CN104252816A - Manufacturing process for glass pane of electronic product - Google Patents
Manufacturing process for glass pane of electronic product Download PDFInfo
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- CN104252816A CN104252816A CN201310259853.2A CN201310259853A CN104252816A CN 104252816 A CN104252816 A CN 104252816A CN 201310259853 A CN201310259853 A CN 201310259853A CN 104252816 A CN104252816 A CN 104252816A
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Abstract
The invention discloses a manufacturing process for a glass pane of an electronic product. The manufacturing process comprises the following steps: S1, graphical transfer, comprising the following concrete steps of <1.1> respectively pasting photosensitive film resists to double faces; <1.2> performing laser targeting; <1.3> performing CCD film cutting; <1.4> stripping waste; <1.5> performing intermediate inspection; S2, chemical etching; S3, glass edge carving (polishing); S4, 2 times of reinforcement; S5, UV (ultraviolet) film removal; S6, ACF welding; S7, final inspection; S8, packaging for delivery. According to the manufacturing process for the glass pane of the electronic product, disclosed by the invention, on the basis that the strength of glass is not broken, manufacturing of various models can be performed on the glass and the precision of the glass is ensured, and moreover, the production efficiency can be effectively improved; the manufacturing process has the following beneficial effects that production processes can be greatly reduced; the production efficiency and the yield are greatly improved; the production cost is greatly reduced, and the processing precision is improved; the chemical tempering strength and the bending strength of the glass are improved; an ITO (indium tin oxide) line and a screen printing pattern are effectively protected.
Description
Technical field
The present invention relates to a kind of processing technology of glass product, specifically, relate to a kind of technique manufacturing electronic product face glass.
Background technology
Along with technology and growth in the living standard, increasing mobile phone, PDA (Personal Digital Assistant), auto-navigation system, MP4, net book (Net Book), as the electronic products such as i-Pad enter daily life.
In order to easy to carry, people propose requirement that is light, thin minimized to these electronic products, and therefore the design of these products have employed small-sized plane display (Flat Display) mostly.
The size of these flat-panel screens is little, accuracy requirement is high, process technology has larger difficulty, so generally adopt in the past, transmittance is better, skin hardness is comparatively large, the high density macromolecular material such as acryl (Acryl), PET that is damage resistant manufactures.
But the hardness of plastic product is low, is easily scratched, grown generation stretcher strain phenomenon service time, therefore serviceable life is shorter.Nearest Japan, Korea S etc. release the macromolecule novel electron material of surperficial pencil hardness up to glass hard (HRC65Yi Shang), but its price is very expensive, are difficult to promote.
In order to make, display product is more beautiful, longer service life, transmittance are higher, generally uses glass product now.Traditional glass machining technique mainly comprises following process: 1) large stretch of glass-cutting is become small pieces (Scriber), 2) (Crude Grinding) is roughly ground, 3) finishing (engraving, Chamfering & Finish), 4) polishing (Polishing) or cleaning, 5) chemical tempering (Chemical Strength), 6) polishing or cleaning, 7) silk-screen (Screen printing), 8) ITO circuit and ag paste electrode electrode is made, 9) anti-fingerprint plated film (AF Coating), 10) final inspection, 11) goods is taken on.
Mainly contain following several:
1) through corase grind after cutting with diamond cutter, the manufacture craft manufacture that fine grinding (engraving), punching etc. are complicated:
Cutting tool can only cut into square, and cut surface is very sharp, uneven.In order to make electronic product (containing mobile phone) outward appearance more beautiful, devisers' panel designs of electronic product becomes various shape, multiple curve, porose or have the shape of V-shaped groove.Process the very long process of lapping of this kind of product needed just can complete.Greatest problem is that glass is not only repeatedly subject to outside physical property shock that intensity is reduced in process, and the chips of glass produced, abrasive material scuffing or pollution glass surface, and time serious, generating plane collapses, while collapse, scratches and causes scrapping.
2) laser cutting parameter:
This technique adopts special high heat laser, utilizes the high temperature melting, the glass-cutting that produce instantaneously.Because glass is that the transparent body is not easy absorbing laser energy, so only fusible glass below very large energy.Molten tangent plane is uneven shows as zigzag for it.Maximum problem is the internal stress that Yin Gaowen produces, and destroys or reduces strength of glass.
3) water under high pressure robs cutting (Water Jet) by corase grind, the manufacture craft manufacture that fine grinding (engraving), punching etc. are complicated:
The great advantage of this technique once to cut divided glass (stacking), and cutting cost is low.But cut surface is very sharp, uneven, and cutting accuracy is poor.Maximum problem is that glass is not only repeatedly subject to outside physical property shock that intensity is reduced in process, and the chips of glass produced, abrasive material scuffing or pollution glass surface.Produce equally when carving and collapse limit.
4) dry etch process:
This is the processing technology (application number: 200910182566.X of Chinese invention patent glass for electronic product; Publication No.: CN102020417).This technique has a lot of excellent feature, is in the industry cycle paid close attention to widely and applies, but there is following problem:
1, precision poor (200-300 micron) is etched;
2, etching face is more coarse, needs engraving, produces limit equally to collapse or face collapses when carving;
3, etching speed is slower;
4, cannot the silicate hydrate lead glass (Alumina Silicate Glass) of (potassium ion length of penetration is greater than 20 microns) after depth of cut chemical tempering, the such as Gorilla P series glass of U.S. CORNING (CORNING) company, but the alumina silicate P series glass of Asahi Glass (ASAHI) company can be cut.
Summary of the invention
For overcoming the deficiencies in the prior art, the object of the present invention is to provide a kind of basis that glass itself emphasizes can carrying out various moulding manufacture to glass and ensure its precision not destroying, and the manufacturing process of the electronic product face glass that can effectively enhance productivity.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the present invention is achieved through the following technical solutions:
A manufacturing process for electronic product face glass, comprises the following steps:
Step 1) graphically shift, its idiographic flow is as follows:
1.1) Double-face adhesive photoresist: closely connected photoresist while of two-sided to face glass with automatic or manual laminator, with hot-pressing roller at 2-4kg/cm
2pressure, 1-2m/min linear velocity and 75-85 DEG C temperature under photoresist is closely attached to face glass surface, ensure in photoresist without any bubble during pad pasting;
1.2) laser makes target: according to CAD setting data, makes the target of CCD location, for subsequent production of laser machine on etchant resist surface; Type of laser is far red light CO2, and wavelength is 10.6um, degree of depth 10-20um;
1.3) film is cut in CCD location: directly cut open by the against corrosion of glass surface according to the graph data laser that CAD edits; Again glass is turned over after the cutting of front, according to cad data cutting reverse side etchant resist, form the figure with figure 1: 1 on CAD in the above and below of face glass.
1.4) waste material divests: do not need the rete against corrosion protected to divest glass surface with artificial, form the diaphragm figure corresponding with the figure 1: 1 on CAD in the above and below of face glass;
1.5) whether intermediate inspection: carry out visual examination to divesting the complete face glass of waste material, mainly check whether that residual film does not eliminate, damage needs when divesting waste material diaphragm, need the etchant resist edge of protection zone to float off;
Step 2) chemical etching, described chemical etching following steps:
High-rate etching: carry out two-sided high-rate etching in the special etching machine of horizontal fountain hydrofluorite: transmission speed is 0-2m/min, temperature is 30-50 DEG C, hydrofluoric acid concentration is 10-35%v/v, sulfuric acid concentration is 10-35%v/v;
Step 3) glass edge engraving (grinding): become the glass of monolithic to be inserted in grinding loading plate by with rete against corrosion through hydrofluoric acid etch, conveyer to 6 machine table, and accurately to be located the glass handling to be processed in loading plate by CCD vision system after vacuum suction; Utilize the carborundum electroplating bistrique on high speed SPI NDLE to spray water while grind afterwards, according to processing formula, complete the actions such as roughing, finishing, punching in order.By conveyer, glass is turned back in discharge tray after machining;
Step 4) 2 strengthenings: also known as final etching, the product through above-mentioned steps 3 carries out two-sided final etching in the special etching machine of horizontal overflow immersion type: speed is 0-2m/min, temperature 30-50 DEG C; Hydrofluoric acid concentration is 5-20%v/v, sulfuric acid concentration is 5-20%v/v;
Step 5) UV striping: divested after using UV illumination to penetrate the etchant resist of glass surface; (etchant resist is special research and development manufacture, and adhesive coating is subject to the ability namely losing bonding after UV illumination is penetrated);
Step 6) ACF welding: the flexible circuit board laser that the face glass above-mentioned technique completed and switching conducting use is welded together;
Step 7) final inspection: the product after above-mentioned ACF welding is done functional test, checks outward appearance;
Step 8) packaging shipment: functional test is without exception, by shipment after the packing of product good for outward appearance.
Further, also wrap following treatment process before step 1, its technological process is followed successively by chemical tempering, cleaning or polishing, making ITO circuit, print silk, makes ag paste electrode, anti-fingerprint plated film and cutting and inspection technique.
Further, described cutting and inspection technique, its concrete technology flow process is as follows:
The cutting diamond cutter that uses diameter to be 2mm, more than at least 300 μm away from cut edge be, the effective coverage of pattern, with the naked eye checks after cutting whether face glass surface has scuffing, face collapses or the surperficial bad phenomenon of bubble.
Further, between step 3 and step 4, following thin engraving and glossing step can be increased according to the demand of client.But the glass product of working it out owing to utilizing present invention process not only size is accurate, and etching the smooth of the edge out, collapse without any limit, face collapses, scuffing etc. is bad, all or part of finishing impression carving technology may be cancelled, because its cost intensive, poor efficiency are very low.
Compared with prior art, the manufacturing process of electronic product face glass of the present invention the basis that glass itself emphasizes can be carried out various moulding manufacture to glass and ensures its precision not destroying, and can effectively enhance productivity, and has following beneficial effect:
1) invented technology significantly can reduce production process;
2) production efficiency and yield is increased substantially;
3) significantly reduce production cost, improve machining precision;
4) chemical tempering intensity and bending strength is improved;
5) available protecting ITO circuit and screen printing pattern.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of instructions, be described in detail as follows below with preferred embodiment of the present invention.The specific embodiment of the present invention is provided in detail by following examples.
Embodiment
Below in conjunction with embodiment, describe the present invention in detail.
A manufacturing process for electronic product face glass, comprises the following steps:
Step 1) graphically to shift, described graphical transfer comprises the following steps:
1.1) Double-face adhesive photoresist: closely connected photoresist while of two-sided to face glass with automatic or manual laminator, with hot-pressing roller at 2-4kg/cm
2pressure, 1-2m/min linear velocity and 75-85 DEG C temperature under photoresist is closely attached to face glass surface, ensure in photoresist without any bubble during pad pasting;
Closely connected photoresist while of two-sided with automatic or manual laminator.The photoresist that the present embodiment technique relates to is the photosensitive PVC film of UV of special development.The characteristic of etchant resist is PVC film thickness 50-80um, and adhesive coating (ADH) thickness is 45-50um, and adhesion is 1300g/50mm wide (vertically pullling).After corrosion resistivity process, form high precision, high-bond, corrosion resistant firm diaphragm (Mask) at glass surface, prevent chemical medicinal liquid from corroding the region that should not corrode.
1.2) laser makes target: according to CAD setting data, makes the target of CCD location, for subsequent production of laser machine in PVC surface; Making the type of laser of target is (far red light CO2), energy (10-30w), wavelength (10.6um), the degree of depth (10-20Um), and target type is (concentric circles or filled circles or right-angle side).
1.3) film is cut in CCD location: directly cut open by the etchant resist of glass surface according to the image laser that CAD edits.
1.4) waste material divests: do not need the rete against corrosion protected to divest glass surface with artificial, form the diaphragm figure corresponding with the figure 1: 1 on CAD in the above and below of face glass; Any foreign matter or film bits can not be left at glass surface after waste material divests.
The etchant resist in effective glass protection region can be combined and adhesion > 1300g/50mm completely with glass, the perfect diaphragm (Mask) firm again of shape.Therefore, when chemical medicinal liquid etches, there is glass by the phenomenon of lateral erosion (Under Cut) in liquid medicine under can not penetrating into film.
Step 2) chemical etching: high-rate etching (H-Etching): carry out two-sided high-rate etching in the special etching machine of horizontal fountain: speed is 0-2m/min, temperature is 30-50 DEG C, hydrofluoric acid concentration is 10-35%v/v, sulfuric acid concentration is 10-35%v/v;
Step 3) glass edge engraving (grinding): become the glass of monolithic to be inserted in grinding loading plate by with rete against corrosion through hydrofluoric acid etch, conveyer to 6 machine table, and accurately to be located the glass handling to be processed in loading plate by CCD vision system after vacuum suction.Utilize the carborundum electroplating bistrique on high speed SPI NDLE to spray water while grind afterwards, according to processing formula, complete the actions such as roughing, finishing, punching in order.By conveyer, glass is turned back in discharge tray after machining.
Step 4) 2 strengthenings: through the product of above-mentioned steps 3, in horizontal overflow-type special hydrofluoric acid etch machine, carry out two-sided final etching: speed is 0-2m/min, temperature 30-50 DEG C; Hydrofluoric acid concentration is 5-20%v/v, sulfuric acid concentration is 5-20%v/v.
Step 5) UV striping (Strip): divest the rete against corrosion in order to protect ITO circuit and screen printing pattern, can after a few minutes are penetrated in UV illumination stripping.
Step 6) ACF welding: together with the flexible circuit board laser bonding that the face glass above-mentioned technique completed and switching conducting use.
Product after step 7 final inspection: ACF welds does functional test, checks outward appearance.
Step 8) packaging shipment: functional test is without exception, the good product of outward appearance according to the packaging needs of guest, by shipment after the packing of product.
Further, also wrap following treatment process before step 1, technological process is as follows: successively through chemical tempering, cleaning or polishing, making ITO circuit and ag paste electrode and anti-fingerprint plated film; Also comprise cutting before step 1 and check technique, technological process is as follows: cutting, chemical tempering, making ITO circuit, silk-screen and making ag paste electrode; Concrete steps are as follows:
Large sheet glass is put into chemical chemical toughening furnace and carries out chemical tempering.Greatly can improve chemical tempering efficiency like this, reduce chemical tempering cost, and need not consider in follow-up operation because of problems such as the change in size that chemical tempering brings.ITO plated film and ITO Sensor is made under 300-350 degree.Simultaneously silk-screen goes out electrically conductive ink end points to be finally conducting to silk-screen outermost surface and is connected (needing perforation conducting technique) with ag paste electrode and on large sheet glass, prints off 4 positioning targets according to CAD design drawing while silk screen product pattern, so increase substantially silk-screen efficiency and yield, reduce manufacturing cost.
Silk-screen order is as follows: the silver paste hole filled or electrically conductive ink perforation > ag paste electrode of silk-screen one deck electrically conductive ink (with ITO line form end points) > first silk-screen > 2-5 road silk-screen > identical or close with first ink colors.The endpoint location covering the electrically conductive ink of (Masking) first impression is needed, so that finally by perforation conducting circuit when 1-5 road silk-screen.
Claims (3)
1. a manufacturing process for electronic product face glass, is characterized in that, comprises following flow process:
Step 1) graphically shift, its concrete steps are as follows:
1.1) Double-face adhesive photoresist: closely connected photoresist while of two-sided to face glass with automatic or manual laminator, with hot-pressing roller at 2-4kg/cm
2pressure, 1-2m/min linear velocity and 75-85 DEG C temperature under photoresist is closely attached to face glass surface, ensure in etchant resist without any bubble during pad pasting;
1.2) laser makes target: according to CAD setting data, makes the target of CCD location, for subsequent production of laser machine in PVC surface;
1.3) film is cut in CCD location: directly cut open by the etchant resist of glass surface according to the image laser that CAD edits;
1.4) waste material divests: do not need the rete against corrosion protected to divest glass surface with artificial, form the diaphragm figure corresponding with the figure 1: 1 on CAD in the above and below of face glass;
1.5) intermediate inspection: damage the diaphragm needed to divesting when the complete face glass of waste material checks whether that residual film does not eliminate or divests waste material in addition;
Step 2) chemical etching, its concrete steps are as follows:
Two-sided high-rate etching is carried out: speed is 0-2m/min, temperature is 30-50 DEG C, hydrofluoric acid concentration is 10-35%v/v, sulfuric acid concentration is 10-35%v/v in the special etching machine of horizontal fountain;
Step 3) glass edge engraving or grinding, its concrete steps are as follows:
Become the glass of monolithic to be inserted in rete against corrosion in grinding loading plate through hydrofluoric acid etch, conveyer to 6 machine table, and accurately to be located the glass handling to be processed in loading plate by CCD vision system after vacuum suction; Utilize the carborundum electroplating bistrique on high speed SPI NDLE to spray water while grind afterwards, according to processing formula, complete the actions such as roughing, finishing, punching in order; By conveyer, glass is turned back in discharge tray after machining;
Step 4) 2 strengthenings: through the product of above-mentioned steps 3, in horizontal overflow-type special hydrofluoric acid etch machine, carry out two-sided final etching: speed is 0-2m/min, temperature 30-50 DEG C; Hydrofluoric acid concentration is 5-20%v/v, sulfuric acid concentration is 5-20%v/v;
Step 5) UV striping: peeled off after using UV illumination to penetrate glass surface etchant resist;
Step 6) ACF welding: the flexible circuit board laser that the face glass above-mentioned technique completed and switching conducting use is welded together;
Step 7) final inspection: the product after above-mentioned ACF welding is done functional test, checks outward appearance;
Step 8) packaging shipment: functional test is without exception, by shipment after the packing of product good for outward appearance.
2. the manufacturing process of electronic product face glass according to claim 1, it is characterized in that: also wrap following treatment process before step 1, its technological process is followed successively by chemical tempering, cleaning or polishing, making ITO circuit, print silk, makes ag paste electrode, anti-fingerprint plated film and cutting and inspection technique.
3. the manufacturing process of electronic product face glass according to claim 2, is characterized in that, described cutting and inspection technique, and its concrete technology flow process is as follows:
The cutting diamond cutter that uses diameter to be 2mm, more than at least 300 μm away from cut edge be, the effective coverage of pattern, with the naked eye checks after cutting whether face glass surface has scuffing, face collapses or the surperficial bad phenomenon of bubble.
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104748490A (en) * | 2015-03-20 | 2015-07-01 | 苏州市灵通玻璃制品有限公司 | Refrigerator glass panel processing process |
| CN106028716A (en) * | 2016-07-15 | 2016-10-12 | 信利光电股份有限公司 | Cover plate and making method thereof |
| CN106116166A (en) * | 2016-06-28 | 2016-11-16 | 江苏钇捷触屏科技有限公司 | The manufacture method of the face glass of mobile terminal |
| CN109003898A (en) * | 2017-06-07 | 2018-12-14 | 郑州光力瑞弘电子科技有限公司 | One kind realizing the new process of pattern transfer on thin slice (including wafer) |
| CN109402698A (en) * | 2018-12-26 | 2019-03-01 | 无锡市五十五度科技有限公司 | A kind of method of aluminium workpiece surface local anodic oxidation |
| CN109485262A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | TFT substrate thining method |
| CN105884211B (en) * | 2016-05-20 | 2019-07-19 | 浙江圣石激光科技股份有限公司 | A kind of coated glass removes film method and film removing device |
| CN110040972A (en) * | 2019-04-17 | 2019-07-23 | 江西沃格光电股份有限公司 | Glass and preparation method thereof and its application is thinned |
| CN114274052A (en) * | 2022-01-13 | 2022-04-05 | 欧浦登（顺昌）光学有限公司 | Process for making picture and text on glass |
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2013
- 2013-06-27 CN CN201310259853.2A patent/CN104252816A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104748490A (en) * | 2015-03-20 | 2015-07-01 | 苏州市灵通玻璃制品有限公司 | Refrigerator glass panel processing process |
| CN105884211B (en) * | 2016-05-20 | 2019-07-19 | 浙江圣石激光科技股份有限公司 | A kind of coated glass removes film method and film removing device |
| CN106116166A (en) * | 2016-06-28 | 2016-11-16 | 江苏钇捷触屏科技有限公司 | The manufacture method of the face glass of mobile terminal |
| CN106028716A (en) * | 2016-07-15 | 2016-10-12 | 信利光电股份有限公司 | Cover plate and making method thereof |
| CN106028716B (en) * | 2016-07-15 | 2018-11-16 | 信利光电股份有限公司 | A kind of cover board and preparation method thereof |
| CN109003898A (en) * | 2017-06-07 | 2018-12-14 | 郑州光力瑞弘电子科技有限公司 | One kind realizing the new process of pattern transfer on thin slice (including wafer) |
| CN109485262A (en) * | 2017-09-12 | 2019-03-19 | 南昌欧菲生物识别技术有限公司 | TFT substrate thining method |
| CN109402698A (en) * | 2018-12-26 | 2019-03-01 | 无锡市五十五度科技有限公司 | A kind of method of aluminium workpiece surface local anodic oxidation |
| CN110040972A (en) * | 2019-04-17 | 2019-07-23 | 江西沃格光电股份有限公司 | Glass and preparation method thereof and its application is thinned |
| CN114274052A (en) * | 2022-01-13 | 2022-04-05 | 欧浦登（顺昌）光学有限公司 | Process for making picture and text on glass |
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