CN113903624A - Multi-path relay switch module - Google Patents

Abstract

The utility model belongs to the technical field of electric elements and specifically relates to a multi-channel relay switch module is related to, it is including installation electric elements's PCB board, set up at a plurality of planar coil of PCB inboard and set up the copper-clad plate in PCB board below, a plurality of planar coil is along the length direction and the wide direction evenly distributed of PCB board, planar coil is the helical shape, be connected through many spliced poles between PCB board and the copper-clad plate, PCB inboard just is provided with hollow air runner around planar coil, the inside intercommunication each other of air runner to the head end and the end of air runner all communicate with the outside of PCB board. This application has the relay working process of improving, and the PCB board problem effect that generates heat easily.

Description

Multi-path relay switch module

Technical Field

The present application relates to the field of electrical components, and more particularly, to a multi-relay switch module.

Background

The present relay is an electric control device, when the change of input quantity meets the specified requirement, the controlled quantity is made to produce predefined step change in the electric output circuit, it possesses the interaction relation between control system (also called input circuit) and controlled system (also called output circuit), and is usually used in automatic control circuit, it is an "automatic switch" which actually uses small current to control large current operation, so that it can play the role of automatic regulation, safety protection and switching circuit in the circuit, but the existent relay has many problems or defects.

A typical existing relay includes: a pole core (pole core) magnetized by a current; an armature operated by a magnetic force of the pole core; and a movable contact that moves by operation of the armature to contact or be spaced from the fixed contact. The movable contact is connected to the fixed contact when the armature is attached to the pole piece by magnetization of the pole piece, and is separated from the fixed contact when the armature is separated from the pole piece by magnetization release of the pole piece.

The relay is generally mounted in such a manner that a plurality of terminals are coupled to a circuit of a Printed Circuit Board (PCB) in a state where a main body of the relay is in close contact with the PCB.

At present, in the field of automatic control, solid-state relays are widely applied to the field of military industry and important industrial control due to high reliability and strong environmental adaptability. However, with the rapid development of electronic equipment and information systems in China, the miniaturization, integration and high-density assembly of electronic equipment are inevitable, and under the application background, the current general solid-state relay cannot meet the use requirement due to large volume and few output groups, so that a sealed solid-state integrated controller which is matched with the general solid-state relay, has small volume, multiple groups of outputs and is resistant to large current impact is urgently needed to meet the application requirement.

In view of the above-mentioned related art, the inventor believes that the conventional relay has the problems that the pole core is easily heated when being electrified during long-term use, and the temperature of the PCB is easily increased when being used for a long time.

Disclosure of Invention

In order to improve relay working process, the problem that the PCB board generates heat easily, this application provides a multi-way relay switch module.

The application provides a multi-way relay switch module adopts following technical scheme:

the utility model provides a multi-channel relay switch module, is including the PCB board of installation electrical component, set up at a plurality of planar coil of PCB inboard and set up the copper-clad plate in PCB board below, and is a plurality of planar coil is along the length direction and the wide direction evenly distributed of PCB board, planar coil is the spiral shape, be connected through many spliced poles between PCB board and the copper-clad plate, PCB inboard just is provided with hollow air runner around planar coil, the inside intercommunication each other of air runner to the head end and the end of air runner all communicate with the outside of PCB board.

Through adopting above-mentioned technical scheme, the air runner that this application set up between the adjacent two coils of PCB inboard and planar coil to inside and the outside intercommunication of PCB board of air runner can introduce PCB inboard with the outside gas of PCB board, improves the inside air flow speed of air runner, and at the in-process that gas flows, takes away the heat on the PCB board, thereby dispels the heat to the PCB board around the planar coil, avoids the temperature rising of PCB board.

Optionally, the air flow channel is in a spiral shape, the spiral direction of the air flow channel is the same as the spiral direction of the planar coil, the air flow channel is located between two adjacent coils in the planar coil, and the air flow channel and the planar coil are nested with each other.

Through adopting above-mentioned technical scheme, be the air runner that the helical shape set up and set up with the planar coil spiral direction syntropy, improved the region and the area that gaseous flows through in PCB inboard, make gaseous main heating source position on can flowing through the PCB board, directly hit the heating source, avoid the temperature from the position outdiffusion in heating source, improve the effect of whole cooling.

Optionally, the air flow channel is in a spiral shape, the spiral direction of the air flow channel is the same as the spiral direction of the planar coil, the air flow channel is located between two adjacent coils in the planar coil, the air flow channel and the planar coil are nested with each other, and the air flow channel is distributed in a serpentine shape along the spiral direction.

Through adopting above-mentioned technical scheme, along the air runner of planar coil helical direction snakelike distribution, greatly increased the length of air runner to also increased the area that flows through on the PCB board, can cool down to more regions on the PCB board, improved the region to the PCB board cooling, had better cooling effect.

Optionally, the air flow channel is spiral, the spiral direction of the air flow channel is the same as the spiral direction of the planar coil, the air flow channel and the planar coil are nested with each other, a plurality of gas cavities arranged on the PCB are uniformly arranged in the spiral direction of the air flow channel, and the gas cavities are located between two adjacent coils in the planar coil.

Through adopting above-mentioned technical scheme, the gas chamber that sets up at air runner spiral direction can store up the gas that a certain amount of temperature is lower in the gas intracavity to the gas chamber that sets up can carry out cooling on a large scale to its nearby PCB board, improves the speed to PCB board cooling, and after the temperature in the gas chamber rose, under the effect that gas circulation flows, the gas in the gas chamber is the cold gas of renewal again.

Optionally, an air duct is arranged between the PCB and the copper-clad plate, the air duct is communicated with a plurality of air inlet pipes, and the air inlet pipes are communicated with the head end of each air flow channel.

By adopting the technical scheme, the air duct is arranged, so that the gas outside the relay module can be introduced into the air flow channel more quickly, the flow of the gas in the air flow channel is accelerated, and the radiating speed of the PCB is improved.

Optionally, the air duct is a conical structure with the diameter of the air inlet larger than that of the air outlet.

By adopting the technical scheme, the air guide cylinder which is arranged in a conical shape can prevent air volume from directly flowing out from the air outlet of the air guide cylinder, so that most of air volume flows into the air flow channel through the air inlet pipe, and the flow of air in the air flow channel is accelerated.

Optionally, heat-conducting epoxy resin is filled between the PCB and the copper-clad plate.

Through adopting above-mentioned technical scheme, the heat conduction epoxy that sets up can in time transmit the copper-clad plate with the temperature of PCB board on, carries out quick heat dissipation through the copper-clad plate.

In summary, the present application includes at least one of the following beneficial technical effects:

1. according to the air flow channel arranged between the two adjacent coils of the planar coil in the PCB, and the inside of the air flow channel is communicated with the outside of the PCB, gas outside the PCB can be introduced into the PCB, the air flow speed in the air flow channel is improved, and heat on the PCB is taken away in the gas flow process, so that the PCB around the planar coil is radiated, and the temperature rise of the PCB is avoided;

2. the air flow channels distributed in the snake shape along the spiral direction of the planar coil greatly increase the length of the air flow channels, increase the area of the air flow channels flowing on the PCB, and can cool more areas on the PCB, thereby improving the areas for cooling the PCB and having better cooling effect;

3. the arranged gas cavity can store a certain amount of cold gas, so that the PCB nearby the gas cavity can be cooled in a large range, the cooling speed of the PCB is increased, and after the temperature in the gas cavity is increased, the gas in the gas cavity is replaced by new cold gas again under the action of gas circulation flow;

4. the air duct can lead the gas outside the relay module into the air flow channel more quickly, so that the flow of the gas in the air flow channel is accelerated, the radiating speed of the PCB is improved, and the air duct which is arranged in a conical shape can lead most of cold gas into the air flow channel, thereby avoiding the loss of gas flow.

Drawings

FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present application;

FIG. 2 is a schematic view of an air flow passage according to an embodiment of the present application;

FIG. 3 is a schematic diagram of an embodiment of the present application embodying a planar coil;

FIG. 4 is a schematic view of an air flow passage according to embodiment 2 of the present application;

fig. 5 is a schematic view of an air flow passage according to embodiment 3 of the present application.

Description of reference numerals: 1. a PCB board; 2. copper-clad plate; 3. a planar coil; 4. an air flow passage; 41. a gas chamber; 5. an air inlet; 6. an air outlet; 7. an air duct; 8. an air inlet pipe; 9. a thermally conductive epoxy.

Detailed Description

The present application is described in further detail below with reference to figures 1-5.

The embodiment of the application discloses a multi-way relay switch module.

Example 1

Referring to fig. 1, a multi-channel relay switch module includes PCB board 1 and the copper-clad plate 2 of setting in PCB board 1 below, is provided with electrical component on the PCB board 1, and PCB board 1 and copper-clad plate 2 all are the rectangle to be provided with the spliced pole of a plurality of metal materials between PCB board 1 and copper-clad plate 2, the vertical setting of spliced pole, the upper end and the welding of PCB board 1 of spliced pole, the lower extreme and the copper-clad plate 2 welding of spliced pole.

Referring to fig. 1, 2 and 3, a plurality of planar coils 3 are arranged inside a PCB 1, the planar coils 3 are equidistantly arrayed along the length direction and the width direction of the PCB 1, in the embodiment of the present application, the number of the planar coils 3 is 8, 8 planar coils 3 are distributed on the PCB 1 in two rows and four columns, 8 planar coils 3 respectively correspond to eight groups of switches which are arranged in an isolated manner, each group of switches respectively corresponds to 4 connecting columns, the 4 connecting columns are divided into two positive and negative control pins and two positive and negative output pins, 32 pins of the eight groups of switches are uniformly distributed along four directions of the PCB or the copper-clad plate, and the distance between two adjacent pins is 2.54 mm; planar coil 3 is the heliciform, and this multi-channel relay switch module is at the working process, and planar coil 3 can pass through the electric current, and long-time work back, planar coil 3 can produce a large amount of heats in PCB board 1 sealing area, if do not have timely heat dissipation, can melt the solder joint of other electric elements on the PCB board 1, lead to other electric elements and PCB board 1 can appear contact failure's problem.

An air flow channel 4 is arranged in the PCB 1 and at the position of the planar coil 3, the arranged air flow channel 4 can dissipate heat of the planar coil 3 which generates heat in the working process, the air flow channel 4 is in a spiral shape, the air flow channel 4 and the planar coil 3 are mutually nested, the spiral direction of the air flow channel 4 is the same as the spiral direction of the planar coil 3, the spiral turns of the air flow channel 4 and the spiral turns of the planar coil 3 are the same, the air flow channel 4 is arranged between two adjacent coils in the planar coil 3, the air flow channel 4 is a spiral cavity arranged in the PCB 1, and the spiral cavity is in a mutually communicated structure from the center to the outer end; in this embodiment, the center of the air flow channel 4 is defined as the head end of the air flow channel 4, the outside of the air flow channel 4 is defined as the tail end of the air flow channel 4, an air inlet 5 communicated with the lower surface of the PCB 1 is arranged at the head end of the air flow channel 4 on the PCB 1, and an air outlet 6 communicated with the upper surface of the PCB 1 is arranged at the tail end of the air flow channel 4 on the PCB 1, so that the air in the air flow channel 4 circularly flows, and the heat of the PCB 1 near the planar coil 3 can be dissipated.

Referring to fig. 1, 2 and 3, a pair of air ducts 7 is arranged between a PCB 1 and a copper-clad plate 2, the two air ducts 7 are arranged along the length direction of the PCB 1, the two air ducts 7 correspond to two rows of planar coils 3, a plurality of vertically arranged air inlet pipes 8 are fixedly connected to the air ducts 7, the air inlet pipes 8 correspond to air channels 4 one by one, one ends of the air inlet pipes 8 are communicated with the inside of the air ducts 7, the other ends of the air inlet pipes 8 are communicated with an air inlet 5 which is arranged on the PCB 1 and is located at the head end of the air channel 4, when the relay switch module works, one ends of the air ducts 7 are aligned with a heat dissipation fan at an application position of the relay switch module, wind energy blown by the heat dissipation fan can flow through the air ducts 7 and then flows into the air channels 4 from the air inlet pipes 8, the flow of air in the air channels 4 is accelerated, and the cooling speed of the PCB 1 is increased.

Furthermore, the air guide cylinder 7 is in a conical cylinder shape, the diameter of the air inlet 5 of the air guide cylinder 7 is larger than that of the air outlet 6 of the air guide cylinder 7, and after the same air quantity flows into the air guide cylinder 7, the air guide cylinder 7 arranged in the conical shape can prevent the air quantity from directly flowing out of the air outlet 6 of the air guide cylinder 7, so that most of the air quantity introduced into the air guide cylinder 7 flows into the air flow channel 4 through the air inlet pipe 8, and the flow of air in the air flow channel 4 is accelerated.

Referring to fig. 1, fig. 2 and fig. 3, space packing between PCB board 1 and copper-clad plate 2 has heat conduction epoxy 9, the heat conduction epoxy 9 of setting closely laminates with the lower surface of PCB board 1, and closely laminate with the upper surface of copper-clad plate 2, after relay switch module overload work, the air runner 4 of setting can not carry out the PCB board 1 fast under the condition that reduces, heat conduction epoxy 9 can in time transmit the temperature of PCB board 1 to copper-clad plate 2 on, carry out quick heat dissipation through copper-clad plate 2.

The implementation principle of the embodiment 1 is as follows: in the working process of the relay switch module, the gas with lower temperature introduced into the air duct 7 can enter the spiral air flow channel 4 through the air inlet pipe 8, and in the process of circulating from the inner head end of the air flow channel 4 to the tail end of the air flow channel 4, the PCB 1 around the planar coil 3 can be cooled in time, and then the gas with increased temperature can be discharged from the air outlet 6 of the air flow channel 4.

Example 2

Referring to fig. 4, the difference between this embodiment and embodiment 1 is that the air flow channel 4 is located between two adjacent coils of the planar coil 3, and the air flow channel 4 is distributed in a serpentine shape along the spiral direction of the planar coil 3, the air flow channel 4 distributed in a serpentine shape inside the PCB 1 increases the area of the air flow channel 4 flowing through the inside of the PCB 1, and the air flow channel 4 distributed in a serpentine shape is closer to the position where the planar coil 3 generates heat, so as to better cool the PCB 1.

The implementation principle of the embodiment 2 is as follows: in the working process of the relay switch module, the gas with lower temperature introduced into the air duct 7 can enter the snakelike spiral air flow channel 4 through the air inlet pipe 8, and in the process of circulating from the inner head end of the air flow channel 4 to the tail end of the air flow channel 4, the PCB 1 around the planar coil 3 can be cooled in time, and then the gas with raised temperature can be discharged from the air outlet 6 of the air flow channel 4.

Example 3

Referring to fig. 5, the present embodiment is different from embodiment 1 in that the air flow channel 4 and the planar coil 3 are nested with each other, a plurality of gas cavities 41 are uniformly arranged in the spiral direction of the air flow channel 4 from the head end to the tail end, the gas cavities 41 are opened inside the PCB 1, the gas cavities 41 are arc-shaped and have rectangular cross sections, two sides of the gas cavities 41 are closer to the planar coil 3, after the gas flows into the gas cavities 41, a certain amount of gas with lower temperature can be accumulated inside the gas cavities 41, the gas can circulate inside the gas cavities 41 during the process of flowing inside the air flow channel 4, and then the gas cavities 41 can cool the PCB 1 nearby in a wide range when the gas flows into the next gas cavity 41 through the air flow channel 4, thereby increasing the speed of cooling the PCB 1.

The implementation principle of the embodiment 3 is as follows: in the working process of the relay switch module, the gas with lower temperature introduced into the air duct 7 can enter the spiral air flow channel 4 through the air inlet pipe 8, and in the process of circulating from the inner head end of the air flow channel 4 to the tail end of the air flow channel 4, the cold gas can be filled in the gas cavity 41 in sequence, so that the PCB (printed circuit board) 1 around the planar coil 3 can be cooled in time, and then the gas with increased temperature can be discharged from the air outlet 6 of the air flow channel 4.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (7)

1. A multi-relay switch module, characterized in that: including PCB board (1) of installation electrical component, set up at a plurality of planar coil (3) of PCB board (1) inside and set up copper-clad plate (2) in PCB board (1) below, every planar coil (3) corresponds an isolator respectively, and is a plurality of planar coil (3) are along the length direction and the wide direction evenly distributed of PCB board (1), planar coil (3) are the spiral shape, be connected through many spliced poles between PCB board (1) and copper-clad plate (2), the spliced pole is connected with isolator, be provided with hollow air runner (4) inside and around planar coil (3) PCB board (1), the inside intercommunication each other of air runner (4) to the head end and the end of air runner (4) all communicate with the outside of PCB board (1).

2. The multiplex relay switch module as defined in claim 1, wherein: the air flow channel (4) is in a spiral shape, the spiral direction of the air flow channel (4) is the same as that of the planar coil (3), the air flow channel (4) is located between two adjacent coils in the planar coil (3), and the air flow channel (4) and the planar coil (3) are mutually nested.

3. The multiplex relay switch module as defined in claim 1, wherein: the air flow channel (4) is in a spiral shape, the spiral direction of the air flow channel (4) is the same as that of the planar coil (3), the air flow channel (4) is located between two adjacent coils in the planar coil (3), the air flow channel (4) and the planar coil (3) are nested with each other, and the air flow channel (4) is distributed in a snake shape along the spiral direction.

4. The multiplex relay switch module as defined in claim 1, wherein: the air flow channel (4) is in a spiral shape, the spiral direction of the air flow channel (4) is the same as that of the planar coil (3), the air flow channel (4) and the planar coil (3) are mutually nested, a plurality of air cavities (41) formed in the PCB (1) are uniformly arranged in the spiral direction of the air flow channel (4), and the air cavities (41) are located between two adjacent coils in the planar coil (3).

5. The multiplex relay switch module as defined in claim 1, wherein: an air duct (7) is arranged between the PCB (1) and the copper-clad plate (2), a plurality of air inlet pipes (8) are communicated with the air duct (7), and the air inlet pipes (8) are communicated with the head end of each air flow channel (4).

6. The multiplex relay switch module as defined in claim 5, wherein: the air duct (7) is of a conical structure, and the diameter of the air inlet (5) is larger than that of the air outlet (6).

7. The multiplex relay switch module as defined in claim 1, wherein: and heat-conducting epoxy resin (9) is filled between the PCB (1) and the copper-clad plate (2).

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