 | Method for manufacturing glass substrate having arched surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103723927A true CN103723927A (en) | 2014-04-16 |
Family
ID=50448265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210497748.8A Pending CN103723927A (en) | 2012-10-12 | 2012-11-29 | Method for manufacturing glass substrate with wavy surface |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101407066B1 (en) |
| CN (1) | CN103723927A (en) |
| TW (1) | TWI461378B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109227036A (en) * | 2018-08-17 | 2019-01-18 | 基准精密工业（惠州）有限公司 | The manufacturing method of amorphous alloy precision component |
| CN109734324A (en) * | 2019-02-21 | 2019-05-10 | 信利光电股份有限公司 | A kind of processing method of glass slot and the glass panel of slotted hole |
| CN110545638A (en) * | 2018-05-28 | 2019-12-06 | 北京小米移动软件有限公司 | Terminal shell manufacturing method and terminal |
| CN112266176A (en) * | 2020-10-26 | 2021-01-26 | 恩利克(浙江)显示科技有限公司 | Ultra-thin glass substrate processing method and display panel processing method |
| CN113906630A (en) * | 2019-05-24 | 2022-01-07 | 株式会社Nsc | Plane glass antenna and manufacturing method thereof |
| US11851363B2 (en) | 2020-10-26 | 2023-12-26 | Flexi Glass Co., Ltd. | Method for manufacturing ultra-thin glass substrate and method for manufacturing display panel |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102300025B1 (en) | 2014-10-08 | 2021-09-09 | 삼성디스플레이 주식회사 | Display apparatus |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000155202A (en) * | 1998-11-20 | 2000-06-06 | Nec Corp | Production of microlens array |
| US20010010597A1 (en) * | 2000-01-19 | 2001-08-02 | Kenjiro Hamanaka | Method for forming planar microlens and planar microlens obtained thereby |
| CN1503035A (en) * | 2002-11-22 | 2004-06-09 | 西山不锈化学股份有限公司 | Glass substrate for plane display device and mfg method thereof |
| CN1600723A (en) * | 2003-09-26 | 2005-03-30 | 日本板硝子株式会社 | Etched article, mold structure for producing the same and method for production thereof |
| CN1891652A (en) * | 2005-07-06 | 2007-01-10 | 深圳Tcl工业研究院有限公司 | Mask for glass etching and its use for glass etching |
| CN102473751A (en) * | 2009-07-14 | 2012-05-23 | 三菱电机株式会社 | Method for roughening substrate surface, method for manufacturing photovoltaic device, and photovoltaic device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002194569A (en) * | 2000-12-21 | 2002-07-10 | Seiko Instruments Inc | Processing method for glass base material |
| CN101815963B (en) * | 2007-10-01 | 2012-06-27 | Lg化学株式会社 | Method for manufacturing glass cliche using laser etching and apparatus for laser irradiation therefor |
| KR20110016101A (en) * | 2009-08-11 | 2011-02-17 | 주식회사 아이지이엔지 | A method for processing glass substrate |
| KR101279472B1 (en) * | 2010-08-18 | 2013-06-27 | 엘지이노텍 주식회사 | Method of manufacturing glass decorative panel comprising enhanced depth pattern |
| KR101784005B1 (en) * | 2010-12-28 | 2017-11-07 | 동우 화인켐 주식회사 | Preparing method for Glass Substrate comprising Transparent Electrode Pattern |
-
2012
- 2012-10-12 TW TW101137708A patent/TWI461378B/en not_active IP Right Cessation
- 2012-11-29 CN CN201210497748.8A patent/CN103723927A/en active Pending
-
2013
- 2013-02-18 KR KR1020130016928A patent/KR101407066B1/en active IP Right Grant
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000155202A (en) * | 1998-11-20 | 2000-06-06 | Nec Corp | Production of microlens array |
| US20010010597A1 (en) * | 2000-01-19 | 2001-08-02 | Kenjiro Hamanaka | Method for forming planar microlens and planar microlens obtained thereby |
| CN1503035A (en) * | 2002-11-22 | 2004-06-09 | 西山不锈化学股份有限公司 | Glass substrate for plane display device and mfg method thereof |
| CN1600723A (en) * | 2003-09-26 | 2005-03-30 | 日本板硝子株式会社 | Etched article, mold structure for producing the same and method for production thereof |
| CN1891652A (en) * | 2005-07-06 | 2007-01-10 | 深圳Tcl工业研究院有限公司 | Mask for glass etching and its use for glass etching |
| CN102473751A (en) * | 2009-07-14 | 2012-05-23 | 三菱电机株式会社 | Method for roughening substrate surface, method for manufacturing photovoltaic device, and photovoltaic device |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110545638A (en) * | 2018-05-28 | 2019-12-06 | 北京小米移动软件有限公司 | Terminal shell manufacturing method and terminal |
| CN109227036A (en) * | 2018-08-17 | 2019-01-18 | 基准精密工业（惠州）有限公司 | The manufacturing method of amorphous alloy precision component |
| CN109734324A (en) * | 2019-02-21 | 2019-05-10 | 信利光电股份有限公司 | A kind of processing method of glass slot and the glass panel of slotted hole |
| CN113906630A (en) * | 2019-05-24 | 2022-01-07 | 株式会社Nsc | Plane glass antenna and manufacturing method thereof |
| CN112266176A (en) * | 2020-10-26 | 2021-01-26 | 恩利克(浙江)显示科技有限公司 | Ultra-thin glass substrate processing method and display panel processing method |
| US11851363B2 (en) | 2020-10-26 | 2023-12-26 | Flexi Glass Co., Ltd. | Method for manufacturing ultra-thin glass substrate and method for manufacturing display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201414686A (en) | 2014-04-16 |
| TWI461378B (en) | 2014-11-21 |
| KR20140048025A (en) | 2014-04-23 |
| KR101407066B1 (en) | 2014-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103723927A (en) | Method for manufacturing glass substrate with wavy surface | |
| CN103359947A (en) | Cutting method of tempered glass | |
| JP6381742B2 (en) | Surface flaw deformation for strengthening glass articles | |
| JP6313391B2 (en) | Glass substrate, cover glass for electronic device, and method for manufacturing glass substrate | |
| KR20180008723A (en) | Glass articles comprising light extraction features and methods of making same | |
| CN105531796A (en) | Geometries and patterns for surface texturing to increase deposition retention | |
| KR101668116B1 (en) | Glass substrate for an electronic device and method for manufacturing an electronic device | |
| JP2010126398A (en) | Method for manufacturing display panel | |
| CN104445975A (en) | Locally anti-dazzle processing process of glass and product thereof | |
| JP2006265017A (en) | Method for etching glass surface | |
| CN104252816A (en) | Manufacturing process for glass pane of electronic product | |
| CN103619773A (en) | Method for manufacturing cover glass for electronic device, cover glass for electronic device, glass plate for cover glass used for electronic device, and method for manufacturing touch sensor module | |
| CN105261569A (en) | Manufacturing method for blind hole of insulating substrate for electronic apparatus | |
| CN106242307A (en) | For strengthening the method at the edge of goods, glass and display device | |
| CN102956759B (en) | Method for preparing ITO (indium tin oxide) patterns by stripping | |
| JP2015131741A (en) | Manufacturing method of glass substrate with end surface protective layer | |
| CN105441947A (en) | Etching process for metal material strip | |
| CN112939477A (en) | Method for etching single surface of glass panel | |
| TWI667212B (en) | Etch cutting solution for use on glass substrates | |
| CN111225509B (en) | Etching method | |
| KR20040015676A (en) | Method and apparatus for manufacturing liquid crystal display | |
| WO2012013214A3 (en) | Method for marking a solar cell, and solar cell | |
| JP2016157056A (en) | Manufacturing method of liquid crystal panel | |
| TWI526305B (en) | Laminated glass structure and manufacturing method of antiglare glass | |
| US10507688B2 (en) | Metal sheet preparing process with surface having wood grain and product thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140416 |